CN103260345A - Metal matrix metal foil plate and preparation method thereof - Google Patents
Metal matrix metal foil plate and preparation method thereof Download PDFInfo
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- CN103260345A CN103260345A CN2013101466451A CN201310146645A CN103260345A CN 103260345 A CN103260345 A CN 103260345A CN 2013101466451 A CN2013101466451 A CN 2013101466451A CN 201310146645 A CN201310146645 A CN 201310146645A CN 103260345 A CN103260345 A CN 103260345A
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Abstract
The invention discloses a metal matrix metal foil plate and a preparation method of the metal matrix metal foil plate. According to the metal matrix metal foil plate and the preparation method of the metal matrix metal foil plate, holes are formed in a metal substrate in advance, so that quality and efficiency of drilling on the metal matrix metal foil plate are greatly improved in a subsequent drilling machining process.
Description
Technical field
The present invention relates to the printed wiring board technical field, relate in particular to Metal Substrate clad with metal foil plate of a kind of prebored hole and preparation method thereof.
Background technology
The clad with metal foil plate is the basic material of electronics industry, is mainly used in the processing and manufacturing printed circuit board (pcb), extensively is used in electronic products such as television set, broadcast receiver, computer, computer, mobile communication.Along with high power, the development of high-density electronic device, for solving high power, the heat dissipation problem of high-density device, some Metal Substrate clad with metal foil plates have now appearred, it is by circuit layer, formations such as heat conductive insulating layer and metal-based layer, metal-based layer is generally thickness several millimeters aluminium sheet or copper coin approximately, earlier metal substrate coating one layer thickness be tens microns to the epoxy resin of hundreds of micron or be filled with the heat conductive insulating layer of heat-conducting metal particle, cover conductive metal layer (being generally copper foil plate) as circuit layer at this heat conductive insulating layer again, its heat radiation operation principle is: the power device surface mount is at circuit layer, the heat that device produces is transmitted to metal-based layer by insulating barrier, be diffused into module-external by metal substrate then, realize the heat radiation to device.Because the good thermolysis of Metal Substrate clad with metal foil plate, Metal Substrate clad with metal foil plate is used widely in high-power integrated circuit, circuit module encapsulation and power circuit assembling.
At present traditional two-sided Metal Substrate clad with metal foil plate is made as the double-sided metal substrate that compacting earlier has the three-decker of conductive metal layer, heat conductive insulating layer and metal-based layer, hole again afterwards and the PCB processing and fabricating, but, in the method, because the physical property of circuit layer, heat conductive insulating layer and metal-based layer differs bigger, thereby make that drilling parameter is difficult to adjust, drilling efficiency is lower, and quality also is difficult to guarantee.
Therefore, the Metal Substrate clad with metal foil plate of the improvement of drilling quality and efficient need be able to effectively be improved in this area.
Summary of the invention
The object of the present invention is to provide Metal Substrate clad with metal foil plate of a kind of boring in advance and preparation method thereof, make that by boring in advance in the follow-up boring course of processing of Metal Substrate clad with metal foil plate, quality and efficient that Metal Substrate clad with metal foil plate is holed have all obtained very large improvement.Its concrete scheme is as follows:
Of the present invention aspect first, a kind of prebored hole Metal Substrate clad with metal foil plate is provided, the conductive metal layer that described Metal Substrate clad with metal foil plate is covered by the outside of metal-based layer, heat conductive insulating layer that described metal-based layer one or both sides are covered and described heat conductive insulating layer constitutes, wherein the position that needs to hole in the boring processing of the downstream of described metal-based layer sets in advance through hole, the aperture of described through hole is more than or equal to required aperture in the boring processing of described downstream, and described through hole is filled by the material of described heat conductive insulating layer.
Prebored hole Metal Substrate clad with metal foil plate of the present invention can be two-sided or single face Metal Substrate clad with metal foil plate.
Wherein single face Metal Substrate clad with metal foil plate is made of metal-based layer, the conductive metal layer that covers the heat conductive insulating layer of metal-based layer one side and cover heat conductive insulating layer opposite side.Double-sided metal base clad with metal foil plate is made of metal-based layer, the conductive metal layer that covers the heat conductive insulating layer of metal-based layer both sides and cover the heat conductive insulating layer outside.
In prebored hole Metal Substrate clad with metal foil plate of the present invention, described conductive metal layer and described metal-based layer adopt identical or different metal independently of one another, and preferably, described metal is selected from the group of being made up of the alloy of copper, aluminium, iron or copper, aluminium, iron.
Aperture difference is excessive, and above-mentioned through hole is filled difficulty by the material of heat conductive insulating layer; Aperture difference is too small, and the heavy copper reliability of through hole is difficult to guarantee.In prebored hole Metal Substrate clad with metal foil plate of the present invention, the ratio in required aperture can be 1:1-20:1 in the aperture of described through hole and the boring processing of described downstream.
For further improving the heavy copper reliability of through hole, in prebored hole Metal Substrate clad with metal foil plate of the present invention, the ratio in required aperture can be 10:1-1.1:1 in the aperture of described through hole and the boring processing of described downstream.
For one going on foot the heavy copper reliability of raising through hole again, in prebored hole Metal Substrate clad with metal foil plate of the present invention, the ratio in required aperture can be 1.25:1 in the aperture of described through hole and the boring processing of described downstream.
In prebored hole Metal Substrate clad with metal foil plate of the present invention, the ratio in required aperture can be 20:1,15:1,10:1,8:1,5:1,4:1,3:1,2:1,1:0.80,1:0.81,1:0.82,1:0.83,1:0.84,1:0.85,1:0.86,1:0.87,1:0.88,1:0.89,1:0.90,1:0.91,1:0.92,1:0.93,1:0.94,1:0.95,1:0.96,1:0.97,1:0.98,1:0.99 or 1:1 in the aperture of described through hole and the boring processing of described downstream.
Aperture difference is excessive, and above-mentioned through hole is filled difficulty by the material of heat conductive insulating layer; Aperture difference is too small, and the heavy copper reliability of through hole is difficult to guarantee.In prebored hole Metal Substrate clad with metal foil plate of the present invention, the difference in required aperture can be in the 0.002mm-20mm scope in the aperture of described through hole and the boring processing of described downstream.
For further improving the heavy copper reliability of through hole, in prebored hole Metal Substrate clad with metal foil plate of the present invention, the difference in required aperture can be in the 0.10mm-10mm scope in the aperture of described through hole and the boring processing of described downstream.
For one going on foot the heavy copper reliability of raising through hole again, in prebored hole Metal Substrate clad with metal foil plate of the present invention, the difference in required aperture can be 0.15mm in the aperture of described through hole and the boring processing of described downstream.
In prebored hole Metal Substrate clad with metal foil plate of the present invention, the difference in required aperture can be 0.05mm, 0.10mm, 0.15mm, 0.20mm, 0.25mm, 0.30mm, 0.35mm, 0.45mm, 0.50mm, 0.55mm, 0.75mm, 0.85mm, 1.0mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 7.0mm, 8.0mm, 9.0mm, 10.0mm, 11.0mm, 12.0mm, 13.0mm, 14.0mm, 15.0mm, 16.0mm, 17.0mm, 18.0mm, 19.0mm or 20mm in the aperture of described through hole and the boring processing of described downstream
In prebored hole Metal Substrate clad with metal foil plate of the present invention, the thickness of described metal-based layer can be 0.105mm～5.0mm
In prebored hole Metal Substrate clad with metal foil plate of the present invention, the thickness of described metal-based layer can be 0.8mm-3.0mm.
Aspect second of the present invention, the manufacture method as first aspect described Metal Substrate clad with metal foil plate is provided, described method is included in the position that needs to hole on the described metal-based layer and sets in advance through hole in the boring processing of downstream.
In the manufacture method of Metal Substrate clad with metal foil plate of the present invention, the aperture of described through hole, number, position and rehearsal compound mode can add aperture, number, position and the permutation and combination that man-hour, needs were holed according to the practical application middle and lower reaches and decide.
The manufacture method of Metal Substrate clad with metal foil plate of the present invention can comprise:
(a) on being used as the metallic plate of metal-based layer, hole to obtain through hole according to needed bore position in the boring processing of downstream;
(b) will be stacked as metal forming, heat conductive insulating layer and the described metal-based layer of conductive metal layer;
(c) material after stacked is carried out lamination, in lamination process, the material of heat conductive insulating layer is filled in the described through hole, obtains described Metal Substrate clad with metal foil plate; With
(d) randomly, described Metal Substrate clad with metal foil plate is carried out follow-up PCB processing, for example hole, change copper and copper facing, exposure imaging+image transfer, etching and anti-welding.
In the manufacture method of Metal Substrate clad with metal foil plate of the present invention, described lamination can be undertaken by heating, pressurization and/or vacuum.
Beneficial effect of the present invention:
(1) Metal Substrate clad with metal foil plate of the present invention can effectively improve the efficient of downstream boring processing and the quality of boring;
(2) hole wall in the hole that obtains in boring processing back, downstream of Metal Substrate clad with metal foil plate of the present invention is the heat conductive insulating layer of homogeneous, can significantly improve the associativity with copper, improves the quality of downstream copper facing processing;
(3) Metal Substrate clad with metal foil plate of the present invention is made and to be simple and easy to, and is suitable for actual production and application.
Description of drawings
Fig. 1 is the metal-based layer structural representation of not holing.
Fig. 2 is the metal-based layer structural representation of holing in advance.
Fig. 3 is the folded fore-telling cross sectional representation of not carrying out the preceding double-sided metal base clad with metal foil plate of lamination.
Fig. 4 is the double-sided metal base clad with metal foil plate cross sectional representation behind the lamination.
Fig. 5 is the cross sectional representation of double-sided metal base clad with metal foil plate after boring processing.
Fig. 6 is the cross sectional representation of double-sided metal base clad with metal foil plate after boring copper facing.
Embodiment
Further specify technical scheme of the present invention below in conjunction with accompanying drawing and by embodiment.
Embodiment 1 Metal Substrate clad with metal foil plate as described in Figure 4
As shown in Figure 4, described Metal Substrate clad with metal foil plate 400 comprises conductive metal layer 401, heat conductive insulating layer 402 and metal-based layer 403, wherein set in advance through hole 404 in the position that needs to hole on the metal-based layer 403 in the boring processing of downstream, the aperture of described through hole 404 is more than or equal to required aperture in the boring processing of described downstream.Metal Substrate clad with metal foil plate 400 also can be single face Metal Substrate clad with metal foil plate.The ratio in required aperture can be 1:1-1:0.8 in the aperture of described through hole 404 and the boring processing of described downstream, is preferably 1:0.95-1:0.85, more preferably is 1:0.9.The difference in required aperture can preferably in the 0.01mm-10mm scope, more preferably be 0.15mm in the 0.002mm-20mm scope in the aperture of described through hole 404 and the boring processing of described downstream.The thickness of described metal-based layer 403 can be 0.105mm-5.0mm, is preferably 0.8mm-3.0mm.
The manufacturing process of embodiment 2 Metal Substrate clad with metal foil plates of the present invention:
1) get required size size, thickness metallic plate (for example: the alloy of copper coin, aluminium sheet, iron plate or copper, aluminium, iron, thickness: 0.105mm～5.0mm) is as Fig. 1;
2) boring in advance on metallic plate.The rehearsal compound mode in the number in aperture, hole, the position in hole and hole adds aperture, number, position and the permutation and combination that man-hour, needs were holed according to the practical application middle and lower reaches decides, as Fig. 2.
3) folded fore-telling, in the middle of hole-drilled aluminium sheet places on request, the two sides be covered with the heat conductive insulating layer (the heat conductive insulating layer can be impregnation partly solidified glass paper, impregnation after partly solidified glass cloth or do not have the glued membrane of reinforcing material), be covered with conductive metal layer on the heat conductive insulating layer again, see Fig. 3 schematic diagram, wherein 301 is that conductive metal layer, 302 is that heat conductive insulating layer, 303 is that metal-based layer and 304 is through hole;
4) double-sided metal base clad with metal foil plate (Fig. 3) laminated material that will not carry out lamination heats, pressurizes, arranges appropriate vacuum degree, vacuum ranges is: 30Pa～101000Pa, also can as nitrogen, helium etc. above-mentioned appropriate vacuum degree be set by feeding inert gas; It should be noted that if take to feed the technology of inert gas lamination, vacuum degree can be greater than an atmospheric pressure.After the suitable vacuum degree being set or feeding inert gas, carry out lamination, in lamination process, the material of heat conductive insulating layer will be filled in the through hole, obtain double-sided metal base clad with metal foil board finished product, see Fig. 4;
5) randomly, can carry out follow-up PCB processing with carrying out double-sided metal base clad with metal foil board finished product, for example: boring (see figure 5), the copper+copper facing (see figure 6) of changing, exposure imaging+image transfer, etching, anti-welding etc.
The downstream boring processing of embodiment 3 Metal Substrate clad with metal foil plates of the present invention
In the boring of Metal Substrate clad with metal foil plate processing, the variation of the material layer that need contact according to drill bit and constantly adjust drilling parameter.When Metal Substrate clad with metal foil plate of the present invention is holed, as shown in Figure 5, wherein owing to preset through hole 504 at metal-based layer 503, therefore an order has been passed through conductive metal layer 501 in the downstream boring processing that forms hole 505, heat conductive insulating layer 502 and conductive metal layer 501, and no longer pass through metal-based layer 503, so, in the boring course of processing, adjustment to drilling parameter is simplified greatly, effectively improved the efficient of boring processing, and, because the outer wall materials in hole 505 homogeneous more, be the material that its overwhelming majority is heat conductive insulating layer 502, the quality of the processing of therefore holing is corresponding being improved also.
The downstream boring copper facing of embodiment 4 Metal Substrate clad with metal foil plates of the present invention
After processing that Metal Substrate clad with metal foil plate of the present invention is holed, also can carry out copper facing processing as required, as shown in Figure 6, wherein owing to preset through hole 604 at metal-based layer 603, therefore the outer wall materials in the formed hole 605 of downstream boring processing homogeneous more, it is the material that its overwhelming majority is heat conductive insulating layer 602, compare with the metal material of metal-based layer 603, what copper often was combined with the insulating material of heat conductive insulating layer 602 in the copper facing processing is better, therefore when adopting Metal Substrate clad with metal foil plate of the present invention, the copper layer 606 that plates does not contact with the metal material of metal-based layer 603 but the overwhelming majority contacts with the insulating material of heat conductive insulating layer 602, thereby the quality of copper facing processing is also corresponding to have obtained very big improvement.
Applicant's statement, the present invention illustrates detailed construction feature of the present invention and method by above-described embodiment, but the present invention is not limited to above-mentioned detailed construction feature and method, does not mean that namely the present invention must rely on above-mentioned detailed construction feature and method could be implemented.The person of ordinary skill in the field should understand, any improvement in the present invention to the increase of the equivalence replacement of the selected parts of the present invention and accessory, the selection of concrete mode etc., all drops within protection scope of the present invention and the open scope.
Claims (9)
1. Metal Substrate clad with metal foil plate, described Metal Substrate clad with metal foil plate is by metal-based layer, the conductive metal layer that the heat conductive insulating layer that the one or both sides of described metal-based layer are covered and the outside of described heat conductive insulating layer are covered constitutes, wherein said, it is characterized in that, the position that needs to hole in the boring processing of the downstream of described metal-based layer sets in advance through hole, the aperture of described through hole is more than or equal to required aperture in the boring processing of described downstream, and described through hole is filled by the material of described heat conductive insulating layer, preferably, the difference in required aperture is in the 0.002mm-20mm scope in the aperture of described through hole and the boring processing of described downstream, more preferably in the 0.10mm-10mm scope, be most preferably 0.15mm.
2. Metal Substrate clad with metal foil plate as claimed in claim 1, it is two-sided or single face Metal Substrate clad with metal foil plate.
3. Metal Substrate clad with metal foil plate as claimed in claim 1 or 2, wherein said conductive metal layer and described metal-based layer adopt identical or different metal independently of one another, preferably, described metal is selected from the group of being made up of the alloy of copper, aluminium, iron or copper, aluminium, iron, more preferably, affiliated metal-based layer is aluminium, and conductive metal layer is selected from copper or aluminium.
4. as each described Metal Substrate clad with metal foil plate among the claim 1-3, the ratio in required aperture is 1:1-20:1 in wherein said through hole and the boring processing of described downstream, is preferably 10:1-1.1:1, more preferably is 1.25:1.
5. as each described Metal Substrate clad with metal foil plate among the claim 1-4, the thickness of wherein said metal-based layer is 0.105mm～5.0mm, is preferably 0.8mm-3.0mm.
6. as the manufacture method of the described Metal Substrate clad with metal foil of claim 1-5 plate, described method is included in the position that needs to hole on the described metal-based layer and sets in advance through hole in the boring processing of downstream.
7. manufacture method as claimed in claim 6, the aperture of wherein said through hole, number, position and rehearsal compound mode add aperture, number, position and the permutation and combination that man-hour, needs were holed according to the practical application middle and lower reaches and decide.
8. as claim 6 or 7 described manufacture methods, described method comprises:
(a) on being used as the metallic plate of metal-based layer, hole to obtain through hole according to needed bore position in the boring processing of downstream;
(b) will be stacked as metal forming, heat conductive insulating layer and the described metal-based layer of conductive metal layer;
(c) material after stacked is carried out lamination, in lamination process, the material of heat conductive insulating layer is filled in the described through hole, obtains described Metal Substrate clad with metal foil plate; With
(d) randomly, described Metal Substrate clad with metal foil plate is carried out follow-up PCB processing, for example hole, change copper and copper facing, exposure imaging and image transfer, etching and/or anti-welding.
9. as each described manufacture method among the claim 6-8, wherein said lamination is undertaken by heating, pressurization and/or vacuum.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310146645.1A CN103260345B (en) | 2013-04-24 | 2013-04-24 | A kind of Metal Substrate metal-clad foil plate and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310146645.1A CN103260345B (en) | 2013-04-24 | 2013-04-24 | A kind of Metal Substrate metal-clad foil plate and preparation method thereof |
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| CN103260345A true CN103260345A (en) | 2013-08-21 |
| CN103260345B CN103260345B (en) | 2016-08-03 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104902697A (en) * | 2014-03-05 | 2015-09-09 | 深南电路有限公司 | A manufacturing method for metalized blind holes and a circuit board having the metalized blind holes |
| TWI666979B (en) * | 2018-06-11 | 2019-07-21 | 欣興電子股份有限公司 | Circuit board and manufacturing method thereof |
| CN110519927A (en) * | 2019-08-05 | 2019-11-29 | 江西志博信科技股份有限公司 | A method of improving HDI cable plate exposure accuracy |
| CN113045856A (en) * | 2019-12-28 | 2021-06-29 | 广东生益科技股份有限公司 | Bonding sheet, preparation method thereof and metal-clad laminate comprising bonding sheet |
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| JPH06152089A (en) * | 1992-10-09 | 1994-05-31 | Internatl Business Mach Corp <Ibm> | Printed wiring board and its manufacture |
| US5774336A (en) * | 1996-02-20 | 1998-06-30 | Heat Technology, Inc. | High-terminal conductivity circuit board |
| US20040107569A1 (en) * | 2002-12-05 | 2004-06-10 | John Guzek | Metal core substrate packaging |
| CN203722921U (en) * | 2013-04-24 | 2014-07-16 | 广东生益科技股份有限公司 | Metal based tinsel coated plate |
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2013
- 2013-04-24 CN CN201310146645.1A patent/CN103260345B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06152089A (en) * | 1992-10-09 | 1994-05-31 | Internatl Business Mach Corp <Ibm> | Printed wiring board and its manufacture |
| US5774336A (en) * | 1996-02-20 | 1998-06-30 | Heat Technology, Inc. | High-terminal conductivity circuit board |
| US20040107569A1 (en) * | 2002-12-05 | 2004-06-10 | John Guzek | Metal core substrate packaging |
| CN203722921U (en) * | 2013-04-24 | 2014-07-16 | 广东生益科技股份有限公司 | Metal based tinsel coated plate |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104902697A (en) * | 2014-03-05 | 2015-09-09 | 深南电路有限公司 | A manufacturing method for metalized blind holes and a circuit board having the metalized blind holes |
| TWI666979B (en) * | 2018-06-11 | 2019-07-21 | 欣興電子股份有限公司 | Circuit board and manufacturing method thereof |
| CN110519927A (en) * | 2019-08-05 | 2019-11-29 | 江西志博信科技股份有限公司 | A method of improving HDI cable plate exposure accuracy |
| CN113045856A (en) * | 2019-12-28 | 2021-06-29 | 广东生益科技股份有限公司 | Bonding sheet, preparation method thereof and metal-clad laminate comprising bonding sheet |
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| CN103260345B (en) | 2016-08-03 |
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