CN103596407A - Thermal buffering element - Google Patents
Thermal buffering element Download PDFInfo
- Publication number
- CN103596407A CN103596407A CN201310270709.9A CN201310270709A CN103596407A CN 103596407 A CN103596407 A CN 103596407A CN 201310270709 A CN201310270709 A CN 201310270709A CN 103596407 A CN103596407 A CN 103596407A
- Authority
- CN
- China
- Prior art keywords
- buffer element
- hot buffer
- heat
- thermal source
- electronic installation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
A thermal buffering element applied to an electronic device is provided. The thermal buffering element includes a heat absorbing material and a plurality of metal particles. The heat absorbing material is disposed corresponding to a heat source of the electronic device. The metal particles are distributed in the heat absorbing material. The invention solves the problem of uneven heat dissipation of an electronic product, which makes a user feel more comfortable.
Description
Technical field
The present invention relates to a kind of hot buffer element.
Background technology
The heat dissipation element that is applied at present electronic product is mostly fan, fin, heat pipe or water-cooled device.Yet due to scientific and technological progress, the external form of the electronic products such as notebook computer, panel computer and mobile phone is more and more frivolous, and above-mentioned heat dissipation element is because volume is difficult to dwindle, and has limited the reduction of electronic product integral thickness, therefore can cause the inconvenience in design.
In addition, though can be attached on the thermal source of electronic product with known slim conducting strip or fin, known conducting strip or fin only can, as the medium of heat transmission, only can provide the path of thermal energy transfer, do not have the function of heat energy storage, and be difficult for maintaining the temperature of electronic product.That is to say, known conducting strip or fin are in fact very limited for the equally distributed effect of heat of electronic product, are therefore difficult to provide good experience for user.
Summary of the invention
The invention provides a kind of hot buffer element that is applied to electronic installation, it comprises heat-absorbing material and a plurality of metallic particles.The corresponding setting of thermal source of heat-absorbing material and electronic installation.Metallic particles is dispersed in heat-absorbing material.
Because heat-absorbing material can store the heat energy that thermal source produces, and metallic particles can improve the rate of heat transfer of hot buffer element, therefore when hot buffer element is positioned on thermal source, when being positioned at circuit board back on the surface of thermal source time or being located close on the housing of thermal source, hot buffer element can be by the thermal energy storage of thermal source diffusion, make electronic installation there is equally distributed temperature, avoid causing hot concentration phenomenon at the heat source position of electronic installation.
In addition,, when the temperature acute variation of thermal source, hot buffer element can pass through heat absorption and the heat release of heat-absorbing material, slows down the rate temperature change of electronic installation, is convenient to the heat management of electronic installation integral body.Thus, can not only promote the component life in electronic installation, and when user uses electronic installation, can differently because of the position touching not feel the excessive temperature difference, there is preferably temperature sensation.
Accompanying drawing explanation
Fig. 1 is according to the vertical view of the hot buffer element of first embodiment of the invention.
Fig. 2 is that the hot buffer element of Fig. 1 is along the profile of line segment 2-2.
Fig. 3 is the profile that the hot buffer element of Fig. 2 is arranged on the back of circuit board of electronic installation.
Fig. 4 is according to the profile of the hot buffer element of second embodiment of the invention.
Fig. 5 is the profile that the hot buffer element of Fig. 4 is arranged on the back of circuit board of electronic installation.
Fig. 6 is the profile that the hot buffer element of Fig. 4 is arranged on the circuit board front of electronic installation.
Fig. 7 is according to the vertical view of the hot buffer element of third embodiment of the invention.
Fig. 8 is that the hot buffer element of Fig. 7 is along the profile of line segment 8-8.
Fig. 9 is the profile that the hot buffer element of Fig. 8 is arranged on the back of circuit board of electronic installation.
Figure 10 is the profile that the hot buffer element of Fig. 8 is arranged on the circuit board front of electronic installation.
Figure 11 is for being arranged on the profile of the housing of electronic installation according to the hot buffer element of four embodiment of the invention.
Embodiment
Below will disclose a plurality of execution mode of the present invention with accompanying drawing, as clearly stated, many details will be explained in the following description.Yet, should be appreciated that, these details do not apply to limit the present invention.That is to say, in part execution mode of the present invention, these details are non-essential.In addition,, for the purpose of simplifying accompanying drawing, some known habitual structures and element represent the mode simply to illustrate in the accompanying drawings.
Figure 1 shows that according to the vertical view of the hot buffer element 100 of first embodiment of the invention.Figure 2 shows that the hot buffer element 100 of Fig. 1 is along the profile of line segment 2-2.Consult Fig. 1 and Fig. 2, hot buffer element 100 comprises heat-absorbing material 110 and a plurality of metallic particles 120 simultaneously.Metallic particles 120 is dispersed in heat-absorbing material 110.
Wherein, heat-absorbing material 110 has the function of thermal energy storage, and metallic particles 120 has the function of heat transfer.In the present embodiment, heat-absorbing material 110 can comprise paraffin, but with paraffin, is not limited, and for example other materials with thermal energy storage function all can.Metallic particles 120 can be copper particle or alumina particles, but with copper particle or alumina particles, is not limited, and for example other metallic particles with high heat-conduction coefficient all can.
In addition, hot buffer element 100 also can comprise the first thermal diffusion material 130.The first thermal diffusion material 130 covers on the surface 112 of heat-absorbing material 110.Wherein, the first thermal diffusion material 130 can comprise the combination of copper, aluminium, graphite or above-mentioned material.The first thermal diffusion material 130 can be fitted or the mode of hot pressing is fixed on heat-absorbing material 110 by viscose.The first thermal diffusion material 130 can promote the rate of heat transfer of hot buffer element 100.
In the following description, the hot buffer element 100 of explanation is applied to the state in electronic installation 200.
Figure 3 shows that the hot buffer element 100 of Fig. 2 is arranged on the profile at circuit board 210 back sides of electronic installation 200.The thermal source 220 of electronic installation 200 is arranged on the front of circuit board 210, and fin 230 is fixed on thermal source 220.Wherein, thermal source 220 can be central processing unit or image chip, and circuit board 210 can be computer main board, but not with restriction the present invention.In the present embodiment, heat-absorbing material 110 and thermal source 220 lay respectively at contrary two surfaces (being circuit board 210 back to the surface of thermal source 220 and surface in the face of thermal source 220) of circuit board 210, and hot buffer element 100 extends to the position under thermal source 220 at least partly, make heat-absorbing material 110 setting corresponding to thermal source 220.
When thermal source 220 adstante febres, because heat-absorbing material 110 can store the heat energy that thermal source 220 produces, and metallic particles 120 can improve the rate of heat transfer of hot buffer element 100, therefore when hot buffer element 100 is positioned at circuit board 210 back on the surface of thermal source 220 time, hot buffer element 100 can be by the thermal energy storage of thermal source 220 evenly diffusion, make electronic installation 200 there is equally distributed temperature, avoid causing hot concentration phenomenon in thermal source 220 positions of electronic installation 200.In the present embodiment, except metallic particles 120 can improve the rate of heat transfer of hot buffer element 100, the first thermal diffusion material 130 also can improve the rate of heat transfer of hot buffer element 100.
In addition, for example, when the temperature acute variation of thermal source 220 when electronic installation 200 power-off (during thermal source 220 overclocking or), hot buffer element 100 can pass through heat absorption and the heat release of heat-absorbing material 110, slow down the rate temperature change of electronic installation 200, be convenient to the heat management of electronic installation 200 integral body, its temperature slowly raise or slowly reduce.Thus, can not only promote the component life in electronic installation 200, and when user uses electronic installation 200, can differently because of the position touching not feel the excessive temperature difference, there is preferably temperature sensation, and can avoid scalding.
Should be appreciated that, the element annexation of having narrated in above narration with narrated consistent, it is no longer repeated for general.In the following description, by the hot buffer element of narration different types.
Figure 4 shows that according to the profile of the hot buffer element 100a of second embodiment of the invention.Figure 5 shows that the hot buffer element 100a of Fig. 4 is arranged on the profile at circuit board 210 back sides of electronic installation 200.Consult Fig. 4 and Fig. 5, hot buffer element 100a comprises heat-absorbing material 110, a plurality of metallic particles 120 and the first thermal diffusion material 130 simultaneously.The places different from Fig. 2, Fig. 3 execution mode are: hot buffer element 100a also can comprise the second thermal diffusion material 140.Wherein, the second thermal diffusion material 140 covers on another surface 114 of relative the first thermal diffusion material 130 of heat-absorbing material 110, makes heat-absorbing material 110 between the first thermal diffusion material 130 and the second thermal diffusion material 140.
In use, the second thermal diffusion material 140 contacts with circuit board 210 back sides, makes the second thermal diffusion material 140 and thermal source 220 lay respectively at contrary two surfaces of circuit board 210.Hot buffer element 100a can, by the thermal energy storage of thermal source 220 evenly diffusion, make electronic installation 200 have equally distributed temperature
In the present embodiment, the second thermal diffusion material 140 can comprise the combination of copper, aluminium, graphite or above-mentioned material, and the second thermal diffusion material 140 and the first thermal diffusion material 130 can be identical can be also different, not with restriction the present invention.Because relative two surfaces 112,114 of heat-absorbing material 110 are coated with respectively the first thermal diffusion material 130 and the second thermal diffusion material 140, therefore the rate of heat transfer of hot buffer element 100a is fast compared with the rate of heat transfer of the hot buffer element 100 of Fig. 2.In addition, the first thermal diffusion material 130 can be connected by connecting material 135 with the second thermal diffusion material 140.Connecting material 135 can be viscose, can be also the diffusion material similar to first, second thermal diffusion material 130,140, not with restriction the present invention.
Figure 6 shows that the hot buffer element 100a of Fig. 4 is arranged on the profile in circuit board 210 fronts of electronic installation 200.The places different from Fig. 5 execution mode are: the second thermal diffusion material 140 of hot buffer element 100a covers on thermal source 220 and circuit board 210.That is to say, hot buffer element 100a and thermal source 220 are positioned at the same side of circuit board 210, and hot buffer element 100a is positioned on thermal source 220 at least partly, and contact with thermal source 220 by the second thermal diffusion material 140.Hot buffer element 100a can, by the thermal energy storage of thermal source 220 evenly diffusion, make electronic installation 200 have equally distributed temperature.In the present embodiment, can omit the fin 230 on Fig. 5 thermal source 220.
Figure 7 shows that according to the vertical view of the hot buffer element 100b of third embodiment of the invention.Figure 8 shows that the hot buffer element 100b of Fig. 7 is along the profile of line segment 8-8.Consult Fig. 7 and Fig. 8, hot buffer element 100b comprises heat-absorbing material 110, a plurality of metallic particles 120, the first thermal diffusion material 130 and the second thermal diffusion material 140 simultaneously.The places different from Fig. 4 execution mode are: the second thermal diffusion material 140 has opening 142, and hot buffer element 100b also comprises insulating material 150.Wherein, insulating material 150 is arranged in opening 142.In the following description, the hot buffer element 100b of explanation is applied to the state in electronic installation 200.
Figure 9 shows that the hot buffer element 100b of Fig. 8 is arranged on the profile at circuit board 210 back sides of electronic installation 200.In use, the second thermal diffusion material 140 of hot buffer element 100b contacts with circuit board 210 back sides, and insulating material 150 and opening 142 correspondences can cause the position of circuit board 210 short circuits to arrange.In the present embodiment, although insulating material 150 is positioned at the below of thermal source 220, the position of insulating material 150 is not as limit.Hot buffer element 100b can, by the thermal energy storage of thermal source 220 evenly diffusion, make electronic installation 200 have equally distributed temperature.In the present embodiment, insulating material 150 can comprise plastics, rubber or pottery, but with above-mentioned material, is not limited.Insulating material 150 can be avoided thermal source 220 contacts at second thermal diffusion material 140 contact circuit plate 210 back sides and cause short circuit.
Figure 10 shows that the hot buffer element 100b of Fig. 8 is arranged on the profile in circuit board 210 fronts of electronic installation 200.The places different from Fig. 9 execution mode are: the second thermal diffusion material 140 of hot buffer element 100b covers on thermal source 220 and circuit board 210.That is to say, hot buffer element 100b and thermal source 220 are positioned at the same side of circuit board 210, and hot buffer element 100b is positioned on thermal source 220 at least partly, and contact with thermal source 220 by the second thermal diffusion material 140.Thus, hot buffer element 100b can, by the thermal energy storage of thermal source 220 evenly diffusion, make electronic installation 200 have equally distributed temperature.In the present embodiment, can omit the fin 230 on Fig. 9 thermal source 220.
Figure 11 shows that the profile that is arranged on the housing 240 of electronic installation 200 according to the hot buffer element 100c of four embodiment of the invention.Hot buffer element 100c comprises heat-absorbing material 110, a plurality of metallic particles 120 and protective tapes 160.Heat-absorbing material 110 is positioned on the housing 240 of electronic installation 200, and protective tapes 160 is attached on heat-absorbing material 110 and housing 240, makes the thermal source 220 distance d on heat-absorbing material 110 and circuit board 210.
When thermal source 220 adstante febres, hot-air can rise, and the hot buffer element 100c temperature of thermal source 220 tops is raise.Hot buffer element 100c can, by the thermal energy storage of thermal source 220 evenly diffusion, make electronic installation 200 have equally distributed temperature.
Hot buffer element of the present invention has the following advantages:
(1) heat-absorbing material can store the heat energy that thermal source produces, and metallic particles can improve the rate of heat transfer of hot buffer element, therefore when hot buffer element is positioned on thermal source, when being positioned at circuit board back on the surface of thermal source time or being located close on the housing of thermal source, hot buffer element can be by the thermal energy storage of thermal source diffusion, make electronic installation there is equally distributed temperature, avoid causing hot concentration phenomenon at the heat source position of electronic installation.
(2) when the temperature acute variation of thermal source, hot buffer element can pass through heat absorption and the heat release of heat-absorbing material, slows down the rate temperature change of electronic installation, is convenient to the heat management of electronic installation integral body.Thus, can not only promote the component life in electronic installation, and when user uses electronic installation, can differently because of the position touching not feel the excessive temperature difference, there is preferably temperature sensation, and avoid scalding.
(3) because hot buffer element is optionally arranged on the inner surface of back of circuit board, front and housing, and the thin thickness of hot buffer element and in the form of sheets, therefore the utilization for electronic installation space relatively has elasticity.
Although the present invention with embodiment openly as above; so it is not in order to limit the present invention; under any, in technical field, there are the personnel of common knowledge; without departing from the spirit and scope of the present invention; when doing a little change and retouching, therefore protection scope of the present invention is when being as the criterion depending on claims person of defining.
Claims (10)
1. a hot buffer element, it is applied to electronic installation, and this electronic installation has thermal source, it is characterized in that, and this hot buffer element comprises:
Heat-absorbing material, it is corresponding to above-mentioned thermal source setting; And
A plurality of metallic particles, it is dispersed in above-mentioned heat-absorbing material.
2. hot buffer element according to claim 1, is characterized in that, also comprises:
The first thermal diffusion material, it covers on the surface of described heat-absorbing material.
3. hot buffer element according to claim 2, is characterized in that, the combination that described the first thermal diffusion material comprises copper, aluminium, graphite or above-mentioned material.
4. hot buffer element according to claim 2, is characterized in that, described thermal source is arranged on circuit board, and described heat-absorbing material and described thermal source lay respectively at contrary two surfaces of this circuit board.
5. hot buffer element according to claim 2, is characterized in that, also comprises:
The second thermal diffusion material, its another surface that covers relatively described the first thermal diffusion material of described heat-absorbing material is upper, makes described heat-absorbing material between described the first thermal diffusion material and this second thermal diffusion material.
6. hot buffer element according to claim 5, is characterized in that, described thermal source is arranged on the circuit board of described electronic installation, and described the second thermal diffusion material and described thermal source lay respectively at contrary two surfaces of this circuit board.
7. hot buffer element according to claim 5, is characterized in that, described thermal source is arranged on the circuit board of described electronic installation, and described the second thermal diffusion material covers on described thermal source and this circuit board.
8. hot buffer element according to claim 5, is characterized in that, described the second thermal diffusion material has opening, and described hot buffer element also comprises:
Insulating material, it is arranged in above-mentioned opening, and this insulating material and above-mentioned opening are arranged at the position that correspondence can cause the circuit board short circuit of described electronic installation.
9. hot buffer element according to claim 5, is characterized in that, the combination that described the second thermal diffusion material comprises copper, aluminium, graphite or above-mentioned material.
10. hot buffer element according to claim 1, is characterized in that, described heat-absorbing material is positioned on the housing of described electronic installation, and described hot buffer element also comprises:
Protective tapes, it is attached on described heat-absorbing material and above-mentioned housing, makes described heat-absorbing material and described thermal source at a distance of a segment distance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/953,742 US9210832B2 (en) | 2012-08-13 | 2013-07-30 | Thermal buffering element |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261682318P | 2012-08-13 | 2012-08-13 | |
| US61/682,318 | 2012-08-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103596407A true CN103596407A (en) | 2014-02-19 |
| CN103596407B CN103596407B (en) | 2016-08-10 |
Family
ID=50086331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310270709.9A Active CN103596407B (en) | 2012-08-13 | 2013-07-01 | Hot buffer element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103596407B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0450968A2 (en) * | 1990-04-06 | 1991-10-09 | De Beers Industrial Diamond Division (Proprietary) Limited | Circuit boards |
| US5315154A (en) * | 1993-05-14 | 1994-05-24 | Hughes Aircraft Company | Electronic assembly including heat absorbing material for limiting temperature through isothermal solid-solid phase transition |
| US6397618B1 (en) * | 2001-05-30 | 2002-06-04 | International Business Machines Corporation | Cooling system with auxiliary thermal buffer unit for cooling an electronics module |
| US7316262B1 (en) * | 2004-01-26 | 2008-01-08 | Rini Technologies, Inc. | Method and apparatus for absorbing thermal energy |
| US20100038053A1 (en) * | 2008-08-15 | 2010-02-18 | Maxik Fredric S | Sustainable endothermic heat stripping method and apparatus |
| US20100319876A1 (en) * | 2007-02-08 | 2010-12-23 | Toyota Jidosha Kabushiki Kaisha | Semiconductor element cooling structure |
| US20120171546A1 (en) * | 2010-08-31 | 2012-07-05 | Nitto Denko Corporation | Heat dissipating housing and lithium battery pack using the same, and semiconducting tape for heat dissipation |
-
2013
- 2013-07-01 CN CN201310270709.9A patent/CN103596407B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0450968A2 (en) * | 1990-04-06 | 1991-10-09 | De Beers Industrial Diamond Division (Proprietary) Limited | Circuit boards |
| US5315154A (en) * | 1993-05-14 | 1994-05-24 | Hughes Aircraft Company | Electronic assembly including heat absorbing material for limiting temperature through isothermal solid-solid phase transition |
| US6397618B1 (en) * | 2001-05-30 | 2002-06-04 | International Business Machines Corporation | Cooling system with auxiliary thermal buffer unit for cooling an electronics module |
| US7316262B1 (en) * | 2004-01-26 | 2008-01-08 | Rini Technologies, Inc. | Method and apparatus for absorbing thermal energy |
| US20100319876A1 (en) * | 2007-02-08 | 2010-12-23 | Toyota Jidosha Kabushiki Kaisha | Semiconductor element cooling structure |
| US20100038053A1 (en) * | 2008-08-15 | 2010-02-18 | Maxik Fredric S | Sustainable endothermic heat stripping method and apparatus |
| US20120171546A1 (en) * | 2010-08-31 | 2012-07-05 | Nitto Denko Corporation | Heat dissipating housing and lithium battery pack using the same, and semiconducting tape for heat dissipation |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103596407B (en) | 2016-08-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9210832B2 (en) | Thermal buffering element | |
| WO2017067219A1 (en) | Cooling device for mobile terminal, and mobile terminal | |
| CN104333620B (en) | A kind of mobile phone heat abstractor | |
| WO2017067202A1 (en) | Cooling device for mobile terminal, and mobile terminal | |
| CN105338783A (en) | Heat dissipation device for electronic equipment | |
| TW201404287A (en) | Heat dissipation composite and the uses thereof | |
| TWM487609U (en) | Heat dissipation structure of handheld electronic device | |
| CN106802849A (en) | Heat dissipation capacity predictor method | |
| CN104981134A (en) | Electronic device | |
| TWM626519U (en) | Structure of temperature-homogenizing and heat-dissipating device | |
| CN204733519U (en) | A kind of electronic installation | |
| CN106413335B (en) | Heat dissipation buffering shielding composite structure of mobile electronic device | |
| US9063712B2 (en) | Laptop computer cooling stand | |
| CN205179142U (en) | Modified heat dissipation type mobile phone motherboard | |
| CN204741649U (en) | Radiating piece of electronic product | |
| CN103596407A (en) | Thermal buffering element | |
| JP2015088575A (en) | Heat insulation sheet and thermal insulation structure using the same | |
| CN204994208U (en) | Camera heat abstractor of electronic product and electronic product of using thereof | |
| US8363398B2 (en) | Electronic device with heat dissipation casing | |
| CN206506813U (en) | Electronic installation | |
| CN104441830A (en) | Heat conduction film structure of electronic product | |
| CN209561374U (en) | A kind of electronic equipment | |
| CN219536638U (en) | External heat abstractor of mobile device | |
| CN107979943B (en) | Composite support heat radiation structure capable of carrying electronic device | |
| CN105555107A (en) | Fan-less thermal dissipation system and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |