CN104470225A - Circuit board producing method and electronic device producing method - Google Patents
Circuit board producing method and electronic device producing method Download PDFInfo
- Publication number
- CN104470225A CN104470225A CN201410729503.2A CN201410729503A CN104470225A CN 104470225 A CN104470225 A CN 104470225A CN 201410729503 A CN201410729503 A CN 201410729503A CN 104470225 A CN104470225 A CN 104470225A
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- CN
- China
- Prior art keywords
- electric component
- circuit board
- veneer
- component position
- different
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
- G06F21/78—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer to assure secure storage of data
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0221—Perforating
Abstract
The invention provides a circuit board producing method and an electronic device producing method. Through a circuit board produced through the circuit board producing method and an electronic device produced through the electronic device producing method, the safety of corresponding products can be effectively improved, and the sensitive information leakage caused by illegal invasion is avoided. The circuit board producing method includes the following steps of manufacturing a splice plate, wherein the splice plate is a printed circuit board and comprises two or more single plate areas which are spliced together, circuits of the single plate areas have the same topological structure, and the single plate areas are different in specific wire arrangement; cutting the splice plate to obtain single plates, wherein the single plates correspond to the single plate areas on the splice plate; arranging electrical elements on the single plates to obtain the circuit board. Through the scheme for designing the circuit board according to the same electrical principle, through different specific circuit board arrangement modes, the randomness of the electrical elements and lines is improved, and the situation that a lawbreaker attempts to break other devices of the same type by studying one device can not occur.
Description
Technical field
The present invention relates to board production technical field and electronic equipment production assembling field.
Background technology
Electronic equipment has been widely used in the every aspect of modern society, while being convenient for people to life, work, also bring many information security hidden danger.Usually the sensitive information of work or individual is all stored in electronic equipment; Electronic equipment also may be equipped with know-how or the business secret of company, such as confidential software code, circuit design etc.Therefore; many specifications all propose requirement to the safety of electronic product with organizing; such as international PCI tissue and domestic BCTC just have clear and definite safety requirements to finance device, prevent from being stolen by sensitive information when holder's the unknown to the sensitive information protection of some keys.
Therefore in order to prevent, sensitive information or know-how etc. be stolen to electronic equipment illegal invasion, need taking the technological means of anti-illegal-inbreak to take precautions against.The scheme of usual anti-illegal-inbreak electronic equipment is that protective device adopts switch form usually, when invader illegally opens electronic equipment, and triggering secure switch, thus excite safety precautions, with the sensitive data etc. in destroy device.
For the field of E-Payment by mails, the requirement of E-Payment field to safety is more and more higher, but inventor finds such scheme, and there are the following problems: electronic payment terminal equipment now, as POS, code keypad etc., the same model of these equipment, the circuit board (PCBA) of its inside is all the same.Way conveniently; crack these equipment; can the equipment of this model be first taken to carry out disassembling, analyzing; obtain the data message of being correlated with; the position of such as safety contact, the polarity of level, these information such as the protection cabling mode of mesh, the position of safety signal via hole etc.; and then take a new machine, navigate to associated safety point, by security mask by these data.
Therefore, need a kind of method for producing circuit board and method of manufacturing electronic apparatus badly, these methods can improve electronic product fail safe effectively, reduce electronic product and are disassembled and cause the possibility of sensitive information leakage.
Summary of the invention
For this reason, inventor provide a kind of method for producing circuit board and method of manufacturing electronic apparatus, with the circuit board that said method is produced, and produce with said method the fail safe that the electronic equipment assembled can improve corresponding product effectively, avoid being caused sensitive information leakage by illegal invasion.
For achieving the above object, inventor provide a kind of method for producing circuit board, comprise the following steps:
Make jigsaw, described jigsaw is printed circuit board (PCB), and comprise more than 2 veneer regions of mutually splicing, the circuit in each veneer region has identical topological structure, but the concrete wiring in each veneer region is different;
Cutting jigsaw, obtains veneer, the veneer region on the corresponding jigsaw of described veneer difference;
Veneer arranges electric component, obtains circuit board.
Wherein, described veneer region is provided with the first electric component position, and in each veneer region, the first electric component position is positioned at identical topology location, but particular location is different;
Veneer arranges electric component, is included on the first electric component position and the first electric component is set.
Wherein, the quantity of described first electric component position is more than 2, and the quantity of described first electric component is less than the quantity of the first electric component position;
When veneer arranges electric component, select part first electric component position to arrange the first electric component wherein, remaining first electric component position is vacant.
Wherein, described first electric component is safety switch or safety sensor.
Wherein, described safety sensor is sensitive switch, pressure sensor or light sensor.
Wherein, described printed circuit board (PCB) is lamina or multi-layer sheet.
Wherein, the concrete wiring difference in each veneer region specifically comprises: the position of electric component position is different, one or more in the position difference of the different and via in the position of Copper Foil wire.
Inventor additionally provides a kind of production method of electronic equipment, comprises step:
Prepare circuit board, the type of described circuit board is two or more, has identical topological structure between dissimilar circuit, but the difference that specifically connects up;
Each circuit board is assemblied on each electronic equipment respectively, obtains described electronic equipment.
Wherein, circuit board is provided with the first electric component position, wherein part first electric component position is provided with the first electric component, remaining first electric component position is vacant, in dissimilar circuit board, the first electric component position is positioned at identical topology location, but particular location is different, and in dissimilar circuit board, the electric component position topology location that the first electric component is arranged is different.
Wherein, described electronic equipment is POS, notebook computer, desktop computer, server, smart mobile phone, panel computer or Wearable, and described first electric component is safety switch or safety sensor.
Be different from prior art, technique scheme is by the board design scheme of same electrical principle, specific boards arrangement form by different way, thus add the randomness of electric component and circuit, lawless person is made to attempt by studying an equipment, thus the attempt cracking other same model device cannot realize, and adds the fail safe of electronic equipment.
Accompanying drawing explanation
The structural representation one that Fig. 1 is jigsaw described in embodiment;
The structural representation two that Fig. 2 is jigsaw described in embodiment;
The production method flow chart that Fig. 3 is circuit board described in embodiment;
The production method flow chart that Fig. 4 is electronic equipment described in embodiment.
Description of symbols:
10: jigsaw
11 ~ 18: veneer region
1 ~ 8: electric component position
Embodiment
By describe in detail technical scheme technology contents, structural feature, realized object and effect, coordinate accompanying drawing to be explained in detail below in conjunction with specific embodiment.
Present embodiments provide a kind of method for producing circuit board, comprise the following steps:
S301 makes jigsaw, and jigsaw 10 is printed circuit board (PCB), and described printed circuit board (PCB) is lamina or multi-layer sheet.
Jigsaw 10 comprises more than 2 veneer regions of mutually splicing, and the circuit in each veneer region has identical topological structure, but the concrete wiring in each veneer region is different;
As shown in Figure 1, 2, jigsaw 10 specifically refers to the circuit board also do not cut, due in generation in order to enhance productivity, usually make the large-area printed circuit board (PCB) of a monoblock, after have passed through the processing steps such as the etching of each layer circuit board, pressing, boring, plating, define one piece of large jigsaw.The jigsaw that actual lastblock is large includes multiple respective independently board circuit, when final molding, large jigsaw is needed to cut, after excision forming, the circuit board formed is called veneer, namely monolithic, has the circuit board of complete independent circuits, is the circuit board section of last application for product.Jigsaw 10 shown in Fig. 1 includes 8 veneer regions 11 ~ 18, forms 8 veneers after cutting.
Described circuit has identical topological structure, refer to that circuit board has identical circuit module, electric connecting relation between circuit module is also identical, the logical relation namely connected is identical, express in another way, circuit theory diagrams corresponding to alternatively different veneer regions are identical with circuit block diagram.Concrete wiring is different, although refer at the circuit catenation principle in each veneer region identical, but concrete wire laying mode is different, concrete, can be that the circuit connected walks line position, direction is different, also can be element, electric component position particular location different, printed substrate figure corresponding to different veneer region is different.The concrete wiring difference in each veneer region specifically comprises: the position of electric component position is different, one or more in the position difference of the different and via in the position of Copper Foil wire.In embodiment, electric component position means for arranging the reserved location of electric component on circuit board, can be golden finger, pad, socket, stitch etc.
S302 cuts jigsaw, obtains veneer, the veneer region on the corresponding jigsaw of described veneer difference;
S303 arranges electric component on veneer, obtains circuit board.
In certain embodiments, veneer region is provided with the first electric component position, and in each veneer region, the first electric component position is positioned at identical topology location, but particular location is different; Namely on each veneer, the first position of electric component position on circuit theory diagrams is the same, but the actual particular location arranged is different.
Veneer arranges electric component, is included on the first electric component position and the first electric component is set.In certain embodiments, the first electric component is safety switch or safety sensor.Described safety switch, also known as safety contact, is the trigger switch being applied to safety circuit in some embodiment.Safety switch can be arranged on the golden finger of circuit board.Safety sensor is the transducer of triggering secure circuit safety mechanism in an embodiment.In some embodiment, safety sensor is sensitive switch, pressure sensor or light sensor.The effect of sensitive switch in security mechanism is by two sides relative in equipment, such as housing and circuit board, by sensitive switch folder between the two, the state opened or closed of sensitive switch is formed, once equipment is illegally opened, sensitive switch reduces due to pressure or disappears, switch flicks, and the state opened or closed changes, thus on circuit, provide a signal intensity, make the contingency plan that device start is invaded, carry out the actions such as destroyed sensitive data.The effect that pressure sensor is and sensitive switch similar, but can experience the amplitude of pressure change due to it, and be not only simply open or close two states, the sensitivity therefore detected is higher, and signal analyticity is stronger, and contingency plan is abundanter.The principle of light sensor in security mechanism is that, when equipment is airtight, equipment is light tight, and when equipment is illegally opened, under equipment is exposed to light, light sensor receives light signal, sends the corresponding signal of telecommunication to start invasion contingency plan.
In certain embodiments, each veneer region includes the first electric component position of more than 2, each veneer same spatial location is all provided with the position of the first electric component position, but the topology location of the first electric component position on circuit theory diagrams corresponding to identical locus, each veneer region is different.
Such as shown in Fig. 1,2, wherein jigsaw 10 includes label 11 ~ 18,8 veneer regions, wherein each plate is provided with 8 electric component positions of label 1 ~ 8, identical at the circuit theory diagrams in each veneer region, but different from each other in concrete wiring, therefore the distribution mode of 8 electric component positions is different.Concrete, as shown in Figure 2, position, 8 electric component positions is provided with in 11 ~ 18 8 veneer regions, this locus in each veneer region, position, 8 electric component positions is the same, but the wire laying mode in each veneer region is different, therefore the electric component position of same spatial location in 8 veneer regions, corresponding safety contact or safety sensor are different.Such as in veneer region 11, the position of electric component position 1 is corresponding in veneer region 12 is the position of electric component position 5, and corresponding in veneer region 18 be the position of electric component position 8, although be therefore all provided with electric component position in identical locus, but these electric component positions topology location is in circuit different, if invader disassembles according to it the equipment of circuit information to other veneers obtained and cracks, because the circuit information of correspondence is not inconsistent, just equipment cannot be cracked, greatly ensure that the safety of equipment, simultaneously because the locus of electric component position is identical, so ensure that the convenience of production in board production process.
In certain embodiments, the quantity of described first electric component position is more than 2, and the quantity of described first electric component is less than the quantity of the first electric component position; When veneer arranges electric component, select part first electric component position to arrange the first electric component wherein, remaining first electric component position is vacant.
Such as the quantity of the first electric component position is 10, and the quantity of the first electric component is 8, vacant 2 the first electric component positions.Like this, in different equipment, the installation site of the first different electric components can be selected further, to improve the difficulty attacked or crack.
Another embodiment, provides a kind of production method of the board production electronic equipment utilizing foregoing circuit plate producing process to obtain, comprises step:
S401 prepares circuit board, and the type of described circuit board is two or more, has identical topological structure between dissimilar circuit, but the difference that specifically connects up; The feature of the circuit board that specifically can obtain see the method for above-mentioned production circuit board.Such as, circuit board is provided with the first electric component position, wherein part first electric component position is provided with the first electric component, remaining first electric component position is vacant, in dissimilar circuit board, the first electric component position is positioned at identical topology location, but particular location is different, and in dissimilar circuit board, the electric component position topology location that the first electric component is arranged is different.
Each circuit board is assemblied on each electronic equipment by S402 respectively, obtains described electronic equipment.
In various embodiments, electronic equipment is POS, notebook computer, desktop computer, server, smart mobile phone, panel computer or Wearable, and described first electric component is safety contact or safety sensor.
The beneficial effect of above-described embodiment is, when not using the concrete circuit randomizing scheme of above-mentioned pcb board, lawless person gets an equipment and disassembles, analyze, obtain the data message of being correlated with, as the position of safety contact, the polarity of level, the cabling mode of protection mesh, these information such as the position of safety signal via hole, and then take the equipment of a new same model, associated safety point is navigated to by these data, by security mask, thus, the hardware unit or software of stealing sensitive information can be implanted in equipment by lawless person, when user uses, steal the associated personal information of user, the economic interests of user are made to receive infringement.And this programme adds randomness, the difficulty that the equipment of considerably increasing is cracked.
Such as, shown in Fig. 2, wherein the position of 8 safety contacts is each different, so such as you have cracked 8 contacts in (veneer region 11) on this block plate of pattern1, obtain the information (position, level, cabling etc.) of these eight contacts, if do not do random process by general, at will take one block of plate, affirmative and this block plate of pattern1 are living, so just be easy to the information that will this block plate of pattern1 obtains, on the plate that this block applied mechanically newly is taken, thus crack new plate.If done random process; the plate that you take; just be different from plate pattern1 (veneer region 11); it is such as the one in pattern2 ~ ~ pattern8 (veneer region 12 ~ 18); this and pattern1 (position, level, cabling etc.) are different; so just absolutely the information that pattern1 obtains cannot be used pattern2 ~ ~ pattern8 upper; if that at this moment take is pattern2; and the information on continuation pattern1 goes to crack; will inevitably report to the police; delete relevant sensitive information, protect the interests of user.
It should be noted that, in this article, the such as relational terms of first and second grades and so on is only used for an entity or operation to separate with another entity or operating space, and not necessarily requires or imply the relation that there is any this reality between these entities or operation or sequentially.And, term " comprises ", " comprising " or its any other variant are intended to contain comprising of nonexcludability, thus make to comprise the process of a series of key element, method, article or terminal equipment and not only comprise those key elements, but also comprise other key elements clearly do not listed, or also comprise by the intrinsic key element of this process, method, article or terminal equipment.When not more restrictions, the key element limited by statement " comprising ... " or " comprising ... ", and be not precluded within process, method, article or the terminal equipment comprising described key element and also there is other key element.In addition, in this article, " be greater than ", " being less than ", " exceeding " etc. be interpreted as and do not comprise this number; " more than ", " below ", " within " etc. be interpreted as and comprise this number.
Although be described the various embodiments described above; but those skilled in the art are once obtain the basic creative concept of cicada; then can make other change and amendment to these embodiments; so the foregoing is only embodiments of the invention; not thereby scope of patent protection of the present invention is limited; every utilize specification of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included within scope of patent protection of the present invention.
Claims (10)
1. a method for producing circuit board, comprises the following steps:
Make jigsaw, described jigsaw is printed circuit board (PCB), and comprise more than 2 veneer regions of mutually splicing, the circuit in each veneer region has identical topological structure, but the concrete wiring in each veneer region is different;
Cutting jigsaw, obtains veneer, the veneer region on the corresponding jigsaw of described veneer difference;
Veneer arranges electric component, obtains circuit board.
2. method for producing circuit board according to claim 1, is characterized in that, described veneer region is provided with the first electric component position, and in each veneer region, the first electric component position is positioned at identical topology location, but particular location is different;
Veneer arranges electric component, is included on the first electric component position and the first electric component is set.
3. method for producing circuit board according to claim 2, is characterized in that, the quantity of described first electric component position is more than 2, and the quantity of described first electric component is less than the quantity of the first electric component position;
When veneer arranges electric component, select part first electric component position to arrange the first electric component wherein, remaining first electric component position is vacant.
4. method for producing circuit board according to claim 2, is characterized in that, described first electric component is safety switch or safety sensor.
5. method for producing circuit board according to claim 4, is characterized in that, described safety sensor is sensitive switch, pressure sensor or light sensor.
6. the production method of the circuit board according to claim 1 to 5 any one, is characterized in that, described printed circuit board (PCB) is lamina or multi-layer sheet.
7. the production method of the circuit board according to claim 1 to 5 any one, it is characterized in that, the concrete wiring difference in each veneer region specifically comprises: the position of electric component position is different, one or more in the position difference of the different and via in the position of Copper Foil wire.
8. a production method for electronic equipment, comprises step:
Prepare circuit board, the type of described circuit board is two or more, has identical topological structure between dissimilar circuit, but the difference that specifically connects up;
Each circuit board is assemblied on each electronic equipment respectively, obtains described electronic equipment.
9. the production method of electronic equipment according to claim 8, is characterized in that,
Circuit board is provided with the first electric component position, wherein part first electric component position is provided with the first electric component, remaining first electric component position is vacant, in dissimilar circuit board, first electric component position is positioned at identical topology location, but particular location is different, and in dissimilar circuit board, the electric component position topology location that the first electric component is arranged is different.
10. the production method of electronic equipment according to claim 9, it is characterized in that, described electronic equipment is POS, notebook computer, desktop computer, server, smart mobile phone, panel computer or Wearable, and described first electric component is safety switch or safety sensor.
Priority Applications (1)
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CN201410729503.2A CN104470225B (en) | 2014-12-04 | 2014-12-04 | Method for producing circuit board and method of manufacturing electronic apparatus |
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CN201410729503.2A CN104470225B (en) | 2014-12-04 | 2014-12-04 | Method for producing circuit board and method of manufacturing electronic apparatus |
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CN104470225A true CN104470225A (en) | 2015-03-25 |
CN104470225B CN104470225B (en) | 2018-01-09 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107615909A (en) * | 2015-05-29 | 2018-01-19 | 富士机械制造株式会社 | Optimum procedure and installation exercise machine |
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US5572409A (en) * | 1994-02-08 | 1996-11-05 | Prolinx Labs Corporation | Apparatus including a programmable socket adapter for coupling an electronic component to a component socket on a printed circuit board |
CN103034155A (en) * | 2012-11-22 | 2013-04-10 | 福建联迪商用设备有限公司 | Printed circuit board (PCB) for protecting liquid crystal signal, method for protecting liquid crystal signal and handheld device for protecting liquid crystal signal |
CN103578201A (en) * | 2012-07-27 | 2014-02-12 | 德昌电机(深圳)有限公司 | Security wrap and method for forming and installing same |
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2014
- 2014-12-04 CN CN201410729503.2A patent/CN104470225B/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US5572409A (en) * | 1994-02-08 | 1996-11-05 | Prolinx Labs Corporation | Apparatus including a programmable socket adapter for coupling an electronic component to a component socket on a printed circuit board |
CN103578201A (en) * | 2012-07-27 | 2014-02-12 | 德昌电机(深圳)有限公司 | Security wrap and method for forming and installing same |
CN103034155A (en) * | 2012-11-22 | 2013-04-10 | 福建联迪商用设备有限公司 | Printed circuit board (PCB) for protecting liquid crystal signal, method for protecting liquid crystal signal and handheld device for protecting liquid crystal signal |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107615909A (en) * | 2015-05-29 | 2018-01-19 | 富士机械制造株式会社 | Optimum procedure and installation exercise machine |
CN107615909B (en) * | 2015-05-29 | 2020-02-21 | 株式会社富士 | Computer-readable storage medium and mounting work machine |
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