CN103732803A - Plating method and apparatus, and strip obtained by this method - Google Patents
Plating method and apparatus, and strip obtained by this method Download PDFInfo
- Publication number
- CN103732803A CN103732803A CN201180062262.5A CN201180062262A CN103732803A CN 103732803 A CN103732803 A CN 103732803A CN 201180062262 A CN201180062262 A CN 201180062262A CN 103732803 A CN103732803 A CN 103732803A
- Authority
- CN
- China
- Prior art keywords
- band
- strip
- masking
- sill
- tape member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0671—Selective plating
- C25D7/0678—Selective plating using masks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0635—In radial cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
Abstract
A method for plating strips comprising: providing a strip (1) of material, providing a masking belt (18) comprising patterned windows, providing a tank (13) with a plating solution, generating a continuous movement in the cell of an assembly of the strip and masking belt, whereby the structure of the masking belt masks portions of the strip in the tank.
Description
Technical field
The present invention relates to electroplate electro-plating method and the device of band.For example, this electro-plating method and device are applicable to manufacture electric connection terminal and electrical connector, and the band obtaining by these methods.
Background technology
In manufacture, aspect the electric connection terminal of the web member of automobile or wireless communications application, describe the present invention in this manual, but should be appreciated that by following description the present invention can be used in the band, particularly flexible sheet metal strip of electroplating any kind material.
For describing the selected application of the present invention, the band of electroplated is web member terminal band.Can use the rigid structure for supporting these electric connection terminals, for example so-called " lead frame " or " carrier ".Lead frame or carrier can keep together terminating unit in its manufacturing processed, thereby can realize manufacturing processed continuous in technical scale.In the final stage of the manufacturing processed of web member, terminating unit separates from the lead frame or the carrier that are scratched.
A step manufacturing electric connection terminal is that metal connecting piece is electroplated in its surface, for example gold.The band of lead frame or carrier is two independently motions continuously between tape member (beltportions) in plating tank, and these tape members are for transmitting (carrying) lead frame or carrier.Need to make this process more efficient.
Below, for simplicity, term " carrier " is for representing the carrier of lead frame or any other type.
Summary of the invention
The present invention relates to the method for the band of a kind of manufacture through electroplating.
The method comprises provides band, for example sheet metal strip.The structure that this band comprises top band, sill strip band, link together top band and sill strip band and the lead-in wire between top band and sill strip band.For example, these lead-in wires are designed to be formed for the electric connection terminal of electrical connector.
Masking strip is provided.The structure that this band comprises top band, sill strip band and top band and sill strip band are linked together.
Plating tank is provided.This plating tank is for example to have the chamber of the solution that holds electrical conductor and the metallization coating bath of electrode.
The assembly of this band and Masking strip is motion continuously in coating bath.In coating bath, this Masking strip hides band at least in part.
Between this continuous moving period, thereby by electroplating electrical conductor applying electric field between this band and electrode in described solution on sheet metal strip.Plating only occurs over just band and is not capped or not covered part.
Due to these features, electrical conductor is not applied to the covered part of band.Because this part can be scratched and/or do not used, for example, so avoided the waste of plated material (gold) and therefore improved the efficiency of this process.
In some embodiments, can also use one or more features of limiting in the claims.
By its three embodiments as non-limiting example and accompanying drawing is described below, show other features and advantages of the present invention.
Accompanying drawing explanation
Figure 1 shows that the partial plan layout of sheet metal strip;
Figure 2 shows that according to the schematic partial perspective view of the device of the first embodiment;
Fig. 3 a and 3b are depicted as for the band of the device of Fig. 2 and relative decomposition diagram with assembly;
Figure 4 shows that the undecomposed view corresponding to Fig. 3 b; And
Shown in Fig. 5 and 6, be respectively second and the view corresponding to Fig. 4 of the 3rd embodiment.
Embodiment
In different figure, identical Reference numeral represents same or analogous parts.
Fig. 1 schematically demonstrates the pattern of electroconductibility band 1.This band 1 is to form in the mode of this type of pattern of multiple repetitions that longitudinally X is arranged in order.This band 1 can comprise hundreds of these type of patterns.This band 1 is made by conductive material, for example thin copper foil, and it is in type, for example, shown in forming through punching press figure.With respect to X-axis, this band 1 is enough thin and resilient from but flexible, and therefore can be used as coiling material provides.This band 1 comprises the carrier band 2 that carries electrical lead 3.This carrier band 2 can limit multiple windows 4, one group of lead-in wire 3 of each closed windows, and it will form the electric connection terminal of identical electrical connector.This carrier band 2 comprises the top band 5 and parallel sill strip band 6 that along direction X, extend.Top band and sill strip band 5,6 interconnect by structure 7, and it guarantees the mechanical stability of carrier band 2.For example, structure 7 is included between top band 5 and sill strip band 6 along the multiple parallel beam column 8 that laterally Y extends.In this special embodiment, window 4 is limited between two beam columns 8 in succession and between top band and sill strip band 5,6.Use union lever 9 go between and 3 integrate with carrier band 2, this union lever be integrate with structure 7 and with the bars of every lead-in wire 3 integration.
In the present embodiment, lead-in wire 3 obviously extends along direction Y with straight line.But other geometrical shapies are also fine.Every lead-in wire 3 extends between the first end 3a and the second end 3b, and the first end and the second end are positioned at opposite side with respect to union lever 9.The first end 3a and the second end 3b are most advanced and sophisticated shapes, and its sharp-pointed degree depends on concrete application.Leadedly needn't there is identical geometrical shape.Some lead-in wires are longer than other.
Carrier band 2 comprises multiple drive disk assemblies 10.These parts 10 are for example the holes 11 arranging along direction X in equidistant mode in top band 5 and sill strip band 6, thereby match with unshowned drive unit, for example motor-driven gear, and it has the tooth engaging with hole 11.
With reference to Fig. 2 tracing device 12.This device 12 comprises at least one plating tank or tank 13 and unwinding rack (feeding reel) 14 and rolling frame (uptake reel) 15.Unwinding rack 14 is transported to band 1 in plating tank 13.Band represents to simplify accompanying drawing with plane, but band has window as shown in Figure 1.In plating tank 13, by electro-conductive material, particularly Metal plating is to band 1.Device 12 can comprise one or more these type of coating baths 13 that are arranged in order, thereby band 1 is implemented repeatedly to identical or different processing.Then this band 1 is rolled again on rolling frame 15.
In coating bath 13, band 1 is assembled together with Masking strip 18, and Masking strip hides band 1 and do not expect the part of electroplating.Drive unit 19 such as roller rotates, and for driving Masking strip 18 at coating bath 13.
In coating bath 13, band 1 and Masking strip 18 press together each other, thereby only have the not covered part plating of band to have the metal of dilution.In the embodiment illustrated, band 1 remains between two tape members 20 and 21.Tape member 20 is the pulley belts that directly contact with drive unit 19 and one or more extra roller 22.
In coating bath 13, two roller 23a and 23b are applied directly to band 1 on tape member 20.These rollers can be arranged on the outside of coating bath 3, and/or for applying electromotive force to band.Their engaging holes 11 are to drive band 1.
Use roller 24a and 24b that the second tape member 21 is applied directly on band 1.Use other roller (not shown), thereby the second tape member 21 can also be continuous (ring-type).
Fig. 3 a and 3b schematically demonstrate band 1 are remained on to the mode between two tape members 20 and 21 in plating solution.Fig. 3 a and 3b schematically show with straight band 1 and tape member 20 and 21, but in fact they are wound on drive unit 19 as shown in Figure 2.
The top band 29 of Masking strip 18 is in the face of the top band 5 of band 1.The sill strip band 30 of Masking strip 18 is also faced the sill strip band 6 of band 1.In addition, Masking strip 18 has periodic structure 31, and its geometrical shape is imitated the geometrical shape of the structure 7 of band 1.Band 1 has in the present embodiment of beam column 8 therein, and Masking strip 18 also has beam column.
In the case, have window 32 in Masking strip 18, it is corresponding with the window 4 of band 1.On the internal surface of one or more tape members 20,21, there is groove or groove 33, its sufficiently long and deeply to hold band 1.
The material of Masking strip 18 has enough strong tolerance for the driving of drive unit 19, this Masking strip can carry band and without any slip, particularly, in the plating solution that particularly motion by moving-member is stirred, this Masking strip can also seal the part that described structure should not be electroplated effectively.For example tape member is made by the enhancement aromatic poly amide that is coated with polysiloxane coating, so that sealing property to be provided.
Fig. 4 has shown the assembly of band 1 and Masking strip 18, and band 1 is masked is with 18 coverings.In this way, plated metal on terminal lead and union lever 9 only.For example, in the present embodiment, electronickelling.In the second embodiment, as shown in Figure 5, as substituting or subsequent operations of the embodiment of Fig. 4, in another coating bath, Masking strip 18 has different geometrical shapies, thereby only in the part of lead-in wire 3, electroplates.Particularly in this embodiment, only in the bottom of pin, below union lever 9, electroplate for example eleetrotinplate.
In a further embodiment, as shown in Figure 6, as substituting or subsequent operations of the embodiment of Fig. 4 or 5, by hide the bottom of lead-in wire 3 with Masking strip 18, only at the top of lead-in wire, electroplate for example electrogilding.
So the lead-in wire of manufacturing can process to manufacture electrical connector, for example, by plastics, lead-in wire being carried out to overmolded (overmolding), and separate with metal frame.
Claims (9)
1. the method for electroplating band, it comprises:
-band (1) is provided,
-Masking strip (18) of the window that comprises patterning is provided,
-the plating tank that contains plating solution (13) is provided,
The assembly of-described band and described Masking strip is motion continuously in coating bath, thereby in described plating tank, by the structure of described Masking strip, hides the part of described band.
2. according to the process of claim 1 wherein that described Masking strip (18) comprises the first and second tape members (20,21), described the first and second tape members hide respectively a face of described band (1).
3. according to the method for claim 2, wherein said the first and second tape members have interdigital parts (34,35), thereby the motion being applied on described Masking strip (18) is transferred on described band, and applied continuous motion to described Masking strip.
4. according to the method for one of aforementioned claim, wherein:
-described plating tank is the plating tank (13) that comprises electrode,
-described plating solution is the electroplate liquid that comprises electrical conductor,
-described method was included between continuous moving period, thereby in described solution, at sheet metal strip (1), above electroplated electrical conductor by apply electric field between described band and described electrode.
5. according to the method for one of aforementioned claim, it comprises:
-sheet metal strip (1) is provided, the structure that it comprises top band, sill strip band, link together this top band and this sill strip band and the lead-in wire between this top band and this sill strip band, these lead-in wires are designed to form the electric connection terminal of electrical connector,
-Masking strip parts (20,21) are provided, the structure that it comprises top band, sill strip band, this top band and this sill strip band are linked together,
And wherein, in plating tank, the top band (29) of described Masking strip hides the top band (5) of described band, the sill strip band (30) of described Masking strip hides the sill strip band (6) of described band.
6. manufacture the method for the electric connection terminal of electrical connector, wherein the method comprises:
-sheet metal strip (1) is provided, the structure that it comprises top band, sill strip band, link together this top band and this sill strip band and the lead-in wire between this top band and this sill strip band, these lead-in wires are designed to form the electric connection terminal of described electrical connector
-Masking strip (18) is provided, the structure that it comprises top band, sill strip band, this top band and this sill strip band are linked together, wherein said Masking strip comprises the first tape member (19), the second tape member (20),
-metallization coating bath (13) is provided, it has chamber and the electrode of the solution that holds electrical conductor,
The assembly of-described sheet metal strip and described Masking strip is motion continuously in coating bath, and wherein said sheet metal strip remains between the first tape member and the second tape member, thereby in described coating bath, by the structure of described Masking strip, hides the structure of described band,
-between continuous moving period, thus by apply electric field between described band and described electrode, in described solution, at sheet metal strip (1), above electroplate electrical conductor.
7. according to the method for claim 6, the structure that wherein each described tape member comprises top band, sill strip band and this top band and this sill strip band are linked together, wherein, in coating bath:
The top band (29) of the-the first tape member is faced the top band of the second tape member,
The sill strip band (30) of the-the first tape member is faced the sill strip band of the second tape member,
The structure (31) of the-the first tape member is in the face of the structure of the second tape member.
8. for electroplating the device of band, wherein this device comprises:
-for the unwinding rack (14) of band (1) is provided,
-comprise the Masking strip (18) of the window of patterning,
-hold the plating tank (13) of plating solution,
-driving mechanism (19), moves at coating bath continuously for the assembly that makes described band and described Masking strip, thereby in described plating tank, with described Masking strip, hides the part of described band.
9. device according to Claim 8, this device also comprises generator (36), it is for applying electric field between moving period between the described band at described plating tank and electrode continuously, thereby on band, electroplates electrical conductor in plating solution.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IB2010003508 | 2010-12-23 | ||
| IBPCT/IB2010/003508 | 2010-12-23 | ||
| PCT/IB2011/003303 WO2012085682A2 (en) | 2010-12-23 | 2011-12-22 | Plating method and apparatus, and strip obtained by this method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103732803A true CN103732803A (en) | 2014-04-16 |
Family
ID=45833474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180062262.5A Pending CN103732803A (en) | 2010-12-23 | 2011-12-22 | Plating method and apparatus, and strip obtained by this method |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20130334055A1 (en) |
| CN (1) | CN103732803A (en) |
| SG (1) | SG191114A1 (en) |
| WO (1) | WO2012085682A2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018098793A1 (en) * | 2016-12-01 | 2018-06-07 | 深圳市奥美特科技有限公司 | Selective plating device and selective plating die thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112323111B (en) * | 2020-11-02 | 2021-07-23 | 昆山一鼎工业科技有限公司 | Method for electrolyzing continuous terminal |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5372699A (en) * | 1991-09-13 | 1994-12-13 | Meco Equipment Engineers B.V. | Method and apparatus for selective electroplating of metals on products |
| CN1137810A (en) * | 1993-11-04 | 1996-12-11 | 桑泰克特贸易公司 | Electroplating apparatus |
| CN1251624A (en) * | 1997-04-18 | 2000-04-26 | 瑟基特·弗依股份有限公司 | Device for carrying out continuous electrolyting precipitation process |
| CN1326016A (en) * | 2000-04-27 | 2001-12-12 | 新光电气工业株式会社 | Local electroplating system |
| JP2002275679A (en) * | 2001-03-16 | 2002-09-25 | Komatsu Lite Seisakusho:Kk | Plating method and plating equipment |
| CN1533449A (en) * | 2001-07-20 | 2004-09-29 | �����ա���Ī��˹ | Method for selectively electroplating strip-shaped metal support material |
| CN1804146A (en) * | 2004-12-27 | 2006-07-19 | 同和矿业株式会社 | Plating device and plating method |
| US20060226017A1 (en) * | 2005-04-06 | 2006-10-12 | Leviton Manufacturing Co., Inc. | Continuous plating system and method with mask registration |
| US20070045786A1 (en) * | 2005-04-06 | 2007-03-01 | Leviton Manufacturing Co., Inc. | Continuous plating system and method with mask registration |
| US20090057158A1 (en) * | 2007-09-05 | 2009-03-05 | Leviton Manufacturing Co., Inc. | Plating systems and methods |
-
2011
- 2011-12-22 US US13/996,768 patent/US20130334055A1/en not_active Abandoned
- 2011-12-22 SG SG2013045091A patent/SG191114A1/en unknown
- 2011-12-22 WO PCT/IB2011/003303 patent/WO2012085682A2/en active Application Filing
- 2011-12-22 CN CN201180062262.5A patent/CN103732803A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5372699A (en) * | 1991-09-13 | 1994-12-13 | Meco Equipment Engineers B.V. | Method and apparatus for selective electroplating of metals on products |
| CN1137810A (en) * | 1993-11-04 | 1996-12-11 | 桑泰克特贸易公司 | Electroplating apparatus |
| CN1251624A (en) * | 1997-04-18 | 2000-04-26 | 瑟基特·弗依股份有限公司 | Device for carrying out continuous electrolyting precipitation process |
| CN1326016A (en) * | 2000-04-27 | 2001-12-12 | 新光电气工业株式会社 | Local electroplating system |
| JP2002275679A (en) * | 2001-03-16 | 2002-09-25 | Komatsu Lite Seisakusho:Kk | Plating method and plating equipment |
| CN1533449A (en) * | 2001-07-20 | 2004-09-29 | �����ա���Ī��˹ | Method for selectively electroplating strip-shaped metal support material |
| CN1804146A (en) * | 2004-12-27 | 2006-07-19 | 同和矿业株式会社 | Plating device and plating method |
| US20060226017A1 (en) * | 2005-04-06 | 2006-10-12 | Leviton Manufacturing Co., Inc. | Continuous plating system and method with mask registration |
| US20070045786A1 (en) * | 2005-04-06 | 2007-03-01 | Leviton Manufacturing Co., Inc. | Continuous plating system and method with mask registration |
| US20090057158A1 (en) * | 2007-09-05 | 2009-03-05 | Leviton Manufacturing Co., Inc. | Plating systems and methods |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018098793A1 (en) * | 2016-12-01 | 2018-06-07 | 深圳市奥美特科技有限公司 | Selective plating device and selective plating die thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012085682A8 (en) | 2014-01-03 |
| SG191114A1 (en) | 2013-07-31 |
| WO2012085682A2 (en) | 2012-06-28 |
| WO2012085682A3 (en) | 2012-11-22 |
| US20130334055A1 (en) | 2013-12-19 |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140416 |