CN103325808A - Display device and manufacturing method thereof - Google Patents
Display device and manufacturing method thereof Download PDFInfo
- Publication number
- CN103325808A CN103325808A CN201210072583XA CN201210072583A CN103325808A CN 103325808 A CN103325808 A CN 103325808A CN 201210072583X A CN201210072583X A CN 201210072583XA CN 201210072583 A CN201210072583 A CN 201210072583A CN 103325808 A CN103325808 A CN 103325808A
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- China
- Prior art keywords
- display unit
- led panel
- organic led
- thin film
- base plate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
Abstract
The invention discloses a display device and a manufacturing method of the display device. The display device comprises a frame, an organic light-emitting diode panel, a light-transmitting element and a glue material. The organic light-emitting diode panel is arranged in the frame. The light-transmitting element is arranged on the organic light-emitting diode panel. The glue material is arranged between the organic light-emitting diode panel and the light-transmitting element and between the organic light-emitting diode panel and the frame in a filling mode.
Description
Technical field
The present invention relates to a kind of display unit and manufacture method thereof, and particularly relate to a kind of organic LED display device and manufacture method thereof.
Background technology
Along with the development that shows science and technology, various display unit is constantly weeded out the old and bring forth the new.Wherein Organic Light Emitting Diode has that self-luminosity, volume are little, the chroma advantages of higher, so that Organic Light Emitting Diode is described as the rising star who shows science and technology.
In the process of development Organic Light Emitting Diode, the researcher finds that Organic Light Emitting Diode quite easily is subject to the destruction of moisture or oxygen, and the life-span of the Organic Light Emitting Diode that significantly detracts.The researcher adopts various designs to increase water preventing ability and the oxygen barrier of Organic Light Emitting Diode, but the manufacture craft speed of the Organic Light Emitting Diode that slows down.Therefore, the Organic Light Emitting Diode front is just before the bottleneck of a technical development.
Summary of the invention
The object of the present invention is to provide a kind of display unit and manufacture method thereof, it utilizes the glue material to insert design between organic LED panel and the framework, so that display unit can reach high water resistance, high oxygen barrier, and the fireballing advantage of manufacture craft.
For reaching above-mentioned purpose, according to an aspect of the present invention, a kind of display unit is proposed.Display unit comprises a framework, an organic LED panel, a translucent element and a glue material.Organic LED panel is arranged in the framework.Translucent element is arranged on the organic LED panel.The glue material is filled between organic LED panel and the translucent element, and is filled between organic LED panel and the framework.
A kind of manufacture method of display unit is proposed according to a further aspect in the invention.The manufacture method of display unit may further comprise the steps.One organic LED panel is provided.Be coated with a glue material on organic LED panel.Organic LED panel is set in a framework.One translucent element is set on the glue material.Pressing translucent element and organic LED panel so that the glue material is filled between organic LED panel and the translucent element, and are filled between organic LED panel and the framework.
For foregoing of the present invention can be become apparent, embodiment cited below particularly, and cooperate appended accompanying drawing, be described in detail below:
Description of drawings
Fig. 1 is the schematic diagram of display unit of the present invention;
Fig. 2～Fig. 9 is the flow chart of the manufacture method of display unit of the present invention.
The main element symbol description
100: display unit
110: framework
120: organic LED panel
120a: upper surface
120b: side surface
121: thin film transistor base plate
122: light-emitting diode
123: protective layer
124: frame glue
125: colored filter substrate
126: packing material
130: translucent element
140: the glue material
D1: highly
D2: sum total thickness
L1, L2: ultraviolet light
Embodiment
Below propose various embodiment and be elaborated, it adopts the glue material to insert design between organic LED panel and the framework, so that display unit can reach high water resistance, high oxygen barrier, and the fireballing advantage of manufacture craft.Yet embodiment is only in order to as example explanation, scope that can't limit wish protection of the present invention.In addition, the accompanying drawing clipped element among the embodiment is with clear demonstration technical characterstic of the present invention.
Please refer to Fig. 1, it illustrates the schematic diagram of display unit 100.Display unit 100 comprises a framework 110, an organic LED panel 120, a translucent element 130 and a glue material 140.Framework 110 for example is a chase in order to the inner member of carrying and protection display unit 100.Organic LED panel 120 for example is active or passive type.Organic LED panel 120 is arranged in the framework 110.Translucent element 130 for example is a panel or a blooming piece, wherein above-mentioned panel for example a contact panel or a 2D/3D switch panel, above-mentioned blooming piece is a polaroid, a phase delay chip, a lenticular lenses (barrier) or a lens pillar sheet (lenticular lens) for example.Translucent element 130 is arranged on the organic LED panel 120, and wherein translucent element 130 can be arranged in the framework 110 simultaneously with organic LED panel 120, and also light-permeable element 130 partly or entirely is exposed to outside the framework 110.Glue material 140 is filled between organic LED panel 120 and the translucent element 130, in order to bonding organic LED panel 120 and translucent element 130.In addition, glue material 140 more is filled between organic LED panel 120 and the framework 110.
Wherein organic LED panel 120 easily is subject to the destruction of moisture or oxygen and detracts the life-span.The glue material 140 of the present embodiment not only is filled between organic LED panel 120 and the translucent element 130 to bind translucent element 130 and organic LED panel 120; the upper surface 120a of organic LED panel 120 and side surface 120b more be filled between organic LED panel 120 and the framework 110, so that can both be subject to further protection.
In the present embodiment, in order to allow the side surface 120b of organic LED panel 120 be subject to enough protections, the filling rate of glue material 140 between organic LED panel 120 and framework 110 for example is greater than 70% or greater than 90% at least greater than 50%.The designer can be according to the selection of glue material 140 materials and manufacture craft speed consider to do design.
With regard to the manufacture method of display unit 100, please refer to Fig. 2～Fig. 9, it illustrates the flow chart of the manufacture method of display unit 100.At first, such as Fig. 2～shown in Figure 5, provide organic LED panel 120 (being illustrated in Fig. 5).In the step that organic LED panel 120 is provided, at first as shown in Figure 2, provide a thin film transistor base plate 121.Thin film transistor base plate 121 is in order to provide one drive circuit.
Then, as shown in Figure 2, several Organic Light Emitting Diodes 122 are set on thin film transistor base plate 121.These a little Organic Light Emitting Diodes 122 can be white light or colour (for example being red, green, blueness).In the present embodiment, these a little light-emitting diodes 122 are white light.These a little Organic Light Emitting Diodes 122 can be arrayed, to form the one by one pixel of matrix arrangement.
Then, as shown in Figure 2, cover these a little Organic Light Emitting Diodes 122 with a protective layer 123, to avoid follow-up manufacture craft to destroy light-emitting diode 122 is arranged.
Then, as shown in Figure 3, a frame glue 124 is set around thin film transistor base plate 121.The height D1 of frame glue 124 is greater than the sum total thickness D2 of Organic Light Emitting Diode 122 and protective layer 123.
Then, as shown in Figure 3, under the environment that vacuumizes, (one drop filling, ODF) is arranged at a packing material 126 on the thin film transistor base plate 121 with the manufacture craft of dripping.Generally speaking, Organic Light Emitting Diode 122 has rugged situation, and the protective layer 123 that arranges thereon also has rugged situation.The employing manufacture craft of dripping can guarantee that packing material 126 can be covered with in rugged protective layer 123.
Then, as shown in Figure 4, under the environment that vacuumizes, a colored filter substrate 125 is set on frame glue 124.In other embodiments, when Organic Light Emitting Diode 122 when being colored, can change in this step and a transparent protective substrate (not illustrating) is set on frame glue 124.
Then; as shown in Figure 5; under the environment that vacuumizes; along with the combination of colored filter substrate 125 with frame glue 124; packing material 126 is in protective layer 123 diffusions; until packing material 126 is filled between colored filter substrate 125, frame glue 124 and the thin film transistor base plate 121 fully, and residue between colored filter substrate 125, frame glue 124 and the thin film transistor base plate 121 without any moisture content or oxygen.
Then, as shown in Figure 5, with a ultraviolet light L1 (or a thermal source) curing filler material 126 and frame glue 124.So far, namely finish organic LED panel 120.At this moment, Organic Light Emitting Diode 122 has been protected layer 123 and the complete protection of packing material 126.
In one embodiment, frame glue 124 also can only be set assemble colored filter substrate 125 and thin film transistor base plate 121, and not adopt the packing material 126 of the manufacture craft of dripping (ODF).
In one embodiment, also can use optical adhesive film (optically clear adhesive film, OCA film) (do not illustrate) and directly fit on the Organic Light Emitting Diode 122, and do not adopt the packing material 126 of the manufacture craft of dripping (ODF).
The execution mode that frame glue 124 only is set can stay the space between colored filter substrate 125 and thin film transistor base plate 121, and makes moisture or oxygen easily infiltrate this space.And, be water preventing ability and the oxygen barrier of guaranteeing frame glue 124, must additionally use laser (not illustrating) that each frame glue is strengthened solidifying one by one, and increase manufacturing cost and slow down manufacture craft speed.
Adopt the execution mode of optical adhesive film (OCA film) between rugged Organic Light Emitting Diode 122, still can have minim gap, and make moisture or oxygen easily infiltrate this minim gap.
In comparison, the drip execution mode of packing material 126 of manufacture craft (ODF) of employing can avoid moisture or oxygen to residue between colored filter substrate 125, frame glue 124 and the thin film transistor base plate 121, with the life-span that prolongs Organic Light Emitting Diode 122 and the optical appearance of guaranteeing Organic Light Emitting Diode 122.And, adopt the execution mode of the packing material 126 of the manufacture craft (ODF) of dripping can use ultraviolet light L1 (or thermal source) to do whole ground curing, so that manufacturing cost is able to cheap and manufacture craft speed is quick.
The step that then enters Fig. 6 and Fig. 7 is provided after the organic LED panel 120 with above-mentioned variety of way.
In Fig. 6 and Fig. 7, glue coating material 140 is on organic LED panel 120.This glue material 140 for example is optical cement fat (OCR).In Fig. 6, can be coated with fifty-fifty first some zones, again these a little glue materials 140 brushes are opened and be covered with on organic LED panel 120.In Fig. 7, glue material 140 directly can be done whole property ground coating.
In this step, because the upper surface 120a of organic LED panel 120 is quite smooth, so glue material 140 can be coated on the organic LED panel 120 very close to each otherly.
In this step, the penetration by water rate of glue material 140 (water vapor transmission rate, WVTR) less than 20 gram/every square metre-every day (g/m
2-day), to guarantee the high water resistance of glue material 140.The oxygen penetrance of glue material 140 (oxygen transmission rate, OTR) is less than 1 * 10
-3Milliliter/every square metre-every day (cc/m
2-day), to guarantee the high oxygen barrier of glue material 140.The optics penetrance of glue material 140 is greater than 90%, to guarantee the high light transmittance of glue material 140.
Then, as shown in Figure 8, organic LED panel 120 is set in framework 110.
Then, as shown in Figure 8, translucent element 130 is set on glue material 140.
Then, as shown in Figure 8, pressing translucent element 130 and organic LED panel 120, so that glue material 140 is filled between organic LED panel 120 and the translucent element 130, and glue material 140 is overflowed and sees through capillarity and be filled between organic LED panel 120 and the framework 110.
In the step of pressing, can be controlled under the environment of bleeding that reduces pressure (for example is 50～1Pa), to help between glue material 140 infiltration organic LED panels 120 and the framework 110.
Then, as shown in Figure 9, solidify glue material 140 with a ultraviolet light L2 (or a thermal source).So far, namely finish display unit 100.
As mentioned above; Organic Light Emitting Diode 122 is subject to four layers protection at least: ground floor is the protection of protective layer 123; the second layer is the protection of encapsulating material 126; the 3rd layer is the protection of glue material 140; the 4th layer is the protection of framework 110, so that Organic Light Emitting Diode 122 can be avoided the destruction of moisture and oxygen effectively.
In sum, though disclosed the present invention in conjunction with above embodiment, it is not to limit the present invention.Be familiar with in the technical field of the invention this operator, without departing from the spirit and scope of the present invention, can be used for a variety of modifications and variations.Therefore, protection scope of the present invention should with enclose claim was defined is as the criterion.
Claims (20)
1. display unit comprises:
Framework;
Organic LED panel is arranged in this framework;
Translucent element is arranged on this organic LED panel; And
The glue material is filled between this organic LED panel and this translucent element, and is filled between this organic LED panel and this framework.
2. display unit as claimed in claim 1, wherein the penetration by water rate of this glue material (water vapor transmission rate, WVTR) less than 20 gram/every square metre-every day (g/m
2-day).
3. display unit as claimed in claim 1, wherein the oxygen penetrance of this glue material (oxygen transmission rate, OTR) is less than 1 * 10
-3Milliliter/every square metre-every day (cc/m
2-day).
4. display unit as claimed in claim 1, wherein the optics penetrance of this glue material is greater than 90%.
5. display unit as claimed in claim 1, wherein this translucent element is a panel.
6. display unit as claimed in claim 1, wherein this translucent element is a blooming piece.
7. display unit as claimed in claim 1, wherein the filling rate of this glue material between this organic LED panel and this framework is greater than 90%.
8. display unit as claimed in claim 1, wherein this glue material is ultraviolet photocureable material or thermosetting material.
9. display unit as claimed in claim 1, wherein this organic LED panel comprises:
Thin film transistor base plate;
A plurality of Organic Light Emitting Diodes are arranged on this thin film transistor base plate, and those Organic Light Emitting Diodes are white light;
Protective layer covers those Organic Light Emitting Diodes;
Frame glue, be arranged at this thin film transistor base plate around;
Colored filter substrate is arranged on this frame glue; And
Packing material is arranged between this colored filter substrate, this frame glue and this thin film transistor base plate.
10. display unit as claimed in claim 1, wherein this organic LED panel comprises:
Thin film transistor base plate;
A plurality of Organic Light Emitting Diodes are arranged on this thin film transistor base plate, and those Organic Light Emitting Diodes are colored;
Protective layer covers those white organic LEDs;
Frame glue, be arranged at this thin film transistor base plate around;
Protective substrate is arranged on this frame glue; And
Packing material is arranged between this protective substrate, this frame glue and this thin film transistor base plate.
11. the manufacture method of a display unit comprises:
One organic LED panel is provided;
Be coated with a glue material on this organic LED panel;
This organic LED panel is set in a framework;
One translucent element is set on this glue material; And
This translucent element of pressing and this organic LED panel so that this glue material is filled between this organic LED panel and this translucent element, and are filled between this organic LED panel and this framework.
12. the manufacture method of display unit as claimed in claim 11, wherein the step of this translucent element of pressing and this organic LED panel be this glue material is filled between this organic LED panel and this translucent element and this glue material of part from overflowing to be filled between this organic LED panel and this framework between this organic LED panel and this translucent element.
13. the manufacture method of display unit as claimed in claim 11, wherein the coating this glue material step in, the penetration by water rate of this glue material (water vapor transmission rate, WVTR) less than 20 gram/every square metre-every day (g/m
2-day).
14. the manufacture method of display unit as claimed in claim 11, wherein in the step of this glue material of coating, the oxygen penetrance of this glue material (oxygen transmission rate, OTR) is less than 1 * 10
-3Milliliter/every square metre-every day (cc/m
2-day).
15. the manufacture method of display unit as claimed in claim 11, wherein in the step of this glue material of coating, the optics penetrance of this glue material is greater than 90%.
16. the manufacture method of display unit as claimed in claim 11, wherein in the step of this translucent element was provided, this translucent element was a panel or a blooming piece.
17. the manufacture method of display unit as claimed in claim 11, wherein in the step of this translucent element of pressing and this organic LED panel, the filling rate of this glue material between this organic LED panel and this framework is greater than 90%.
18. the manufacture method of display unit as claimed in claim 11 also comprises:
Solidify this glue material with a ultraviolet light or a thermal source.
19. the manufacture method of display unit as claimed in claim 11 wherein provides the step of this OLED panel to comprise:
One thin film transistor base plate is provided;
A plurality of Organic Light Emitting Diodes are set on this thin film transistor base plate, those Organic Light Emitting Diodes are white light;
Cover those Organic Light Emitting Diodes with a protective layer;
One frame glue is set around this thin film transistor base plate;
(one drop filling, ODF) is arranged at a packing material on this thin film transistor base plate with the manufacture craft of dripping; And
One colored filter substrate is set on this frame glue, so that this packing material is arranged between this colored filter substrate, this frame glue and this thin film transistor base plate.
20. the manufacture method of display unit as claimed in claim 11 wherein provides the step of this OLED panel to comprise:
One thin film transistor base plate is provided;
A plurality of Organic Light Emitting Diodes are set on this thin film transistor base plate, those Organic Light Emitting Diodes are colored;
Cover those Organic Light Emitting Diodes with a protective layer;
One frame glue is set around this thin film transistor base plate;
(one drop filling, ODF) is arranged at a packing material on this thin film transistor base plate with the manufacture craft of dripping; And
One protective substrate is set on this frame glue, so that this packing material is arranged between this protective substrate, this frame glue and this thin film transistor base plate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210072583.XA CN103325808B (en) | 2012-03-19 | 2012-03-19 | Display unit and manufacture method thereof |
| CN201610284142.4A CN105845709B (en) | 2012-03-19 | 2012-03-19 | Display device and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210072583.XA CN103325808B (en) | 2012-03-19 | 2012-03-19 | Display unit and manufacture method thereof |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610284142.4A Division CN105845709B (en) | 2012-03-19 | 2012-03-19 | Display device and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103325808A true CN103325808A (en) | 2013-09-25 |
| CN103325808B CN103325808B (en) | 2016-06-08 |
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|---|---|---|---|
| CN201210072583.XA Active CN103325808B (en) | 2012-03-19 | 2012-03-19 | Display unit and manufacture method thereof |
| CN201610284142.4A Active CN105845709B (en) | 2012-03-19 | 2012-03-19 | Display device and its manufacturing method |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610284142.4A Active CN105845709B (en) | 2012-03-19 | 2012-03-19 | Display device and its manufacturing method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103730067A (en) * | 2013-11-22 | 2014-04-16 | 上海和辉光电有限公司 | AMOLED module structure and assembly method thereof |
| CN104460056A (en) * | 2013-09-16 | 2015-03-25 | 元太科技工业股份有限公司 | Method for manufacturing display module |
| WO2016049945A1 (en) * | 2014-09-30 | 2016-04-07 | 深圳市华星光电技术有限公司 | White light oled display and encapsulation method therefor |
| CN108207063A (en) * | 2014-03-10 | 2018-06-26 | 株式会社小糸制作所 | Illuminator and lamps and lanterns |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108538763B (en) * | 2018-04-24 | 2020-05-15 | 京东方科技集团股份有限公司 | Heating assembly, packaging device and packaging method |
| CN109860424A (en) * | 2019-02-26 | 2019-06-07 | 固安翌光科技有限公司 | A kind of flexible OLED screen body with outer protection structure |
| CN110048018B (en) * | 2019-04-02 | 2020-06-16 | 深圳市华星光电半导体显示技术有限公司 | Display packaging structure and manufacturing method thereof |
| CN111584745A (en) * | 2020-05-13 | 2020-08-25 | 深圳市华星光电半导体显示技术有限公司 | Display panel and method for manufacturing the same |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN105845709B (en) | 2019-06-04 |
| CN103325808B (en) | 2016-06-08 |
| CN105845709A (en) | 2016-08-10 |
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Address after: 518109 Guangdong, Shenzhen, town, Foxconn science and Technology Industrial Park E District, building 4, building 1, building Applicant after: Qunkang Technology (Shenzhen) Co., Ltd. Applicant after: Innolux Display Group Address before: 518109 Guangdong, Shenzhen, town, Foxconn science and Technology Industrial Park E District, building 4, building 1, building Applicant before: Qunkang Technology (Shenzhen) Co., Ltd. Applicant before: Chimei Optoelectronics Co., Ltd. |
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