CN103596407B - Hot buffer element - Google Patents
Hot buffer element Download PDFInfo
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- CN103596407B CN103596407B CN201310270709.9A CN201310270709A CN103596407B CN 103596407 B CN103596407 B CN 103596407B CN 201310270709 A CN201310270709 A CN 201310270709A CN 103596407 B CN103596407 B CN 103596407B
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- Prior art keywords
- buffer element
- heat
- hot buffer
- thermal source
- electronic installation
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Abstract
The invention discloses a kind of hot buffer element, it is applied to electronic installation.Hot buffer element comprises heat-absorbing material and multiple metallic particles.Heat-absorbing material is correspondingly arranged with the thermal source of electronic installation.Metallic particles is dispersed in heat-absorbing material.The present invention solves the problem that electronic product radiating is uneven, makes user have preferably temperature sensation.
Description
Technical field
The present invention relates to a kind of hot buffer element.
Background technology
The heat dissipation element being applied to electronic product at present is mostly fan, fin, heat pipe or water-cooled dress
Put.But, due to the progress of science and technology, outside the electronic product such as notebook computer, panel computer and mobile phone
Type is more and more frivolous, and above-mentioned heat dissipation element is difficult to reduce because of volume, limits electronic product entirety thick
The reduction of degree, therefore can cause the inconvenience in design.
Though additionally, can be attached on the thermal source of electronic product with known slim conducting strip or fin, but
Known conducting strip or fin are only capable of the medium as heat transfer, are only provided that the path that heat energy transmits, and
Do not store the function of heat energy, and be difficult to maintain the temperature of electronic product.That is, it is known that conducting strip
Or fin is the most very limited for the equally distributed effect of heat of electronic product, therefore, it is difficult to for using
Person provides good experience.
Summary of the invention
The present invention provides a kind of hot buffer element being applied to electronic installation, and it comprises heat-absorbing material with multiple
Metallic particles.Heat-absorbing material is correspondingly arranged with the thermal source of electronic installation.Metallic particles is dispersed in heat-absorbing material
In.
Owing to heat-absorbing material can store the heat energy that thermal source produces, and metallic particles can improve hot buffer element
Rate of heat transfer, therefore when hot buffer element is positioned on thermal source, be positioned at circuit board back on the surface of thermal source
Time or when being located close on the housing of thermal source, hot buffer element can by the thermal energy storage of thermal source and spread,
Electronic installation is made to have equally distributed temperature, it is to avoid it is existing that the heat source position at electronic installation causes heat to concentrate
As.
Additionally, when the high temperature of thermal source changes, hot buffer element can by the heat absorption of heat-absorbing material with
Heat release, slows down the rate temperature change of electronic installation, it is simple to the heat management that electronic installation is overall.Such one
Come, the component life in electronic installation can not only be promoted, and when user uses electronic installation, Bu Huiyin
The position touched is different and feels the excessive temperature difference, has preferably temperature sensation.
Accompanying drawing explanation
Fig. 1 is the top view of the hot buffer element according to first embodiment of the invention.
Fig. 2 is the hot buffer element profile along line segment 2-2 of Fig. 1.
Fig. 3 is the profile that the hot buffer element of Fig. 2 is arranged on the back of circuit board of electronic installation.
Fig. 4 is the profile of the hot buffer element according to second embodiment of the invention.
Fig. 5 is the profile that the hot buffer element of Fig. 4 is arranged on the back of circuit board of electronic installation.
Fig. 6 is the profile that the hot buffer element of Fig. 4 is arranged on the circuit board front of electronic installation.
Fig. 7 is the top view of the hot buffer element according to third embodiment of the invention.
Fig. 8 is the hot buffer element profile along line segment 8-8 of Fig. 7.
Fig. 9 is the profile that the hot buffer element of Fig. 8 is arranged on the back of circuit board of electronic installation.
Figure 10 is the profile that the hot buffer element of Fig. 8 is arranged on the circuit board front of electronic installation.
Figure 11 is the housing that the hot buffer element according to four embodiment of the invention is arranged on electronic installation
Profile.
Detailed description of the invention
Below by the multiple embodiments with the open present invention of accompanying drawing, as clearly stated, many concrete
Details will be explained in the following description.It should be appreciated, however, that these details are not applied with limit
The present invention processed.It is to say, in some embodiments of the present invention, these details are non-essential.
Additionally, for the sake of simplifying accompanying drawing, some known usual structures and element in the accompanying drawings will be with simple signals
Mode represent.
Fig. 1 show the top view of the hot buffer element 100 according to first embodiment of the invention.Fig. 2
It show the hot buffer element 100 profile along line segment 2-2 of Fig. 1.Simultaneously refering to Fig. 1 and Fig. 2, heat
Buffer element 100 comprises heat-absorbing material 110 and multiple metallic particles 120.Metallic particles 120 is dispersed in suction
In hot material 110.
Wherein, heat-absorbing material 110 has the function of thermal energy storage, and metallic particles 120 has heat transfer
Function.In the present embodiment, heat-absorbing material 110 can comprise paraffin, but is not limited with paraffin,
Such as other materials with thermal energy storage function all may be used.Metallic particles 120 can be copper granule or aluminum
Grain, but be not limited with copper granule or alumina particles, such as other have the metallic particles of high heat-conduction coefficient
All may be used.
Additionally, hot buffer element 100 also can comprise the first thermal diffusion material 130.First thermal diffusion material
130 cover on the surface 112 of heat-absorbing material 110.Wherein, the first thermal diffusion material 130 can comprise
The combination of copper, aluminum, graphite or above-mentioned material.First thermal diffusion material 130 can be fitted by viscose or heat
The mode of pressing is fixed on heat-absorbing material 110.First thermal diffusion material 130 can promote hot buffer element
The rate of heat transfer of 100.
In the following description, will illustrate that hot buffer element 100 is applied to the state in electronic installation 200.
Fig. 3 show the hot buffer element 100 of Fig. 2 and is arranged on the circuit board 210 of electronic installation 200 and carries on the back
The profile in face.The thermal source 220 of electronic installation 200 is arranged on the front of circuit board 210, and fin
230 are fixed on thermal source 220.Wherein, thermal source 220 can be central processing unit or image chip, circuit
Plate 210 can be computer main board, but not to limit the present invention.In the present embodiment, heat-absorbing material
110 lay respectively at contrary two surfaces of circuit board 210 with thermal source 220, and (i.e. circuit board 210 is back to thermal source 220
Surface with in the face of the surface of thermal source 220), and hot buffer element 100 extends at least partially into thermal source 220
Location directly below, makes heat-absorbing material 110 be correspondingly arranged with thermal source 220.
When thermal source 220 adstante febre, owing to heat-absorbing material 110 can store the heat energy that thermal source 220 produces, and
Metallic particles 120 can improve the rate of heat transfer of hot buffer element 100, therefore when hot buffer element 100
In circuit board 210 back to time on the surface of thermal source 220, hot buffer element 100 can be by the warm of thermal source 220
Can store and uniformly spread, make electronic installation 200 have equally distributed temperature, it is to avoid at electronic installation
Hot concentration phenomenon is caused in thermal source 220 position of 200.In the present embodiment, can except metallic particles 120
Improving outside the rate of heat transfer of hot buffer element 100, the first thermal diffusion material 130 also can improve hot cushioning element
The rate of heat transfer of part 100.
Additionally, when the high temperature of thermal source 220 changes (such as during thermal source 220 overclocking or electronic installation 200
During power-off), hot buffer element 100 can slow down electronic installation by the heat absorption of heat-absorbing material 110 and heat release
The rate temperature change of 200, it is simple to the heat management of electronic installation 200 entirety so that it is temperature slowly raise or
Slowly reduce.Consequently, it is possible to the component life that can not only promote in electronic installation 200, and when user makes
During with electronic installation 200, the excessive temperature difference will not be felt because the position of touch is different, have preferably
Temperature sensation, and it is avoided that scald.
It will be understood that the element annexation described in described above is consistent with described, will
It is no longer repeated.In the following description, by the hot buffer element of narration different types.
Fig. 4 show the profile of the hot buffer element 100a according to second embodiment of the invention.Fig. 5
It show the section that the hot buffer element 100a of Fig. 4 is arranged on circuit board 210 back side of electronic installation 200
Figure.Comprise heat-absorbing material 110, multiple metal refering to Fig. 4 and Fig. 5, hot buffer element 100a simultaneously
Grain 120 and the first thermal diffusion material 130.The place different from Fig. 2, Fig. 3 embodiment is: heat is slow
Rush element 100a and also can comprise the second thermal diffusion material 140.Wherein, the second thermal diffusion material 140 covers
On another surface 114 of the relative first thermal diffusion material 130 of heat-absorbing material 110, make heat-absorbing material 110
Between the first thermal diffusion material 130 and the second thermal diffusion material 140.
In use, the second thermal diffusion material 140 and circuit board 210 rear-face contact so that the second heat expands
Dissipate material 140 and lay respectively at contrary two surfaces of circuit board 210 with thermal source 220.Hot buffer element 100a
By the thermal energy storage of thermal source 220 and can uniformly spread, make electronic installation 200 have equally distributed temperature
In the present embodiment, the second thermal diffusion material 140 can comprise copper, aluminum, graphite or above-mentioned material
The combination of material, and the second thermal diffusion material 140 and the first thermal diffusion material 130 can be identical also may be used
To be different, not to limit the present invention.Relative two surfaces 112,114 due to heat-absorbing material 110
The first thermal diffusion material 130 and the second thermal diffusion material 140, the hottest buffer element 100a are covered each by it
The rate of heat transfer of the rate of heat transfer hot buffer element 100 compared with Fig. 2 fast.Additionally, the first thermal diffusion material
130 can be connected by connecting material 135 with the second thermal diffusion material 140.Connecting material 135 can be
Viscose, it is also possible to for the first, second similar diffusion material of thermal diffusion material 130,140, not with
Limit the present invention.
Fig. 6 show the hot buffer element 100a of Fig. 4 and is just being arranged on the circuit board 210 of electronic installation 200
The profile in face.The place different from Fig. 5 embodiment is: second heat of hot buffer element 100a expands
Dissipate material 140 to cover on thermal source 220 with circuit board 210.It is to say, hot buffer element 100a with
Thermal source 220 is positioned at the same side of circuit board 210, and hot buffer element 100a is at least partially disposed at thermal source 220
On, and contacted with thermal source 220 by the second thermal diffusion material 140.Hot buffer element 100a can be by warm
The thermal energy storage in source 220 also uniformly spreads, and makes electronic installation 200 have equally distributed temperature.At this
In embodiment, the fin 230 on Fig. 5 thermal source 220 can be omitted.
Fig. 7 show the top view of the hot buffer element 100b according to third embodiment of the invention.Fig. 8
It show the hot buffer element 100b profile along line segment 8-8 of Fig. 7.Simultaneously refering to Fig. 7 and Fig. 8,
Hot buffer element 100b comprises heat-absorbing material 110, multiple metallic particles the 120, first thermal diffusion material 130
With the second thermal diffusion material 140.The place different from Fig. 4 embodiment is: the second thermal diffusion material
140 have opening 142, and hot buffer element 100b also comprises insulant 150.Wherein, insulant
150 are positioned in opening 142.In the following description, hot for explanation buffer element 100b is applied to electronics dress
Put the state in 200.
Fig. 9 show the hot buffer element 100b of Fig. 8 and is arranged on the circuit board 210 of electronic installation 200 and carries on the back
The profile in face.In use, second thermal diffusion material 140 and the circuit board 210 of hot buffer element 100b
Back face touches, and insulant 150 and opening 142 correspondence can cause the position of circuit board 210 short circuit
Arrange.In the present embodiment, although insulant 150 is positioned at the lower section of thermal source 220, but insulation material
The position of material 150 is not limited thereto.Hot buffer element 100b can by the thermal energy storage of thermal source 220 the most all
Even diffusion, makes electronic installation 200 have equally distributed temperature.In the present embodiment, insulant
150 can comprise plastics, rubber or pottery, but are not limited with above-mentioned material.Insulant 150 can be avoided
Second thermal diffusion material 140 contacts thermal source 220 contact at circuit board 210 back side and causes short circuit.
Figure 10 show the hot buffer element 100b of Fig. 8 and is arranged on the circuit board 210 of electronic installation 200
The profile in front.The place different from Fig. 9 embodiment is: second heat of hot buffer element 100b
Diffusion material 140 covers on thermal source 220 with circuit board 210.It is to say, hot buffer element 100b
With the same side that thermal source 220 is positioned at circuit board 210, and hot buffer element 100b is at least partially disposed at thermal source
On 220, and contacted with thermal source 220 by the second thermal diffusion material 140.Consequently, it is possible to hot cushioning element
Part 100b by the thermal energy storage of thermal source 220 and uniformly can spread, and makes electronic installation 200 have and is uniformly distributed
Temperature.In the present embodiment, the fin 230 on Fig. 9 thermal source 220 can be omitted.
Figure 11 show the hot buffer element 100c according to four embodiment of the invention and is arranged on electronics dress
Put the profile of the housing 240 of 200.Hot buffer element 100c comprises heat-absorbing material 110, multiple metal
Granule 120 and protection adhesive tape 160.Heat-absorbing material 110 is positioned on the housing 240 of electronic installation 200, and
Protection adhesive tape 160 is attached on heat-absorbing material 110 and housing 240, makes heat-absorbing material 110 and circuit board
Thermal source 220 distance d on 210.
When thermal source 220 adstante febre, hot-air can rise, and makes the hot buffer element 100c above thermal source 220
Temperature raises.Hot buffer element 100c by the thermal energy storage of thermal source 220 and uniformly can spread, and makes electronics fill
Put 200 and there is equally distributed temperature.
The hot buffer element of the present invention has the advantage that
(1) heat-absorbing material can store the heat energy that thermal source produces, and metallic particles can improve hot buffer element
Rate of heat transfer, therefore when hot buffer element is positioned on thermal source, be positioned at circuit board back on the surface of thermal source
Time or when being located close on the housing of thermal source, hot buffer element can by the thermal energy storage of thermal source and spread,
Electronic installation is made to have equally distributed temperature, it is to avoid it is existing that the heat source position at electronic installation causes heat to concentrate
As.
(2) when the high temperature of thermal source changes, hot buffer element can by the heat absorption of heat-absorbing material with put
Heat, slows down the rate temperature change of electronic installation, it is simple to the heat management that electronic installation is overall.Consequently, it is possible to
The component life in electronic installation can not only be promoted, and when user uses electronic installation, will not be because touching
Position different and feel the excessive temperature difference, there is preferably temperature sensation, and avoid scalding.
(3) it is optionally provided at the interior table of back of circuit board, front and housing due to hot buffer element
On face, and the thickness of hot buffer element thin and in the form of sheets, therefore the utilization for electronic installation space is compared
There is elasticity.
Although the present invention is open as above with embodiment, so it is not limited to the present invention, Ren Hesuo
Belong in technical field the personnel with usual knowledge, without departing from the spirit and scope of the present invention, when can
Make a little variation and retouching, therefore protection scope of the present invention is when being as the criterion depending on those as defined in claim.
Claims (7)
1. a hot buffer element, it is applied to electronic installation, and this electronic installation has thermal source, its feature
Being, this hot buffer element comprises:
Heat-absorbing material, it is arranged corresponding to above-mentioned thermal source；And
Multiple metallic particles, it is dispersed in above-mentioned heat-absorbing material；
First thermal diffusion material, it covers on the surface of described heat-absorbing material；
Second thermal diffusion material, it covers another at the most described first thermal diffusion material of described heat-absorbing material
On one surface, make described heat-absorbing material be positioned at described first thermal diffusion material and this second thermal diffusion material it
Between, described second thermal diffusion material has opening；
Insulant, it is positioned in above-mentioned opening, and this insulant and above-mentioned opening are arranged at corresponding meeting
Cause the position of the circuit board short circuit of described electronic installation.
Hot buffer element the most according to claim 1, it is characterised in that described first thermal diffusion material
Material comprises at least one in copper, aluminum and graphite.
Hot buffer element the most according to claim 1, it is characterised in that described thermal source is arranged on electricity
On the plate of road, and described heat-absorbing material lays respectively at contrary two surfaces of this circuit board with described thermal source.
Hot buffer element the most according to claim 1, it is characterised in that described thermal source is arranged on institute
State on the circuit board of electronic installation, and described second thermal diffusion material lays respectively at this circuit with described thermal source
Contrary two surfaces of plate.
Hot buffer element the most according to claim 1, it is characterised in that described thermal source is arranged on institute
State on the circuit board of electronic installation, and described second thermal diffusion material covers at described thermal source and this circuit board
On.
Hot buffer element the most according to claim 1, it is characterised in that described second thermal diffusion material
Material comprises at least one in copper, aluminum and graphite.
Hot buffer element the most according to claim 1, it is characterised in that described heat-absorbing material is positioned at
On the housing of described electronic installation, described hot buffer element also comprises:
Protection adhesive tape, it is attached on described heat-absorbing material and above-mentioned housing, makes described heat-absorbing material and institute
State thermal source distance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/953,742 US9210832B2 (en) | 2012-08-13 | 2013-07-30 | Thermal buffering element |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261682318P | 2012-08-13 | 2012-08-13 | |
| US61/682,318 | 2012-08-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103596407A CN103596407A (en) | 2014-02-19 |
| CN103596407B true CN103596407B (en) | 2016-08-10 |
Family
ID=50086331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310270709.9A Active CN103596407B (en) | 2012-08-13 | 2013-07-01 | Hot buffer element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103596407B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0450968A2 (en) * | 1990-04-06 | 1991-10-09 | De Beers Industrial Diamond Division (Proprietary) Limited | Circuit boards |
| US5315154A (en) * | 1993-05-14 | 1994-05-24 | Hughes Aircraft Company | Electronic assembly including heat absorbing material for limiting temperature through isothermal solid-solid phase transition |
| US6397618B1 (en) * | 2001-05-30 | 2002-06-04 | International Business Machines Corporation | Cooling system with auxiliary thermal buffer unit for cooling an electronics module |
| US7316262B1 (en) * | 2004-01-26 | 2008-01-08 | Rini Technologies, Inc. | Method and apparatus for absorbing thermal energy |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4694514B2 (en) * | 2007-02-08 | 2011-06-08 | トヨタ自動車株式会社 | Semiconductor device cooling structure |
| US8631855B2 (en) * | 2008-08-15 | 2014-01-21 | Lighting Science Group Corporation | System for dissipating heat energy |
| JP2012054001A (en) * | 2010-08-31 | 2012-03-15 | Nitto Denko Corp | Heat dissipation housing, lithium battery pack using the same, and semiconductive tape for heat dissipation |
-
2013
- 2013-07-01 CN CN201310270709.9A patent/CN103596407B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0450968A2 (en) * | 1990-04-06 | 1991-10-09 | De Beers Industrial Diamond Division (Proprietary) Limited | Circuit boards |
| US5315154A (en) * | 1993-05-14 | 1994-05-24 | Hughes Aircraft Company | Electronic assembly including heat absorbing material for limiting temperature through isothermal solid-solid phase transition |
| US6397618B1 (en) * | 2001-05-30 | 2002-06-04 | International Business Machines Corporation | Cooling system with auxiliary thermal buffer unit for cooling an electronics module |
| US7316262B1 (en) * | 2004-01-26 | 2008-01-08 | Rini Technologies, Inc. | Method and apparatus for absorbing thermal energy |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103596407A (en) | 2014-02-19 |
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