CN104264136A - Formula of salt-based colloid palladium activating solution - Google Patents
Formula of salt-based colloid palladium activating solution Download PDFInfo
- Publication number
- CN104264136A CN104264136A CN201410531666.XA CN201410531666A CN104264136A CN 104264136 A CN104264136 A CN 104264136A CN 201410531666 A CN201410531666 A CN 201410531666A CN 104264136 A CN104264136 A CN 104264136A
- Authority
- CN
- China
- Prior art keywords
- salt
- formula
- based colloid
- colloid palladium
- activating solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
- C23C18/1831—Use of metal, e.g. activation, sensitisation with noble metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
Abstract
The invention discloses a formula of salt-based colloid palladium activating solution. The formula comprises the following ingredients in ratio by weight: 0.35g/L of palladium oxide, 20g/L of stannous oxide, 11.5mL/L of oxalate, 173g/L of sodium oxide, 0.5g/L of sodium stannate and 50g/L of urea. The formula of the salt-based colloid palladium activating solution, provided by the invention has great stable performance.
Description
Technical field
The present invention relates to the formula of the activation solution in a kind of chemical-copper-plating process.
Background technology
in chemical-copper-plating process, activation solution forms the colloidal solid containing palladium metal in the solution, physisorption is utilized when activation treatment, palladium active center is formed at matrix surface, therefore, precious metal in activation solution can not and metallic copper between produce and replace metal level, the catalysis particle of the just unimolecular layer produced on matrix surface after activation, provides good condition of surface to the bonding force improving coating.Volatile containing hydrochloric acid in existing Salt-Based Colloid Palladium activation solution, and the hydrochloric acid of excessive concentrations can accelerate the oxidation rate of Salt-Based Colloid Palladium, causes solution premature failure.
Summary of the invention
Goal of the invention: the invention solves the problems referred to above, provides the formula of the good Salt-Based Colloid Palladium activation solution of a kind of stability.
Technical scheme: a kind of formula of Salt-Based Colloid Palladium activation solution, comprises following composition by weight ratio, palladous oxide 0.35g/L, tin protoxide 20g/L, oxalic acid 11.5mL/L, sodium oxide 173g/L, sodium stannate 0.5g/L, urea 50g/L.
Particularly, the concentration of described oxalic acid is 34%.
Particularly, described temperature controls at 50 DEG C.
Beneficial effect: compared with prior art, its advantage is to make palladium content in Salt-Based Colloid Palladium activation solution at 100-140mg/L, make Salt-Based Colloid Palladium more stable with careless acid instead of HCl, improves the stability of Salt-Based Colloid Palladium activation solution in the present invention.
Embodiment
Below in conjunction with embodiment, illustrate the present invention further.
Embodiment 1
A formula for Salt-Based Colloid Palladium activation solution, comprises following composition by weight ratio, palladous oxide 0.35g/L, tin protoxide 20g/L, and concentration is the oxalic acid 11.5mL/L of 34%, sodium oxide 173g/L, sodium stannate 0.5g/L, urea 50g/L.
By in the oxalic acid of 0.35g palladous oxide heating for dissolving and 5mL, then by 5g tin protoxide heating for dissolving in the oxalic acid of 5.5 mL and the deionized water of 10mL, above 15g tin protoxide is slowly added in the solution containing palladous oxide, stir 6 minutes, place for subsequent use.Add the deionized water of 800mL in a reservoir, then add 173g sodium oxide, 50g urea, 5g tin protoxide successively, heat and stir.Above step all operates under the environment of temperature 50 C.
The formulation operations of a kind of Salt-Based Colloid Palladium activation solution of the present invention is simple, and the activity of Salt-Based Colloid Palladium and stability better.
Claims (3)
1. a formula for Salt-Based Colloid Palladium activation solution, is characterized in that: comprise following composition by weight ratio, palladous oxide 0.35g/L, tin protoxide 20g/L, oxalic acid 11.5mL/L, sodium oxide 173g/L, sodium stannate 0.5g/L, urea 50g/L.
2. the formula of a kind of Salt-Based Colloid Palladium activation solution according to claim 1, is characterized in that: the concentration of described oxalic acid is 34%.
3. the formula of a kind of Salt-Based Colloid Palladium activation solution according to claim 1, is characterized in that: described temperature controls at 50 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410531666.XA CN104264136A (en) | 2014-10-11 | 2014-10-11 | Formula of salt-based colloid palladium activating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410531666.XA CN104264136A (en) | 2014-10-11 | 2014-10-11 | Formula of salt-based colloid palladium activating solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104264136A true CN104264136A (en) | 2015-01-07 |
Family
ID=52155704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410531666.XA Pending CN104264136A (en) | 2014-10-11 | 2014-10-11 | Formula of salt-based colloid palladium activating solution |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104264136A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105779977A (en) * | 2016-02-15 | 2016-07-20 | 深圳市瑞世兴科技有限公司 | Palladium activating solution for nickel plating of magnesium alloy and nickel plating method of magnesium alloy |
| CN109750286A (en) * | 2019-03-12 | 2019-05-14 | 阳江市超耐精饰表面处理技术有限公司 | A kind of mechanical zinc-plating-aluminium-magnesium alloy coating promotor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3011920A (en) * | 1959-06-08 | 1961-12-05 | Shipley Co | Method of electroless deposition on a substrate and catalyst solution therefor |
| CN101928937A (en) * | 2009-06-22 | 2010-12-29 | 比亚迪股份有限公司 | Colloid palladium activation solution, preparation method thereof and non-metal surface activation method |
-
2014
- 2014-10-11 CN CN201410531666.XA patent/CN104264136A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3011920A (en) * | 1959-06-08 | 1961-12-05 | Shipley Co | Method of electroless deposition on a substrate and catalyst solution therefor |
| CN101928937A (en) * | 2009-06-22 | 2010-12-29 | 比亚迪股份有限公司 | Colloid palladium activation solution, preparation method thereof and non-metal surface activation method |
Non-Patent Citations (3)
| Title |
|---|
| 《简明化学试剂手册》编写组: "《简明化学试剂手册》", 31 January 1991 * |
| 方景礼: "《电镀配合物——理论与应用》", 31 January 2008 * |
| 王柏华: "《中国纺织品整理及进展·第1卷》", 30 September 2013 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105779977A (en) * | 2016-02-15 | 2016-07-20 | 深圳市瑞世兴科技有限公司 | Palladium activating solution for nickel plating of magnesium alloy and nickel plating method of magnesium alloy |
| CN109750286A (en) * | 2019-03-12 | 2019-05-14 | 阳江市超耐精饰表面处理技术有限公司 | A kind of mechanical zinc-plating-aluminium-magnesium alloy coating promotor |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150107 |