CN103579503A - Method for utilizing photo-crosslinking polymers to conduct thin film packaging on organic electronic device - Google Patents

Method for utilizing photo-crosslinking polymers to conduct thin film packaging on organic electronic device Download PDF

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CN103579503A
CN103579503A CN201310566672.4A CN201310566672A CN103579503A CN 103579503 A CN103579503 A CN 103579503A CN 201310566672 A CN201310566672 A CN 201310566672A CN 103579503 A CN103579503 A CN 103579503A
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electronic device
organic electronic
organic
photocrosslinkable polymer
thin
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段羽
杨丹
陈平
王潇
杨永强
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Jilin University
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Jilin University
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Abstract

The invention provides a method for utilizing photo-crosslinking polymers to conduct thin film packaging on an organic electronic device, and belongs to the technical field of organic electronic devices. According to the method for utilizing the photo-crosslinking polymers to conduct thin film packaging on the organic electronic device, permeation of water vapor and oxygen into the organic electronic device can be effectively obstructed. Thin films formed through the method have stable chemical and physical properties, and the thin films are suitable for the flexible organic electronic device due to the potential material property of the thin films. The method includes the steps that the organic electronic device with an anode, a functional layer and a metallic cathode structure is manufactured on a substrate; then, the photo-crosslinking polymers are dripped to a metallic cathode of the organic electronic device in a hanging mode, and an organic packaging thin film is acquired through a spin coating method; eventually the organic electronic device coated with the organic packaging thin film is cured under the ultraviolet condition, and then the organic electronic device is packaged.

Description

A kind of photocrosslinkable polymer that utilizes carries out the method for thin-film package to organic electronic device
Technical field
The invention belongs to organic electronic device technical field, be specifically related to a kind of photocrosslinkable polymer that adopts and organic electronic device carried out to the method for thin-film package, this method for packing can effectively intercept steam and oxygen to the infiltration of organic electronic device.The film that the method forms has stable chemistry and physical characteristic, and its material character is more potential is applicable to flexible organic electronic device.
Background of invention
It is extensive that organic electronic device has material source, and rich color also can form the features such as flexible device.But the industrialization of organic electronic device also exists many problems, one of key issue is that organic assembly causes its life-span to decline to airborne water oxygen attack sensitivity.Therefore, organic electronic device must carry out effectively encapsulation to intercept water oxygen.Traditional method for packing is to use glass or metal cover board that device is completely cut off and opened with steam, oxygen.But this method has the shortcoming of technical process relative complex, and device cannot be crooked.In recent years, the research of flexible organic electronic has been caused to the flourish of flexible device thin-film package technology.The ultra-thin rete of these encapsulation can be deposited on device, and they can be inorganic thin film or inorganic/organic mixed film.Although these packaging films have met the industrial requirements that the life-span surpasses 10000 hours, but this depositional mode for the manufacture of inorganic structure still has 2 an open questions: first, their encapsulation process will be carried out under the environment that is applicable to organic electronic device, generally, the low temperature process of high-quality inorganic layer need to utilize plasma to strengthen, or utmost point jogging speed deposition technique (for example ald), but can increasing cost, elapsed time, above-mentioned technology seriously limits organic electronic Product industrialization production scale.Secondly, the mechanical performance of inorganic encapsulated film does not reach completely and meets flexible device encapsulation required standard, because when under tension or pressure-acting, inorganic encapsulated film can ftracture.In general, wanting to obtain very soft encapsulated layer must make by solwution method.But the encapsulated layer that people seldom make solwution method is studied.
Photocrosslinkable polymer is to make intermolecular generation crosslinked by photochemical reaction, form insoluble, there is cancellated polymer.This class photocrosslinkable polymer is liquid photopolymer curing under UV-irradiation.It is that one pack system is solidified glue and is 100% entity, and curing rate is exceedingly fast, and depends on applied thickness and accepts to apply the energy of ultraviolet light.
Summary of the invention
The object of this invention is to provide a kind of photocrosslinkable polymer that adopts and organic electronic device is carried out to the method for thin-film package, this method for packing can effectively intercept steam and oxygen to the infiltration of organic electronic device.And this film is flexible, be especially applicable to the encapsulation of flexible organic electronic device.
The present invention obtains novel encapsulated layer by spin coating method, and this method can not damaged the characteristics of luminescence of device, and does not use any vacuum or heating process, thereby in future, can be used as the basic method for packing of organic electronic device.
Organic electronic device of the present invention is comprised of substrate, ito anode, functional layer and metallic cathode successively; Functional layer is comprised of hole transmission layer, active layer and electron transfer layer; In addition, at ito anode and hole transport interlayer, can also there is nonessential hole injection layer, between electron transfer layer and metallic cathode, can also have nonessential electron injecting layer, between electron transfer layer and metallic cathode, can also have cathode buffer layer.
Described organic electronic device can be organic electroluminescence device (organic light emitting device, OLED), can also be OTFT (organic thin-film transistor, OTFT), organic photovoltaic cell (organic photovoltage, OPV) etc.;
The method of the invention, its step is as follows:
1) first on substrate, prepare the organic electronic device with anode, functional layer and metallic cathode structure;
2) hanging drop photocrosslinkable polymer on the metallic cathode of organic electronic device then, utilizes spin coating method to obtain the organic packaging film of one deck;
3) finally the organic electronic device that scribbles organic packaging film is solidified under ultraviolet condition, thereby complete the encapsulation to organic electronic device.
Substrate described in said method step 1) can be the rigid substrate such as glass, can be also the flexible substrate such as PEN polyethylene naphthalate (PEN), PETG polyethylene terephthalate (PET), Polyetherimide polyetherimide (PEI).
Said method step 2) spin coating method described in is to utilize sol evenning machine that photocrosslinkable polymer (as ultraviolet light polymerization packaging plastic) is spin-coated on the metallic cathode of organic electronic device, even glue speed is 200～3000rad/s, and the thickness of the organic packaging film obtaining is 14～90nm;
Said method step 2) photocrosslinkable polymer described in can be close, the French Techkal as triumphant in Japan of the type package glue such as the NOA63, the NOA61 that produce of Norland Optical Co., Ltd, NOA60, NOA65, NOA68, NOA68T, NBA108, UVS91, NEA123, PDMS and other company, the German prestige silicone based packaging plastic of agreeing WEICON, DOW CORNING and producing, polyurethane encapsulation glue etc.
Be 3～5 minutes the curing time described in said method step 3), and ultraviolet condition is for adopting uviol lamp to solidify, and uviol lamp power is 30～70mW/cm 2.
The functional layer of organic electronic device can adopt the method preparation of vacuum evaporation, spin coating, silk screen printing or solution coating;
Organic electronic device anode is the tin indium oxide of 80～200nm, or the argent of 10～25nm or aluminium;
The cathode buffer layer of organic electronic device is LiF, Cs 2cO 3, NaCl, MgCl 2deng; Metallic cathode is Al, Au, Ag etc.
The general thickness of organic electronic device functional layer is 80～120nm.
Accompanying drawing explanation
Fig. 1: organic electronic device structures schematic diagram prepared by the method for the invention; 1 is substrate and anode, and 2 is hole transmission layer, and 3 is active layer, and 4 is electron transfer layer, and 5 is cathode buffer layer and metallic cathode, 6 for application spin coating method prepare through the curing photocrosslinkable polymer packaging film of uviol lamp.
Fig. 2: the brightness-voltage curve of different structure device (a) and electric current-voltage curve (b); Wherein curve 1 is that exposed OLED device, curve 2 is to have the OLED device that thickness is 16 μ m photocrosslinkable polymer encapsulating structures for having OLED device, the curve 3 of glass package structure; We have tested L-V and the I-V characteristic of above-mentioned device and have come comparator device to change at the electrical behavior that forms encapsulating structure front and back.
Above-mentioned phenomenon shows our encapsulation, especially passes through ultra-violet curing, completes liquid arriving after the photocrosslinkable polymer thin-film package of Solid State Transformation process, OLED device is not caused to infringement chemically any and physically.
Fig. 3: the OLED device under various different encapsulation conditions is normalization brightness curve (L/L during continuous firing under the environment of 20 ℃ of temperature, relative humidity 50% 0); All brightness data relative motion durations are all uninterruptedly measured when direct voltage is 8.1V.The device that curve 1 is tested in the glove box of isolated steam, oxygen, the device under curve 2 use glass cover-plates (GCE) encapsulate, the device under curve 3 use photocrosslinkable polymers encapsulate, curve 4 does not encapsulate and is exposed to airborne device.
Fig. 4: the equivalent Ca Electrical test component structural representation that scribbles the organic electronic device of photocrosslinkable polymer of the present invention; 41 glass substrate, 42Ca simple substance membrane, 43 two discrete Al contact electrodes, 44 are photocrosslinkable polymer packaging film, the area 1x1cm of calcium film 2, thickness is 200nm, deposits to clean on glassly, the aluminium that 100nm is thick is done electrode.
Fig. 5: the calcium corrosion test curve of photocrosslinkable polymer water vapor permeable barrier structure when 20 ℃ of temperature, relative humidity 50%.According to the downward trend with conductivity running time, the water vapor permeable speed of photocrosslinkable polymer thin-film package device is pushed off out as 0.031g/m 2my god, this is the minimum value obtaining in polymer/organic passivation layer structure.We are containing the lipid prepolymer of the few solvent of sulfydryl by so low water vapor permeable value owing to photocrosslinkable polymer, can carry out appropriate ultra-violet curing cross-linking process, and this can cause low-density statistical shortcomings.And the high viscosity of photocrosslinkable polymer glue allows glue tear drop self-supporting formula to fall, and the edge along device, is accurately bonded at it on substrate.This glue is fine to heavy in section section solidification effect, and it is minimum that the low-shrinkage that it has and slight elasticity can reduce to stress.
Figure: 6: the NOA63TFE surface topography map under atomic force microscope.The thin layer of thickness 16 μ m has the average surface roughness of 1.2nm, and maximum difference in height (peak value is to valley) is approximately 1.9nm, and this has illustrated that liquid film can generate super smooth surface.
Embodiment
Embodiment 1:
We have prepared structure: glass/ITO/MoO 2(5nm) the OLED device of/mMTDATA(30nm)/NPB (20nm)/Alq (50nm)/LiF (1nm)/Al.Prepare on this basis A, B, tri-groups of devices of C.Wherein, A group device does not encapsulate, and B group device adopts glass cover-plate encapsulation (GCE), and C group device adopts the NOA63 encapsulation of 16 μ m.
Preparation process is as follows:
[1] backing material is ito glass, first by the scrub clean repeatedly of acetone, ethanol cotton balls for ito glass;
[2] substrate of scrub is put into clean beaker and used successively again acetone, ethanol, deionized water each ultrasonic 10 minutes, be then placed in baking oven and dry, thereby obtain surface without the clean substrate of chemical impurity and fine particle;
[3] substrate of handling well is placed in to multi-source organic molecule gas-phase deposition system, the vacuum degree of system can reach 10 -5pa, in the process of film growth, the vacuum degree of system maintains 5 * 10 -4pa left and right.Organic material growth rate is controlled at
Figure BDA0000413841770000041
all current-voltages, the test of brightness-voltage curve is all carried out in atmosphere at room temperature environment.
Shown in Fig. 2 (a), in L – V characteristic, do not observe significantly difference between exposed device and packaging.Contrast the device exposed, that glass packaging is crossed, photocrosslinkable polymer encapsulated, cut-in voltage is respectively 3.22V, 3.35V and 3.35V, and all devices are at 5.1V, and brightness during 8.1V is 100cd/m respectively 2, 1000cd/m 2(brightness of three kinds of devices is completely very nearly the same, illustrates that encapsulation is on the not impact of the luminescent properties of device).In Fig. 2 (b), the device I – V curve of being crossed by photocrosslinkable polymer thin-film package has been transferred to High Level DC Voltage district, however material change in lightness properties not obvious.In addition, peak value is continually and steadily at the luminescent spectrum of 520nm, and this depends on driving voltage and encapsulating structure.Applying photocrosslinkable polymer thin-film package affects and can ignore device performance.
OLED in Fig. 3 under the various different encapsulation of device is 20 ℃ of temperature, and under the environment of relative humidity 50%, the result of uninterruptedly measuring when direct voltage is 8.1V shows to have the life-span of encapsulating structure device than long 270 minutes of the life-span of exposed device.The device of glass packaging has the life-span of 2970 minutes, similar with the device recording in glove box at exclusion of water oxygen.The brightness decay curve of OLED shown due to the unsteadiness of device own cause with the running time of downward trend gradually.Consider in glass package structure and there is no drier, curve table Mingguang City cross-linked polymer of this slow-decay has good adhesive effect to the device of glass substrate, and few water oxygen can permeate in device periphery through photocrosslinkable polymer adhesive.Therefore,, when photocrosslinkable polymer film is formed on top device, we are contemplated to and have good gas barrier property.By relatively drawing, the OLED life-span of photocrosslinkable polymer thin-film package can reach 1860 minutes substantially, than long 6.8 times of the life-span of exposed device.
Embodiment 2: the equivalent Ca Electrical test of organic electronic device
For packaging film that can we prepare to the precise evaluation barrier property to steam, we have prepared the organic electronic device equivalence Ca Electrical test component that has NOA63 packaging film with the spin coating described in embodiment 1, and its device architecture and parameter are: Ca (200nm)/Al (100nm)/NOA63 (16 μ m);
Ca Electrical test component structure as shown in Figure 4, glass substrate 41,42, two discrete Al contact electrodes 43 of Ca simple substance membrane, photocrosslinkable polymer thinner package rete 44 form;
Ca simple substance membrane (long 10mm, wide 10mm, thick 200nm) preparation is at the place, centre position of glass substrate (long 25mm, wide 25mm), and two discrete Al contact electrodes are convex shape structure (the long 24mm in large region, the wide 4mm in large region, the long 10mm of zonule, the wide 4mm of zonule, thick 100nm), prepare in opposite directions both sides in glass substrate near end, and the convex shape center protrusion of Al contact electrode contacts with Ca simple substance membrane; Photocrosslinkable polymer thinner package rete (long 20mm, wide 20mm) 44 is prepared on Ca simple substance membrane and Al contact electrode, and the convex shape center protrusion of Ca simple substance membrane and Al contact electrode is completely coated, and the remainder of Al contact electrode is outside exposed;
Preparation process is as follows:
[1] backing material is slide glass, first by slide for glass acetone, ethanol cotton balls repeatedly clean;
[2] substrate of scrub is put into clean beaker and used successively again acetone, ethanol, deionized water each ultrasonic 10 minutes, be then placed in baking oven and dry, thereby obtain surface without the clean substrate of chemical impurity and fine particle;
[3] substrate of handling well is placed in to multi-source organic molecule gas-phase deposition system, the vacuum degree of system can reach 10 -5pa, in the process of film growth, the vacuum degree of system maintains 5 * 10 -4pa left and right.Evaporation Ca simple substance membrane and Al contact electrode successively in glass substrate, the plating material that evaporation Ca simple substance membrane adopts is calcium particle, calcium particle is put into molybdenum boat, the energising of molybdenum boat two ends, utilize the principle evaporation Ca simple substance membrane of thermal evaporation, Ca simple substance membrane utilizes mask plate (it is 10mm that centre has empty length, and wide is the square of 10mm) to be grown in place, substrate centre position; The plating material that evaporating Al electrode adopts is aluminum strip, aluminum strip is suspended on a tungsten filament evaporating source, the energising of tungsten filament two ends, utilize the principle evaporating Al electrode of thermal evaporation, the mask plate of evaporation AL electrode is shaped as I-shape construction, and the Al contact electrode obtaining is two convex shape structures (the long 24mm in large region, the wide 4mm in large region, the long 10mm of zonule, the wide 2mm of zonule) both sides that are positioned at substrate are near end.For making to study device, be not subject to the erosion of the gases such as water oxygen in preparation and test process, mask plate is not being transmitted and changed to requirement of experiment in exposure air condition.
[4] device is carried out in glove box to spin coating photocrosslinkable polymer.Sol evenning machine arranges the rotation at a slow speed (rotating speed is 500rpm) in front 10 seconds, photocrosslinkable polymer viscosity solution has been distributed to behind whole surface, the fast rotational in 20 seconds (rotating speed is 2000rpm), has determined and above device, has formed the film that final thickness is 16 μ m again.Then,, by the irradiation of high-pressure mercury lamp, film has formed solid-state passivation layer, and (light energy under exposing is 50mW/cm at 370nm place 2).
[5] after encapsulation, device is exposed to 20 ℃ of temperature, in the environment of relative humidity RH=50%, different time is surveyed I-V curve, obtains the interconversion rate of its film resistor, brings formula below into:
WVTR [ g / m 2 / day ] = - n × δ ca × ρ ca × d dt ( 1 R ) × M ( H 2 O ) M ( Ca ) × Ca _ Area Window _ Area
N is the mol ratio in chemical reaction, and value is 2;
δ cafor the resistivity of Ca, 3.91 * 10 -8Ω m;
ρ cafor Ca density, 1.55g/cm 3;
1/R is the resistivity measuring;
M(H 2o) and M (Ca) be respectively molal weight 18g/mol, the 40g/mol. of water and Ca
Can obtain the water vapor transmittance of this device.
As Fig. 5, according to the downward trend with conductivity running time, the water vapor permeable speed of photocrosslinkable polymer thin-film package device is pushed off out as 0.031g/m 2my god.Be that photocrosslinkable polymer thin-film packing structure can make the aerial stability of OLED realize improvement to a certain extent.

Claims (5)

1. utilize photocrosslinkable polymer organic electronic device to be carried out to a method for thin-film package, its step is as follows:
1) first on substrate, prepare the organic electronic device with anode, functional layer and metallic cathode structure;
2) hanging drop photocrosslinkable polymer on the metallic cathode of organic electronic device then, utilizes spin coating method to obtain the organic packaging film of one deck;
3) finally the organic electronic device that scribbles organic packaging film is solidified under ultraviolet condition, thereby complete the encapsulation to organic electronic device.
2. a kind of photocrosslinkable polymer that utilizes as claimed in claim 1 carries out the method for thin-film package to organic electronic device, it is characterized in that: the substrate described in step 1) is glass, PEN, PETG or Polyetherimide.
3. a kind of photocrosslinkable polymer that utilizes as claimed in claim 1 carries out the method for thin-film package to organic electronic device, it is characterized in that: step 2) described in spin coating method be to utilize sol evenning machine photocrosslinkable polymer to be spin-coated on the metallic cathode of organic electronic device, even glue speed is 200～3000rad/s, and the thickness of the organic packaging film obtaining is 14～90nm.
4. a kind of photocrosslinkable polymer that utilizes as claimed in claim 1 carries out the method for thin-film package to organic electronic device, it is characterized in that: step 2) described in photocrosslinkable polymer be NOA63, NOA61, NOA60, NOA65, NOA68, NOA68T, NBA108, UVS91, NEA123 or the PDMS type package glue that Norland Optical Co., Ltd produces.
5. a kind of photocrosslinkable polymer that utilizes as claimed in claim 1 carries out the method for thin-film package to organic electronic device, it is characterized in that: be 3～5 minutes the curing time described in step 3), ultraviolet condition is for adopting uviol lamp to solidify, and uviol lamp power is 30～70mW/cm 2.
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103834188A (en) * 2014-02-26 2014-06-04 吉林大学 Photo-crosslinkable polymer-organosiloxane mixed glue flexible substrate and application thereof in preparing organic electronic device
CN105742431A (en) * 2016-04-19 2016-07-06 Tcl集团股份有限公司 Quantum-dot light emitting diode (QLED) package structure and OLED package method
CN109065747A (en) * 2018-07-19 2018-12-21 武汉华星光电半导体显示技术有限公司 A kind of flexible OLED devices and preparation method thereof
CN109148732A (en) * 2017-06-19 2019-01-04 Tcl集团股份有限公司 A kind of device packaging method based on metallic and small organic molecule crosslinking
US10734605B2 (en) 2018-07-19 2020-08-04 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Flexible OLED device and manufacturing method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050093001A1 (en) * 2003-10-30 2005-05-05 General Electric Company Organic electro-optic device and method for making the same
CN101939855A (en) * 2007-12-10 2011-01-05 3M创新有限公司 Semiconductor light emitting device and method of making same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050093001A1 (en) * 2003-10-30 2005-05-05 General Electric Company Organic electro-optic device and method for making the same
CN101939855A (en) * 2007-12-10 2011-01-05 3M创新有限公司 Semiconductor light emitting device and method of making same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DAN YANG, ET AL.: "《Passivation Properties of UV-Curable Polymer for Organic Light Emitting Diodes》", 《ECS SOLID STATE LETTERS》 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103834188A (en) * 2014-02-26 2014-06-04 吉林大学 Photo-crosslinkable polymer-organosiloxane mixed glue flexible substrate and application thereof in preparing organic electronic device
CN105742431A (en) * 2016-04-19 2016-07-06 Tcl集团股份有限公司 Quantum-dot light emitting diode (QLED) package structure and OLED package method
CN109148732A (en) * 2017-06-19 2019-01-04 Tcl集团股份有限公司 A kind of device packaging method based on metallic and small organic molecule crosslinking
CN109065747A (en) * 2018-07-19 2018-12-21 武汉华星光电半导体显示技术有限公司 A kind of flexible OLED devices and preparation method thereof
US10734605B2 (en) 2018-07-19 2020-08-04 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Flexible OLED device and manufacturing method thereof

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Application publication date: 20140212