CN103561907A - 具有其上包括离散突起的均质主体的抛光垫 - Google Patents
具有其上包括离散突起的均质主体的抛光垫 Download PDFInfo
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- CN103561907A CN103561907A CN201280024792.5A CN201280024792A CN103561907A CN 103561907 A CN103561907 A CN 103561907A CN 201280024792 A CN201280024792 A CN 201280024792A CN 103561907 A CN103561907 A CN 103561907A
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Links
- 238000005498 polishing Methods 0.000 title claims abstract description 164
- 239000000463 material Substances 0.000 claims abstract description 103
- 238000000034 method Methods 0.000 claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 239000000203 mixture Substances 0.000 claims description 101
- 239000003795 chemical substances by application Substances 0.000 claims description 38
- 238000007493 shaping process Methods 0.000 claims description 24
- 229920001187 thermosetting polymer Polymers 0.000 claims description 23
- 229920002635 polyurethane Polymers 0.000 claims description 22
- 239000004814 polyurethane Substances 0.000 claims description 22
- 239000000945 filler Substances 0.000 claims description 12
- 238000002156 mixing Methods 0.000 claims description 10
- 239000004088 foaming agent Substances 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 230000008569 process Effects 0.000 description 12
- 239000000126 substance Substances 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 239000002002 slurry Substances 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 239000002243 precursor Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 239000012948 isocyanate Substances 0.000 description 4
- 150000002513 isocyanates Chemical class 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- -1 polytetrafluoroethylene Polymers 0.000 description 4
- 238000005987 sulfurization reaction Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- 238000009966 trimming Methods 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 150000004984 aromatic diamines Chemical class 0.000 description 2
- QCCDYNYSHILRDG-UHFFFAOYSA-K cerium(3+);trifluoride Chemical compound [F-].[F-].[F-].[Ce+3] QCCDYNYSHILRDG-UHFFFAOYSA-K 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 239000007779 soft material Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- ITRNXVSDJBHYNJ-UHFFFAOYSA-N tungsten disulfide Chemical compound S=[W]=S ITRNXVSDJBHYNJ-UHFFFAOYSA-N 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- 244000137852 Petrea volubilis Species 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 125000006157 aromatic diamine group Chemical group 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011449 brick Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004567 concrete Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 201000006549 dyspepsia Diseases 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 239000003361 porogen Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/12—Making multilayered or multicoloured articles
- B29C39/123—Making multilayered articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2075/00—Use of PU, i.e. polyureas or polyurethanes or derivatives thereof, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2009/00—Layered products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/736—Grinding or polishing equipment
Abstract
Description
Claims (44)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/113,655 US20120302148A1 (en) | 2011-05-23 | 2011-05-23 | Polishing pad with homogeneous body having discrete protrusions thereon |
US13/113,655 | 2011-05-23 | ||
PCT/US2012/038212 WO2012162066A1 (en) | 2011-05-23 | 2012-05-16 | Polishing pad with homogeneous body having discrete protrusions thereon |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103561907A true CN103561907A (zh) | 2014-02-05 |
CN103561907B CN103561907B (zh) | 2017-05-31 |
Family
ID=46147792
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280024792.5A Active CN103561907B (zh) | 2011-05-23 | 2012-05-16 | 具有其上包括离散突起的均质主体的抛光垫 |
Country Status (7)
Country | Link |
---|---|
US (2) | US20120302148A1 (zh) |
EP (2) | EP2714331B1 (zh) |
JP (3) | JP5657178B2 (zh) |
KR (2) | KR101831909B1 (zh) |
CN (1) | CN103561907B (zh) |
TW (2) | TWI504479B (zh) |
WO (1) | WO2012162066A1 (zh) |
Cited By (18)
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CN105033840A (zh) * | 2014-04-28 | 2015-11-11 | 株式会社理光 | 研磨具以及研磨装置 |
CN105500183A (zh) * | 2015-11-26 | 2016-04-20 | 上海集成电路研发中心有限公司 | 一种研磨垫及其使用周期检测方法 |
CN106470799A (zh) * | 2014-06-18 | 2017-03-01 | 内克斯普拉纳公司 | 具有带有液体填充物的致孔剂的抛光垫 |
CN107078048A (zh) * | 2014-10-17 | 2017-08-18 | 应用材料公司 | 使用加成制造工艺的具复合材料特性的cmp衬垫建构 |
CN107107306A (zh) * | 2014-10-17 | 2017-08-29 | 应用材料公司 | 由积层制造工艺所生产的研磨垫 |
CN108136563A (zh) * | 2015-07-30 | 2018-06-08 | Jh罗得股份有限公司 | 聚合磨光材料、包含聚合磨光材料的介质和系统及其形成和使用方法 |
CN108972319A (zh) * | 2018-09-18 | 2018-12-11 | 长鑫存储技术有限公司 | 化学机械研磨垫及其制备方法 |
CN110238752A (zh) * | 2014-10-17 | 2019-09-17 | 应用材料公司 | 抛光制品 |
CN110815037A (zh) * | 2018-08-08 | 2020-02-21 | 湖北鼎龙控股股份有限公司 | 抛光垫及其制备方法、应用 |
US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
CN112384330A (zh) * | 2019-01-23 | 2021-02-19 | 应用材料公司 | 使用增材制造工艺所形成的抛光垫及其相关方法 |
US10953515B2 (en) | 2014-10-17 | 2021-03-23 | Applied Materials, Inc. | Apparatus and method of forming a polishing pads by use of an additive manufacturing process |
CN113103145A (zh) * | 2015-10-30 | 2021-07-13 | 应用材料公司 | 形成具有期望ζ电位的抛光制品的设备与方法 |
TWI738323B (zh) * | 2019-05-07 | 2021-09-01 | 美商Cmc材料股份有限公司 | 化學機械拋光墊及化學機械拋光晶圓之方法 |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
US11772229B2 (en) | 2016-01-19 | 2023-10-03 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
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US20120302148A1 (en) | 2011-05-23 | 2012-11-29 | Rajeev Bajaj | Polishing pad with homogeneous body having discrete protrusions thereon |
KR101532990B1 (ko) * | 2011-09-22 | 2015-07-01 | 도요 고무 고교 가부시키가이샤 | 연마 패드 |
US9067297B2 (en) | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with foundation layer and polishing surface layer |
KR101819539B1 (ko) * | 2011-11-29 | 2018-01-17 | 캐보트 마이크로일렉트로닉스 코포레이션 | 기초 레이어 및 연마면 레이어를 가진 연마 패드 |
US9067298B2 (en) * | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with grooved foundation layer and polishing surface layer |
US10022842B2 (en) | 2012-04-02 | 2018-07-17 | Thomas West, Inc. | Method and systems to control optical transmissivity of a polish pad material |
US10722997B2 (en) | 2012-04-02 | 2020-07-28 | Thomas West, Inc. | Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads |
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US9597769B2 (en) | 2012-06-04 | 2017-03-21 | Nexplanar Corporation | Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer |
US9649742B2 (en) * | 2013-01-22 | 2017-05-16 | Nexplanar Corporation | Polishing pad having polishing surface with continuous protrusions |
US10160092B2 (en) | 2013-03-14 | 2018-12-25 | Cabot Microelectronics Corporation | Polishing pad having polishing surface with continuous protrusions having tapered sidewalls |
US20150038066A1 (en) * | 2013-07-31 | 2015-02-05 | Nexplanar Corporation | Low density polishing pad |
WO2015153597A1 (en) * | 2014-04-03 | 2015-10-08 | 3M Innovative Properties Company | Polishing pads and systems and methods of making and using the same |
US9649741B2 (en) * | 2014-07-07 | 2017-05-16 | Jh Rhodes Company, Inc. | Polishing material for polishing hard surfaces, media including the material, and methods of forming and using same |
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JP6476924B2 (ja) | 2015-01-30 | 2019-03-06 | 株式会社リコー | 研磨シート、研磨具、及び、研磨方法 |
US10092998B2 (en) * | 2015-06-26 | 2018-10-09 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of making composite polishing layer for chemical mechanical polishing pad |
TWI695752B (zh) * | 2015-10-16 | 2020-06-11 | 美商應用材料股份有限公司 | 用於以積層製程形成先進拋光墊的配方 |
CN105598866B (zh) * | 2015-12-28 | 2017-07-21 | 郑州磨料磨具磨削研究所有限公司 | 一种电镀超硬材料砂轮的制造方法 |
CN117283450A (zh) | 2016-01-19 | 2023-12-26 | 应用材料公司 | 多孔化学机械抛光垫 |
JP7193221B2 (ja) | 2016-01-25 | 2022-12-20 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法、並びに、研磨加工品の製造方法 |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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Also Published As
Publication number | Publication date |
---|---|
CN103561907B (zh) | 2017-05-31 |
TW201309419A (zh) | 2013-03-01 |
JP2015006731A (ja) | 2015-01-15 |
JP2014515319A (ja) | 2014-06-30 |
JP6309559B2 (ja) | 2018-04-11 |
TWI504479B (zh) | 2015-10-21 |
EP2857145B1 (en) | 2018-12-26 |
EP2714331A1 (en) | 2014-04-09 |
KR101621789B1 (ko) | 2016-05-17 |
KR101831909B1 (ko) | 2018-02-26 |
JP2016135542A (ja) | 2016-07-28 |
TWI630067B (zh) | 2018-07-21 |
KR20130138841A (ko) | 2013-12-19 |
EP2714331B1 (en) | 2015-04-01 |
TW201538274A (zh) | 2015-10-16 |
KR20150122806A (ko) | 2015-11-02 |
US20120302148A1 (en) | 2012-11-29 |
US9296085B2 (en) | 2016-03-29 |
US20150056900A1 (en) | 2015-02-26 |
JP5657178B2 (ja) | 2015-01-21 |
WO2012162066A1 (en) | 2012-11-29 |
EP2857145A1 (en) | 2015-04-08 |
JP5965453B2 (ja) | 2016-08-03 |
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