CN103425066A - Wafer batch operation dynamic processing system and method - Google Patents
Wafer batch operation dynamic processing system and method Download PDFInfo
- Publication number
- CN103425066A CN103425066A CN2013103335801A CN201310333580A CN103425066A CN 103425066 A CN103425066 A CN 103425066A CN 2013103335801 A CN2013103335801 A CN 2013103335801A CN 201310333580 A CN201310333580 A CN 201310333580A CN 103425066 A CN103425066 A CN 103425066A
- Authority
- CN
- China
- Prior art keywords
- batch jobs
- batch
- sets
- wafers
- last time
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention discloses a wafer batch operation dynamic processing system which comprises a batch operation creating module, a wafer group gathering module, a batch operation dynamic updating module, a batch operation status judging module and an operation result feedback module. The invention further discloses a wafer batch operation dynamic processing method. The method includes the steps: creating present batch operation; gathering wafer groups of the present batch operation; judging a completion status of wafer group gathering of the present batch operation and a completion status of previous batch operation; dynamically updating the present batch operation till the previous batch operation is completed; and feeding back an operation result of the previous batch operation to enable the present batch operation to start or revoke. Production efficiency and yield of batch operation equipment are maximized through feedback control, on whether the present batch operation can be started or not, of dynamic changes of the wafer groups in batch operation and the operation result of the previous batch operation.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors, relate in particular to semiconductor manufacturing execution system (MES, Manufacturing Execution System) and equipment automatization system (EAP, Equipment Automation Process), specifically a kind of batch wafer operation DPS and disposal route thereof.
Background technology
Semiconductor chip fabrication technological process at present becomes increasingly complex various, and the production cycle is also more and more longer, and the required activity durations of batch jobs operation website such as boiler tube are particularly outstanding than other technique websites.The equipment such as boiler tube have the longer activity duration, with the batch(batch jobs, there is identical operating condition in the batch jobs equipment sites, can be simultaneously the lot(sets of wafers of operation together, the set of the wafer of same process flow is arranged, maximum 25) set) characteristics of carrying out operation for unit, before the batch operation, need in MES, create in advance the relation (create batch sets up batch jobs) of batch and lot.
Chinese patent (publication number: CN102768941A) disclose the method and apparatus that a kind of batch processing board is sent goods, the method is carried out the current formulation parameter of the pending wafer set of the formulation parameter of operation and this batch processing board in the batch processing board by each wafer set relatively, the current operation of priority processing formulation parameter same wafer group, send goods to the batch processing board, make the batch processing board obtain as early as possible can batch processing together with pending wafer set wafer set, thereby reduced the stand-by period of sending goods, guarantee to send correctness and the dirigibility of goods, avoid can sending goods to make the batch processing board can't carry out the problem of batch processing for the wafer set of batch processing owing to lacking, therefore improve production efficiency and saved the cost that semiconductor is manufactured.
(publication number: CN 102810457A) disclose a kind of method that system prompt stops the sheet rule and can carry out batch processing, comprise the following steps: to all technique on production line, by stopping, whether the sheet rule is identical is classified Chinese patent; Defined respectively with reference to technique and can, with reference to technique, each have been defined and stop the sheet rule with reference to technique by different classes of; The GUI Program is optimized, and after making all techniques after gathering stop sheet rule import system, the system energy: (1) provides form, provides the prompting that can stop sheet each batch of future and can not stop sheet; (2) do in GUI while stopping sheet and can provide prompting; (3) can stop sheet at yarn batches, doing batch processing in GUI.Can significantly improve and stop the sheet treatment effeciency by above method, promote production capacity, reduce costs, reduce the risk of makeing mistakes simultaneously.
Although above-mentioned two patents also disclose the method for batch processing, for the technique website with longer activity duration, do not invented.Due to from create batch to starting operation, between may also have the very long stand-by period, during this period of time, may have with current batch and have the lot of identical operation condition to arrive this website, current MES and the logic of EAP can not realize during this period of time batch member's dynamic change.So just reduced the efficiency of batch implement, in addition because can the operation result of last batch do not carry out FEEDBACK CONTROL to a rear batch, starting operation.As bad as last batch operation result, need to stop this equipment and be overhauled or adjust operating condition, parameter and not stopping, so can causing this production efficiency of equipment and yield to reduce.
Summary of the invention
Problem for above-mentioned existence, the present invention discloses a kind of batch wafer operation DPS and disposal route, with the sets of wafers that overcomes batch jobs in prior art can't dynamic change, last batch jobs can't feedback result give rear one problem of operation in batches.
To achieve these goals, the present invention adopts following technical scheme:
A kind of batch wafer operation DPS, be applied in semiconductor manufacturing execution system and equipment automatization system, wherein, comprise: module is set up in batch jobs, the sets of wafers collection modules, the batch jobs that with described batch jobs establishment module, are connected respectively dynamically update module, the batch jobs condition judgment module be connected with described sets of wafers collection modules, and the operation result feedback module be connected with described batch jobs establishment module, described batch jobs condition judgment module respectively;
Described batch jobs are set up module for setting up this batch jobs;
Described sets of wafers collection modules is for gathering the sets of wafers of described these batch jobs;
Described batch jobs condition judgment module is for judging the sets of wafers set completion status of these batch jobs and the completion status of batch jobs last time;
Described operation result feedback module, for described last time, after batch jobs complete, setting up module to described batch jobs the operation result feedback of described last time batch jobs, makes described these batch jobs start or cancel;
Described batch jobs dynamically update module for described last time, before batch jobs complete, dynamically update described batch jobs and set up these batch jobs that module is set up.
Above-mentioned batch wafer operation DPS, wherein, described batch jobs condition judgment module also comprises this batch jobs sets of wafers set completion status judgement submodule and last time batch jobs completion status judgement submodule;
Described this batch jobs sets of wafers set completion status judges that submodule is used for judging whether the sets of wafers of these batch jobs has been gathered, and if not, waits for that the sets of wafers set completes; If continue by the judgement of described last time batch jobs completion status judgement submodule;
Described last time batch jobs completion status judges that submodule is used for judging whether last time batch jobs complete, and if not, waits for that last time batch jobs completed; If continue, by described operation result feedback module, the operation result feedback of described last time batch jobs is set up to module to described batch jobs.
Above-mentioned batch wafer operation DPS, wherein, described operation result feedback module sets up module to described batch jobs the operation result feedback of described last time batch jobs, if when the operation result of described last time batch jobs has been, described these batch jobs start; When if the operation result of described last time batch jobs is bad, described these batch jobs are cancelled.
Above-mentioned batch wafer operation DPS, wherein, described batch jobs dynamically update the sets of wafers that module will have with the sets of wafers of described these batch jobs the identical operation condition and dynamically update in described these batch jobs.
Above-mentioned batch wafer operation DPS, wherein, described sets of wafers collection modules is sent to implement by several wafer transfer boxes by the sets of wafers of described these batch jobs and carries out the sets of wafers set.
A kind of batch wafer operation method for dynamically processing, adopt above-mentioned batch wafer operation DPS, is applied to, in semiconductor manufacturing execution system and equipment automatization system, wherein, comprise the steps:
Step S1, set up this batch jobs;
Step S2, by the sets of wafers set of described these batch jobs;
Step S3, judge the sets of wafers set completion status of described these batch jobs and the completion status of batch jobs last time;
Step S4, dynamically update described these batch jobs, and repeating step S2, S3, until described last time batch jobs complete;
Step S5, after batch jobs complete, feed back the operation result of described last time batch jobs described last time, makes described these batch jobs start or cancel.
Above-mentioned batch wafer operation method for dynamically processing wherein, in described step S3, specifically comprises:
Step S301, judge whether the sets of wafers of these batch jobs has been gathered, and if not, waits for that the sets of wafers set completes; If continue to be judged by next step;
Step S302, judge whether last time batch jobs complete, and if not, waits for that last time batch jobs completed; If feed back the operation result of described last time batch jobs.
Above-mentioned batch wafer operation method for dynamically processing, wherein, in described step S5, if when the operation result of described last time batch jobs has been, described these batch jobs start; When if the operation result of described last time batch jobs is bad, described these batch jobs are cancelled.
Above-mentioned batch wafer operation method for dynamically processing, wherein, in described step S4, the sets of wafers that will have with the sets of wafers of described these batch jobs the identical operation condition dynamically updates in described these batch jobs.
Above-mentioned batch wafer operation method for dynamically processing, wherein, in described step S2, be sent to implement by several wafer transfer boxes by the sets of wafers of described these batch jobs and carry out the sets of wafers set.
The present invention has following advantage or beneficial effect:
The present invention is applied in the establishment batch jobs design in MES and EAP, sets of wafers capable of dynamic by batch jobs change and last time the operation result of batch jobs can start the FEEDBACK CONTROL of operation to these batch jobs, realize the production efficiency of batch jobs equipment and the maximization of yield.
The accompanying drawing explanation
By reading the detailed description of non-limiting example being done with reference to the following drawings, the present invention and feature thereof, profile and advantage will become more apparent.In whole accompanying drawings, identical mark is indicated identical part.Can proportionally not draw accompanying drawing, focus on illustrating purport of the present invention.
Fig. 1 is the structured flowchart of first embodiment of the invention;
Fig. 2 is the process flow diagram of second embodiment of the invention.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment, the present invention is further illustrated, but not as limiting to the invention.
The first embodiment of the present invention relates to a kind of batch wafer operation DPS, be applied in semiconductor manufacturing execution system and equipment automatization system, referring to Fig. 1, comprise: module is set up in batch jobs, the sets of wafers collection modules, the batch jobs that with batch jobs establishment module, are connected respectively dynamically update module, the batch jobs condition judgment module be connected with the sets of wafers collection modules, and the operation result feedback module be connected with batch jobs establishment module, batch jobs condition judgment module respectively.
Wherein, batch jobs are set up module for setting up this batch jobs, and send the data-signal of these batch jobs to the batch jobs condition judgment module; The sets of wafers of these batch jobs of data-signal set that sets of wafers collection modules basis receives, and the aggregated result signal is sent to the batch jobs condition judgment module; The batch jobs condition judgment module judges the sets of wafers set completion status of these batch jobs and the completion status of batch jobs last time according to the aggregated result signal, and settling signal is sent to operation result feedback module when the operation of last time batch jobs completes; Operation result feedback module, according to the settling signal (after last time batch jobs complete) received, is set up module by the operation result feedback of last time batch jobs to batch jobs, makes these batch jobs start or cancel; Before batch jobs dynamically update module and settling signal sent to operation result feedback module in the batch jobs condition judgment module (before last time batch jobs complete), dynamically update batch jobs and set up these batch jobs that module is set up.
In the present embodiment, batch jobs condition judgment module also comprises this batch jobs sets of wafers set completion status judgement submodule and last time batch jobs completion status judgement submodule; This batch jobs sets of wafers set completion status judges submodule is used for judging whether the sets of wafers of these batch jobs has been gathered, and if not, waits for that the sets of wafers set completes, and after the sets of wafers set completes, this judgment result is that "Yes"; If continue by the judgement of last time batch jobs completion status judgement submodule; Last time batch jobs completion status judges that submodule for judging whether last time batch jobs complete, if not, waits for that last time batch jobs completed, last time in batches ancestors' meritorious achievements this judgment result is that "Yes" after completing; If continue to incite somebody to action the last time operation result feedback of batch jobs by operation result feedback module and set up module to batch jobs.
In the present embodiment, the operation result feedback module last time operation result feedback of batch jobs is set up module to batch jobs, if when last time the operation result of batch jobs had been, these batch jobs start; If, when last time the operation result of batch jobs is bad, these batch jobs are cancelled, this implement be need to stop and operating condition, parameter overhauled or adjust, do like this production efficiency and the yield that can improve implement.And dynamically updating the sets of wafers that module will have with the sets of wafers of these batch jobs the identical operation condition, batch jobs dynamically update in these batch jobs, can dynamically adjust according to actual conditions the sets of wafers of these batch jobs in stand-by period before batch jobs last time complete like this, to utilize better implement, improve operating efficiency.
In addition, the sets of wafers collection modules is sent to implement by the sets of wafers of these batch jobs and carries out the sets of wafers set by several wafer transfer boxes (FOUP, Front Opening Unified Pod).
The second embodiment of the present invention relates to a kind of batch wafer operation method for dynamically processing, take above-mentioned the first embodiment as basis, referring to Fig. 2, comprises the steps:
Step S1, set up this batch jobs.
Step S2, by the sets of wafers set of these batch jobs, be sent to implement by several wafer transfer boxes by the sets of wafers of these batch jobs and carry out the sets of wafers set.
Step S3, judge the sets of wafers set completion status of these batch jobs and the completion status of batch jobs last time, is specially:
Step S301, judge whether the sets of wafers of these batch jobs has been gathered, and if not, waits for that the sets of wafers set completes; If continue to be judged by next step;
Step S302, judge whether last time batch jobs complete, and if not, waits for that last time batch jobs completed; If feed back the operation result of last time batch jobs.
Step S4, dynamically update this batch jobs, and the sets of wafers that will have with the sets of wafers of these batch jobs the identical operation condition dynamically updates in these batch jobs, and repeating step S2, S3, until last time batch jobs completed; Wherein, before last time batch jobs complete, can dynamically update at any time the sets of wafers of these batch jobs.
Step S5, after last time batch jobs complete, feed back the operation result of last time batch jobs, makes these batch jobs start or cancel; Wherein, if, when last time the operation result of batch jobs had been, these batch jobs start; If, when last time the operation result of batch jobs is bad, these batch jobs are cancelled.
Be not difficult to find, the present embodiment is embodiment of the method corresponding to those in the first embodiment, the present embodiment can with the first embodiment enforcement of working in coordination.The correlation technique details of mentioning in the first embodiment is still effective in the present embodiment, in order to reduce repetition, repeats no more here.Correspondingly, the correlation technique details of mentioning in the present embodiment also can be applicable in the first embodiment.
It is worth mentioning that, each module involved in the present embodiment is logic module, and in actual applications, a logical block can be a physical location, can be also the part of a physical location, can also realize with the combination of a plurality of physical locations.In addition, for outstanding innovation part of the present invention, unit that will be not too not close with solving technical matters relation proposed by the invention in the present embodiment is introduced, but this does not show in the present embodiment not exist other unit.
It should be appreciated by those skilled in the art that those skilled in the art can realize described variation example in conjunction with prior art and above-described embodiment, such variation example does not affect flesh and blood of the present invention, does not repeat them here.
Above preferred embodiment of the present invention is described.It will be appreciated that, the present invention is not limited to above-mentioned specific implementations, and the equipment of wherein not describing in detail to the greatest extent and structure are construed as with the common mode in this area to be implemented; Any those of ordinary skill in the art, do not breaking away from technical solution of the present invention scope situation, all can utilize method and the technology contents of above-mentioned announcement to make many possible changes and modification to technical solution of the present invention, or being revised as the equivalent embodiment of equivalent variations, this does not affect flesh and blood of the present invention.Therefore, every content that does not break away from technical solution of the present invention,, all still belong in the scope of technical solution of the present invention protection any simple modification made for any of the above embodiments, equivalent variations and modification according to technical spirit of the present invention.
Claims (10)
1. a batch wafer operation DPS, be applied in semiconductor manufacturing execution system and equipment automatization system, it is characterized in that, comprise: module is set up in batch jobs, the sets of wafers collection modules, the batch jobs that with described batch jobs establishment module, are connected respectively dynamically update module, the batch jobs condition judgment module be connected with described sets of wafers collection modules, and the operation result feedback module be connected with described batch jobs establishment module, described batch jobs condition judgment module respectively;
Described batch jobs are set up module for setting up this batch jobs;
Described sets of wafers collection modules is for gathering the sets of wafers of described these batch jobs;
Described batch jobs condition judgment module is for judging the sets of wafers set completion status of these batch jobs and the completion status of batch jobs last time;
Described operation result feedback module, for described last time, after batch jobs complete, setting up module to described batch jobs the operation result feedback of described last time batch jobs, makes described these batch jobs start or cancel;
Described batch jobs dynamically update module for described last time, before batch jobs complete, dynamically update described batch jobs and set up these batch jobs that module is set up.
2. batch wafer operation DPS according to claim 1, it is characterized in that, described batch jobs condition judgment module also comprises this batch jobs sets of wafers set completion status judgement submodule and last time batch jobs completion status judgement submodule;
Described this batch jobs sets of wafers set completion status judges that submodule is used for judging whether the sets of wafers of these batch jobs has been gathered, and if not, waits for that the sets of wafers set completes; If continue by the judgement of described last time batch jobs completion status judgement submodule;
Described last time batch jobs completion status judges that submodule is used for judging whether last time batch jobs complete, and if not, waits for that last time batch jobs completed; If continue, by described operation result feedback module, the operation result feedback of described last time batch jobs is set up to module to described batch jobs.
3. batch wafer operation DPS according to claim 1, it is characterized in that, described operation result feedback module sets up module to described batch jobs the operation result feedback of described last time batch jobs, when if the operation result of described last time batch jobs has been, described these batch jobs start; When if the operation result of described last time batch jobs is bad, described these batch jobs are cancelled.
4. batch wafer operation DPS according to claim 1, it is characterized in that, described batch jobs dynamically update the sets of wafers that module will have with the sets of wafers of described these batch jobs the identical operation condition and dynamically update in described these batch jobs.
5. batch wafer operation DPS according to claim 1, is characterized in that, described sets of wafers collection modules is sent to implement by several wafer transfer boxes by the sets of wafers of described these batch jobs and carries out the sets of wafers set.
6. a batch wafer operation method for dynamically processing, adopt batch wafer operation DPS as claimed in claim 1, is applied to, in semiconductor manufacturing execution system and equipment automatization system, it is characterized in that, comprises the steps:
Step S1, set up this batch jobs;
Step S2, by the sets of wafers set of described these batch jobs;
Step S3, judge the sets of wafers set completion status of described these batch jobs and the completion status of batch jobs last time;
Step S4, dynamically update described these batch jobs, and repeating step S2, S3, until described last time batch jobs complete;
Step S5, after batch jobs complete, feed back the operation result of described last time batch jobs described last time, makes described these batch jobs start or cancel.
7. batch wafer operation method for dynamically processing according to claim 6, is characterized in that, in described step S3, specifically comprises:
Step S301, judge whether the sets of wafers of these batch jobs has been gathered, and if not, waits for that the sets of wafers set completes; If continue to be judged by next step;
Step S302, judge whether last time batch jobs complete, and if not, waits for that last time batch jobs completed; If feed back the operation result of described last time batch jobs.
8. batch wafer operation method for dynamically processing according to claim 6, is characterized in that, in described step S5, if when the operation result of described last time batch jobs has been, described these batch jobs start; When if the operation result of described last time batch jobs is bad, described these batch jobs are cancelled.
9. batch wafer operation method for dynamically processing according to claim 6, is characterized in that, in described step S4, the sets of wafers that will have with the sets of wafers of described these batch jobs the identical operation condition dynamically updates in described these batch jobs.
10. batch wafer operation method for dynamically processing according to claim 6, is characterized in that, in described step S2, by several wafer transfer boxes, the sets of wafers of described these batch jobs is sent to implement and carries out the sets of wafers set.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310333580.1A CN103425066B (en) | 2013-08-02 | 2013-08-02 | A kind of batch wafer operation DPS and disposal route thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310333580.1A CN103425066B (en) | 2013-08-02 | 2013-08-02 | A kind of batch wafer operation DPS and disposal route thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103425066A true CN103425066A (en) | 2013-12-04 |
| CN103425066B CN103425066B (en) | 2015-11-25 |
Family
ID=49649976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310333580.1A Active CN103425066B (en) | 2013-08-02 | 2013-08-02 | A kind of batch wafer operation DPS and disposal route thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103425066B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104751261A (en) * | 2013-12-30 | 2015-07-01 | 中芯国际集成电路制造(上海)有限公司 | Technological process changing method and method for monitoring changed technological process |
| CN108303955A (en) * | 2017-11-15 | 2018-07-20 | 大连佳峰自动化股份有限公司 | A kind of product batch manufacturing method and system |
| CN108615135A (en) * | 2016-12-13 | 2018-10-02 | 海太半导体（无锡）有限公司 | Semiconductor module set product goes out to keep accounts automatically system and goes out the method that keeps accounts |
| CN108615202A (en) * | 2016-12-13 | 2018-10-02 | 海太半导体（无锡）有限公司 | Engineering equipment preset parameter management system and management method after encapsulation |
| CN112309918A (en) * | 2020-10-30 | 2021-02-02 | 上海华力微电子有限公司 | Advanced process control method and system of VT-BS model and semiconductor equipment |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63250702A (en) * | 1987-04-07 | 1988-10-18 | Hitachi Ltd | Sequence controller |
| US6763277B1 (en) * | 2001-07-16 | 2004-07-13 | Advanced Micro Devices, Inc. | Method and apparatus for proactive dispatch system to improve line balancing |
| CN1804746A (en) * | 2004-12-23 | 2006-07-19 | 台湾积体电路制造股份有限公司 | Systems and methods for managing lot aggregation |
| CN102117730A (en) * | 2009-12-31 | 2011-07-06 | 中芯国际集成电路制造(上海)有限公司 | Method for processing parameter data of machine station in manufacturing process of semiconductor and device thereof |
| CN102768941A (en) * | 2011-05-05 | 2012-11-07 | 中芯国际集成电路制造(上海)有限公司 | Method and device for dispatching to batch machine |
| CN102810457A (en) * | 2011-05-31 | 2012-12-05 | 无锡华润上华半导体有限公司 | Method for promoting wafer stop rule and implementing batch wafer stop by system |
-
2013
- 2013-08-02 CN CN201310333580.1A patent/CN103425066B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63250702A (en) * | 1987-04-07 | 1988-10-18 | Hitachi Ltd | Sequence controller |
| US6763277B1 (en) * | 2001-07-16 | 2004-07-13 | Advanced Micro Devices, Inc. | Method and apparatus for proactive dispatch system to improve line balancing |
| CN1804746A (en) * | 2004-12-23 | 2006-07-19 | 台湾积体电路制造股份有限公司 | Systems and methods for managing lot aggregation |
| CN102117730A (en) * | 2009-12-31 | 2011-07-06 | 中芯国际集成电路制造(上海)有限公司 | Method for processing parameter data of machine station in manufacturing process of semiconductor and device thereof |
| CN102768941A (en) * | 2011-05-05 | 2012-11-07 | 中芯国际集成电路制造(上海)有限公司 | Method and device for dispatching to batch machine |
| CN102810457A (en) * | 2011-05-31 | 2012-12-05 | 无锡华润上华半导体有限公司 | Method for promoting wafer stop rule and implementing batch wafer stop by system |
Non-Patent Citations (1)
| Title |
|---|
| 李程等: "基于规则的批处理设备调度方法在半导体晶圆制造系统中应用", 《上海交通大学学报》, vol. 47, no. 2, 28 February 2013 (2013-02-28), pages 230 - 235 * |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104751261A (en) * | 2013-12-30 | 2015-07-01 | 中芯国际集成电路制造(上海)有限公司 | Technological process changing method and method for monitoring changed technological process |
| CN104751261B (en) * | 2013-12-30 | 2018-04-27 | 中芯国际集成电路制造(上海)有限公司 | The method that the variation of technological process, the technological process to change are monitored |
| CN108615135A (en) * | 2016-12-13 | 2018-10-02 | 海太半导体（无锡）有限公司 | Semiconductor module set product goes out to keep accounts automatically system and goes out the method that keeps accounts |
| CN108615202A (en) * | 2016-12-13 | 2018-10-02 | 海太半导体（无锡）有限公司 | Engineering equipment preset parameter management system and management method after encapsulation |
| CN108303955A (en) * | 2017-11-15 | 2018-07-20 | 大连佳峰自动化股份有限公司 | A kind of product batch manufacturing method and system |
| CN108303955B (en) * | 2017-11-15 | 2020-06-16 | 大连佳峰自动化股份有限公司 | Method and system for batch production of products |
| CN112309918A (en) * | 2020-10-30 | 2021-02-02 | 上海华力微电子有限公司 | Advanced process control method and system of VT-BS model and semiconductor equipment |
| CN112309918B (en) * | 2020-10-30 | 2023-09-22 | 上海华力微电子有限公司 | Advanced process control method and system of VT-BS model and semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103425066B (en) | 2015-11-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103425066A (en) | Wafer batch operation dynamic processing system and method | |
| CN102768941B (en) | Method and device for dispatching to batch machine | |
| CN108695199B (en) | Abnormality detection system, semiconductor device manufacturing system and method | |
| RU2010107287A (en) | ELECTRIC POWER DISTRIBUTION MANAGEMENT | |
| CN105491017A (en) | RS485 bus multi-device multi-protocol analysis method and RS485 bus multi-device multi-protocol analysis system | |
| CN111756610A (en) | RS485 bus communication time sequence control method | |
| CN103979245B (en) | A kind of collocation method of brilliant box storage case shelf | |
| CN102496955B (en) | Intelligent photovoltaic system and method for data detection and transmission | |
| US9792193B2 (en) | Method and system for processing data conflict | |
| CN104243577A (en) | Electronic device having automatic networking function and automatic networking method | |
| CN111034209A (en) | Method for reading information from a group of electricity meters | |
| CN104103553B (en) | Data transmission processing method for semiconductor production equipment and system thereof | |
| US20120044941A1 (en) | Data transmission system, data transmission method, and data transmission device | |
| CN105630723A (en) | Management architecture based on heterogeneous processor platform and management method thereof | |
| CN103439893B (en) | The reservation of equipment load port uses control method | |
| CN100422888C (en) | System and method for controlling batches in layers of reaction chamber | |
| CN108712244B (en) | One-to-many half-duplex communication method and system | |
| CN102736951A (en) | A method and an apparatus for calling a module | |
| CN102848746B (en) | Batch work outputting method and device | |
| EP3242372B1 (en) | System for controlling power device | |
| JP2015113108A (en) | Method for updating module information in battery modularization structure | |
| CN104090522A (en) | Multilevel control system for spinning machine | |
| EP2677693A1 (en) | Communication system | |
| CN100419607C (en) | Wafer-based planning methods and systems | |
| CN103235570A (en) | Monitoring message communication system of distributed production equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |