CN104519658B - 一种电路板跳层盲孔的制作方法及电路板 - Google Patents

一种电路板跳层盲孔的制作方法及电路板 Download PDF

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Publication number
CN104519658B
CN104519658B CN201310461626.8A CN201310461626A CN104519658B CN 104519658 B CN104519658 B CN 104519658B CN 201310461626 A CN201310461626 A CN 201310461626A CN 104519658 B CN104519658 B CN 104519658B
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China
Prior art keywords
window
conductive pattern
layer
blind hole
skip floor
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CN201310461626.8A
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Chinese (zh)
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CN104519658A (zh
Inventor
金立奎
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New Founder Holdings Development Co ltd
Zhuhai Founder Technology High Density Electronic Co Ltd
Original Assignee
Zhuhai Founder Technology High Density Electronic Co Ltd
Peking University Founder Group Co Ltd
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Priority to CN201310461626.8A priority Critical patent/CN104519658B/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
CN201310461626.8A 2013-09-30 2013-09-30 一种电路板跳层盲孔的制作方法及电路板 Active CN104519658B (zh)

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CN201310461626.8A CN104519658B (zh) 2013-09-30 2013-09-30 一种电路板跳层盲孔的制作方法及电路板

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CN201310461626.8A CN104519658B (zh) 2013-09-30 2013-09-30 一种电路板跳层盲孔的制作方法及电路板

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CN104519658A CN104519658A (zh) 2015-04-15
CN104519658B true CN104519658B (zh) 2017-09-29

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114615799A (zh) * 2020-12-07 2022-06-10 华为技术有限公司 电路板、电路板制作方法及电子设备

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101009972A (zh) * 2006-01-26 2007-08-01 株式会社日立制作所 电路基板以及搭载了该基板的传输装置
CN101296583A (zh) * 2008-04-24 2008-10-29 苏州市惠利华电子有限公司 印刷线路板的加工方法
CN101340781A (zh) * 2001-01-16 2009-01-07 佛姆法克特股份有限公司 高频印刷线路板通孔(via)
CN101610643A (zh) * 2009-07-14 2009-12-23 华中科技大学 一种激光加工盲孔的方法
CN101785103A (zh) * 2007-07-05 2010-07-21 Aac微技术有限公司 低阻抗晶圆穿孔
CN102686017A (zh) * 2011-03-15 2012-09-19 富士通株式会社 印刷配线板及其制造方法、印刷电路板单元和电子装置
CN102802351A (zh) * 2012-08-13 2012-11-28 深圳英飞拓科技股份有限公司 一种用于pcb设计的过孔削减焊盘及其方法
CN102946695A (zh) * 2012-10-31 2013-02-27 华为技术有限公司 一种通孔结构、印刷电路基板及通孔结构的制作方法
CN103002674A (zh) * 2012-09-03 2013-03-27 杭州华三通信技术有限公司 一种pcb板背钻的方法及pcb板通孔结构

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001048819A2 (fr) * 1999-12-28 2001-07-05 Intel Corporation Structure d'interconnexion et procede de fabrication associe
US7781889B2 (en) * 2006-06-29 2010-08-24 Intel Corporation Shielded via

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101340781A (zh) * 2001-01-16 2009-01-07 佛姆法克特股份有限公司 高频印刷线路板通孔(via)
CN101009972A (zh) * 2006-01-26 2007-08-01 株式会社日立制作所 电路基板以及搭载了该基板的传输装置
CN101785103A (zh) * 2007-07-05 2010-07-21 Aac微技术有限公司 低阻抗晶圆穿孔
CN101296583A (zh) * 2008-04-24 2008-10-29 苏州市惠利华电子有限公司 印刷线路板的加工方法
CN101610643A (zh) * 2009-07-14 2009-12-23 华中科技大学 一种激光加工盲孔的方法
CN102686017A (zh) * 2011-03-15 2012-09-19 富士通株式会社 印刷配线板及其制造方法、印刷电路板单元和电子装置
CN102802351A (zh) * 2012-08-13 2012-11-28 深圳英飞拓科技股份有限公司 一种用于pcb设计的过孔削减焊盘及其方法
CN103002674A (zh) * 2012-09-03 2013-03-27 杭州华三通信技术有限公司 一种pcb板背钻的方法及pcb板通孔结构
CN102946695A (zh) * 2012-10-31 2013-02-27 华为技术有限公司 一种通孔结构、印刷电路基板及通孔结构的制作方法

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Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031

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Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd.

Address before: 100871 room 808, founder building, Zhongguancun, 298 Chengfu Road, Haidian District, Beijing

Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd.

Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd.

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