CN103715362A - Flexible display and preparation method thereof - Google Patents
Flexible display and preparation method thereof Download PDFInfo
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- CN103715362A CN103715362A CN201210375915.1A CN201210375915A CN103715362A CN 103715362 A CN103715362 A CN 103715362A CN 201210375915 A CN201210375915 A CN 201210375915A CN 103715362 A CN103715362 A CN 103715362A
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- layer
- substrate
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- support plate
- interface layer
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
Abstract
The invention relates to a flexible display which comprises a carrier plate, an interface layer arranged on a surface of the carrier plate and an organic light emitting diode layer arranged on the interface layer, wherein the thickness of the interface layer is 0.5-10 microns.
Description
Technical field
The invention relates to a kind of flexible display and preparation method thereof, espespecially a kind of flexible display that has soft speciality and withstand high temperatures characteristic concurrently and preparation method thereof.
Background technology
Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED), refers to organic semiconducting materials and luminescent material under current drives and reaches luminous and realize the technology showing.Compare with LCD, OLED has many advantages, as ultralight, ultra-thin (thickness can lower than 1mm), brightness is high, visible angle is large (can reach 170 degree), do not need backlight, low in energy consumption, fast response time, definition is high, caloric value is low, anti-seismic performance is excellent, low cost of manufacture and flexible etc.
At present, in the manufacture method of OLED flexible display, generally to use resistance to high thermoplastic materials for example, as flexible base plate material: some special pi material is to pass through the high heat treatment temperature of 450 ℃, therefore be suitable as the material for the flexible base plate of display.In addition, flexible base plate is to need certain thickness (being about 10 to 100 μ m), just can reach the object of enough supports and loading.Yet, in order to meet this thickness requirement, cause manufacturing cost expensive compared to glass substrate; Moreover, if need the substrate of this thickness of preparation, in preparation process, be to need to use the equipment that can precisely control substrate thickness, such as: slit coating apparatus etc., also expend increasing extra technique.
In view of this, need at present the preparation method of a kind of flexible display of invention badly, it can utilize existing LCD equipment, appropriate mix wins/removes technology again, and use the good material of pliability as the main body of supporting construction, the flexible display that has soft speciality and withstand high temperatures technology concurrently can be produced, thus, material cost and process equipment cost can be significantly reduced.
Summary of the invention
Main purpose of the present invention is that a kind of flexible display and preparation method thereof is being provided, to can significantly reduce material cost and process equipment cost, and this flexible display is to have soft speciality and withstand high temperatures characteristic concurrently.
For reaching above-mentioned purpose, the present invention is to provide a kind of flexible display, comprising: a support plate; One boundary layer is a surface that is arranged at this support plate; And an Organic Light Emitting Diode layer, be to be arranged on this boundary layer; Wherein, the thickness of this interface layer is to be 0.5 μ m to 10 μ m.
Flexible display of the present invention can also comprise: a tft layer is to be arranged between this interface layer and this Organic Light Emitting Diode layer; Another support plate is to be arranged on this Organic Light Emitting Diode layer; And another interface layer, be to be arranged between this Organic Light Emitting Diode layer and this another support plate, and the thickness of this another interface layer is preferably 0.5 μ m to 10 μ m.Moreover flexible display of the present invention can also comprise: a colored filter is to be arranged between this Organic Light Emitting Diode layer and this another interface layer.
The present invention also provides a kind of preparation method of flexible display, comprises the following steps: that (A) provides a substrate; (B) in the upper interface layer that forms in a surface of this substrate, the thickness of this interface layer is to be 0.5 μ m to 10 μ m; (C) on this boundary layer, form an Organic Light Emitting Diode layer; And (D) remove this substrate and replace to arrange with a support plate.Wherein, in step (C) before, can also comprise and form a tft layer on this interface layer.In addition, on this Organic Light Emitting Diode layer, another support plate can be set on demand again.
Or the preparation method of flexible display comprises the following steps: that (A) provides a first substrate and a second substrate; (B) respectively at upper one first boundary layer and the second contact surface layer of forming in a surface of this first substrate and this second substrate, in this first interface layer and this second interface layer, at least one thickness is to be 0.5 μ m to 10 μ m; (C) on this first boundary layer, sequentially form a tft layer and an Organic Light Emitting Diode layer, and form a colored filter on this second contact surface layer; (D) this second substrate that makes to be provided with this colored filter is oppositely arranged with this first substrate that is provided with this Organic Light Emitting Diode layer, so that this colored filter is arranged on this Organic Light Emitting Diode layer; And (E) remove this first substrate and replace to arrange with one first support plate, remove this second substrate and replace and arrange with one second support plate.For example, if make a white organic LED (white organiclight-emitting diode, White OLED) display, it need comprise a colored filter, can use this preparation method.
In following, " support plate " word not only refers to this support plate, also refers to this first support plate and this second support plate; " interface layer " word not only refers to this interface layer, also refers to this first boundary layer and this second contact surface layer; " substrate " word not only refers to this substrate, also refers to this first substrate and this second substrate.
Flexible display described above and preparation method; this first support plate and this second support plate are limited neither especially; can be according to device demand with choice for use; contribute to increase element supportive and in conjunction with additional function, as: plastic plate, touch control film (touch film), cover sheet (cover lens), hardness reinforced film (hard coat film) or its combination.The example of plastic plate material can be lifted: polyethylene terephthalate (Polyethylene Terephthalate, PET), polymethyl methacrylate (polymethyl methacrylate, PMMA) or its combination.
Wherein, better 1 μ m to the 5 μ m that can be of the thickness of this interface layer, better 1 μ m to the 3 μ m that can be; This thickness can by the people of same technical field according to actual device required and process equipment usefulness and being adjusted.For example, if having two-layer or above interface layer, the thickness of indivedual interface layers also can be not identical.
Wherein, the tolerable temperature of this interface layer is not limited, only needs by high-temperature technology, not damage, be out of shape, be preferably can be resistance to 450 degree C or more than.Thus, the material of this interface layer can be used plastic material as pi (polyimide); Or inorganic material is as silicon nitride (silicon nitride), gallium nitride (gallium nitride); Or the combination of plastic material and inorganic material; But the present invention is not limited to this, any material that meets tolerable temperature restriction is all applicable to the present invention.
In addition, the method that forms this interface layer can be utilized after any known technology roll printing or coating, then is heating and curing and forms; Or, also can use the method for evaporation to form.And the method that removes substrate can utilize any known technology to complete, modes such as laser or cutter cutting.In addition, the selection of substrate kind is not limited, is preferably a glass substrate, maybe can use the conventional substrate of any the art.
Moreover this tft layer and this Organic Light Emitting Diode layer can encapsulate, this encapsulation can utilize any known known technology to complete, for example, use the plastic basis material with tackness to fit, or complete by evaporation encapsulating material.
Accompanying drawing explanation
For making auditor do further understanding and understanding to the object, the technical characteristics and the effect of the present invention, below enumerate embodiment and coordinate accompanying drawing, be described in detail as follows, wherein:
Figure 1A to 1G is the preparation flow figure of the flexible display of a preferred embodiment of the present invention.
Fig. 2 A to 2E is the preparation flow figure of the flexible display of another preferred embodiment of the present invention.
Fig. 3 A to 3D is the present invention preparation flow figure of the flexible display of a preferred embodiment again.
Embodiment
Embodiment 1-makes white organic LED (white organic light-emittingdiode, White OLED) display
Please refer to Figure 1A to 1G, it is the preparation flow figure of the flexible display of embodiment 1.
First, as shown in Figure 1A, two substrates 11,12 is provided, the material of substrate 11,12 can be glass, and utilize the modes such as roll printing (as printing reliefs therefrom (APR plate)) or evaporation, respectively resistance to high hot interface layer material (as pi, silicon nitride, gallium nitride or its mixing) is covered on substrate 11,12, forms two- layer boundary layer 21,22, the thickness of at least one in interface layer 21,2 can be between 0.5 μ m to 10 μ m; Preferably, the thickness of at least one in interface layer 21,22 can be between 1 μ m to 5 μ m; More preferably, the thickness of at least one in interface layer 21,22 can be between 1 μ m to 3 μ m; Also can optionally carry out multilayer roll printing to increase interface layer thickness.
Then, as shown in Figure 1B, be formed with on the substrate 11 of boundary layer 21, sequentially forming tft layer 3 and white organic LED layer 4; And on being formed with the substrate 12 of boundary layer 22, another forms colored filter 5.
After, as shown in Figure 1 C, by be provided with colored filter 5 substrate 12, be oppositely arranged with the substrate 11 that is provided with white organic LED layer 4, so that colored filter 5 is arranged on white organic LED layer 4.
Finally, as shown in Fig. 1 D, in modes such as laser or cutter cuttings, remove substrate 12, and replace (asking for an interview Fig. 1 E) is set with support plate 61; For another example shown in Fig. 1 F, 1G, in modes such as laser or cutter cuttings, remove substrate 11 and replace and arrange with support plate 62.This support plate 61 can be touch control film (touch film), cover sheet (cover lens), hardness reinforced film (hard coat film) or its combination with this support plate 62; its material can be plastic plate; for example: polyethylene terephthalate (Polyethylene Terephthalate; PET), polymethyl methacrylate (polymethylmethacrylate, PMMA) or its combination.
By above-mentioned steps, the laminated construction (asking for an interview Fig. 1 G) that can obtain a white organic LED display, it is to be sequentially support plate 62, boundary layer 21, tft layer 3, white organic LED layer 4, colored filter 5, boundary layer 22 and support plate 61.
Embodiment 2-makes three primary colors independence luminescent organic LEDs (side-by-sideorganic light-emitting diode) display
Please refer to Fig. 2 A to 2E, it is the preparation flow figure of the flexible display of embodiment 2.
First, as shown in Figure 2 A, substrate 11 is provided, the material of substrate 11 can be glass, utilize the modes such as roll printing (as printing reliefs therefrom (APR plate)) or evaporation, resistance to high hot interface layer material (as pi, silicon nitride, gallium nitride or its mixing) is covered on substrate 11 to form interface layer 21, the thickness of interface layer 21 can be between 0.5 μ m to 10 μ m, better can be between 1 μ m to 5 μ m, better can be between 1 μ m to 3 μ m; Also can optionally carry out multilayer roll printing to increase interface layer thickness.
Then, as shown in Figure 2 B, be formed with on the substrate 11 of boundary layer 21, sequentially forming tft layer 3 and Organic Light Emitting Diode layer 4.After, as shown in Figure 2 C, a support plate 61 is set on Organic Light Emitting Diode layer 4.Finally, as shown in Figure 2 D, in modes such as laser or cutter cuttings, remove substrate 11, and replace (asking for an interview Fig. 2 E) is set with support plate 62.This support plate 61 can be touch control film (touch film), cover sheet (cover lens), hardness reinforced film (hardcoat film) or its combination with this support plate 62; its material can be plastic plate; for example: polyethylene terephthalate (Polyethylene Terephthalate; PET), polymethyl methacrylate (polymethylmethacrylate, PMMA) or its combination.
By above-mentioned steps, can obtain the laminated construction (asking for an interview Fig. 2 E) of a three primary colors independence luminescent organic LED display, it is to be sequentially support plate 62, boundary layer 21, tft layer 3, Organic Light Emitting Diode layer 4 and support plate 61.
Embodiment 3-makes three primary colors independence luminescent organic LEDs (side-by-sideorganic light-emitting diode) display
Please refer to Fig. 3 A to 3D, it is the preparation flow figure of the flexible display of embodiment 3.
First, as shown in Figure 3A, substrate 11 is provided, the material of substrate 11 can be glass, utilize the modes such as roll printing (as printing reliefs therefrom (APR plate)) or evaporation, resistance to high hot interface layer material (as pi, silicon nitride, gallium nitride or its mixing) is covered on substrate 11 to form interface layer 21, the thickness of interface layer 21 can be between 0.5 μ m to 10 μ m, better can be between 1 μ m to 5 μ m, better can be between 1 μ m to 3 μ m; Also can optionally carry out multilayer roll printing to increase interface layer thickness.
Then, as shown in Figure 3 B, be formed with on the substrate 11 of boundary layer 21, sequentially forming the encapsulated layer 7 that tft layer 3, Organic Light Emitting Diode layer 4 and thickness are about 10 to 30 μ m.After, as shown in Figure 3 C, because the thickness of encapsulated layer is enough as support, can directly in modes such as laser or cutter cuttings, remove substrate 11, and replace (asking for an interview Fig. 3 D) is set with support plate 6.This support plate 6 can be touch control film (touch film), cover sheet (cover lens), hardness reinforced film (hardcoat film) or its combination; its material can be plastic plate; for example: polyethylene terephthalate (Polyethylene Terephthalate; PET), polymethyl methacrylate (polymethylmethacrylate, PMMA) or its combination.
By above-mentioned steps, can obtain the laminated construction (asking for an interview Fig. 3 D) of a three primary colors independence luminescent organic LED display, it is to be sequentially support plate 6, boundary layer 21, tft layer 3, Organic Light Emitting Diode layer 4 and encapsulated layer 7.
Thus, by flexible display of the present invention and preparation method thereof, utilize interface layer as thin as a wafer, the resistance to high heat softenable baseplate material of costliness capable of reducing using, also do not need additionally to buy expensive accurate coating apparatus, to can significantly reduce material cost and process equipment cost.
Above-described embodiment is only to give an example for convenience of description, and the interest field that the present invention advocates should be as the criterion certainly described in claim scope, but not only limits to above-described embodiment.
Claims (10)
1. a flexible display, comprising:
One support plate;
One boundary layer, is arranged at a surface of this support plate; And
One Organic Light Emitting Diode layer, is arranged on this boundary layer;
Wherein, the thickness of this interface layer is 0.5 μ m to 10 μ m.
2. flexible display as claimed in claim 1, wherein, the tolerable temperature of this interface layer be 450 ℃ or more than.
3. flexible display as claimed in claim 1, wherein, the material of this interface layer is: pi, silicon nitride, gallium nitride or its combination.
4. flexible display as claimed in claim 1, wherein, this support plate is plastic plate, touch control film, cover sheet, hardness reinforced film or its combination.
5. a preparation method for flexible display, comprises the following steps:
(A) provide a substrate;
(B) in the upper interface layer that forms in a surface of this substrate, the thickness of this interface layer is 0.5 μ m to 10 μ m;
(C) on this boundary layer, form an Organic Light Emitting Diode layer; And
(D) remove this substrate and replace and arrange with a support plate.
6. the preparation method of flexible display as claimed in claim 5, this support plate is plastic plate, touch control film, cover sheet, hardness reinforced film or its combination.
7. the preparation method of flexible display as claimed in claim 5, wherein, the material of this interface layer is: pi, silicon nitride, gallium nitride or its combination.
8. a preparation method for flexible display, comprises the following steps:
(A) provide a first substrate and a second substrate;
(B) respectively at upper one first boundary layer and the second contact surface layer of forming in a surface of this first substrate and this second substrate, in this first interface layer and this second interface layer, at least one thickness is to be 0.5 μ m to 10 μ m;
(C) on this first boundary layer, sequentially form a tft layer and an Organic Light Emitting Diode layer, and form a colored filter on this second contact surface layer;
(D) this second substrate that makes to be provided with this colored filter is oppositely arranged with this first substrate that is provided with this Organic Light Emitting Diode layer, so that this colored filter is arranged on this Organic Light Emitting Diode layer; And
(E) remove this first substrate and replace and arrange with one first support plate, remove this second substrate and replace and arrange with one second support plate.
9. the preparation method of flexible display as claimed in claim 8, wherein, at least one in this first support plate and this second support plate is plastic plate, touch control film, cover sheet, hardness reinforced film or its combination.
10. the preparation method of flexible display as claimed in claim 8, wherein, the material of this first interface layer and this second contact surface layer is respectively: pi, silicon nitride, gallium nitride or its combination.
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| CN201210375915.1A CN103715362A (en) | 2012-10-08 | 2012-10-08 | Flexible display and preparation method thereof |
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| CN201210375915.1A CN103715362A (en) | 2012-10-08 | 2012-10-08 | Flexible display and preparation method thereof |
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| CN103715362A true CN103715362A (en) | 2014-04-09 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107910354A (en) * | 2017-11-24 | 2018-04-13 | 信利光电股份有限公司 | A kind of flexibility touch-control display module and electronic display unit |
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| CN102013414A (en) * | 2009-09-08 | 2011-04-13 | 群康科技(深圳)有限公司 | Making method of flexible display assembly |
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| US6664137B2 (en) * | 2001-03-29 | 2003-12-16 | Universal Display Corporation | Methods and structures for reducing lateral diffusion through cooperative barrier layers |
| CN1779744A (en) * | 2004-11-23 | 2006-05-31 | 统宝光电股份有限公司 | Color active organic electroluminescent assembly, its production and electronic device |
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| CN107910354A (en) * | 2017-11-24 | 2018-04-13 | 信利光电股份有限公司 | A kind of flexibility touch-control display module and electronic display unit |
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Application publication date: 20140409 |