CN103243699A - Transducer for measuring thermal parameters of soil around cable - Google Patents
Transducer for measuring thermal parameters of soil around cable Download PDFInfo
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- CN103243699A CN103243699A CN2013101906682A CN201310190668A CN103243699A CN 103243699 A CN103243699 A CN 103243699A CN 2013101906682 A CN2013101906682 A CN 2013101906682A CN 201310190668 A CN201310190668 A CN 201310190668A CN 103243699 A CN103243699 A CN 103243699A
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Abstract
The invention provides a transducer for measuring thermal parameters of soil around a cable. The transducer mainly comprises a direct-current power supply, a high-power current-limiting resistor, a semiconductor switch, a diode, a capacitor bank, an air core inductor group, a copper spherical casing and a temperature transducer. The transducer has the advantages that a novel main circuit topological structure is used, the whole transducer is reliable in operation, high in portability and rapid in measurement; a heating part of the copper spherical casing is an ideal isothermal surface, so that the measurement result is accurate and reliable; and the on-off time ratio of a metal-oxide -semiconductor field effect transistor (MOSFET) is reasonably set, so that charging and discharging processes of the capacitor bank are continuous, continuous shockwaves are generated at two ends of the air core inductor group, a continuous alternating magnetic field is produced, and the copper spherical casing is uniformly heated.
Description
Technical field
The present invention relates to soil thermal parameter measurement technology and application thereof, particularly relate to a kind of portable sensor for the real-time monitoring of power cable surrounding soil thermal parameter.
Background technology
In the last few years, a kind of technology of utilizing thermoprobe method to measure the soil thermal parameter had obtained application more and more widely.By the temperature rise curve of measuring probe, by setting up the thermal parameter that simple mathematics model just can calculate soil.
Yet present above-mentioned measuring method also exists some technical problems to wait to solve in actual applications: 1) the thermal probe surface can't guarantee it is a desirable isothermal level, the accuracy that influence is measured; 2) ignore self thermal capacitance of thermal probe and the thermal contact resistance between thermal probe and the soil in the measuring process, caused the error of measurement result.3) thermal capacitance value of soil can't be measured.Therefore, how to design and make a kind of portable, measure the sensor that new fast soil thermal parameter measurement is used, solve at present and measure the realistic problem that the soil thermal parameter faces based on thermoprobe method, one of real important subject that belongs to current industry.
Summary of the invention
Technical problem to be solved by this invention is, the sensor that provides a kind of cable surrounding soil thermal parameter measurement to use, have safe, portable, measure and quick and precisely to wait characteristics, with overcome measuring system in the prior art in practice technical elements exist not enough and difficult.
Adopt following technical scheme for solving the problems of the technologies described above, the invention provides a kind of cable surrounding soil thermal parameter measurement sensor, mainly comprise dc source DC11, high-power current-limiting resistance R11, semiconductor switch K11, diode D11, capacitance group C11, air core inductor group L11, copper ball shell and temperature pick up;
Described dc source DC11 is used to whole thermal parameter measurement to power with sensor;
Described high-power current-limiting resistance R11, DC11 links to each other with dc source, is used for the electric current of limiting sensor charge circuit;
Described semiconductor switch K11 links to each other with high-power current-limiting resistance R11, is used for the charging control loop of sensor; Described semiconductor switch K11 works in charge circuit, does not participate in the oscillatory process of major loop;
Described diode D11, K11 links to each other with semiconductor switch, is used for insulation blocking, prevents the wave of oscillation counterattack current supply circuit of forward;
Described capacitance group C11 one end links to each other with diode D11, and other end ground connection is energy storage and the oscillating unit of whole device;
Described air core inductor group L11 is in parallel with capacitance group C11, for generation of the wave of oscillation and then produce the electromagnetic field of alternation at its two ends;
Described copper ball shell places air core inductor group L11 outside, owing to eddy-current loss is generated heat, is the heating module of whole sensor in the alternating electromagnetic field that air core inductor produces;
Described temperature pick up places copper ball shell inner surface, is used for measuring the temperature rise on copper ball shell surface;
Preferably, described capacitance group C11 comprises:
First capacitor C 21, the one end links to each other with Power Diode Pumped, other end ground connection;
Second capacitor C 22, in parallel with capacitor C 21;
The 3rd capacitor C 23, in parallel with capacitor C 22;
The 4th capacitor C 24, in parallel with capacitor C 23;
The 5th capacitor C 25, in parallel with capacitor C 24;
The 6th capacitor C 26, in parallel with capacitor C 25;
Preferably, described air core inductor group L11 comprises:
First inductance L 21, the one end links to each other with capacitance group, other end ground connection;
Second inductance L 22, in parallel with inductance L 21;
The 3rd inductance L 23, in parallel with inductance L 22;
The 4th inductance L 24, in parallel with inductance L 23;
The 5th inductance L 25, in parallel with inductance L 24;
The 6th inductance L 26, in parallel with inductance L 25;
Preferably, described semiconductor switch K11 structure is by direct-current switch power supply, the MOSFET control panel, MOSFET drive plate and MOSFET module constitute, the input of direct-current switch power supply links to each other with the 220V alternating current, described MOSFET module connects the MOSFET drive plate, and described MOSFET drive plate links to each other with the MOSFET control panel by optical fiber;
Preferably, the inductance among the described air core inductor group L11 is wound on the inductance framework by enamel covered wire, has lower internal resistance value, can guarantee that the decay of damped oscillation waveform is slower;
Preferably, six inductance among the described air core inductor group L11 evenly vertically stick on the inner surface of copper ball shell, guarantee that the copper ball shell is heated evenly;
Preferably, the external diameter of described copper ball shell is 10cm, and wall thickness is 1mm, is that two hemispherical Shells are stitched together, and diameter is arranged at copper ball shell top is the hole of 1cm, is used for the lead of the inner connection of copper ball shell inductance and the connecting line of temperature pick up are drawn the copper ball shell;
Preferably, described dc source DC11 is rechargeable battery.
The present invention has following beneficial effect: 1, the sensor used of a kind of cable surrounding soil thermal parameter measurement among the present invention adopts novel main circuit topological structure, and whole device reliable operation is portable strong, measures fast; 2, heat generating components copper ball shell of the present invention is a desirable isothermal level, makes measurement result more accurately and reliably; 3, the embodiment of the invention rationally arranges opening and the turn-off time ratio of MOSFET, make that the charge and discharge process of capacitance group C11 is continuous, produce continuous concussion waveform at air core inductor group L11 two ends, thereby produce continuous alternating magnetic field, make the copper ball shell be heated evenly.When 4, the cable surrounding soil thermal parameter measurement sensor of the embodiment of the invention is measured at the scene, operating personnel only need the copper ball housing of sensor is imbedded in the soil to be measured, the temperature value of continuous record temperature pick up in certain time interval, draw out the temperature rise curve of sensor, by setting up the thermal parameter that precise math model comparatively can calculate soil to be measured.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, will do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below
Fig. 1 is the main circuit structure schematic diagram of cable surrounding soil thermal parameter measurement sensor of the present invention
Fig. 2 is the electrical block diagram of the capacitance group of cable surrounding soil thermal parameter measurement sensor of the present invention
Fig. 3 is the electrical block diagram of the air core inductor group of cable surrounding soil thermal parameter measurement sensor of the present invention
Fig. 4 is that the semiconductor switch of cable surrounding soil thermal parameter measurement sensor of the present invention is formed block diagram
Fig. 5 is the oscillogram of the capacitance group C11 both end voltage of cable surrounding soil thermal parameter measurement sensor of the present invention
Among the figure, 1, temperature pick up 2, copper ball shell 3, direct-current switch power supply 4, MOSFET drive plate 5, MOSFET control panel 6, MOSFET module
The specific embodiment
For making the purpose, technical solutions and advantages of the present invention clearer, below in conjunction with accompanying drawing invention is described in further detail.
As shown in Figure 1, the sensor that a kind of cable surrounding soil thermal parameter measurement is used mainly comprises dc source DC11, high-power current-limiting resistance R11, semiconductor switch K11, diode D11, capacitance group C11, air core inductor group L11, copper ball shell 2 and temperature pick up 1;
Described dc source DC11 is used to whole thermal parameter measurement to power with sensor;
Described high-power current-limiting resistance R11, DC11 links to each other with dc source, is used for the electric current of limiting sensor charge circuit; Choose high-power current-limiting resistance R11=1 Ω, power is the above large power winding resistance of 250W.
Described semiconductor switch K11 links to each other with high-power current-limiting resistance R11, is used for the charging control loop of sensor; Described semiconductor switch K11 works in charge circuit, does not participate in the oscillatory process of major loop; Preferred switching speed is less than 1 μ s, and withstand voltage greater than 50V, through-current capability is greater than the semiconductor switch of 50A.
Described diode D11, K11 links to each other with semiconductor switch, is used for insulation blocking, prevents the wave of oscillation counterattack current supply circuit of forward; Can adopt the above diode of withstand voltage 50V, through-flow 50A;
Described capacitance group C11 one end links to each other with diode D11, other end ground connection, energy storage and oscillating unit for whole device, namely when semiconductor switch K11 is closed, dc source DC11 charges by the capacitance group C11 of high-power current-limiting resistance R11, after K11 disconnected, the air core inductor group L11 resonance that capacitance group C11 will be in parallel with it produced the wave of oscillation;
Described air core inductor group L11 is in parallel with capacitance group C11, for generation of the wave of oscillation and then produce the electromagnetic field of alternation at its two ends.
Described copper ball shell 2 places air core inductor group L11 outside, owing to eddy-current loss is generated heat, is the heating module of whole sensor in the alternating electromagnetic field that air core inductor produces;
Described temperature pick up 1 places copper ball shell 2 inner surfaces, is used for measuring the temperature rise on copper ball shell 2 surfaces;
As shown in Figure 2, described capacitance group C11 is composed in parallel by low-loss metal polypropylene screen (MKP) electric capacity of six 5uf, withstand voltage 50V:
First capacitor C 21, the one end links to each other with Power Diode Pumped, other end ground connection;
Second capacitor C 22, in parallel with capacitor C 21;
The 3rd capacitor C 23, in parallel with capacitor C 22;
The 4th capacitor C 24, in parallel with capacitor C 23;
The 5th capacitor C 25, in parallel with capacitor C 24;
The 6th capacitor C 26, in parallel with capacitor C 25;
As shown in Figure 3, described air core inductor group L11 is composed in parallel greater than the air core inductor of 50A by six 3uH, through-current capability:
First inductance L 21, the one end links to each other with capacitance group, other end ground connection;
Second inductance L 22, in parallel with inductance L 21;
The 3rd inductance L 23, in parallel with inductance L 22;
The 4th inductance L 24, in parallel with inductance L 23;
The 5th inductance L 25, in parallel with inductance L 24;
The 6th inductance L 26, in parallel with inductance L 25;
As shown in Figure 4, described semiconductor switch K11 structure is by direct-current switch power supply 3, MOSFET control panel 5, MOSFET drive plate 4 and MOSFET module 6 constitute, the input of direct-current switch power supply 3 links to each other with the 220V alternating current, described MOSFET module 6 connects MOSFET drive plate 4, and described MOSFET drive plate 4 links to each other with MOSFET control panel 5 by optical fiber; MOSFET module 6 is selected for use withstand voltage greater than 50V, the operating current module greater than 50A; Direct-current switch power supply 3 power are 20w, and the dutycycle of the control signal of MOSFET control panel 5 (PWM modulation signal) is 0.089, and it is opened with the turn-off time than being 12us: 122us.
Preferably, the inductance among the described air core inductor group L11 is wound on the inductance framework by enamel covered wire, has lower internal resistance value, can guarantee that the decay of damped oscillation waveform is slower.
Preferably, six inductance among the described air core inductor group L11 evenly vertically stick on the inner surface of copper ball shell 2, guarantee that copper ball shell 2 is heated evenly.
Preferably, the external diameter of described copper ball shell 2 is 10cm, and wall thickness is 1mm, is that two hemispherical Shells are stitched together, and diameter is arranged at copper ball shell 2 tops is the hole of 1cm, is used for the lead of copper ball shell 2 inner connection inductance and the connecting line of temperature pick up 1 are drawn the copper ball shell.
Preferably, described dc source DC11 is rechargeable battery, and rechargeable battery selection work voltage is the lead accumulator of the big capacity (as 14Ah) of 48V, and this rechargeable battery is that 4 big capacity rechargeable batteries of 12V are composed in series.
As shown in Figure 5, it is the oscillogram of capacitance group C11 both end voltage of the present invention, as can be seen from this figure, when choosing by the parameter of embodiment shown in Fig. 1, press the control signal of MOSFET control panel embodiment illustrated in fig. 4 (corresponding to the dotted portion among Fig. 5, high level represents that the MOSFET control panel is open-minded, low level represents that the MOSFET control panel turn-offs) modulate after, make that the charge and discharge process of capacitance group C11 is continuous, thereby produce continuous concussion waveform (corresponding to the solid line part among Fig. 5).
Above disclosed only is preferred embodiment of the present invention; so can not limit interest field of the present invention with this; those skilled in the art utilize the technology contents of above-mentioned exposure to make a little simple modification, equivalent variations or modification, still belong within protection scope of the present invention.
Claims (8)
1. cable surrounding soil thermal parameter measurement sensor, it is characterized in that, mainly comprise dc source DC11, high-power current-limiting resistance R11, semiconductor switch K11, diode D11, capacitance group C11, air core inductor group L11, copper ball shell and temperature pick up;
Described dc source DC11 is used to whole thermal parameter measurement to power with sensor;
Described high-power current-limiting resistance R11, DC11 links to each other with dc source, is used for the electric current of limiting sensor charge circuit;
Described semiconductor switch K11 links to each other with high-power current-limiting resistance R11, is used for the charging control loop of sensor; Described semiconductor switch K11 works in charge circuit, does not participate in the oscillatory process of major loop;
Described diode D11, K11 links to each other with semiconductor switch, is used for insulation blocking, prevents the wave of oscillation counterattack current supply circuit of forward;
Described capacitance group C11 one end links to each other with diode D11, and other end ground connection is energy storage and the oscillating unit of whole device;
Described air core inductor group L11 is in parallel with capacitance group C11, for generation of the wave of oscillation and then produce the electromagnetic field of alternation at its two ends;
Described copper ball shell places air core inductor group L11 outside, owing to eddy-current loss is generated heat, is the heating module of whole sensor in the alternating electromagnetic field that air core inductor produces;
Described temperature pick up places copper ball shell inner surface, is used for measuring the temperature rise on copper ball shell surface.
2. cable surrounding soil thermal parameter measurement sensor according to claim 1 is characterized in that described capacitance group C11 comprises:
First capacitor C 21, the one end links to each other with Power Diode Pumped, other end ground connection;
Second capacitor C 22, in parallel with capacitor C 21;
The 3rd capacitor C 23, in parallel with capacitor C 22;
The 4th capacitor C 24, in parallel with capacitor C 23;
The 5th capacitor C 25, in parallel with capacitor C 24;
The 6th capacitor C 26, in parallel with capacitor C 25.
3. cable surrounding soil thermal parameter measurement sensor according to claim 1 is characterized in that, described air core inductor group L11 comprises:
First inductance L 21, the one end links to each other with capacitance group, other end ground connection;
Second inductance L 22, in parallel with inductance L 21;
The 3rd inductance L 23, in parallel with inductance L 22;
The 4th inductance L 24, in parallel with inductance L 23;
The 5th inductance L 25, in parallel with inductance L 24;
The 6th inductance L 26, in parallel with inductance L 25.
4. cable surrounding soil thermal parameter measurement sensor according to claim 1, it is characterized in that, described semiconductor switch K11 structure is by direct-current switch power supply, the MOSFET control panel, MOSFET drive plate and MOSFET module constitute, the input of direct-current switch power supply links to each other with the 220V alternating current, and described MOSFET module connects the MOSFET drive plate, and described MOSFET drive plate links to each other with the MOSFET control panel by optical fiber.
5. cable surrounding soil thermal parameter measurement sensor according to claim 1, it is characterized in that, inductance among the described air core inductor group L11 is wound on the inductance framework by enamel covered wire, has lower internal resistance value, can guarantee that the decay of damped oscillation waveform is slower.
6. cable surrounding soil thermal parameter measurement sensor according to claim 1 is characterized in that, six inductance among the described air core inductor group L11 evenly vertically stick on the inner surface of copper ball shell, guarantees that the copper ball shell is heated evenly.
7. cable surrounding soil thermal parameter measurement sensor according to claim 1, it is characterized in that, the external diameter of described copper ball shell is 10cm, wall thickness is 1mm, be that two hemispherical Shells are stitched together, diameter is arranged at copper ball shell top is the hole of 1cm, is used for the lead of the inner connection of copper ball shell inductance and the connecting line of temperature pick up are drawn the copper ball shell.
8. cable surrounding soil thermal parameter measurement sensor according to claim 1 is characterized in that described dc source DC11 is rechargeable battery.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201310190668.2A CN103243699B (en) | 2013-05-22 | 2013-05-22 | A kind of cable surrounding soil thermal parameter measurement sensor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310190668.2A CN103243699B (en) | 2013-05-22 | 2013-05-22 | A kind of cable surrounding soil thermal parameter measurement sensor |
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| CN103243699A true CN103243699A (en) | 2013-08-14 |
| CN103243699B CN103243699B (en) | 2015-12-23 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104897718A (en) * | 2015-05-08 | 2015-09-09 | 西安交通大学 | Deep soil thermal parameter monitoring sensor and detection method |
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| US4579461A (en) * | 1983-02-14 | 1986-04-01 | United States Steel Corporation | Dual sensor radiation pyrometer |
| CN2422643Y (en) * | 2000-05-25 | 2001-03-07 | 中国农业大学 | Soil moisture measuring sensor |
| CN201508338U (en) * | 2009-10-23 | 2010-06-16 | 中国建筑科学研究院 | Soil thermal property parameter measuring device |
| CN202204605U (en) * | 2011-08-12 | 2012-04-25 | 北京农业智能装备技术研究中心 | Soil temperature sensing and transmitting device |
| CN202372211U (en) * | 2011-12-29 | 2012-08-08 | 哈尔滨商业大学 | Soil temperature and humidity measuring instrument |
| CN102854214A (en) * | 2012-08-31 | 2013-01-02 | 中国建筑科学研究院 | Soil thermophysical property parameter measuring device and measuring method |
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2013
- 2013-05-22 CN CN201310190668.2A patent/CN103243699B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4579461A (en) * | 1983-02-14 | 1986-04-01 | United States Steel Corporation | Dual sensor radiation pyrometer |
| CN2422643Y (en) * | 2000-05-25 | 2001-03-07 | 中国农业大学 | Soil moisture measuring sensor |
| CN201508338U (en) * | 2009-10-23 | 2010-06-16 | 中国建筑科学研究院 | Soil thermal property parameter measuring device |
| CN202204605U (en) * | 2011-08-12 | 2012-04-25 | 北京农业智能装备技术研究中心 | Soil temperature sensing and transmitting device |
| CN202372211U (en) * | 2011-12-29 | 2012-08-08 | 哈尔滨商业大学 | Soil temperature and humidity measuring instrument |
| CN102854214A (en) * | 2012-08-31 | 2013-01-02 | 中国建筑科学研究院 | Soil thermophysical property parameter measuring device and measuring method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104897718A (en) * | 2015-05-08 | 2015-09-09 | 西安交通大学 | Deep soil thermal parameter monitoring sensor and detection method |
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