CN104155563A - Test fixture of circuit board - Google Patents

Test fixture of circuit board Download PDF

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Publication number
CN104155563A
CN104155563A CN201410424762.4A CN201410424762A CN104155563A CN 104155563 A CN104155563 A CN 104155563A CN 201410424762 A CN201410424762 A CN 201410424762A CN 104155563 A CN104155563 A CN 104155563A
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CN
China
Prior art keywords
probe
circuit board
under casing
pressure bar
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201410424762.4A
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Chinese (zh)
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CN104155563B (en
Inventor
黄锦章
狄静
王盛
胡志刚
杨伟
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Kunshan Myzy Fixture Technology Co Ltd
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Kunshan Myzy Fixture Technology Co Ltd
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Priority to CN201410424762.4A priority Critical patent/CN104155563B/en
Publication of CN104155563A publication Critical patent/CN104155563A/en
Application granted granted Critical
Publication of CN104155563B publication Critical patent/CN104155563B/en
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Abstract

The invention discloses a test fixture of a circuit board and belongs to the technical field of jig equipment. The test fixture is designed to solve the problems that a traditional commissioning method for the circuit board is low in detection efficiency, high in labor intensity and low in precision, and errors are prone to occur. The test fixture of the circuit board comprises an upper module assembly and a lower module assembly, wherein the upper module assembly is arranged above a bottom box, and the lower module assembly is arranged on an upper panel of the bottom box. Under the action of lifting mechanisms and X-axis and Y-axis adjusting mechanisms of the upper module assembly, probes on the upper module assembly are adjusted to penetrate through probe holes in probe plates of the lower module assembly so that the probes can make contact with tested products on product carrier plates to be used for testing the solder skipping of main elements and components of the circuit board, opening and short-circuiting of circuits and other conditions. The test fixture is easy to operate and high in automation degree, manual operation is simplified, labor intensity is lowered, and working efficiency and testing accuracy are improved.

Description

A kind of measurement jig of circuit board
Technical field
The present invention relates to a kind of tool, relate in particular to a kind of measurement jig of circuit board.
Background technology
Along with scientific and technical progress, electronics industry development is advanced by leaps and bounds, and electronic system becomes increasingly complex, and the reliability and maintainability of electronic system requires also more and more higher.Circuit board is as the important component part in electronic system research and production, and the quality of its quality directly affects the quality of whole equipment, and production cycle length can have influence on machine debugging progress and delivery time.Therefore, debugging circuit board is to be related to the quality of electronic system and the important step of production cycle.
Traditional debugging circuit board method is mainly to utilize people's naked eyes to come the solder skip of main components and the situations such as short circuit of opening of circuit of checking circuit plate, but the method not only detection efficiency is low, and labour intensity is large, easily makes mistakes, degree of accuracy is low, and cannot find out the substantive issue in circuit board.
Summary of the invention
The object of the invention is to propose a kind of simple to operate, automaticity is high, and work efficiency is high, the measurement jig of the circuit board that degree of accuracy is high.
For reaching this object, the present invention by the following technical solutions:
The invention provides a kind of measurement jig of circuit board, comprise and be arranged on the upper die component of under casing top and be arranged on the lower membrane module under casing top panel, described upper die component comprises elevating mechanism, XY axle governor motion and probe, described elevating mechanism is used for driving described probe to move up and down, and described XY axle governor motion is used for driving described probe along Y direction and/or X-direction, to move in surface level;
Described lower membrane module comprises product support plate and pressure bar module, on described product support plate, be provided with probe module, described pressure bar module comprises air cylinder under pressure bar and pressure bar, described probe module comprises probe card, on described probe card, be provided with probe aperture, when described probe test product, under the effect of described pressure bar air cylinder under pressure bar, be pressed on product support plate, described probe contacts with test product through described probe aperture, and described probe connecting test unit transfers to test data in the interface plate on described under casing.
Preferably, described pressure bar module also comprises Y-axis governor motion, for driving described pressure bar to move along Y direction.
Preferably, described XY axle governor motion comprises Y-axis governor motion and several X-axis micro-adjusting mechanisms, described Y-axis governor motion is connected with described X-axis micro-adjusting mechanism with the cantilever of described elevating mechanism respectively, and described in each, X-axis micro-adjusting mechanism is connected with a probe by a shaft coupling.
Preferably, described probe module also comprises top gas cylinder on the probe module that is arranged on described under casing top panel bottom and is positioned at described under casing, when described probe test product, and the probe card jack-up that makes progress described in the air cylinder driven of top on described probe module.
Preferably, described under casing top panel bottom is provided with for the fixing vacuum cup of test product, and described vacuum cup is connected with vacuum generator.
Preferably, on described under casing top panel, be provided with line slideway, described line slideway is parallel to Y direction setting, described pressure bar can along described line slideway slide into described product support plate directly over.
Preferably, in described under casing, be provided with PLC controller.
Preferably, the rear of described under casing is provided with air intake opening, and described air intake opening is connected with top gas cylinder on outside air pump and described probe module respectively by tracheae.
Preferably, in described under casing, be also provided with heat abstractor.
Preferably, the bottom of described under casing is provided with buphthalmos wheel.
Beneficial effect of the present invention is:
(1) the invention provides a kind of measurement jig of circuit board, under the elevating mechanism and the effect of XY axle governor motion of upper die component, probe on upper die component is adjusted to through the probe aperture on lower membrane module probe card, probe is contacted for testing the situations such as short circuit of opening as the solder skip of circuit board main components and circuit with the test product on product support plate.The present invention is simple to operate, and automaticity is high, has simplified manual operation, has reduced labour intensity, has improved work efficiency and testing precision.
(2) under casing top panel bottom is provided with vacuum cup, by vacuum cup, holds test product, has realized fixedlying positioning of test product circuit board, has strengthened reliability and stability and the degree of accuracy of test.
(3) bottom of under casing is provided with the buphthalmos wheel flexibly that rolls, and makes the slippage very neatly of this measurement jig, has reduced workman's labour intensity, has facilitated operating personnel to use in different workshops, has expanded usable range.
Accompanying drawing explanation
Fig. 1 is the stereographic map of the proving installation of the circuit board that provides of the embodiment of the present invention one;
Fig. 2 is the partial enlarged drawing at A place in Fig. 1;
Fig. 3 is the structural representation of the upper membrane module that provides of the embodiment of the present invention one;
Fig. 4 is the product support plate that provides of the embodiment of the present invention one and the structural representation of probe module;
Fig. 5 is the structural representation of the under casing top panel bottom that provides of the embodiment of the present invention one;
Fig. 6 is the partial enlarged drawing at B place in Fig. 5;
Fig. 7 is the rear view of the proving installation of the circuit board that provides of the embodiment of the present invention one.
In figure, 1, under casing; 21, elevating mechanism; 211, cantilever; 22, XY axle governor motion; 221, Y-axis governor motion; 222, X-axis micro-adjusting mechanism; 223, shaft coupling; 23, probe; 31, product support plate; 311, locating slot; 32, pressure bar module; 321, pressure bar; 322, air cylinder under pressure bar; 323, Y-axis governor motion; 33, probe module; 331, probe card; 332, probe aperture; 333, top gas cylinder on probe module; 4, vacuum cup; 5, PLC controller; 6, air intake opening; 7, heat abstractor; 8, buphthalmos wheel.
Embodiment
Below in conjunction with accompanying drawing and by embodiment, further illustrate technical scheme of the present invention.
Embodiment mono-:
The present embodiment provides a kind of measurement jig of circuit board, and the structure of the measurement jig of this circuit board is as shown in Fig. 1-Fig. 7, and it comprises and is arranged on the upper die component of under casing 1 top and is arranged on the lower membrane module under casing top panel.Upper die component comprises four groups of probes 23 that four groups of elevating mechanisms 21, four groups of XY axle governor motions 22 and corresponding elevating mechanism 21 and XY axle governor motion 22 arrange, and every group of probe 23 comprises three probes 23.Elevating mechanism 21 is for driving probe 23 to move up and down.Every group of XY axle governor motion 22 comprises a Y-axis governor motion 221 and three X-axis micro-adjusting mechanisms 222, Y-axis governor motion 221 is connected with X-axis micro-adjusting mechanism 222 with the cantilever 211 of elevating mechanism 21 respectively, and each X-axis micro-adjusting mechanism 222 is connected with a probe 23 by a shaft coupling 223.Y-axis governor motion 221 is for driving probe 23 mobile along Y direction (as shown in Figure 1) in surface level, and X-axis micro-adjusting mechanism 222 is for driving probe 23 mobile along X-direction (as shown in Figure 1) in surface level.
Lower membrane module comprises product support plate 31, pressure bar module 32 and probe module 33.Wherein, the upper surface of product support plate 31 is formed with for the fixing locating slot 311 of circuit board under test, and the bottom of this locating slot 311 is connected with the sucker mouth of the vacuum cup 4 that under casing top panel bottom arranges, and vacuum cup 4 is connected with vacuum generator by tracheae.So design, the suction-operated by vacuum cup 4 interior vacuum is firmly fixed on circuit board under test on product support plate 31, has realized the location of circuit board under test, has strengthened reliability and stability and the degree of accuracy of test.
Probe module 33 comprises top gas cylinder 333 on probe card 331 and probe module, is provided with probe aperture 332 on probe card 331, and on probe module, top gas cylinder 333 is arranged under casing top panel bottom and is positioned under casing.When probe 23 test products, on probe module, top gas cylinder 333 drives upwards jack-up of probe card 331.
Air cylinder 322 and Y-axis governor motion 323 under the pressure bar that pressure bar module 32 comprises pressure bar 321, be connected with pressure bar 321, pressure bar 321 is arranged on the top of under casing top panel, on under casing top panel, be provided with and be parallel to the line slideway that Y direction arranges, under pressure bar, air cylinder 322 is arranged on the below of under casing top panel and is positioned under casing 1, and pressure bar 321 can slide by Y-axis governor motion 323 before and after line slideway.When probe 23 test circuit board under test, the driving effect lower slider of pressure bar 321 air cylinder 322 under pressure bar is to product support plate 31, and be pressed on product support plate 31, probe 23 contacts with circuit-under-test plate through probe aperture 332, and probe 23 connecting test unit transfer to test data in the interface plate under casing 1.
In under casing 1, be provided with PLC controller 5, the probe that can control upper die component by PLC controller contacts with test product through the probe aperture on lower membrane module probe card, thereby realizes as the accurate test of the situations such as short circuit of opening of the solder skip of circuit board main components and circuit.
The rear of under casing 1 is provided with air intake opening 6, and air intake opening 6 is connected with top gas cylinder 333 on outside air pump and probe module respectively by tracheae.
For fear of this measurement jig, due to the overheated damage that causes tool in operational process, be provided with heat abstractor 7 under casing 1, this heat abstractor 7 is preferably fan, can effectively remove the heat producing in operational process, has extended the serviceable life of equipment.
The bottom of under casing 1 is provided with buphthalmos wheel 8, and this buphthalmos wheel rolls flexibly, can make the slippage very neatly of this measurement jig, has reduced workman's labour intensity, has facilitated operating personnel to use in different workshops, has expanded usable range.
Concrete test process is as follows:
First, circuit-under-test plate is placed in the locating slot 311 of counterdie subassembly product support plate 31, then open the power switch of measurement jig, the pressure bar 321 of lower membrane module by Y-axis governor motion 323 along being parallel to line slideway that Y direction arranges to front slide, until slide into product support plate 31 directly over, under driving by air cylinder under pressure bar 322, be pressed on product support plate 31, simultaneously, the probe 23 of upper die component is at elevating mechanism 21, under Y-axis governor motion 221 and 222 actings in conjunction of X-axis micro-adjusting mechanism, move to the probe aperture 332 of aiming on probe card 331, until probe 23 is through probe aperture 332, and the bottom of probe 23 contacts with the components and parts to be measured of circuit board under test, and then the solder skip of completing circuit plate main components and the test of opening the situations such as short circuit of circuit.
In when test, probe utilizes the principle of virtual earth between operational amplifier two input ends, after making the components and parts two ends that are connected with components and parts to be measured on circuit board under test idiostatic, after isolation, measures, and has guaranteed the accuracy of measuring.
In the present embodiment, the quantity of the elevating mechanism of upper die component, XY axle governor motion and probe is not limited to above-mentioned four groups, can need to arbitrarily arrange according to reality test.The quantity of the product support plate of lower membrane module, pressure bar module and the quantity of probe module and the elevating mechanism of upper die component and XY axle governor motion is corresponding, can determine according to their magnitude setting.
The present invention is simple to operate, and automaticity is high, has simplified manual operation, has reduced labour intensity, has improved work efficiency and testing precision.
Know-why of the present invention has below been described in conjunction with specific embodiments.These are described is in order to explain principle of the present invention, and can not be interpreted as by any way limiting the scope of the invention.Explanation based on herein, those skilled in the art do not need to pay creative work can associate other embodiment of the present invention, within these modes all will fall into protection scope of the present invention.

Claims (10)

1. the measurement jig of a circuit board, it is characterized in that: comprise and be arranged on the upper die component of under casing (1) top and be arranged on the lower membrane module under casing top panel, described upper die component comprises elevating mechanism (21), XY axle governor motion (22) and probe (23), described elevating mechanism (21) is for driving described probe (23) to move up and down, and described XY axle governor motion (22) is for driving described probe (23) to move along Y direction and/or X-direction in surface level;
Described lower membrane module comprises product support plate (31) and pressure bar module (32), on described product support plate (31), be provided with probe module (33), described pressure bar module (32) comprises air cylinder (322) under pressure bar (321) and pressure bar, described probe module (33) comprises probe card (331), on described probe card (331), be provided with probe aperture (332), when described probe (23) test products, under the effect of described pressure bar (321) air cylinder (322) under pressure bar, be pressed on product support plate (31), described probe (23) contacts with test product through described probe aperture (332), described probe (23) connecting test unit transfers to test data in the interface plate on described under casing (1).
2. the measurement jig of a kind of circuit board according to claim 1, is characterized in that: described pressure bar module also comprises Y-axis governor motion (323), for driving described pressure bar (321) to move along Y direction.
3. the measurement jig of a kind of circuit board according to claim 1, it is characterized in that: described XY axle governor motion (22) comprises Y-axis governor motion (221) and several X-axis micro-adjusting mechanisms (222), described Y-axis governor motion is connected with described X-axis micro-adjusting mechanism (222) with the cantilever (211) of described elevating mechanism (21) respectively, and described in each, X-axis micro-adjusting mechanism (222) is connected with a probe (23) by a shaft coupling (223).
4. the measurement jig of a kind of circuit board according to claim 1, it is characterized in that: described probe module (33) also comprises top gas cylinder (333) on the probe module that is arranged on described under casing top panel bottom and is positioned at described under casing, when described probe (23) test products, on described probe module, top gas cylinder (333) drives upwards jack-up of described probe card (331).
5. the measurement jig of a kind of circuit board according to claim 1, is characterized in that: described under casing top panel bottom is provided with for the fixing vacuum cup of test product (4), and described vacuum cup (4) is connected with vacuum generator.
6. the measurement jig of a kind of circuit board according to claim 1, it is characterized in that: on described under casing top panel, be provided with line slideway, described line slideway is parallel to Y direction setting, described pressure bar (321) can along described line slideway slide into described product support plate (31) directly over.
7. the measurement jig of a kind of circuit board according to claim 1, is characterized in that: in described under casing (1), be provided with PLC controller (5).
8. the measurement jig of a kind of circuit board according to claim 4, it is characterized in that: the rear of described under casing (1) is provided with air intake opening (6), described air intake opening (6) is connected with top gas cylinder (333) on outside air pump and described probe module respectively by tracheae.
9. the measurement jig of a kind of circuit board according to claim 7, is characterized in that: in described under casing (1), be also provided with heat abstractor (7).
10. the measurement jig of a kind of circuit board according to claim 1, is characterized in that: the bottom of described under casing (1) is provided with buphthalmos wheel (8).
CN201410424762.4A 2014-08-26 2014-08-26 A kind of measurement jig of circuit board Active CN104155563B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410424762.4A CN104155563B (en) 2014-08-26 2014-08-26 A kind of measurement jig of circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410424762.4A CN104155563B (en) 2014-08-26 2014-08-26 A kind of measurement jig of circuit board

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CN104155563A true CN104155563A (en) 2014-11-19
CN104155563B CN104155563B (en) 2018-02-02

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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104777438A (en) * 2015-04-17 2015-07-15 深圳市炫硕光电科技有限公司 Filament lighting increasing device
CN105929321A (en) * 2016-06-12 2016-09-07 深圳市斯纳达科技有限公司 Integrated circuit tester
CN105938169A (en) * 2016-03-25 2016-09-14 江苏凯尔生物识别科技有限公司 Adsorption tool for fingerprint module group metal ring assembling
CN105954672A (en) * 2016-06-18 2016-09-21 东莞华贝电子科技有限公司 Mainboard combined measurement machine and test method thereof
CN106885968A (en) * 2017-03-17 2017-06-23 广东长盈精密技术有限公司 Continuity test tool
CN107402128A (en) * 2017-08-25 2017-11-28 歌尔股份有限公司 Module presses test fixture and method of testing
CN108761309A (en) * 2018-05-23 2018-11-06 昆山龙雨智能科技有限公司 A kind of test device
CN109283454A (en) * 2018-11-06 2019-01-29 深圳市凯码时代科技有限公司 Full-automatic pcb board electric logging device
CN113359006A (en) * 2021-05-31 2021-09-07 潍坊歌尔电子有限公司 Testing device for electronic device
CN113639979A (en) * 2021-07-26 2021-11-12 苏州佳祺仕信息科技有限公司 Detection tool and detection device for detecting performance of workpiece with hole
CN114641176A (en) * 2022-03-31 2022-06-17 深圳市中冀联合技术股份有限公司 Drawer type electromagnetic shielding box for realizing calibration test
CN116559628A (en) * 2023-06-12 2023-08-08 广东汉为信息技术有限公司 Circuit board module test fixture
CN116559628B (en) * 2023-06-12 2024-04-30 广东汉为信息技术有限公司 Circuit board module test fixture

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CN200986565Y (en) * 2006-11-20 2007-12-05 深圳麦逊电子有限公司 PCB test clamp micro-adjusting device
CN201812003U (en) * 2010-09-01 2011-04-27 景美科技股份有限公司 Electronic component testing device
CN102508069A (en) * 2011-11-02 2012-06-20 昆山迈致治具科技有限公司 Automatic test fixture for PCB (Printed Circuit Board) board
CN102773690A (en) * 2012-08-23 2012-11-14 昆山迈致治具科技有限公司 Pressing jig for PCB (printed circuit board) connecting nails
CN202649367U (en) * 2012-05-08 2013-01-02 Tcl王牌电器(惠州)有限公司 PCB testing device
CN103412212A (en) * 2013-07-24 2013-11-27 昆山迈致治具科技有限公司 PCB performance detection jig with positioning function
CN203616356U (en) * 2013-12-06 2014-05-28 扬州飞堑电子设备有限公司 Manual probe bench for testing semiconductor chip
CN204044281U (en) * 2014-08-26 2014-12-24 昆山迈致治具科技有限公司 A kind of measurement jig of circuit board

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5003254A (en) * 1989-11-02 1991-03-26 Huntron, Inc. Multi-axis universal circuit board test fixture
US6147505A (en) * 1996-12-24 2000-11-14 Hewlett-Packard Company Adapter arrangement for electrically testing printed circuit boards
CN200986565Y (en) * 2006-11-20 2007-12-05 深圳麦逊电子有限公司 PCB test clamp micro-adjusting device
CN201812003U (en) * 2010-09-01 2011-04-27 景美科技股份有限公司 Electronic component testing device
CN102508069A (en) * 2011-11-02 2012-06-20 昆山迈致治具科技有限公司 Automatic test fixture for PCB (Printed Circuit Board) board
CN202649367U (en) * 2012-05-08 2013-01-02 Tcl王牌电器(惠州)有限公司 PCB testing device
CN102773690A (en) * 2012-08-23 2012-11-14 昆山迈致治具科技有限公司 Pressing jig for PCB (printed circuit board) connecting nails
CN103412212A (en) * 2013-07-24 2013-11-27 昆山迈致治具科技有限公司 PCB performance detection jig with positioning function
CN203616356U (en) * 2013-12-06 2014-05-28 扬州飞堑电子设备有限公司 Manual probe bench for testing semiconductor chip
CN204044281U (en) * 2014-08-26 2014-12-24 昆山迈致治具科技有限公司 A kind of measurement jig of circuit board

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104777438A (en) * 2015-04-17 2015-07-15 深圳市炫硕光电科技有限公司 Filament lighting increasing device
CN105938169A (en) * 2016-03-25 2016-09-14 江苏凯尔生物识别科技有限公司 Adsorption tool for fingerprint module group metal ring assembling
CN105929321B (en) * 2016-06-12 2023-03-03 深圳市斯纳达科技有限公司 Integrated circuit test equipment
CN105929321A (en) * 2016-06-12 2016-09-07 深圳市斯纳达科技有限公司 Integrated circuit tester
CN105954672A (en) * 2016-06-18 2016-09-21 东莞华贝电子科技有限公司 Mainboard combined measurement machine and test method thereof
CN105954672B (en) * 2016-06-18 2018-07-10 东莞华贝电子科技有限公司 A kind of mainboard translocation machine and its test method
CN106885968A (en) * 2017-03-17 2017-06-23 广东长盈精密技术有限公司 Continuity test tool
CN107402128A (en) * 2017-08-25 2017-11-28 歌尔股份有限公司 Module presses test fixture and method of testing
CN108761309A (en) * 2018-05-23 2018-11-06 昆山龙雨智能科技有限公司 A kind of test device
CN109283454A (en) * 2018-11-06 2019-01-29 深圳市凯码时代科技有限公司 Full-automatic pcb board electric logging device
CN113359006A (en) * 2021-05-31 2021-09-07 潍坊歌尔电子有限公司 Testing device for electronic device
CN113639979A (en) * 2021-07-26 2021-11-12 苏州佳祺仕信息科技有限公司 Detection tool and detection device for detecting performance of workpiece with hole
CN113639979B (en) * 2021-07-26 2022-04-26 苏州佳祺仕信息科技有限公司 Detection tool and detection device for detecting performance of workpiece with hole
CN114641176A (en) * 2022-03-31 2022-06-17 深圳市中冀联合技术股份有限公司 Drawer type electromagnetic shielding box for realizing calibration test
CN116559628A (en) * 2023-06-12 2023-08-08 广东汉为信息技术有限公司 Circuit board module test fixture
CN116559628B (en) * 2023-06-12 2024-04-30 广东汉为信息技术有限公司 Circuit board module test fixture

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