CN103646269A - RFID (radio frequency identification) flexible tag and packaging method thereof - Google Patents
RFID (radio frequency identification) flexible tag and packaging method thereof Download PDFInfo
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- CN103646269A CN103646269A CN201310606018.1A CN201310606018A CN103646269A CN 103646269 A CN103646269 A CN 103646269A CN 201310606018 A CN201310606018 A CN 201310606018A CN 103646269 A CN103646269 A CN 103646269A
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Abstract
The invention relates to an RFID (radio frequency identification) flexible tag and a packaging method thereof. The RFID flexible tag comprises a circuit chip, an antenna, a substrate plate, a circuit chip protective colloid and outer packaging, wherein the circuit chip is electrically connected with the antenna, the antenna is arranged on the substrate plate, and the circuit chip protective colloid covers on the circuit chip. The RFID flexible tag is characterized by further comprising a first protective strip and a second protective strip, wherein the first protective strip is provided with an opening and covers on the antenna, the opening exposes a part where the circuit chip and the antenna are fixed, and the second protective strip covers the opening and is arranged at the upper side of the first protective strip. The RFID flexible tag protects the circuit chip by adopting dispensing, the first protective strip and the second protective strip, and meanwhile, and the outer packaging of the tag is made of a flexible material, thereby enabling the RFID flexible tag to have the advantages of ability of bearing external pressure, high temperature resistance, corrosion protection and the like, and improving the efficiency in reading information stored in the RFID tag.
Description
Technical field
The present invention relates to RFID label field, relate in particular to the method for packing of a kind of RFID flexible label and RFID flexible label.
Background technology
In recent years, along with the development of the communication technology, take radio-frequency technique as support, the short-range communication that the wireless communication technology of take is means obtains constantly perfect, RFID(Radio Frequency Identification, is called for short RFID) REID arises at the historic moment.
RFID radio-frequency (RF) identification is a kind of contactless automatic identification technology, and it can see through exterior material, by radiofrequency signal, is automatically identified destination object and is obtained related data, and identification work need not manual intervention, can work in various rugged surroundings.RFID technology not only can be identified high-speed moving object but also can identify a plurality of labels simultaneously, convenient to operation.Radio frequency identification RFID produces in this technical foundation.
Because radio frequency identification RFID has very large information storage amount, therefore, in fields such as the management of modern logistics, electric power asset and foodstuff traceabilities, there is application very widely, thus the making of radio frequency identification RFID and be encapsulated into RFID REID and be able to the hardware guarantee in association area application.Chinese invention patent CN200610004747.X has announced a kind of RFID label, the circuit chip of this RFID label is electrically connected to antenna pattern, both are fixed on substrate simultaneously, position away from circuit chip on substrate is fixed with the first strengthening body that covers circuit chip, and the first strengthening body is not fixed on circuit chip.Although this RFID label design can reduce the impact of bending stress on circuit chip, but when object is in the severe environmental conditions such as crooked pressure, high temperature, corrosion lower time, RFID chip and antenna easily come off from backing material plate because of factor impacts such as crooked pressure, high temperature and corrosion, thereby have a strong impact on scanning device reading the built-in information of radio frequency identification RFID.
Summary of the invention
Primary technical matters to be solved by this invention is for above-mentioned prior art, to provide a kind of can carry out the RFID flexible label that normal data information reads in stressed crooked situation.
The further technical matters to be solved of the present invention is to provide a kind of RFID flexible label with superperformances such as high temperature resistant and anticorrosions for above-mentioned prior art.
Another technical matters to be solved by this invention is that a kind of method for packing of RFID flexible label is provided for prior art.
The present invention solves the technical scheme that above-mentioned primary technical matters adopts: a kind of RFID flexible label, comprise circuit chip, antenna, backing material plate, circuit chip protecting colloid and outer package, circuit chip conducts electricity and is connected with antenna, antenna is arranged on backing material plate, circuit chip protecting colloid is covered on circuit chip, it is characterized in that, also comprise the first ceiling and the second ceiling, described the first ceiling is provided with perforate and is covered on antenna, described perforate exposes the bearing of circuit chip and antenna, described the second ceiling covers perforate and is arranged at the upside of the first ceiling.
As preferably, described the first ceiling is cover antenna at least completely, and the thickness of the first ceiling at least equals the thickness of circuit chip, and described the second ceiling covers perforate at least completely.
As preferably, described the first ceiling and/or the second ceiling adopt exotic material to make.
Selectively, adopt conducting resinl or welding or metal wire to conduct electricity and be connected between described circuit chip and described antenna, described antenna is by metal material or Nano Silver or printing ink to manufacture.
As improvement, the downside of described backing material plate is provided with the 3rd ceiling, and the 3rd ceiling is covering substrates plate at least completely, and the 3rd ceiling adopts exotic material to make.
As preferably, described outer package adopts flexible material to make.
A method for packing for RFID flexible label, is characterized in that, comprises the following steps:
(1) antenna is arranged on backing material plate;
(2) circuit chip is fixed on antenna, and is connected conducting electricity between circuit chip and antenna;
(3) on the first ceiling, perforate is set, will be provided with the complete cover antenna of the first ceiling of perforate;
(4), by the perforate of the first ceiling, the circuit chip and the antenna that the first ceiling tapping are exposed in the mode of a glue are fixed;
(5) the second ceiling is covered completely to the perforate of the first ceiling, and the second ceiling is arranged on to the upside of the first ceiling;
(6) adopt flexible material parcel be integrated in the device on backing material plate and be fixed, encapsulate.
Compared with prior art, the invention has the advantages that: first, RFID flexible label provided by the invention adopts some glue, the first ceiling and the second ceiling to carry out triple protection to circuit chip, the outer package of label adopts flexible material to make simultaneously, bear external pressure, thereby make RFID flexible label there is the advantages such as the external pressure of bearing, high temperature resistant and anticorrosion, improved reading speed and the reliability to storing information in RFID label in practical application; Secondly, RFID flexible label method for packing process provided by the invention is simple, encapsulation is firm, is convenient to industrial mass manufacture.
Accompanying drawing explanation
Fig. 1 is the cross-sectional view of RFID flexible label in the embodiment of the present invention;
Fig. 2 is the decomposition texture schematic diagram (except outer package) of RFID flexible label in the embodiment of the present invention;
Fig. 3 is the cross-sectional view after the improvement of RFID flexible label in the embodiment of the present invention;
Fig. 4 is the process flow diagram of RFID flexible label method for packing in the embodiment of the present invention.
Embodiment
Below in conjunction with accompanying drawing, embodiment is described in further detail the present invention.
As shown in Figure 1, a kind of RFID flexible label, comprise circuit chip 1, antenna 2, backing material plate 3, circuit chip protecting colloid 7 and outer package 6, circuit chip 1 conducts electricity and is connected with antenna 2, antenna 2 is arranged on backing material plate 3, circuit chip protecting colloid 7 is covered on circuit chip 1, it is characterized in that, also comprise the first ceiling 4 and the second ceiling 5, described the first ceiling 4 is provided with perforate 8 and is covered on antenna 2, described perforate 8 exposes the bearing of circuit chip 1 and antenna 2, described the second ceiling 5 covers perforate 8 and is arranged at the upside of the first ceiling 4.
The reason that perforate 8 is set on the first ceiling 4 is; between circuit chip 1 and antenna 2, adopt some glue mode to be fixed; in order to limit a glue in condition of high temperature current downflow; thereby in order to make the first ceiling 4 be unlikely to be because a gelling is solid the fixed effect that convex affects the second ceiling 5, the measure of taking at this is, on the first ceiling 4, perforate 8 is set further.In a glue process, required colloid can adopt the high-temperature plastic of black glue or other types.
For circuit chip 1 is fully come out with antenna 2 bearings, to utilize some glue to be fixed, to be protected by 8 pairs of circuit chips of perforate 1 and antenna 2, as preferably, perforate 8 at least can expose the bearing of circuit chip 1 and antenna 2 completely.
As preferably; the infringement in use causing because of external force impacts such as label bending, distortions for fear of antenna 2; the thickness of at least complete cover antenna 2, the first ceilings 4 of the first ceiling 4 at least equals the thickness of circuit chip 1, and the first ceiling 4 adopts exotic materials to make.For example, exotic material can adopt the exotic materials such as high temperature resistant PET material to make.The thickness that why requires the thickness of the first ceiling 4 at least to equal circuit chip 1 be because; after circuit chip 1 and antenna 2 are fixed in the mode of a glue; the bearing of circuit chip 1 and antenna 2 is just in the perforate in the first ceiling 48; thereby can avoid the impact of ambient pressure, play protective effect.
As preferably, described the second ceiling 5 covers perforate 8, the second ceilings 5 at least completely and adopts exotic materials to make.For example, exotic material can adopt the exotic materials such as high temperature resistant PET material to make.The reason that the second ceiling 5 covers perforate 8 at least is completely; such setting can so that circuit chip 1 with the bearing of antenna 2 in an enclosure space being surrounded by the first ceiling 4 and the second ceiling 5, thereby reduced the impact of the factors such as external pressure, temperature.
As preferably, between described circuit chip 1 and described antenna 2, adopt conducting resinl or welding or metal wire to conduct electricity and be connected, so that circuit chip 1 can communicate with the external world by antenna 2.
As preferably, described antenna 2 is by metal material or Nano Silver or printing ink to manufacture.That metal material can be selected is copper, aluminium matter and the metal such as silver, to can effectively launch signal.For protection of the environment and the needs that save production cost, antenna 2 can also be by Nano Silver or printing ink to manufacture.
As preferably, described outer package 6 adopts flexible materials to make.Flexible material can be selected the flexible materials such as silica gel or plastics or petroleum derivation product.
For RFID flexible label structure is described intuitively, Fig. 2 has provided the decomposition texture schematic diagram (except outer package) of RFID flexible label.
As improvement; for circuit chip 1, antenna 2 and backing material plate 3 are fixed further and are protected; the downside of backing material plate 3 is provided with the 3rd ceiling 9; the 3rd ceiling 9 is covering substrates plate 3 at least completely; the material of the 3rd ceiling 9 can be identical with the material of the first ceiling 4, also can be different.Fig. 3 has provided the cross-sectional view after the improvement of RFID flexible label in the embodiment of the present invention.
As shown in Figure 4, the method for packing of RFID flexible label, comprises the following steps:
(1) antenna is fixed on backing material plate:
(1-1) adopt metal material or Nano Silver or printing ink to manufacture antenna;
(1-2) to print or the mode such as plating or etching is fixed on antenna on backing material plate.
(2) circuit chip is fixed on antenna, and is connected conducting electricity between circuit chip and antenna:
At circuit chip and antenna, conduct electricity in the operation being connected, can utilize the modes such as conducting resinl or welding or metal wire to conduct electricity connection.
(3) on the first ceiling, perforate is set, will be provided with the complete cover antenna of the first ceiling of perforate:
(3-1) the first ceiling of selecting exotic material to make, the first ceiling is cover antenna at least completely, and the thickness of the first ceiling at least equals the thickness of circuit chip;
(3-2) on the first ceiling, perforate is set, perforate at least can expose the bearing of circuit chip and antenna completely.
The object that perforate is set on the first ceiling is, is that the high temperature resistant colloid in restriction subsequent step (4) flows in high-temperature technology on the one hand, is on the other hand to guarantee that the second ceiling is unlikely to the projection because high temperature resistant colloid solidifies, and affects packaging effect.This be because; if perforate is not set on the first ceiling; but the second ceiling is directly overlayed on the high-temperature plastic of cure states, can, because circuit chip and cure states high-temperature plastic occur projection than higher second ceiling that causes of other parts, affect packaging effect so.
(4), by the perforate of the first ceiling, the circuit chip and the antenna that the first ceiling tapping are exposed in the mode of a glue are fixed:
(4-1) by high temperature resistant colloid heating, make it to be colloidal;
(4-2) in the mode of a glue, insert tapping, and be cured at low temperatures, make the high temperature resistant colloid after solidifying can not be emerging in perforate outside.
(5) the second ceiling is covered completely to the perforate of the first ceiling, and the second ceiling is arranged on to the upside of the first ceiling:
(5-1) adopt exotic material to make the second ceiling,
(5-2), according to the size of the tapping of the first ceiling, the second ceiling is covered to tapping at least completely, and the second ceiling is arranged on to the upside of the first ceiling.
(6) adopt flexible material parcel be integrated in the device on backing material plate and be fixed, encapsulate:
Adopt flexible material to carry out in the operation of outer package, adopting low temperature AB glue injection process, thus can be so that the label of encapsulation be more firm, and flexible material can be chosen as silica gel, high-temperature resistance plastice or other petroleum derivation product material etc.
Claims (10)
1. a RFID flexible label; comprise circuit chip, antenna, backing material plate, circuit chip protecting colloid and outer package; circuit chip conducts electricity and is connected with antenna; antenna is arranged on backing material plate; circuit chip protecting colloid is covered on circuit chip; it is characterized in that; also comprise the first ceiling and the second ceiling; described the first ceiling is provided with perforate and is covered on antenna; described perforate exposes the bearing of circuit chip and antenna, and described the second ceiling covers perforate and is arranged at the upside of the first ceiling.
2. a kind of RFID flexible label according to claim 1, is characterized in that, described the first ceiling is cover antenna at least completely, and the thickness of the first ceiling at least equals the thickness of circuit chip, and described the second ceiling covers perforate at least completely.
3. a kind of RFID flexible label according to claim 1 and 2, is characterized in that, described the first ceiling and/or the second ceiling adopt exotic material to make.
4. a kind of RFID flexible label according to claim 1 and 2, it is characterized in that, between described circuit chip and described antenna, adopt conducting resinl or welding or metal wire to conduct electricity and be connected, described antenna is by metal material or Nano Silver or printing ink to manufacture.
5. a kind of RFID flexible label according to claim 1 and 2, is characterized in that, the downside of described backing material plate is provided with the 3rd ceiling, and the 3rd ceiling is covering substrates plate at least completely, and the 3rd ceiling adopts exotic material to make.
6. a kind of RFID flexible label according to claim 1 and 2, is characterized in that, described outer package adopts flexible material to make.
7. a method for packing for RFID flexible label, is characterized in that, comprises the following steps:
(1) antenna is arranged on backing material plate;
(2) circuit chip is fixed on antenna, and is connected conducting electricity between circuit chip and antenna;
(3) on the first ceiling, perforate is set, will be provided with the complete cover antenna of the first ceiling of perforate;
(4), by the perforate of the first ceiling, the circuit chip and the antenna that the first ceiling tapping are exposed in the mode of a glue are fixed;
(5) the second ceiling is covered completely to the perforate of the first ceiling, and the second ceiling is arranged on to the upside of the first ceiling;
(6) adopt flexible material parcel be integrated in the device on backing material plate and be fixed, encapsulate.
8. the method for packing of a kind of RFID flexible label according to claim 7, it is characterized in that, between circuit chip and antenna, adopt conducting resinl or welding or metal wire to conduct electricity in described step (2) and be connected, described antenna is by metal material or Nano Silver or printing ink to manufacture.
9. the method for packing of a kind of RFID flexible label according to claim 7; it is characterized in that; described the first ceiling is cover antenna at least completely; the thickness of the first ceiling at least equals the thickness of circuit chip; described perforate at least can expose the bearing of circuit chip and antenna completely, and described the second ceiling covers perforate at least completely.
10. the method for packing of a kind of RFID flexible label according to claim 7, is characterized in that, described the first ceiling and/or the second ceiling adopt exotic material to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310606018.1A CN103646269A (en) | 2013-11-25 | 2013-11-25 | RFID (radio frequency identification) flexible tag and packaging method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310606018.1A CN103646269A (en) | 2013-11-25 | 2013-11-25 | RFID (radio frequency identification) flexible tag and packaging method thereof |
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| CN103646269A true CN103646269A (en) | 2014-03-19 |
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| CN201310606018.1A Pending CN103646269A (en) | 2013-11-25 | 2013-11-25 | RFID (radio frequency identification) flexible tag and packaging method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106355237A (en) * | 2016-08-30 | 2017-01-25 | 苏州金信宇电子科技有限公司 | Polyester fabric based RFID (radio frequency identification) tag |
| CN111222615A (en) * | 2018-11-23 | 2020-06-02 | 财团法人纺织产业综合研究所 | Wireless radio frequency yarn module |
| CN112183685A (en) * | 2020-09-18 | 2021-01-05 | 中国石油天然气集团有限公司 | Rotary guide part identification method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106355237A (en) * | 2016-08-30 | 2017-01-25 | 苏州金信宇电子科技有限公司 | Polyester fabric based RFID (radio frequency identification) tag |
| CN111222615A (en) * | 2018-11-23 | 2020-06-02 | 财团法人纺织产业综合研究所 | Wireless radio frequency yarn module |
| CN112183685A (en) * | 2020-09-18 | 2021-01-05 | 中国石油天然气集团有限公司 | Rotary guide part identification method |
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Application publication date: 20140319 |
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| RJ01 | Rejection of invention patent application after publication |