CN103582293A - Method and circuit for achieving bridge joint and close range wireless communication antenna - Google Patents
Method and circuit for achieving bridge joint and close range wireless communication antenna Download PDFInfo
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- CN103582293A CN103582293A CN201210283441.8A CN201210283441A CN103582293A CN 103582293 A CN103582293 A CN 103582293A CN 201210283441 A CN201210283441 A CN 201210283441A CN 103582293 A CN103582293 A CN 103582293A
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Abstract
The embodiment of the invention discloses a method and circuit for achieving bridge joint and a close range wireless communication antenna. The method for achieving bridge joint comprises the steps that a substrate of a single-layer flexible printed circuit board is cut along the edge of a first welding point, the cut first welding point is bent to the back face of the substrate, the first welding point is tightly attached to the back face of the substrate, and the first welding point is turned to the front face of the substrate and is tightly attached to the front face of the substrate, so that the first welding point and a second welding point in the front face of the substrate are both located in the same side of a metal coil of the single-layer flexible printed circuit board. The function of circuit bridge joint, only achieved through a double-layer flexible printed circuit board, is achieved through the structural modification of the single-layer flexible printed circuit board, and compared with the circuit bridge joint of the double-layer flexible printed circuit board, the method and circuit for achieving bridge joint obviously lower cost and are simpler in implement process.
Description
Technical field
Embodiment of the present invention relates to flexible PCB (Flexible Printed Circuit Board) technical field, more specifically, relates to a kind of method, circuit and close range wireless communication antenna of realizing cross-over connection.
Background technology
Flexible PCB (FPC, Flexible Printed Circuit Board) claims again " soft board ", is the printed circuit made from flexible insulating substrate, has advantages of that many rigid printed circuit boards do not possess.For example it can free bend, coiling, folding, can require to arrange arbitrarily according to space layout, and mobile and flexible arbitrarily at three dimensions, thereby reach integrated that components and parts assembling is connected with wire.Utilize FPC technology can greatly dwindle the volume of electronic product, applicable electronic product is to the needs of high density, miniaturization, highly reliable future development.Therefore, FPC is widely used on the fields such as space flight, military affairs, mobile communication, laptop computer, computer peripheral equipment, PDA, digital camera or product.
Flexible print circuit board have one side, two-sided and multi-layer sheet minute.The base material adopting be take polyimide copper clad lamination as main.This kind of material thermal resistance is high, good stability of the dimension, forms final products with the coverlay that has mechanical protection and good electrical insulation property concurrently by compacting.Top layer and inner conductor two-sided, multilayer printed wiring board are realized the electrical connection of ectonexine circuit by metallization.Generally, the function of flexible circuit board can be divided into four kinds, be respectively lead (Lead Line), printed circuit (Printed Circuit), connector (Connector) and Multifunctional whole assembly system (Integration of Function), purposes has contained the scopes such as computer, computer peripheral auxiliary system, consumer people's livelihood electrical equipment and automobile.
In some applications, need to there is the circuit of realizing cross-over connection on one deck base material.Such as, sort circuit goes for close range wireless communication (NFC) antenna.Because the circuitry shapes of NFC antenna is the metal figure that elongated metal wire is coiled into a certain size in the plane, the number of turns of quoit changes to some extent depending on antenna size, generally more than 3 circles.This just causes two of antenna to present the same side that point can not be positioned over quoit at grade, if the same side of placing at grade can cause short circuit.
If wish two feedback points of antenna to be placed on the same example of quoit, the implementation of prior art is that a feedback point is placed on ground floor base material, the connecting line of another feedback point is through the hole of this layer of carrier surface, guide on second layer base material, then it is parallel with another one feedback point by the another one on ground floor base material, to pierce back ground floor base material.
Yet, in this technology, need to adopt Double-layer flexible circuit board to realize the cross-over connection of circuit, cost is higher, and it is comparatively complicated to realize technique.
Summary of the invention
In view of this, embodiment of the present invention proposes a kind of method that realizes cross-over connection, adopts single-layer-flex circuit can realize circuit cross-over connection function, thereby reduces costs, and reduce process complexity.
Embodiment of the present invention has also proposed a kind of circuit of realizing cross-over connection, adopts single-layer-flex circuit can realize circuit cross-over connection function, thereby reduces costs, and reduce process complexity.
Embodiment of the present invention has also proposed a kind of NFC antenna, adopts single-layer-flex circuit can realize circuit cross-over connection function, thereby reduces costs, and reduce process complexity.
The technical scheme of embodiment of the present invention is as follows:
A method that realizes cross-over connection, the method comprises:
Along the edge of the first pad, cut the base material of single-layer-flex circuit, and the first pad cutting out is folded into the back side of described base material;
The back side of described the first pad and described base material is close to;
Described the first pad reflexed returned to the positive of described base material and is close to the front of described base material, make the second pad in this first pad and described base material front, being all positioned at the same side of the wire coil that this single-layer-flex circuit comprises.
Preferably, the described front that the first pad reflexed is returned to described base material comprises:
Long side direction along described single-layer-flex circuit goes back to described the first pad reflexed to the front of described base material, or along the short side direction of described single-layer-flex circuit, described the first pad reflexed is gone back to the front of described base material.
Preferably, the described back side by the first pad and described base material is close to and is comprised:
Utilize the viscose glue on described substrate backside described the first pad to be bonded in to the back side of described base material.
Realize a circuit for cross-over connection, this circuit is printed in single-layer-flex circuit, and this single-layer-flex circuit comprises base material and is positioned at the first pad, the second pad and the wire coil on described base material;
This first pad is along the cropped base material in its edge and be folded into the back side of described base material, and by the mode of reflexed, is close to the front of described base material; This first pad and described the second pad are all positioned at the same side of the wire coil that this single-layer-flex circuit comprises.
Preferably, described the first pad is close to the front of described base material along the long side direction of described single-layer-flex circuit by the mode of reflexed, or by the mode of reflexed, is close to the front of described base material along the short side direction of described single-layer-flex circuit.
Preferably, at least one in following material of described base material formed:
Polyester insulated resin (PET);
Polyimide insulative resin (PI); Or
Flexible copper foil (FCCL)
An antenna, comprises and is positioned at the feedback of first in single-layer-flex circuit point, the second feedback point and wire coil, this single-layer-flex circuit comprises base material; Wherein the first feedback point along the cropped base material in its edge and be folded into the back side of described base material, is close to the front of described base material by the mode of reflexed; This first pad and described the second pad are all positioned at the same side of the wire coil that this single-layer-flex circuit comprises and are parallel to each other.
Preferably, on described base material, there is groove part, for the first feedback point reflexed is positioned to described base material front.
Preferably, in described base material front, there is mark, for the first feedback point being close to the front of described base material, position.
Preferably, described the first feedback point is close to the front of described base material along the long side direction of described single-layer-flex circuit by the mode of reflexed, or by the mode of reflexed, is close to the front of described base material along the short side direction of described single-layer-flex circuit.
From technique scheme, can find out, in embodiment of the present invention, first along the edge of the first pad, cut the base material of single-layer-flex circuit, and the first pad cutting out is folded into the back side of base material; Again the back side of the first pad and base material is close to; The first pad reflexed returned to the positive of base material and is close to the front of base material, make the second pad in this first pad and base material front, being all positioned at the same side of the wire coil that this single-layer-flex circuit comprises.As can be seen here, after application embodiment of the present invention, structural change by single-layer-flex circuit has realized the circuit cross-over connection function that Double-layer flexible circuit board just can be accomplished, and the circuit cross-over connection of the Double-layer flexible circuit board of comparing, embodiment of the present invention has significantly reduced cost, and it is more simple to realize technique.
In addition, embodiment of the present invention specifically can be applied in NFC antenna, be applicable to the cross-over connection of two feedback points of NFC antenna.
Accompanying drawing explanation
Fig. 1 is the schematic diagram that available technology adopting Double-layer flexible circuit board is realized cross-over connection function;
Fig. 2 is for to realize the method flow diagram of circuit cross-over connection according to the single-layer-flex circuit of utilizing of embodiment of the present invention;
Fig. 3 A is according to the schematic diagram of the single-layer-flex circuit of embodiment of the present invention;
Fig. 3 B is the base material cutting fracture schematic diagram according to embodiment of the present invention;
Fig. 3 C is the pad bending sketch map according to embodiment of the present invention;
Fig. 3 D is rear according to the pad bending of embodiment of the present invention and base material is close to schematic diagram;
Fig. 3 E is rear according to the pad bending of embodiment of the present invention and base material is close to local enlarged diagram;
Fig. 3 F is for to return base material front schematic view according to the pad reflexed of embodiment of the present invention;
The local enlarged diagram of Fig. 3 G for going back to base material front according to the pad reflexed of embodiment of the present invention;
Fig. 3 H is for returning behind base material front more sturdy signal according to the pad reflexed of embodiment of the present invention;
Fig. 3 I is for returning behind base material front more sturdy local enlarged diagram according to the pad reflexed of embodiment of the present invention;
Fig. 4 is the optional overbending direction exemplary schematic representation according to embodiment of the present invention;
The schematic diagram of Fig. 5 for utilizing groove part to position circuit according to embodiment of the present invention;
Fig. 6 is according to embodiment of the present invention, the schematic diagram that the position that should paste at pad utilizes transparent region to position.
Embodiment
For making the object, technical solutions and advantages of the present invention clearer, below in conjunction with accompanying drawing, the present invention is described in further detail.
Fig. 1 is the schematic diagram that available technology adopting Double-layer flexible circuit board is realized cross-over connection function.
As seen from Figure 1, for two feedback points of antenna (the first feedback point (1) and the second feedback point (2)) being placed on to conplane the same side of quoit, the second feedback point (2) is placed on ground floor base material, the connecting line of the first feedback point (1) is through the hole on this layer of ground floor substrate carrier surface, guide on second layer base material, by the another one on ground floor base material, pierce back ground floor base material more parallel with the second feedback point (2), and the first feedback point (1) and second is presented the same side that point (2) is all positioned at coil.
Yet, in this technology, need to use Double-layer flexible circuit board to realize the cross-over connection of circuit.Because Double-layer flexible circuit board is compared with single-layer-flex circuit complex process, cost is higher, so popularization is not high, has more shortcoming.
In embodiment of the present invention, the structural change by single-layer-flex circuit can realize the circuit cross-over connection that Double-layer flexible circuit board just can be accomplished, is particularly useful for the cross-over connections of two feedback points of NFC antenna.
Fig. 2 is for to realize the method flow diagram of circuit cross-over connection according to the single-layer-flex circuit of utilizing of embodiment of the present invention.
As shown in Figure 2, the method comprises:
Step 201: cut the base material of single-layer-flex circuit along the edge of the first pad, and the first pad cutting out is folded into the back side of described base material.
Here, the first pad extends certain length, can base material cutting be ruptured along the shape of the first pad, and the metallic circuit of the first pad cutting out part partly retains and is connected with substrate body, and the metallic circuit of the first pad extension, that cut out is bent downwards from root, be folded into the back side of described base material.
Step 202: the back side of described the first pad and described base material is close to.
Can utilize the viscose glue on described substrate backside described the first pad to be bonded in to the back side of described base material here.
Step 203: described the first pad reflexed is returned to the positive of described base material and is close to the front of described base material, make the second pad in this first pad and described base material front, be all positioned at the same side of the wire coil that this single-layer-flex circuit comprises.
Here, can the first pad reflexed be gone back to the front of base material along the long side direction of single-layer-flex circuit, or along the short side direction of single-layer-flex circuit, the first pad reflexed be gone back to the front of base material.
Below in conjunction with drawings in detail, said process is described in more details.
Fig. 3 A is according to the schematic diagram of the single-layer-flex circuit of embodiment of the present invention.From Fig. 3 A, the first pad and the second pad that is positioned at coil outside that this single-layer-flex circuit comprises wire coil and is positioned at wire coil inside, the first pad is connected with wire coil respectively with the second pad.
The first pad extends certain length on base material, can base material cutting be ruptured along the shape of the first pad, and the metallic circuit of the first pad cutting out part partly retains and is connected with substrate body, and the metallic circuit of the first pad of cutting out is bent downwards from root, be folded into the back side of base material.
Fig. 3 B is the base material cutting fracture schematic diagram according to embodiment of the present invention; Fig. 3 C is the pad bending sketch map according to embodiment of the present invention.From Fig. 3 B, along the shape of the first pad, base material cutting is ruptured, and the metallic circuit of the first pad cutting out part partly retains and is connected with substrate body.From Fig. 3 C, the metallic circuit of the first pad cutting out bends downwards from root, is folded into the back side of base material.
After the metallic circuit of the first pad is folded into the back side of base material, can utilizes the viscose glue on substrate backside the first pad to be bonded in to the back side of described base material, thereby be close to base material.Fig. 3 D is rear according to the pad bending of embodiment of the present invention and base material is close to schematic diagram; Fig. 3 E is rear according to the pad bending of embodiment of the present invention and base material is close to local enlarged diagram.
Then, the first pad reflexed is returned to the positive and sturdy with the front of base material of base material, make the second pad in this first pad and base material front, be all positioned at the same side of the wire coil that this single-layer-flex circuit comprises.Fig. 3 F is for to return base material front schematic view according to the pad reflexed of embodiment of the present invention; The local enlarged diagram of Fig. 3 G for going back to base material front according to the pad reflexed of embodiment of the present invention.Fig. 3 H is for returning behind base material front more sturdy signal according to the pad reflexed of embodiment of the present invention; Fig. 3 I is for returning behind base material front more sturdy local enlarged diagram according to the pad reflexed of embodiment of the present invention.
Preferably, can on base material, set in advance groove part, this groove part can play the effect of location, thereby it is positive and sturdy that the first pad circuit of this part under cutting can be returned along the groove reflexed of base material part, thereby prevent from mounting inaccuracy, guaranteed line location correctness.The schematic diagram of Fig. 5 for utilizing groove part to position circuit according to embodiment of the present invention;
Preferably, on base material front, can also there is mark, for the first pad being close to the front of base material, position.Such as.This mark is preferably the transparent region setting in advance, thereby can assist the location of the first feedback point, thereby has further improved line location correctness.Fig. 6 is according to embodiment of the present invention, the schematic diagram that the position that should paste at pad utilizes transparent region to position.
In embodiment of the present invention, can described the first pad reflexed be gone back to the front of described base material along the long side direction of described single-layer-flex circuit, also can the first pad reflexed be gone back to the front of base material along the short side direction of single-layer-flex circuit.
In embodiment of the present invention, base material material can be any flexible substrates such as polyester insulated resin (PET), polyimide insulative resin (PI) or flexible copper foil (FCCL), and embodiment of the present invention is to this and indefinite.
Although enumerated in detail above the concrete direction that the first pad reflexed goes back to base material front, those skilled in the art can recognize, depend on the variation of applied environment and the requirement of manufacturing process, the direction that the first pad reflexed goes back to base material front is not limited to above-mentioned enumerating, but can be direction arbitrarily.
Exemplarily, Fig. 4 is the optional overbending direction exemplary schematic representation according to embodiment of the present invention.
Based on above-mentioned labor.Embodiment of the present invention has also proposed a kind of circuit of realizing cross-over connection.This circuit is printed in single-layer-flex circuit, and this single-layer-flex circuit comprises base material and is positioned at the first pad, the second pad and the wire coil on base material; The first pad, the second pad are connected respectively to wire coil.
Utilize this circuit, can use single-layer-flex circuit to replace Double-layer flexible circuit board to realize circuit cross-over connection.Particularly, this circuit design designs for coiled type, the pad of circuit one end (i.e. the first pad) need to across pad (i.e. the second pad) distance of coil and the other end near and parallel, to be connected with other elements.First pad of this circuit one end is one section of circuit that cuts off base material according to shape along its edge, is separated with theme circuit, this section of circuit is along cutting direction, be wrapped in the back side of single-layer-flex circuit, and by the form single-layer-flex circuit front of turning back of bending.This single-layer-flex circuit substrate backside has glue, and this section of circuit of separation is bonded to single-layer-flex circuit substrate backside firmly, makes it keep fixing.
Particularly, the first pad is along the cropped base material in its edge and be folded into the back side of base material, and by the mode of reflexed, is close to the front of base material; This first pad and described the second pad are all positioned at the same side of the wire coil that this single-layer-flex circuit comprises.
In one embodiment, the first pad is close to the front of described base material along the long side direction of described single-layer-flex circuit by the mode of reflexed, or by the mode of reflexed, is close to the front of described base material along the short side direction of described single-layer-flex circuit.
Embodiment of the present invention can be applied in NFC antenna.Based on above-mentioned labor, embodiment of the present invention has also proposed a kind of NFC antenna.This NFC antenna comprises that being positioned at the feedback of first in single-layer-flex circuit point, second presents point and wire coil, and this single-layer-flex circuit comprises base material; Wherein the first feedback point along the cropped base material in its edge and be folded into the back side of described base material, is close to the front of described base material by the mode of reflexed; This first pad and described the second pad are all positioned at the same side of the wire coil that this single-layer-flex circuit comprises and are parallel to each other.
Preferably, on described base material, there is groove part, for the first feedback point reflexed is positioned to described base material front.
Preferably, in described base material front, there is mark, for the first feedback point being close to the front of described base material, position.
Preferably, the first feedback point is close to the front of described base material along the long side direction of described single-layer-flex circuit by the mode of reflexed, or by the mode of reflexed, is close to the front of described base material along the short side direction of described single-layer-flex circuit.
In sum, in embodiment of the present invention, first along the edge of the first pad, cut the base material of single-layer-flex circuit, and the first pad cutting out is folded into the back side of base material; Again the back side of the first pad and base material is close to; The first pad reflexed returned to the positive of base material and is close to the front of base material, make the second pad in this first pad and base material front, being all positioned at the same side of the wire coil that this single-layer-flex circuit comprises.As can be seen here, after application embodiment of the present invention, structural change by single-layer-flex circuit has realized the circuit cross-over connection function that Double-layer flexible circuit board just can be accomplished, and the circuit cross-over connection of the Double-layer flexible circuit board of comparing, embodiment of the present invention has significantly reduced cost, and it is more simple to realize technique.
In addition, embodiment of the present invention specifically can be applied in NFC antenna, be applicable to the cross-over connection of two feedback points of NFC antenna.
The above, be only preferred embodiment of the present invention, is not intended to limit protection scope of the present invention.Within the spirit and principles in the present invention all, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (10)
1. a method that realizes cross-over connection, is characterized in that, the method comprises:
Along the edge of the first pad, cut the base material of single-layer-flex circuit, and the first pad cutting out is folded into the back side of described base material;
The back side of described the first pad and described base material is close to;
Described the first pad reflexed returned to the positive of described base material and is close to the front of described base material, make the second pad in this first pad and described base material front, being all positioned at the same side of the wire coil that this single-layer-flex circuit comprises.
2. the method that realizes cross-over connection according to claim 1, is characterized in that, the described front that the first pad reflexed is returned to described base material comprises:
Long side direction along described single-layer-flex circuit goes back to described the first pad reflexed to the front of described base material, or along the short side direction of described single-layer-flex circuit, described the first pad reflexed is gone back to the front of described base material.
3. the method that realizes cross-over connection according to claim 1 and 2, is characterized in that, the described back side by the first pad and described base material is close to and is comprised:
Utilize the viscose glue on described substrate backside described the first pad to be bonded in to the back side of described base material.
4. a circuit of realizing cross-over connection, is characterized in that, this circuit is printed in single-layer-flex circuit, and this single-layer-flex circuit comprises base material and is positioned at the first pad, the second pad and the wire coil on described base material;
This first pad is along the cropped base material in its edge and be folded into the back side of described base material, and by the mode of reflexed, is close to the front of described base material; This first pad and described the second pad are all positioned at the same side of the wire coil that this single-layer-flex circuit comprises.
5. the circuit of realizing cross-over connection according to claim 4, it is characterized in that, described the first pad is close to the front of described base material along the long side direction of described single-layer-flex circuit by the mode of reflexed, or by the mode of reflexed, is close to the front of described base material along the short side direction of described single-layer-flex circuit.
6. the circuit of realizing cross-over connection according to claim 4, is characterized in that, at least one in following material of described base material formed:
Polyester insulated resin (PET);
Polyimide insulative resin (PI); Or
Flexible copper foil (FCCL).
7. a close range wireless communication antenna, is characterized in that, comprises and is positioned at the feedback of first in single-layer-flex circuit point, the second feedback point and wire coil, and this single-layer-flex circuit comprises base material; Wherein the first feedback point along the cropped base material in its edge and be folded into the back side of described base material, is close to the front of described base material by the mode of reflexed; This first pad and described the second pad are all positioned at the same side of the wire coil that this single-layer-flex circuit comprises and are parallel to each other.
8. close range wireless communication antenna according to claim 7, is characterized in that, on described base material, has groove part, for the first feedback point reflexed is positioned to described base material front.
9. close range wireless communication antenna according to claim 7, is characterized in that, in described base material front, has mark, for the first feedback point being close to the front of described base material, positions.
10. according to the close range wireless communication antenna described in claim 7,8 or 9, described the first feedback point is close to the front of described base material along the long side direction of described single-layer-flex circuit by the mode of reflexed, or by the mode of reflexed, is close to the front of described base material along the short side direction of described single-layer-flex circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210283441.8A CN103582293A (en) | 2012-08-10 | 2012-08-10 | Method and circuit for achieving bridge joint and close range wireless communication antenna |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210283441.8A CN103582293A (en) | 2012-08-10 | 2012-08-10 | Method and circuit for achieving bridge joint and close range wireless communication antenna |
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| CN103582293A true CN103582293A (en) | 2014-02-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210283441.8A Pending CN103582293A (en) | 2012-08-10 | 2012-08-10 | Method and circuit for achieving bridge joint and close range wireless communication antenna |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102021131730A1 (en) | 2020-12-02 | 2022-06-02 | Molex, Llc | battery connection module |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06296073A (en) * | 1993-02-12 | 1994-10-21 | Sumitomo Electric Ind Ltd | Flexible printed board |
| US20040090378A1 (en) * | 2002-11-08 | 2004-05-13 | Hsin Kuo Dai | Multi-band antenna structure |
| CN201233951Y (en) * | 2008-07-08 | 2009-05-06 | 比亚迪股份有限公司 | Mobile phone antenna |
| CN201508908U (en) * | 2009-07-22 | 2010-06-16 | 比亚迪股份有限公司 | Multiple-frequency antenna |
| CN101783441A (en) * | 2009-01-19 | 2010-07-21 | 环隆电气股份有限公司 | Antenna device and radio frequency device |
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2012
- 2012-08-10 CN CN201210283441.8A patent/CN103582293A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06296073A (en) * | 1993-02-12 | 1994-10-21 | Sumitomo Electric Ind Ltd | Flexible printed board |
| US20040090378A1 (en) * | 2002-11-08 | 2004-05-13 | Hsin Kuo Dai | Multi-band antenna structure |
| CN201233951Y (en) * | 2008-07-08 | 2009-05-06 | 比亚迪股份有限公司 | Mobile phone antenna |
| CN101783441A (en) * | 2009-01-19 | 2010-07-21 | 环隆电气股份有限公司 | Antenna device and radio frequency device |
| CN201508908U (en) * | 2009-07-22 | 2010-06-16 | 比亚迪股份有限公司 | Multiple-frequency antenna |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102021131730A1 (en) | 2020-12-02 | 2022-06-02 | Molex, Llc | battery connection module |
| US11876248B2 (en) | 2020-12-02 | 2024-01-16 | Molex, Llc | Battery connection module |
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Application publication date: 20140212 |