CN103560119B - For shielding three-dimension flexible substrate encapsulation structure and the making method of chip more - Google Patents
For shielding three-dimension flexible substrate encapsulation structure and the making method of chip more Download PDFInfo
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- CN103560119B CN103560119B CN201310542832.1A CN201310542832A CN103560119B CN 103560119 B CN103560119 B CN 103560119B CN 201310542832 A CN201310542832 A CN 201310542832A CN 103560119 B CN103560119 B CN 103560119B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention provides a kind of three-dimension flexible substrate encapsulation structure for shielding chip more, comprises a flexible base board, is preset with the first metal screen layer and the 2nd metal screen layer in described flexible base board; Need to shielding chip and be mounted on flexible base board pros and cons respectively, position, flexible base board both sides, respectively to bending in the middle of flexible base board front, forms two U-shaped shielding parts; Two U-shaped shielding parts top flexible base board separately partly overlaps in the height direction, and the top flexible base board of the 2nd U-shaped shielding part is above first U-shaped shielding part on flexible base board. First need to shield chip distribution in first U-shaped shielding part, and the 2nd need to shield chip distribution above first U-shaped shielding part above flexible base board and the 2nd U-shaped shielding part between flexible base board. Metal screen layer need to shield in chip is coated on. The invention solves relatively strong electromagnetic radiation chip electromagnetic interference problem to external world, and it is compacter to encapsulate structure.
Description
Technical field
The present invention relates to a kind of encapsulation structure, especially a kind of electromagnetic shielding encapsulation structure adopting flexible base board.
Background technology
Along with the development of microelectronics, the complexity of microelectronics processing capacity, variation, make in microelectronics the integration density of electronic component in substrate increasing, the raising suddenly of micro-packing density and integrated level certainly will be increased, have higher requirement for improving the over all Integration degree of encapsulation in the finite space and the device of relatively strong electromagnetic radiation is carried out electromagnetic shielding, technology difficulty increases, and must ensure again the normal operation of system.
Fig. 1 is existing a kind of electromagnetic shielding solution, mainly arranges an electro-magnetic shielding cover on semiconductor package, for shielding the electromagnetic interference of chip chamber. But do not consider the problem that electromagnetic radiation is revealed from bottom device and the bigger problem of encapsulation scantlings of the structure. Shielding case 101 considers interfering with each other between shielding chip 108 and 112, but does not consider that chip 112 reveals the process of radiation from bottom.
Summary of the invention
The present invention is based on the manufacture of flexible base board and brake techniques, a kind of three-dimension flexible substrate encapsulation structure for shielding chip and corresponding making method are provided more, it is bent to form the encapsulation structure with multiaspect electromagnetic armouring structure by the flexible base board of built-in screen layer, multiple high electromagnetic radiation chip can be shielded simultaneously, solve the electromagnetic interference problem that there is relatively strong electromagnetic radiation chip to external world in the micro-assembling of high-density multiaspect; And package dimension is compact. The technical solution used in the present invention is:
For shielding a three-dimension flexible substrate encapsulation structure for chip, comprise a flexible base board more, described flexible base board is preset with the first metal screen layer and the 2nd metal screen layer; The conducting hole having through flexible base board pros and cons in flexible base board, is filled with metallic conduction material in described conducting hole, by conducting hole, the first metal screen layer is electrically connected with the ground pad on flexible base board pros and cons; Flexible base board also has blind hole, described blind hole is filled with metallic conduction material, by blind hole, the 2nd metal screen layer is electrically connected with the ground pad of flexible base board reverse side; Conducting hole and the insulation of the 2nd metal screen layer.
First need to shield chip attachment at position in the middle of flexible base board front, and the first convex point of ground connection that need to shield chip is connected with the ground pad in flexible base board front; 2nd need to shield chip attachment in the side at flexible base board reverse side, and the 2nd convex point of ground connection that need to shield chip is connected with the ground pad of flexible base board reverse side; Bend the flexible base board of that side of chip need to be shielded with the 2nd and deviates from the 2nd flexible base board that need to shield that side of chip respectively in the middle of flexible base board front, form two U-shaped shielding parts; Two U-shaped shielding parts top flexible base board separately partly overlaps in the height direction, and the top flexible base board of the 2nd U-shaped shielding part is above first U-shaped shielding part on flexible base board.
First need to shield chip distribution in first U-shaped shielding part, and the 2nd need to shield chip distribution above first U-shaped shielding part above flexible base board and the 2nd U-shaped shielding part between flexible base board; The first metal screen layer in flexible base board after bending need to shield in chip is coated on completely to major general first, and the 2nd metal screen layer in flexible base board need to shield in chip is coated on by the 2nd.
Further, the described first interior face that need to shield the back side of chip and the top flexible base board 1 of first U-shaped shielding part welds together.
Further, the described 2nd interior face that need to shield the back side of chip and the top flexible base board of the 2nd U-shaped shielding part welds together.
Further, the described 2nd need to shield chip is in first and need to shield directly over chip, forms stacked structure.
Further, above the 2nd U-shaped shielding part, the side in the outside of flexible base board is pasted with common chip, and common chip is positioned at first and need to shield chip and the 2nd and need to shield above chip, forms multi-chip stacking structure.
Further, chip and the 2nd need to be shielded first need to shield chip underfill and have end filler.
Further, in first U-shaped shielding part and the 2nd U-shaped shielding part, it is filled with potting compound.
Further, the outside side of the underlying flex substrate of above-mentioned two U-shaped shielding parts is implanted with multiple weldering ball, wherein has at least a weldering ball to be connected with the ground pad of electrical connection the first metal screen layer; A weldering ball is had at least to be connected with the ground pad of electrical connection the 2nd metal screen layer.
For shielding a making method for the three-dimension flexible substrate encapsulation structure of chip, comprise the steps: more
Step one. flexible base board is provided, described flexible base board is preset with the first metal screen layer and the 2nd metal screen layer; Flexible base board is opened the conducting hole of through flexible base board pros and cons, filler metal electro-conductive material in conducting hole, by conducting hole, the first metal screen layer is electrically connected with the ground pad on flexible base board pros and cons; Open-blind hole in flexible base board, filler metal electro-conductive material in blind hole, makes the 2nd metal screen layer be electrically connected with the ground pad of flexible base board reverse side by blind hole; Conducting hole and the insulation of the 2nd metal screen layer;
Step 2. in the middle of flexible base board front, position attachment first need to shield chip so that the first convex point of ground connection that need to shield chip is connected with the ground pad in flexible base board front; A side attachment the 2nd at flexible base board reverse side need to shield chip so that the 2nd convex point of ground connection that need to shield chip is connected with the ground pad of flexible base board reverse side; Chip and the 2nd need to be shielded first and need to shield filler at the bottom of chip underfill;
Step 3. the flexible base board bending in the middle of flexible base board front that will need to shield that side of chip with the 2nd, forms first U-shaped shielding part, and makes the 2nd need to shield chip and be in first and need to shield directly over chip, formation stacked structure; The interior face that need to shield the back side of chip and the top flexible base board of first U-shaped shielding part by first welds together;
Step 4. flexible base board bending in the middle of flexible base board front that the 2nd need to shield that side of chip will be deviated from, form the 2nd U-shaped shielding part, make the top flexible base board of the 2nd U-shaped shielding part be positioned at the 2nd need to shield above chip, and the first metal screen layer in flexible base board need to shield in chip is coated on completely to major general first after making flexible base board bending, the 2nd metal screen layer in flexible base board need to shield in chip is coated on by the 2nd; The interior face that need to shield flexible base board above the back side of chip and the 2nd U-shaped shielding part by the 2nd welds together;
Step 5. the space in above-mentioned two U-shaped shielding parts is filled potting compound and is carried out plastic packaging;
Step 6. in the outside side of the underlying flex substrate of above-mentioned two U-shaped shielding parts, plant weldering ball, form signal loop and electromagnetic shielding loop; A weldering ball is wherein had at least to be connected with the ground pad of electrical connection the first metal screen layer; A weldering ball is had at least to be connected with the ground pad of electrical connection the 2nd metal screen layer.
In above-mentioned making method, further,
In step 2, first need to shield chip and the 2nd need to shield chip attachment complete after, also comprise: common chip is mounted on flexible base board reverse side and deviates from that side that the 2nd need to shield chip;
In step 4, when carrying out the bending forming the 2nd U-shaped shielding part, make common chip be positioned at first and need to shield chip and the 2nd and need to shield above chip, form multi-chip stacking structure.
The present invention possesses following advantage:
1. the present invention is by different electromagnetic shielding loops, it is possible to shield multiple chip simultaneously, reduces the mutual interference of multiple high electromagnetic radiation chip and electromagnetic interference to external world as far as possible.
2. adopting 3D to encapsulate structure, after encapsulation, scantlings of the structure is little, packaging density height.
3. being equipped with metal screen layer in flexible base board, and pass through conducting hole or blind hole and ground pad and interconnect, form the structure of multiaspect shielding, shield effectiveness is better.
Accompanying drawing explanation
Fig. 1 is a kind of electromagnetic armouring structure of the prior art.
Fig. 2 is the flexible base board schematic diagram of the present invention.
Fig. 3 is the chip attachment schematic diagram of the present invention.
Fig. 4 is the flexible base board first time bending sketch map of the present invention.
Fig. 5 is the flexible base board second time bending sketch map of the present invention.
Fig. 6 is the chip plastic packaging schematic diagram of the present invention.
Ball schematic diagram planted by the device that Fig. 7 is the present invention.
Embodiment
Below in conjunction with concrete drawings and Examples, the invention will be further described.
As shown in Figure 2 to 7: a kind of three-dimension flexible substrate encapsulation structure for shielding chip, comprises a flexible base board 1 more, described flexible base board 1 is preset with the first metal screen layer 2 and the 2nd metal screen layer 3; The conducting hole 4 having through flexible base board 1 pros and cons in flexible base board 1, is filled with metallic conduction material in described conducting hole 4, by conducting hole 4, first metal screen layer 2 is electrically connected with the ground pad on flexible base board 1 pros and cons; Flexible base board 1 also has blind hole 5, described blind hole 5 is filled with metallic conduction material, by blind hole 5, the 2nd metal screen layer 3 is electrically connected with the ground pad of flexible base board 1 reverse side; Conducting hole 4 and the 2nd metal screen layer 3 insulate.
First need to shield chip 6 is mounted on position in the middle of flexible base board 1 front, and the first convex point of ground connection that need to shield chip 6 is connected with the ground pad in flexible base board 1 front; 2nd need to shield chip 7 is mounted in a side of flexible base board 1 reverse side, and the 2nd convex point of ground connection that need to shield chip 7 is connected with the ground pad of flexible base board 1 reverse side; Bend the flexible base board 1 of that side of chip 7 need to be shielded with the 2nd and deviates from the 2nd flexible base board 1 that need to shield that side of chip 7 respectively in the middle of flexible base board 1 front, form two U-shaped shielding parts; Two U-shaped shielding parts top flexible base board 1 separately partly overlaps in the height direction, and the top flexible base board 1 of the 2nd U-shaped shielding part (being right U-shaped shielding part in figure) is on the top flexible base board 1 of first U-shaped shielding part (being left U-shaped shielding part in figure); First need to shield chip 6 is distributed in first U-shaped shielding part, and the 2nd need to shield chip 7 is distributed in above first U-shaped shielding part above flexible base board 1 and the 2nd U-shaped shielding part between flexible base board 1; The first metal screen layer 2 to major general first in flexible base board 1 after bending need to shield in chip 6 is coated on completely, and the 2nd metal screen layer 3 in flexible base board 1 need to shield in chip 7 is coated on by the 2nd.
Preferably, the described first interior face that need to shield the back side of chip 6 and the top flexible base board 1 of first U-shaped shielding part welds together.
Preferably, the described 2nd interior face that need to shield the back side of chip 7 and the top flexible base board 1 of the 2nd U-shaped shielding part welds together.
Preferably, the 2nd need to shield chip 7 is in first and need to shield directly over chip 6, forms stacked structure.
Preferably, above the 2nd U-shaped shielding part, the side in the outside of flexible base board 1 is pasted with common chip 8, and common chip 8 is positioned at first and need to shield chip 6 and the 2nd and need to shield above chip 7, forms multi-chip stacking structure.
Preferably, first need to shield chip 6 and the 2nd and need to shield chip 7 underfill and have end filler 9.
Preferably, it is filled with potting compound 10 in first U-shaped shielding part and the 2nd U-shaped shielding part.
Finally, the outside side of the underlying flex substrate 1 of above-mentioned two U-shaped shielding parts is implanted with multiple weldering ball 11, wherein has at least a weldering ball 11 to be connected with the ground pad of electrical connection the first metal screen layer 2; A weldering ball 11 is had at least to be connected with the ground pad of electrical connection the 2nd metal screen layer 3.
Detail is used for the making method of the three-dimension flexible substrate encapsulation structure of many shielding chips below, comprises the steps:
Step one. as shown in Figure 2, it is provided that flexible base board 1, described flexible base board 1 is preset with the first metal screen layer 2 and the 2nd metal screen layer 3; First metal screen layer 2 and the 2nd metal screen layer 3 all can adopt layers of copper. Flexible base board 1 is opened the conducting hole 4 of through flexible base board 1 pros and cons, filler metal electro-conductive material in conducting hole 4, by conducting hole 4, first metal screen layer 2 is electrically connected with the ground pad on flexible base board 1 pros and cons; Open-blind hole 5 in flexible base board 1, filler metal electro-conductive material in blind hole 5, makes the 2nd metal screen layer 3 be electrically connected with the ground pad of flexible base board 1 reverse side by blind hole 5; Conducting hole 4 and the 2nd metal screen layer 3 insulate;
Step 2. as shown in Figure 3, in the middle of flexible base board 1 front, position attachment first need to shield chip 6 so that the first convex point of ground connection that need to shield chip 6 is connected with the ground pad in flexible base board 1 front; A side attachment the 2nd at flexible base board 1 reverse side need to shield chip 7 so that the 2nd convex point of ground connection that need to shield chip 7 is connected with the ground pad of flexible base board 1 reverse side;
In this step, chip 6 and the 2nd need to be shielded first and need to shield the pros and cons that chip 7 is mounted on flexible base board 1 respectively by flip chip bonding mode, for follow-up bending forming is got ready. In this step, it is also possible to common chip 8(refers to not need the chip of shielding herein) it is mounted on flexible base board 1 reverse side and deviates from that side that the 2nd need to shield chip 7. The first convex point of ground connection that need to shield chip 6 is connected with the ground pad in flexible base board 1 front, and the 2nd convex point of ground connection that need to shield chip 7 is connected with the ground pad of flexible base board 1 reverse side, has begun to take shape two electromagnetic shielding loops. After each chip attachment is complete, chip 6 and the 2nd need to be shielded first and need to shield filler 9 at the bottom of chip 7 underfill, to get rid of gas below.
Step 3. as shown in Figure 4, flexible base board 1 bending in the middle of flexible base board 1 front of that side of chip 7 will need to be shielded with the 2nd, form first U-shaped shielding part, this example is in terms of Fig. 4 first form left U-shaped shielding part, and after forming left U-shaped shielding part, first need to shield chip 6 is positioned at left U-shaped shielding part; And make the 2nd need to shield chip 7 to be in first and need to shield directly over chip 6, form stacked structure;
The interior face (being also exactly the front before not bending) that need to shield the back side of chip 6 and the top flexible base board 1 of first U-shaped shielding part by first welds together;
Step 4. as shown in Figure 5, flexible base board 1 bending in the middle of flexible base board 1 front that the 2nd need to shield that side of chip 7 will be deviated from, form the 2nd U-shaped shielding part, it this example is also exactly right U-shaped shielding part, making the top flexible base board 1 of the 2nd U-shaped shielding part be positioned at the 2nd need to shield above chip 7, and the first metal screen layer 2 to the major general first making flexible base board 1 bend in rear flexible base board 1 need to shield in chip 6 is coated on completely, the 2nd metal screen layer 3 in flexible base board 1 need to shield in chip 7 is coated on by the 2nd; The interior face (being also exactly the front before not bending) that need to shield flexible base board 1 above the back side of chip 7 and the 2nd U-shaped shielding part by the 2nd welds together;
As can be seen from Figure 5, the first metal screen layer 2 end in the top flexible base board 1 of right U-shaped shielding part needs the top of the first metal screen layer 2 end reaching in the top flexible base board 1 of left U-shaped shielding part, or slightly above some distances. The end of the 2nd metal screen layer 3 in the top flexible base board 1 of right U-shaped shielding part needs to meet or exceed the end that the 2nd need to shield chip 7.
When carrying out the bending forming the 2nd U-shaped shielding part, common chip 8 is positioned in the side in the outside of flexible base board 1 above the 2nd U-shaped shielding part, common chip 8 so just can be made to be positioned at first need to shield chip 6 and the 2nd and need to shield above chip 7, form multi-chip stacking structure.
Step 5. as shown in Figure 6, the space in above-mentioned two U-shaped shielding parts is filled potting compound 10 and is carried out plastic packaging;
Step 6. as shown in Figure 7, in the outside side of the underlying flex substrate 1 of above-mentioned two U-shaped shielding parts, (i.e. reverse side) plants weldering ball 11, forms signal loop and final two electromagnetic shielding loops;
A weldering ball 11 is had at least to be connected with the ground pad of electrical connection the first metal screen layer 2;
A weldering ball 11 is had at least to be connected with the ground pad of electrical connection the 2nd metal screen layer 3.
Claims (10)
1. one kind for shielding the three-dimension flexible substrate encapsulation structure of chip more, it is characterized in that, comprise a flexible base board (1), described flexible base board (1) is preset with the first metal screen layer (2) and the 2nd metal screen layer (3);
Flexible base board (1) has the conducting hole (4) of through flexible base board (1) pros and cons, it is filled with metallic conduction material in described conducting hole (4), by conducting hole (4), the first metal screen layer (2) is electrically connected with the ground pad on flexible base board (1) pros and cons; Flexible base board (1) also has blind hole (5), described blind hole is filled with metallic conduction material in (5), by blind hole (5), the 2nd metal screen layer (3) is electrically connected with the ground pad of flexible base board (1) reverse side; Conducting hole (4) and the 2nd metal screen layer (3) insulation;
First need to shield chip (6) is mounted on position in the middle of flexible base board (1) front, and the first convex point of ground connection that need to shield chip (6) is connected with the ground pad in flexible base board (1) front; 2nd need to shield chip (7) is mounted in a side of flexible base board (1) reverse side, and the 2nd convex point of ground connection that need to shield chip (7) is connected with the ground pad of flexible base board (1) reverse side;
Bend the flexible base board (1) of chip (7) that side need to be shielded with the 2nd and deviates from the 2nd flexible base board (1) that need to shield chip (7) that side respectively in the middle of flexible base board (1) front, form two U-shaped shielding parts; Two U-shaped shielding parts top flexible base board (1) separately partly overlaps in the height direction, and the top flexible base board (1) of the 2nd U-shaped shielding part is above first U-shaped shielding part on flexible base board (1);
First need to shield chip (6) is distributed in first U-shaped shielding part, and the 2nd need to shield chip (7) is distributed in above first U-shaped shielding part above flexible base board (1) and the 2nd U-shaped shielding part between flexible base board (1);
The first metal screen layer (2) in flexible base board (1) after bending need to shield in chip (6) is coated on completely to major general first, and the 2nd metal screen layer (3) in flexible base board (1) need to shield in chip (7) is coated on by the 2nd.
2. as claimed in claim 1 for shielding the three-dimension flexible substrate encapsulation structure of chip more, it is characterised in that: the described first interior face that need to shield the back side of chip (6) and the top flexible base board (1) of first U-shaped shielding part welds together.
3. as claimed in claim 1 or 2 for shielding the three-dimension flexible substrate encapsulation structure of chip more, it is characterised in that: the described 2nd interior face that need to shield the back side of chip (7) and the top flexible base board (1) of the 2nd U-shaped shielding part welds together.
4. as claimed in claim 3 for shielding the three-dimension flexible substrate encapsulation structure of chip more, it is characterised in that: the described 2nd need to shield chip (7) is in first and need to shield directly over chip (6), forms stacked structure.
5. as claimed in claim 4 for shielding the three-dimension flexible substrate encapsulation structure of chip more, it is characterized in that: above the 2nd U-shaped shielding part, the side in the outside of flexible base board (1) is pasted with common chip (8), and common chip (8) be positioned at first need to shield chip (6) and the 2nd need to shield chip (7) top, formed multi-chip stacking structure.
6. as claimed in claim 1 for shielding the three-dimension flexible substrate encapsulation structure of chip more, it is characterised in that: chip (6) and the 2nd need to be shielded first and need to shield chip (7) underfill and have end filler (9).
7. as claimed in claim 1 for shielding the three-dimension flexible substrate encapsulation structure of chip more, it is characterised in that: in first U-shaped shielding part and the 2nd U-shaped shielding part, it is filled with potting compound (10).
8. as claimed in claim 1 for shielding the three-dimension flexible substrate encapsulation structure of chip more, it is characterized in that: in the outside side of the underlying flex substrate (1) of above-mentioned two U-shaped shielding parts, be implanted with multiple weldering ball (11) wherein having at least weldering ball (11) to be connected with the ground pad of electrical connection the first metal screen layer (2); Weldering ball (11) is had at least to be connected with the ground pad of electrical connection the 2nd metal screen layer (3).
9. one kind for shielding the making method of the three-dimension flexible substrate encapsulation structure of chip more, it is characterised in that, comprise the steps:
Step one. flexible base board (1) is provided, described flexible base board (1) is preset with the first metal screen layer (2) and the 2nd metal screen layer (3); Flexible base board (1) is opened the conducting hole (4) of through flexible base board (1) pros and cons, filler metal electro-conductive material in conducting hole (4), makes the first metal screen layer (2) be electrically connected with the ground pad on flexible base board (1) pros and cons by conducting hole (4); In flexible base board (1) open-blind hole (5), filler metal electro-conductive material in blind hole (5), makes the 2nd metal screen layer (3) be electrically connected with the ground pad of flexible base board (1) reverse side by blind hole (5); Conducting hole (4) and the 2nd metal screen layer (3) insulation;
Step 2. in the middle of flexible base board (1) front, position attachment first need to shield chip (6) so that the first convex point of ground connection that need to shield chip (6) is connected with the ground pad in flexible base board (1) front; A side attachment the 2nd at flexible base board (1) reverse side need to shield chip (7) so that the 2nd convex point of ground connection that need to shield chip (7) is connected with the ground pad of flexible base board (1) reverse side; Chip (6) and the 2nd need to be shielded first and need to shield filler (9) at the bottom of chip (7) underfill;
Step 3. flexible base board (1) bending in the middle of flexible base board (1) front of chip (7) that side will need to be shielded with the 2nd, form first U-shaped shielding part, and make the 2nd need to shield chip (7) to be in first and need to shield directly over chip (6), form stacked structure; The interior face that need to shield the back side of chip (6) and the top flexible base board (1) of first U-shaped shielding part by first welds together;
Step 4. flexible base board (1) bending in the middle of flexible base board (1) front that the 2nd need to shield chip (7) that side will be deviated from, form the 2nd U-shaped shielding part, make the top flexible base board (1) of the 2nd U-shaped shielding part be positioned at the 2nd and need to shield chip (7) top, and the first metal screen layer (2) in flexible base board (1) need to shield in chip (6) is coated on completely to major general first after making flexible base board (1) bending, the 2nd metal screen layer (3) in flexible base board (1) need to shield in chip (7) is coated on by the 2nd, the interior face that need to shield flexible base board (1) above the back side of chip (7) and the 2nd U-shaped shielding part by the 2nd welds together,
Step 5. the space in above-mentioned two U-shaped shielding parts is filled potting compound (10) and is carried out plastic packaging;
Step 6. in the outside side of the underlying flex substrate (1) of above-mentioned two U-shaped shielding parts, plant weldering ball (11), form signal loop and electromagnetic shielding loop; Weldering ball (11) is wherein had at least to be connected with the ground pad of electrical connection the first metal screen layer (2); Weldering ball (11) is had at least to be connected with the ground pad of electrical connection the 2nd metal screen layer (3).
10. as claimed in claim 9 for shielding the making method of the three-dimension flexible substrate encapsulation structure of chip more, it is characterised in that:
In step 2, first need to shield chip (6) and the 2nd need to shield after chip (7) mounted, and also comprises: common chip (8) is mounted on flexible base board (1) reverse side and deviates from that side that the 2nd need to shield chip (7);
In step 4, carry out formed the 2nd U-shaped shielding part bending time, make common chip (8) be positioned at first need to shield chip (6) and the 2nd need to shield chip (7) top, formation multi-chip stacking structure.
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| CN105118827A (en) * | 2015-08-10 | 2015-12-02 | 成都锐华光电技术有限责任公司 | Three-dimensional chip stack packaging structure based on flexible substrate and packaging method |
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| CN110034096A (en) * | 2019-03-01 | 2019-07-19 | 江苏长电科技股份有限公司 | It is a kind of using flexible base board and the encapsulating structure of TSV chip and preparation method thereof |
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| CN113851451B (en) * | 2021-11-30 | 2022-08-02 | 江苏长晶科技有限公司 | Plastic substrate based chip 3D stacked packaging structure and manufacturing method thereof |
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