CN103427007A - Light emitting diode and method for packaging light emitting diode - Google Patents
Light emitting diode and method for packaging light emitting diode Download PDFInfo
- Publication number
- CN103427007A CN103427007A CN2012101549712A CN201210154971A CN103427007A CN 103427007 A CN103427007 A CN 103427007A CN 2012101549712 A CN2012101549712 A CN 2012101549712A CN 201210154971 A CN201210154971 A CN 201210154971A CN 103427007 A CN103427007 A CN 103427007A
- Authority
- CN
- China
- Prior art keywords
- electrode
- light
- emitting diode
- emitting component
- convex extension
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000004806 packaging method and process Methods 0.000 title abstract 3
- 238000009413 insulation Methods 0.000 claims abstract description 3
- 230000000994 depressogenic effect Effects 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 9
- 238000012856 packing Methods 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 5
- 239000012530 fluid Substances 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 230000000903 blocking effect Effects 0.000 description 8
- 239000000843 powder Substances 0.000 description 8
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 6
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
Abstract
A light emitting diode comprises a pin structure, a light emitting component and a packaging layer covering the light emitting component. The pin structure comprises a first electrode and a second electrode which are mutually separated. The first electrode and the second electrode are respectively and electrically connected with the light emitting component. The first electrode comprises a protruding and extending part, the second electrode comprises a concave part, the protruding and extending part extends into the concave part, and the protruding and extending part and the concave part are in electric insulation. Compared with the prior art, the light emitting diode has the advantages that due to the fact that the protruding and extending part extends into the concave part, a long curved and narrow gap filled with insulating materials is formed between the protruding and extending part and the concave part, and the path from the bottom of the pin structure to the light emitting component via the gap is long, outside water vapor does not enter the concave part from the gap between the pin structure and a base plate easily, the gas tightness of the light emitting diode is enhanced, and the service life of the light emitting component is guaranteed. The invention further relates to a method for packaging the light emitting diode.
Description
Technical field
The present invention relates to a kind of semiconductor and method for packing thereof, relate in particular to a kind of light-emitting diode and method for packing thereof.
Background technology
Light-emitting diode (Light Emitting Diode, LED) be a kind ofly current conversion can be become to the semiconductor element of the light of particular range of wavelengths, rely on that its luminous efficiency is high, volume is little, the advantage such as lightweight, environmental protection, be widely applied in the middle of current every field.Light-emitting diode in being applied to above-mentioned each field before, light-emitting diode chip for backlight unit need to be encapsulated, with the protection light-emitting diode chip for backlight unit.
Industry, when being encapsulated, can arrange pin configuration and light-emitting diode chip for backlight unit and be electrically connected.Described pin configuration comprises the first electrode and the second electrode, rectangular-shaped and the space that this first electrode and the second electrode are set to rule usually forms a gap, described gap-fill plastic material forms substrate, due to this gap vertically arrange and path shorter, thereby steam easily enters between electrode and plastics the life-span that light-emitting diode affects light-emitting diode chip for backlight unit.Therefore, need further improve.
Summary of the invention
The present invention aims to provide a kind of light-emitting diode and method for packing thereof of good airproof performance.
A kind of light-emitting diode, comprise pin configuration, light-emitting component and be covered in the encapsulated layer on described light-emitting component, described pin configuration comprises the first electrode and second electrode of space, described light-emitting component and this first electrode, the second electrode form respectively electric connection, described the first electrode comprises a convex extension part, the second electrode comprises a depressed part, and described convex extension part stretches in described depressed part, and electric insulation between described convex extension part and depressed part.
A kind of method for packing of light-emitting diode, it comprises step:
The first electrode with a convex extension part is provided and there is depressed part second electrode, the convex extension part of described the first electrode is stretched in the depressed part of the second electrode, the end face that makes described convex extension part and the two between space relative with the inner face of described depressed part, to form pin configuration, to fill fluid material in described gap, form substrate;
One light-emitting component is electrically connected to described first, second electrode; And
Cover this light-emitting component with an encapsulated layer.
With prior art, compare, in the present invention, this convex extension part extend in this depressed part, the long and narrow gap of bending that is filled with insulating material due to this convex extension part and this depressed part space one, make the path that arrives light-emitting component via gap from the pin configuration bottom longer, thereby extraneous steam is difficult for entering this depression along the gap between pin configuration and substrate, strengthen the sealing of this light-emitting diode, thereby guarantee the useful life of light-emitting component.
The accompanying drawing explanation
The generalized section of the light-emitting diode that Fig. 1 is one embodiment of the invention.
Each step schematic diagram of the LED encapsulation method that Fig. 2 to Fig. 7 is one embodiment of the invention.
The main element symbol description
| Light- |
100 |
| |
10 |
| |
20 |
| Light- |
30 |
| Encapsulated |
40 |
| The |
11 |
| The |
12 |
| |
13 |
| |
14 |
| |
15 |
| |
50 |
| |
111 |
| Convex |
112 |
| The |
113 |
| |
121 |
| The |
122 |
| The first |
123 |
| The second |
124 |
| |
125 |
| Receiving |
126 |
| Fixed |
21 |
| Reflecting |
22 |
| Draw-in |
211 |
| |
23 |
| |
60 |
| Bed die | 61 |
| |
62 |
| |
63 |
| |
621 |
| |
622 |
| |
623 |
| Runner | 624 |
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Below with reference to accompanying drawing, light-emitting diode 100 of the present invention is described in further detail.
Refer to Fig. 1, the light-emitting diode 100 of the present invention's one preferred embodiment comprises a pin configuration 10, is located at a reflector 20 and a light-emitting component 30 on this pin configuration 10, and covers the encapsulated layer 40 of this light-emitting component 30.
Concrete, this pin configuration 10 comprises the first electrode 11 and second electrode 12 of space, each electrode 11 comprises first surface 13 and a second surface 14 relative with this first surface 13.Described the first electrode 11 comprises a body 111, the convex extension part 112 that this body 111 extends towards these the second electrode 12 directions certainly, and deviates from from these body 111 edges one first clamping part 113 that these the second electrode 12 directions are extended.Described body 111 is the rectangular-shaped of rule, 112De longitudinal section, described convex extension part is rectangle, and the middle part of an end of these body 111 close these the second electrodes 12 protrudes out to these the second electrode 12 directions certainly, the height of this convex extension part 112 is less than the height of this body 111.Described the second electrode 12 comprises a depressed part 121 and one second clamping part 122 be connected with this depressed part 121.Concrete, described depressed part 121 roughly is U-shaped, and opening is towards this first electrode 11, it comprises and is positioned at electrically section 123 of first on this first surface 13, be positioned at electrical section 124 of second on this second surface 14 and connect linkage section 125 of second electrical section 124 of this first electrical section 123 and this, this first electrical section 123 is parallel to each other with this second electrical section 124, the described first electrical section 123, the second electrical section 124 and this linkage section 125 enclose and form a receiving space 126, the upper surface of the described first electrical section 123 and the upper surface flush of this body 111, the lower surface of this second electrical section 124 flushes with the lower surface of this body 111.Described the second clamping part 122 protrudes out along the direction away from this first electrode 11 from this linkage section 125, and this second clamping part 122 is corresponding with this first clamping part 113.In the present embodiment, this first clamping part 113, the second clamping part 122 and 112De upper and lower end face, this convex extension part flush mutually.
This convex extension part 112 is stretched in this depressed part 121, in the present embodiment, this convex extension part 112 is embedded in the receiving space 126 that is contained in this depressed part 121, relative and one gap 15, space between the two of the inner face of the end face of this convex extension part 112 and this depressed part 121, described gap 15 is filled with insulating material and forms substrate 50.This convex extension part 112 is parallel to each other near each end face of this second electrode 12 and each inner face of this depressed part 121 close these the first electrodes 11.Understandable, this convex extension part 112 can not be parallel to each other with the end face of this depressed part 121 near these the first electrodes 11 near the end face of these the second electrodes 12 yet, only guarantee two electrodes 11,12 one of them stretch into wherein another also electrically insulated from one another get final product; Simultaneously, the spacing between each end face can equate, also can be different.This convex extension part 112 also can be other with the shape of depressed part 121, as stepped etc.
Described reflector 20 is formed on this pin configuration 10 and is arranged in the side of this pin configuration 10, and described reflector 20 comprises a fixed part 21 and is positioned at the reflecting part 22 on this fixed part 21.21 pairs of this fixed parts should the first clamping part 113 and the position of the second clamping part 122 respectively correspondence one draw-in groove 211 is set, this draw-in groove 211 and this clamping part 113,122 card that cooperatively interacts establishes to strengthen fixing this reflector 20.Described reflecting part 22 is positioned at this pin configuration 10 tops, these reflecting part 22 medial surfaces can be formed with high reflecting material, the substrate 50 exposed between this reflecting part 22 and this pin configuration 10 and two electrode 11,12 upper surfaces jointly encloses and forms a depression 23, and the top dimension of described depression 23 is greater than its bottom size.
This light-emitting component 30 is located on this first electrode 11 and is positioned on the body 111 of this first electrode 11, and two electrodes of this light-emitting component 30 form and are electrically connected with the first electrode 11, the second electrode 12 respectively.In the present embodiment, this light-emitting component 30 is LED crystal particle, and electrode 11,12 modes by routing of itself and both sides form electric connection.
This encapsulated layer 40 is located on this light-emitting component 30 and is filled in this depression 23, and the upper surface flush of the end face at these encapsulated layer 40 tops and this reflector 20.This encapsulated layer 40 can be the transparent colloid doped with fluorescent material, and this fluorescent material can be one or more in garnet-base fluorescent material, silicate-base fluorescent material, orthosilicate base fluorescent powder, sulfide base fluorescent powder, thiogallate base fluorescent powder, nitrogen oxide base fluorescent powder and nitride based fluorescent material.
The long and narrow gap 15 of bending that is filled with insulating material due to this convex extension part 112 and these depressed part 121 spaces one, reflector 20 is arranged in the side increase reflector 20 of pin configuration 10 and the fitting area between pin configuration 10 simultaneously, make from pin configuration 10 bottoms via the laminating gap between reflector 20 and pin configuration 10 or longer via the path of gap 15 arrival light-emitting components 30, thereby extraneous steam is difficult for along gap 15, or the gap between pin configuration 10 and insulating material enters this depression 23, strengthen the air-tightness of this light-emitting diode 100, thereby guarantee the useful life of light-emitting component 30.
In addition, because light-emitting component 30 is arranged on this first electrode 11, the first electrode 11 has an extra convex extension part 112, make fixedly the first electrode 11 of light-emitting component 30 possess larger area of dissipation, thereby the capacity of heat transmission is strengthened, with the heat that effectively conduction light-emitting component 30 produces fast, strengthening the radiating efficiency of light-emitting diode 100.
Moreover, because the depressed part 121 of described the second electrode 12 roughly is U-shaped, therefore, not only the lower surface of this second electrode 12 has larger contact area, be conducive to be electrically connected fully with circuit board, and more close this light-emitting component 30 of the upper surface of this second electrode 12, can reduce the length of the gold thread (not shown) of this light-emitting component 30 and the second electrode 12 electric connections, be conducive to reduce costs.
The light-emitting diode 100 of the embodiment of the present invention of below take is example, and the manufacture process of this light-emitting diode 100 is described in conjunction with Fig. 1.
First step: refer to Fig. 2, a pin configuration 10 is provided, this pin configuration 10 comprises the first electrode 11 and second electrode 12 of space, and each electrode 11,12 comprises first surface 13 and a second surface 14 relative with this first surface 13.
Described the first electrode 11 comprises a body 111, the convex extension part 112 that this body 111 extends towards these the second electrode 12 directions certainly, and deviates from from these body 111 edges one first clamping part 113 that these the second electrode 12 directions are extended.Described body 111 is the rectangular-shaped of rule, 112De longitudinal section, described convex extension part is rectangle, and the middle part of these body 111 close these the second electrode 12 1 ends protrudes out to these the second electrode 12 directions certainly, the height of this convex extension part 112 is less than the height of this body 111.Described the second electrode 12 comprises a depressed part 121 and one second clamping part 122 be connected with this depressed part 121.Concrete, described depressed part 121 roughly is U-shaped, and opening is towards this first electrode 11, it comprises and is positioned at electrically section 123 of first on this first surface 13, be positioned at electrical section 124 of second on this second surface 14 and connect linkage section 125 of second electrical section 124 of this first electrical section 123 and this, this first electrical section 123 is parallel to each other with this second electrical section 124, the described first electrical section 123, the second electrical section 124 and this linkage section 125 enclose and form a receiving space 126, the upper surface of the described first electrical section 123 and the upper surface flush of this body 111, the lower surface of this second electrical section 124 flushes with the lower surface of this body 111.Described the second clamping part 122 protrudes out along the direction away from this first electrode 11 from this linkage section 125, and this second clamping part 122 is corresponding with this first clamping part 113.In the present embodiment, this first clamping part 113, the second clamping part 122 and 112 upper and lower end faces, this convex extension part flush mutually.
This convex extension part 112 is embedded in the receiving space 126 that is contained in this depressed part 121, the dielectric fluid material is filled to form substrate 50 in the end face that makes this convex extension part 112 and the two between space one gap 15 relative with the inner face of this depressed part 121 in this gap 15.In the present embodiment, this convex extension part 112 is parallel to each other near each end face of this second electrode 12 and the inner face of this depressed part 121 close these the first electrodes 11.Understandable, this convex extension part 112 can not be parallel to each other near the end face of this second electrode 12 and the end face of this depressed part 121 close these the first electrodes 11 yet, only guarantees that two electrodes 11,12 are embedded each other and space gets final product; Simultaneously, the spacing between each end face can equate, also can be different.
Second step: refer to Fig. 3, mould 60 is provided, make 10 of mould 60 and this pin configuration form a cavity 63.This mould 60 comprises a bed die 61 and a backform 62, and these bed die 61 tops are a flat surface, and it closes the second surface 14 of described pin configuration 10 to carry described pin configuration 10 for supporting.Described backform 62 supports the first surface 13 that closes described pin configuration 10 and jointly forms a cavity 63 with the upper surface of pin configuration 10.
This backform 62 comprises a top board 621, the blocking part 622 that these top board 621 peripheries protrude out towards these bed die 61 directions certainly and the location division 623 protruded out towards these bed die 61 directions from these top board 621 centers.Concrete, the outer surface of described top board 621 is a smooth plane.Described blocking part 622 surrounds an annular sidewall at top board 621 peripheries, itself and this top board 621 is one-body molded and protrude out to these bed die 61 directions from these top board 621 lower surface edges, 622 middle parts, described blocking part are offered perforation and are formed runner 624, in order to follow-up injection moulding fluent material, in the present embodiment, the quantity of described runner 624 is 2.Extend towards these bed die 61 directions from these top board 621 lower surface middle parts described location division 623, itself and this 622 spaces, blocking part, described location division 623 Outside Dimensions subtract towards these bed die 61 directions gradually from top board, and the lower surface of described location division 623 flushes with the lower surface of this blocking part 622.
Third step: to the interior injection fluent material of this cavity 63, also solidify this fluent material to form reflector 20 structures.Concrete, make bed die 61 and this pin configuration 10 of backform 62 sandwicheds, it is the second surface 14 that the top of described bed die 61 fits in this pin configuration 10, the location division 623 of this backform 62 fits in the first surface 13 of this pin configuration 10, described blocking part 622 encloses this location division 623 and fits in the first surface 13 of this pin configuration 10, and 623, blocking part 622, described location division and pin configuration 10 enclose and form an annular housing 63.Along runner 624 to the interior injection fluent material of this cavity 63, the fluent material that is positioned at this cavity 63 rear formation reflector 20 that is cured.This fluent material can be epoxy resin, silicones or other macromolecular materials.
The 4th step: refer to Fig. 4 to Fig. 6, remove mould 60, on this pin configuration 10, light-emitting component 30 is set, and this light-emitting component 30 is electrically connected to this first, second electrode 11,12.Concrete, this step is that described light-emitting component 30 is arranged on the body 111 of this first electrode 11.Concrete, the mode by routing makes this light-emitting component 30 form and be electrically connected with this first electrode 11 and the second electrode 12.
The 5th step: refer to Fig. 7, an encapsulated layer 40 is covered and is formed in reflector 20 to cover this light-emitting component 30.Concrete, an encapsulated layer 40 is covered on this light-emitting component 30, this encapsulated layer 40 is filled described reflector 20 and is maintained an equal level mutually with the upper surface of described reflector 20.Encapsulated layer 40 is made by transparent material, and it can be by silicones or other resins, or other composite materials are made.This encapsulated layer 40 also can include fluorescent material according to light-emitting component 30 and luminous needs.This fluorescent material comprises one or more in garnet-base fluorescent material, silicate-base fluorescent material, orthosilicate base fluorescent powder, sulfide base fluorescent powder, thiogallate base fluorescent powder, nitrogen oxide base fluorescent powder and nitride based fluorescent material.
Understandable, in the said method step, the step that forms reflector 20 is also nonessential, by pin configuration 10 being provided, light-emitting component 30 is set and covers encapsulated layer 40 these three steps, can complete encapsulation.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change and distortion all should belong to the protection range of the claims in the present invention.
Claims (10)
1. a light-emitting diode, comprise pin configuration, light-emitting component and be covered in the encapsulated layer on described light-emitting component, described pin configuration comprises the first electrode and second electrode of space, described light-emitting component and described the first electrode, the second electrode form respectively electric connection, it is characterized in that: described the first electrode comprises a convex extension part, the second electrode comprises a depressed part, and described convex extension part stretches in described depressed part, and electric insulation between this convex extension part and depressed part.
2. light-emitting diode as claimed in claim 1, is characterized in that, described light-emitting component is arranged on this first electrode.
3. light-emitting diode as claimed in claim 1, is characterized in that, described depressed part is U-shaped, and opening is towards the convex extension part of described the first electrode, and the convex extension part of described the first electrode is embedded in described depressed part.
4. light-emitting diode as claimed in claim 1, is characterized in that, described convex extension part is parallel to each other near each end face of described the second electrode and each inner face of close described the first electrode of described depressed part.
5. light-emitting diode as claimed in claim 4, it is characterized in that, described the first electrode also comprises a body and deviates from from described body edge one first clamping part that described the second electrode direction is extended, described convex extension part protrudes out to described the second electrode from described body one end, described the second electrode also comprises one second clamping part that deviates from described the first electrode direction extension from described depressed part edge, and the upper and lower end face of described the first clamping part flushes with the upper and lower end face of the second clamping part respectively.
6. light-emitting diode as claimed in claim 5, it is characterized in that, described light-emitting diode also comprises a reflector, and described reflector is formed on described pin configuration, and coordinates with described the first clamping part and the second clamping part and be arranged in the side of described pin configuration.
7. the method for packing of a light-emitting diode, it comprises step:
The first electrode with a convex extension part is provided and there is depressed part second electrode, the convex extension part of described the first electrode is stretched in the depressed part of the second electrode, the end face that makes described convex extension part and the two between space relative with the inner face of described depressed part, to form pin configuration, to fill fluid material in described gap, form substrate;
One light-emitting component is electrically connected to described first, second electrode; And
Cover this light-emitting component with an encapsulated layer.
8. LED encapsulation method as claimed in claim 7, is characterized in that, described light-emitting component is arranged on this first electrode.
9. LED encapsulation method as claimed in claim 7, is characterized in that, described depressed part is U-shaped, and opening is towards the convex extension part of described the first electrode, and the convex extension part of described the first electrode is embedded in described depressed part.
10. LED encapsulation method as claimed in claim 7, it is characterized in that, also comprise step after forming substrate, before light-emitting component is being set: provide mould, make between mould and described pin configuration to form a cavity, in this cavity, inject fluent material and solidify described fluent material formation reflector structure.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210154971.2A CN103427007B (en) | 2012-05-18 | 2012-05-18 | Light emitting diode and method for packing thereof |
| CN201610012382.9A CN105702841B (en) | 2012-05-18 | 2012-05-18 | Light emitting diode and its packaging method |
| CN201610012922.3A CN105720162B (en) | 2012-05-18 | 2012-05-18 | Light emitting diode and its method for packing |
| TW101121887A TW201349600A (en) | 2012-05-18 | 2012-06-19 | Light emitting diode and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210154971.2A CN103427007B (en) | 2012-05-18 | 2012-05-18 | Light emitting diode and method for packing thereof |
Related Child Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610012874.8A Division CN105742459A (en) | 2012-05-18 | 2012-05-18 | Light emitting diode and encapsulating method thereof |
| CN201610012382.9A Division CN105702841B (en) | 2012-05-18 | 2012-05-18 | Light emitting diode and its packaging method |
| CN201610012922.3A Division CN105720162B (en) | 2012-05-18 | 2012-05-18 | Light emitting diode and its method for packing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103427007A true CN103427007A (en) | 2013-12-04 |
| CN103427007B CN103427007B (en) | 2016-07-20 |
Family
ID=49651474
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610012922.3A Active CN105720162B (en) | 2012-05-18 | 2012-05-18 | Light emitting diode and its method for packing |
| CN201210154971.2A Expired - Fee Related CN103427007B (en) | 2012-05-18 | 2012-05-18 | Light emitting diode and method for packing thereof |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610012922.3A Active CN105720162B (en) | 2012-05-18 | 2012-05-18 | Light emitting diode and its method for packing |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN105720162B (en) |
| TW (1) | TW201349600A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103682064A (en) * | 2012-08-31 | 2014-03-26 | 展晶科技(深圳)有限公司 | Lateral LED and packaging method for lateral LED |
| CN104659197A (en) * | 2013-11-26 | 2015-05-27 | 展晶科技(深圳)有限公司 | Light emitting diode package body |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019219177A1 (en) * | 2018-05-15 | 2019-11-21 | Osram Opto Semiconductors Gmbh | Carrier for an optoelectronic device, method for producing a carrier for an optoelectronic device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020175621A1 (en) * | 2001-05-24 | 2002-11-28 | Samsung Electro-Mechanics Co., Ltd. | Light emitting diode, light emitting device using the same, and fabrication processes therefor |
| JP2005136123A (en) * | 2003-10-30 | 2005-05-26 | Kyocera Corp | Package for housing light-emitting element, and light-emitting device |
| CN102194979A (en) * | 2010-03-05 | 2011-09-21 | 精工电子有限公司 | Light emitting device |
| JP2011216202A (en) * | 2010-03-31 | 2011-10-27 | Murata Mfg Co Ltd | Power storage device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201508851U (en) * | 2009-09-04 | 2010-06-16 | 复盛股份有限公司 | LED bracket structure |
| CN202189829U (en) * | 2011-07-21 | 2012-04-11 | 弘凯光电(深圳)有限公司 | Light emitting diode, display device and lighting device |
-
2012
- 2012-05-18 CN CN201610012922.3A patent/CN105720162B/en active Active
- 2012-05-18 CN CN201210154971.2A patent/CN103427007B/en not_active Expired - Fee Related
- 2012-06-19 TW TW101121887A patent/TW201349600A/en unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020175621A1 (en) * | 2001-05-24 | 2002-11-28 | Samsung Electro-Mechanics Co., Ltd. | Light emitting diode, light emitting device using the same, and fabrication processes therefor |
| JP2005136123A (en) * | 2003-10-30 | 2005-05-26 | Kyocera Corp | Package for housing light-emitting element, and light-emitting device |
| CN102194979A (en) * | 2010-03-05 | 2011-09-21 | 精工电子有限公司 | Light emitting device |
| JP2011216202A (en) * | 2010-03-31 | 2011-10-27 | Murata Mfg Co Ltd | Power storage device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103682064A (en) * | 2012-08-31 | 2014-03-26 | 展晶科技(深圳)有限公司 | Lateral LED and packaging method for lateral LED |
| CN103682064B (en) * | 2012-08-31 | 2016-12-07 | 展晶科技(深圳)有限公司 | Side direction LED and method for packing thereof |
| CN104659197A (en) * | 2013-11-26 | 2015-05-27 | 展晶科技(深圳)有限公司 | Light emitting diode package body |
| CN104659197B (en) * | 2013-11-26 | 2017-11-07 | 展晶科技(深圳)有限公司 | LED encapsulation body |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105720162A (en) | 2016-06-29 |
| TW201349600A (en) | 2013-12-01 |
| CN103427007B (en) | 2016-07-20 |
| CN105720162B (en) | 2018-03-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105765716A (en) | Power semiconductor module and composite module | |
| EP2348550B1 (en) | Package structure and LED package structure | |
| US10123428B2 (en) | Package module | |
| US20140027051A1 (en) | Method of Fabricating a Light Emitting Diode Packaging Structure | |
| US20170162477A1 (en) | Lead frame and light emitting diode package having the same | |
| CN105633023B (en) | Semiconductor device with a plurality of semiconductor chips | |
| CN102738351B (en) | Light emitting diode (LED) packaging structure and manufacturing method thereof | |
| JP2015046476A (en) | Power semiconductor device and method of manufacturing the same | |
| CN103682064A (en) | Lateral LED and packaging method for lateral LED | |
| US9318666B2 (en) | Light emitting diode device and method for manufacturing same | |
| CN103427007A (en) | Light emitting diode and method for packaging light emitting diode | |
| CN104752369A (en) | Photoelectric element module | |
| CN104103734A (en) | Light-emitting diode packaging structure | |
| US20130015488A1 (en) | Light emitting diode package and method for fabricating the same | |
| TWI509834B (en) | Led package and method for manufacturing the same | |
| CN103794594A (en) | Semiconductor package | |
| CN103378262B (en) | Light emitting diode and encapsulating method thereof | |
| TWI425676B (en) | Structure of the semiconductir package | |
| CN105702841A (en) | Light emitting diode and packaging method thereof | |
| CN105742459A (en) | Light emitting diode and encapsulating method thereof | |
| KR101346342B1 (en) | Led lamp with low thermal resistance | |
| CN105098043A (en) | Light-emitting device composite substrate and light emitting diode (LED) module with same | |
| CN202948921U (en) | Non-insulated type power module | |
| CN104701440A (en) | LED packaging element and production method thereof | |
| CN104701436A (en) | LED packaging element and production method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20151207 Address after: 201424 Shanghai city Fengxian District Tuo Village barracks Lin Zhen No. 598 building ninth room 111 Applicant after: Shanghai Lirui Network Technology Co.,Ltd. Address before: 518109 Guangdong province Shenzhen city Longhua District Dragon Road No. 83 wing group building 11 floor Applicant before: SCIENBIZIP CONSULTING (SHEN ZHEN) Co.,Ltd. Effective date of registration: 20151207 Address after: 518109 Guangdong province Shenzhen city Longhua District Dragon Road No. 83 wing group building 11 floor Applicant after: SCIENBIZIP CONSULTING (SHEN ZHEN) Co.,Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Street tabulaeformis Industrial Zone tenth east two Ring Road No. two Applicant before: ZHANJING Technology (Shenzhen) Co.,Ltd. Applicant before: Advanced Optoelectronic Technology Inc. |
|
| C14 | Grant of patent or utility model | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| GR01 | Patent grant | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20160629 Address after: 100086 Beijing city Haidian District North Sanhuan Road 43, Tsing Wun contemporary building 12A11 Applicant after: BEIJING ZHITAO SCIENCE & TECHNOLOGY Co.,Ltd. Address before: 201424 Shanghai city Fengxian District Tuo Village barracks Lin Zhen No. 598 building ninth room 111 Applicant before: Shanghai Lirui Network Technology Co.,Ltd. |
|
| CB03 | Change of inventor or designer information |
Inventor after: He Zengwen Inventor before: Zhang Yaozu |
|
| CB03 | Change of inventor or designer information | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170508 Address after: Shijie Zhen Si Jia Cun 523290 Guangdong province Dongguan Qingfeng West Road No. 143 two floor Patentee after: DONG GUAN QUEEDOM Group Ltd. Address before: 100086 Beijing city Haidian District North Sanhuan Road 43, Tsing Wun contemporary building 12A11 Patentee before: BEIJING ZHITAO SCIENCE & TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160720 Termination date: 20190518 |