CN103240233A - Method for washing inner shielding baffle - Google Patents
Method for washing inner shielding baffle Download PDFInfo
- Publication number
- CN103240233A CN103240233A CN2012100225608A CN201210022560A CN103240233A CN 103240233 A CN103240233 A CN 103240233A CN 2012100225608 A CN2012100225608 A CN 2012100225608A CN 201210022560 A CN201210022560 A CN 201210022560A CN 103240233 A CN103240233 A CN 103240233A
- Authority
- CN
- China
- Prior art keywords
- baffle plate
- cover
- inner shielding
- superficies
- shielding baffle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Abstract
The invention relates to a method for washing an inner shielding baffle. The method comprises the steps of a, winding the outer-layer surface of the inner shielding baffle through an adhesive tape for shielding; b, filling gaps of joint areas of the adhesive tape on the outer-layer surface of the inner shielding baffle with glue; c, immersing the inner shielding baffle after shielding processing into a chemical agent for washing. According to the method, consumption to the outer-layer surface of the inner shielding baffle can be avoided, and service lives of products are prolonged greatly.
Description
Technical field
The present invention relates to a kind of for the interior method of cleaning that covers baffle plate.
Background technology
In to cover baffle plate (Shield Inner) be one of key core part of semiconductive thin film process apparatus, after each the use, surface of bottom material can adhere to one deck tantalum nitride (TaN), just can reuse after needing to clean, and the main purpose of cleaning will be removed tantalum nitride layer exactly.
In to cover baffle plate be the barrel shape structure, there is the roughness design on its internal layer surface, the tantalum nitride attachment is mainly concentrated this face that is attached to; Superficies are smooth surface, and this face major function is to engage use with semiconductor production equipment.
At present, in cover baffle plate method of cleaning be to utilize chemical agent to soak etched mode, remove the tantalum nitride layer of surface attachment; Owing to be that the attachment adhering range is big and thick, need comprehensive will in cover baffle plate and soak the most effective cleaning just all arranged in the theory of evolution medicament; Through cleaning of repeated multiple times, in cover the baffle plate superficies and consume gradually, the situation not good with the semiconductor production equipment connecting state occur, and then cover scrapping and changing of baffle plate in causing.
Well known, the parts that semiconductor production equipment is relevant are all external import, domesticly itself there is no manufacturing capacity, relative, the purchase cost of related components is just high naturally, so not only because be external import buying time-histories but also length, when needs are purchased in a large number, huge money and the cost of time all are white elephants.
Therefore, to cause consumption be one of those skilled in the art's problem of being devoted to solve to the superficies that how internally do not cover baffle plate in the process of cleaning always.
Summary of the invention
Purpose of the present invention provides a kind of for the interior method of cleaning that covers baffle plate at the problems referred to above exactly, and the superficies that this method of cleaning can internally not cover baffle plate cause consumption, have prolonged the service life of product greatly.
The technical scheme that the present invention adopts in order to reach the goal is:
Of the present invention a kind of for the interior method of cleaning that covers baffle plate, may further comprise the steps:
A. with adhesive tape the superficies that cover baffle plate in described are twined and screen;
B. for the slit of covering baffle plate superficies gluing interband engaging zones in above-mentioned, adopt glue to fill up;
C. with above-mentioned screen handled in cover baffle plate and immerse in the chemical agent, clean.
Method of cleaning of the present invention and existing method relatively have the following advantages:
1. adopt and cover baffle plate immersion theory of evolution medicament in the comprehensive general, in cover baffle plate because the complete protection of screening arranged, even through cleaning of repeated multiple times, in cover the baffle plate superficies and also can not produce loss gradually, cover not good unusual of baffle plate and semiconductor production equipment connecting state in can significantly reducing;
2. cover the baffle plate superficies in and can not produce loss, can effectively increase the service life, significantly reduce the new product purchase cost;
3. cover the baffle plate superficies by the chemical agent etching in the inventive method can effectively be avoided, can use the chemical agent of higher concentration to clean, effectively increase operating efficiency, significantly reduce the time cost of producing.
The specific embodiment
Be further described below in conjunction with the present invention of embodiment:
Cover the method for cleaning of baffle plate in the present invention is used for, may further comprise the steps:
A. with adhesive tape the superficies that cover baffle plate in described are twined and screen;
B. for the slit of covering baffle plate superficies gluing interband engaging zones in above-mentioned, adopt glue to fill up;
C. with above-mentioned screen handled in cover baffle plate and immerse in the chemical agent, clean and namely remove the attachment tantalum nitride;
D. after immersion is finished, the adhesive tape removal is got final product.
Above embodiment is only for the usefulness that the present invention is described, but not limitation of the present invention, person skilled in the relevant technique, under the situation that does not break away from the spirit and scope of the present invention, can also make various conversion or modification, therefore all technical schemes that are equal to also should belong to category of the present invention, should be limited by each claim.
Claims (1)
1. a method of cleaning that covers baffle plate in being used for is characterized in that, may further comprise the steps:
A. with adhesive tape the superficies that cover baffle plate in described are twined and screen;
B. for the slit of covering baffle plate superficies gluing interband engaging zones in above-mentioned, adopt glue to fill up;
C. with above-mentioned screen handled in cover baffle plate and immerse in the chemical agent, clean.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100225608A CN103240233A (en) | 2012-02-01 | 2012-02-01 | Method for washing inner shielding baffle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100225608A CN103240233A (en) | 2012-02-01 | 2012-02-01 | Method for washing inner shielding baffle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103240233A true CN103240233A (en) | 2013-08-14 |
Family
ID=48920305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100225608A Pending CN103240233A (en) | 2012-02-01 | 2012-02-01 | Method for washing inner shielding baffle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103240233A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114904835A (en) * | 2022-05-06 | 2022-08-16 | 合肥升滕半导体技术有限公司 | Method for cleaning ceramic insulating ring suitable for physical vapor deposition process |
| CN114985366A (en) * | 2022-05-25 | 2022-09-02 | 合肥升滕半导体技术有限公司 | Method for cleaning silicon carbide part suitable for dry etching process |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2185642Y (en) * | 1993-11-16 | 1994-12-21 | 高天来 | Covering rubber film for spraying paint |
| US5746834A (en) * | 1996-01-04 | 1998-05-05 | Memc Electronics Materials, Inc. | Method and apparatus for purging barrel reactors |
| US20030136428A1 (en) * | 2002-01-23 | 2003-07-24 | Applied Materials, Inc. | Cleaning process residues on a process chamber component |
| US20040099285A1 (en) * | 2002-11-25 | 2004-05-27 | Applied Materials, Inc. | Method of cleaning a coated process chamber component |
| US20050172984A1 (en) * | 2004-02-11 | 2005-08-11 | Applied Materials, Inc. | Cleaning of chamber components |
| CN1659022A (en) * | 2002-05-03 | 2005-08-24 | 吉奥马斯克股份有限公司 | Improved adhesive tape for masking |
| CN101224458A (en) * | 2007-01-15 | 2008-07-23 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Method for cleaning ceramic parts surface in polysilicon etching cavity |
| CN101474613A (en) * | 2009-01-14 | 2009-07-08 | 黄运波 | Technique for lacquering product |
-
2012
- 2012-02-01 CN CN2012100225608A patent/CN103240233A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2185642Y (en) * | 1993-11-16 | 1994-12-21 | 高天来 | Covering rubber film for spraying paint |
| US5746834A (en) * | 1996-01-04 | 1998-05-05 | Memc Electronics Materials, Inc. | Method and apparatus for purging barrel reactors |
| US20030136428A1 (en) * | 2002-01-23 | 2003-07-24 | Applied Materials, Inc. | Cleaning process residues on a process chamber component |
| CN1659022A (en) * | 2002-05-03 | 2005-08-24 | 吉奥马斯克股份有限公司 | Improved adhesive tape for masking |
| US20040099285A1 (en) * | 2002-11-25 | 2004-05-27 | Applied Materials, Inc. | Method of cleaning a coated process chamber component |
| US20050172984A1 (en) * | 2004-02-11 | 2005-08-11 | Applied Materials, Inc. | Cleaning of chamber components |
| CN101224458A (en) * | 2007-01-15 | 2008-07-23 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Method for cleaning ceramic parts surface in polysilicon etching cavity |
| CN101474613A (en) * | 2009-01-14 | 2009-07-08 | 黄运波 | Technique for lacquering product |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114904835A (en) * | 2022-05-06 | 2022-08-16 | 合肥升滕半导体技术有限公司 | Method for cleaning ceramic insulating ring suitable for physical vapor deposition process |
| CN114985366A (en) * | 2022-05-25 | 2022-09-02 | 合肥升滕半导体技术有限公司 | Method for cleaning silicon carbide part suitable for dry etching process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130814 |