CN104751261A - Technological process changing method and method for monitoring changed technological process - Google Patents
Technological process changing method and method for monitoring changed technological process Download PDFInfo
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- CN104751261A CN104751261A CN201310745816.2A CN201310745816A CN104751261A CN 104751261 A CN104751261 A CN 104751261A CN 201310745816 A CN201310745816 A CN 201310745816A CN 104751261 A CN104751261 A CN 104751261A
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Abstract
The invention relates to a technological process changing method and a method for monitoring a changed technological process. The technological process changing method comprises the steps of pre-batching wafer groups to obtain a plurality of wafer batches; selecting the wafer batches applicable to changing application according to current change application, wherein wafers in the wafer batches include standard wafers; selecting changed wafers in the selected wafer batches applicable to the changing application except the standard wafers so as to obtain a wafer batching result; executing a technological process based on the wafer batching result. By means of the technological process changing method, change repeating rate and change cost of the technological process can be reduced.
Description
Technical field
The present invention relates to IC manufacturing field, the variation of particularly technological process and the method that the technological process of changing is monitored.
Background technology
In the manufacturing of integrated circuit, each wafer (Wafer) finally forms product from raw material to be needed through becoming hundred and even thousands of procedure, wafer all process steps of process constitute technological process.Under normal circumstances, wafer performs each procedure length by length according to pre-set technological process, that is, the content of each procedure in pre-set technological process, the content of each procedure also comprises concrete technological parameter, the time sequencing that each procedure also pre-set performs, technological process drives engine according to pre-set technological process, controls wafer and performs each procedure successively.
But complicated along with integrated circuit manufacture process, the continuous renewal of manufacture technics, change in the work can frequently occur in the production run of integrated circuit.These change the improvement to integrated circuit manufacture process, and the lifting of semiconductor technology yield and the raising of production efficiency have the meaning of decision.
Change in the work relates generally to the change of technological process, comprises technique and changes (process engineeringchange), and the change of program (procedure) or OI.Under many circumstances, wafer needs to process according to the technological parameter after changing according on a certain procedure in technological process of the requirement of slip-stick artist or a few procedure.
The variation of technological process comprises: when performing certain procedure, being divided into some batches (Lot) by one group of wafer, selecting several to manufacture according to former technological parameter artificially, and other batches manufacture according to the technological parameter after change.Prior art also comprises the method monitored the technological process of changing, and comprises the technological parameter after to change and verifies, to guarantee the raising of product yield.
But, the technological process of semiconductor and complexity thereof, the Method compare changing various parameter or processing procedure is extensive, and prior art only selects batch change wafer being carried out to technological process artificially, again by verifying and rechange the testing result of the technological process of changing, to obtain Expected Results.This alter mode is in batches difficult to take into account the coverage between operation in choosing batch involved by wafer and operation, carry out choosing batch to wafer artificially to change, change repetition rate and the Change cost of technological process can be improved to a great extent, particularly the change of mistake also can reduce the yield of product, causes the low of production efficiency.
Summary of the invention
The technical matters that technical solution of the present invention solves is: the change repetition rate and the Change cost that how to reduce technological process.
In order to solve the problems of the technologies described above, technical solution of the present invention provides a kind of variation of technological process, based on modification application at least one times, comprising:
Wafer set is carried out in advance in batches, to obtain some wafers batch;
Select the wafer batch of applicable described modification application according to current modification application, the wafer of described wafer batch comprises benchmark wafer;
The change wafer except described benchmark wafer is selected, to obtain wafer set result in batches from the wafer batch of selected applicable described modification application;
Based on described wafer set in batches result perform described technological process.
Optionally, the wafer batch and second that described wafer batch comprises the first change grade changes the wafer batch of grade; Described first wafer batch changing grade only can be suitable for a modification application simultaneously, and the described second wafer batch changing grade can be suitable for repeatedly modification application simultaneously.
Optionally, the described wafer batch according to the applicable described modification application of current modification application selection comprises:
Search ongoing modification application list;
Detect this wafer batch whether applicable described ongoing modification application list:
When the wafer batch that this wafer described batch is the first change grade, check whether this wafer batch has been applied in other modification application lists: continue detect or wait for that this wafer batch is applied complete in other modification application lists if then change next wafer batch, then select the wafer batch that this wafer batch is described applicable described modification application if not;
When the wafer batch that this wafer described batch is the second change grade, select the wafer batch that this wafer batch is described applicable described modification application.
In order to solve the problems of the technologies described above, technical solution of the present invention additionally provides a kind of variation of technological process, based on modification application at least one times, comprising:
Wafer set is carried out in advance in batches, to obtain some wafers batch;
Select the wafer batch of applicable described modification application according to current modification application, the wafer of described wafer batch comprises the wafer of benchmark wafer and applicable described modification application;
Select to change wafer, to obtain wafer set result in batches from the wafer of the applicable described modification application of the wafer batch of selected applicable described modification application;
Based on described wafer set in batches result perform described technological process.
Optionally, the wafer batch and second that described wafer batch comprises the first change grade changes the wafer batch of grade; Described first wafer batch changing grade only can be suitable for a modification application simultaneously, and the described second wafer batch changing grade can be suitable for repeatedly modification application simultaneously;
Described second to change in the wafer batch of grade wafer except described benchmark wafer except comprises the wafer of the first change grade and the wafer of the second change grade, described first wafer changing grade only can be suitable for a modification application simultaneously, and the described second wafer changing grade can be suitable for repeatedly modification application simultaneously.
Optionally, the described wafer batch according to the applicable described modification application of current modification application selection comprises:
Search ongoing modification application list;
Detect this wafer batch whether applicable described ongoing modification application list:
When the wafer batch that this wafer described batch is the first change grade, check whether this wafer batch has been applied in other modification application lists: continue detect or wait for that this wafer batch is applied complete in other modification application lists if then change next wafer batch, then select the wafer batch that this wafer batch is described applicable described modification application if not;
When the wafer batch that this wafer described batch is the second change grade, select the wafer batch that this wafer batch is described applicable described modification application.
Optionally, when the wafer batch of described applicable described modification application is the wafer batch of the first change grade, the wafer of described applicable described modification application is the wafer in this wafer batch except described benchmark wafer;
Wafer batch when the wafer batch of described applicable described modification application is the second change grade:
If except described benchmark wafer, wafer is the wafer of the first change grade in this wafer batch, then the wafer of described applicable described modification application is except described benchmark wafer, is not applied to the wafer of other modification applications;
If except described benchmark wafer, wafer is the wafer of the second change grade in this wafer batch, then the wafer of described applicable described modification application is the wafer except described benchmark wafer.
In order to solve the problems of the technologies described above, technical solution of the present invention additionally provides a kind of variation of technological process, based on modification application at least one times, comprising:
Wafer set is carried out in advance in batches, to obtain some wafers batch;
The wafer batch and the 3rd that the wafer batch, second that the type of described wafer batch comprises the first change grade changes grade changes the wafer batch of grade, type based on described wafer batch is selected to change wafer, to obtain wafer set result in batches from the wafer batch of applicable described modification application;
Based on described wafer set in batches result perform described technological process.
In order to solve the problems of the technologies described above, technical solution of the present invention additionally provides the method monitored the technological process of changing, and comprising:
Variation based on technological process as above performs technological process;
Obtain the result and with the benchmark wafer in described wafer batch with change wafer relevant information in batches of wafer set in described technological process implementation;
The Parameters variation of described benchmark wafer and the Parameters variation changing wafer are compared, to monitor the technological process of described change.
The beneficial effect of technical solution of the present invention at least comprises:
Technical solution of the present invention, by selecting the wafer batch being applicable to current modification application, being carried out the selection of changing wafer, and being obtained the result in batches of wafer set with this, performing technological process, thus complete the change of technological process based on described result in batches.Be different from prior art, the wafer batch not artificial selection of technical solution of the present invention, but carry out selecting based on current modification application, it can avoid conflicting with the change of other modification applications, reduce the influence power to technological process, secondly, the result in batches of technical solution of the present invention also comprises the information changing wafer, improves the validity that information is transmitted; Based on above-mentioned, technical solution of the present invention both ensure that the change process of technological process can not be subject to the impact of other changes, in turn ensure that technique changes the utilization of process maximal efficiency, can reduce and change repetition rate and Change cost, provide the production efficiency of product.
In possibility, technical solution of the present invention additionally provides the mode classification of a kind of wafer batch, distinguishes and select the wafer batch of applicable described modification application for system.Based on the mode classification of above-mentioned wafer batch, can the wafer batch of the applicable described modification application of high-speed decision, and wafer can be given batch to make full use of rate, guarantee effective operation of technological process.
In another kind of technical scheme of the present invention, the wafer batch of technical solution of the present invention is selected according to current modification application respectively with change wafer, not only prevent the execution conflict of wafer batch, also from change wafer, distinguish the changed content of technological process more meticulously, the further technogenic influence reducing change wafer and bring, improves the formation efficiency produced, reduces manufacturing cost.
In possibility, technical solution of the present invention additionally provides a kind of mode classification based on wafer batch and wafer, distinguishes and selects the wafer of applicable described modification application batch and distinguish and select the change wafer of applicable described modification application for system.Based on the mode classification of above-mentioned wafer batch and wafer, can the wafer batch of the applicable described modification application of high-speed decision and the change wafer of applicable described modification application, and implement the utilization of every wafer meticulously, vacant batch and wafer is utilized to carry out the change of technological process substantially, and reduce with minimizing and change wafer impact is performed on other technological processes, guarantee effective operation of technological process.
In addition, when carrying out technological process based on the result in batches obtained, the carrying of wafer batch has also been re-started according to described result in batches, the wafer batch upgrading technological parameter obtains to be redistributed, thus ensure technological process can be strict carry out performing in batches according to described result in batches, complete the change of related process flow process, guarantee that the change of technological process can effectively perform.
Wafer set result and with the benchmark wafer in described wafer batch with change wafer relevant information in batches in the implementation that technical solution of the present invention is also changed by technological process, carry out the analysis on altered project of technological process timely and accurately, and analysis result is fed back to altering system, realize the monitoring to the technological process of changing, be conducive to acquisition of information and the improvement of changing technological process.Described analysis result is based on benchmark wafer and change wafer relevant information, can obtain the parameter change of change wafer to the entire effect power of technological process.In addition, WAT test data in combined process flow performing process and CP test data can also carry out Comprehensive Evaluation to the technological process implementation status changed, obtain the change conclusion of technological process, be conducive to the change number of times, the saving Change cost that reduce technological process, thus improve the production efficiency of product.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of the variation of a kind of technological process that technical solution of the present invention provides;
Fig. 2 is the wafer batch a kind of method flow schematic diagram selecting applicable described modification application;
Fig. 3 is a kind of schematic diagram of the choice menus changing wafer;
Fig. 4 is the another kind of schematic diagram of the choice menus changing wafer;
Fig. 5 be based on described wafer set in batches result perform a kind of method flow schematic diagram of described technological process;
Fig. 6 is a kind of schematic diagram to manufacturing board and distribute the distribution menu of wafer batch;
Fig. 7 is the another kind of schematic diagram to manufacturing board and distribute the distribution menu of wafer batch;
Fig. 8 based on described wafer set in batches result perform the another kind of method flow schematic diagram of described technological process;
Fig. 9 is the schematic flow sheet of the variation of the another kind of technological process that technical solution of the present invention provides;
Figure 10 is a kind of method flow schematic diagram selecting to change wafer;
Figure 11 is the schematic flow sheet of the variation of another technological process that technical solution of the present invention provides;
Figure 12 is a kind of schematic flow sheet to the method that the technological process of changing is monitored that technical solution of the present invention provides;
Figure 13 is a kind of schematic diagram based on the tables of data of distributing data sample;
Figure 14 is the structural representation of the altering system of a kind of technological process that technical solution of the present invention provides;
Figure 15 is the structural representation of a kind of system that technical solution of the present invention provides.
Embodiment
In order to enable object of the present invention, characteristic sum effect becomes apparent more, elaborates to the specific embodiment of the present invention below in conjunction with accompanying drawing.
Set forth a lot of detail in the following description so that fully understand the present invention, but the present invention can also adopt other to be different from mode described here to implement, therefore the present invention is not by the restriction of following public specific embodiment.
Embodiment 1
A variation for technological process, based on modification application at least one times, as shown in Figure 1, comprising:
Step S100, carries out in advance in batches wafer set.
Carrying out pre-result in batches to wafer is obtain some wafers batch.Wafer batch is merged into by one or more wafer, in order to the processing procedure by a succession of manufacture board, is finally made as integrated circuit.Each manufactures board can be assigned to the wafer batch of specifying usually, performs one single wafer manufacturing operation.Such as, specific a manufacture on board can perform film (layering) operation, patterning (patterning) operation, doping (doping) operation or thermal treatment (thermal treatment) operation on wafer.Each manufactures board and performs wafer manufacturing operation according to defined job procedure.The technological process of the present embodiment indication, can comprise the execution of above-mentioned manufacturing operation.
Described modification application graphically can be used interface to receive by the management system of a technological process or one, and realize with the form of modification application list, modification application Dan Zhongke comprises the information such as the specification of the technological process of change, the classification grade of the technological process of change, manufacturing process and board operation.Modification application can the form of modification application list, the wafer batch that the technological process that acquisition request changes affects, and the wafer in selecting wafer batch.So the variation of the technological process of the present embodiment also comprises:
Step S101, selects the wafer batch of applicable described modification application according to current modification application.
What be different from prior art selects to be suitable for the wafer batch of modification application artificially, and the present embodiment searches for the wafer batch of applicable current modification application based on the modification information in modification application or modification application list: include the classification situation to described wafer batch in modification information:
The wafer batch and second that described wafer batch comprises the first change grade changes the wafer batch of grade:
Described first wafer batch changing grade only can be suitable for a modification application simultaneously, it is larger that first wafer batch changing grade mainly considers that it changes influence power, may be comparatively serious on the impact of other technological processes, alter operation is carried out to itself and wafer thereof, needs whether are applicable to other modification applications according to it or modification application list is determined, such as, for the wafer batch changing grade for first of other modification application lists, then current change request is no longer selected, but continues other wafers batch of search.
Described second wafer batch changing grade can be suitable for repeatedly modification application simultaneously, it is smaller relative to the first change grade that second wafer batch changing grade mainly considers that it changes influence power, not serious on the impact of other technological processes, when carrying out alter operation to it, the wafer batch can ignoring the second change grade in the service condition of other modification applications or modification application list, and is directly applied for this modification application or modification application list.Such as, for the wafer batch changing grade for second of other modification application lists, then current this wafer batch of change request selecting.
Based on above-mentioned known, for current modification application or modification application list, can according in modification information to the classification situation of described wafer batch, obtain the wafer batch of applicable described modification application.
Based on above-mentioned analysis, with reference to figure 2, the described wafer batch according to the applicable described modification application of current modification application selection comprises:
Step S110, searches ongoing modification application list.
Step S120, detects this wafer batch whether applicable described ongoing modification application list; Wherein, when this wafer described batch is the wafer batch of the first change grade, then perform step S121; When the wafer batch that this wafer described batch is the second change grade, then perform step S122.
Step S121, check whether this wafer batch has been applied in other modification application lists: continue detect or wait for that this wafer batch is applied complete in other modification application lists if then change next wafer batch, then select the wafer batch that this wafer batch is described applicable described modification application if not.
Step S122, when this wafer described batch is the wafer batch of the second change grade, selects the wafer batch that this wafer batch is described applicable described modification application.
Continue with reference to figure 1, the variation of the technological process of the present embodiment also comprises:
Step S102, described wafer batch comprises benchmark wafer and other wafers except described benchmark wafer, selects the change wafer except described benchmark wafer from the wafer batch of selected applicable described modification application.
Benchmark wafer is the non-modifiable wafer in wafer batch, and it is selected as changing wafer in no instance.Benchmark wafer is that one when changing described change wafer is with reference to wafer.The benchmark wafer of described wafer batch can be selected from described wafer batch based on random algorithm.
Described change wafer can be all wafers except described benchmark wafer, also can have the restriction of sheet number.The change wafer of the present embodiment is based on having the restriction of sheet number, and it selects sheet base in input chip number.
For the selection of changing wafer, based on described input chip number by system Stochastic choice in the wafer except described benchmark wafer, also hand picking can be carried out at the wafer except described benchmark wafer.
Fig. 3 is the wafer batch (lot ID:E35024) to selected applicable described modification application, based on input chip number (split wafer Qty:5), Stochastic choice (split wafer method:Automatic) is numbered the schematic diagram of choice menus p1 of change wafer of " #06 ", " #13 ", " #21 ", " #23 ", " #24 ";
Fig. 4 is the wafer batch (lot ID:E35024) to selected applicable described modification application, based on input chip number (split wafer Qty:5), the choice menus p2 schematic diagram of the change wafer in hand picking (split wafer method:Manual) wafer batch, wherein, being numbered of alternative wafer " #01 ", " #02 " ..., " #24 ", " #25 ".
Continue with reference to figure 1, the variation of the technological process of the present embodiment also comprises:
Step S103, according to the wafer batch of selected applicable described modification application and change wafer and obtain wafer set result in batches.
The result in batches of wafer set comprises the information of selected wafer batch and to change the information of wafer:
In the present embodiment, the information spinner of described wafer batch will corresponding to described modification information.Described modification information comprises the modification information of each wafer batch, and the modification information of wafer batch relates to: lot identification codes (lotidentity), change request identification code (ECR identity) and other change relevant descriptor to technological process.Each request of changing can by described lot identification codes, change the modification information that request identification code or multiple identification code associate one or more wafer batch, to form the described modification information changing request.
The information spinner of described change wafer will refer to the information changing corresponding change wafer technique parameter because of the request of changing, and in other words, based on change request, is will change the technological process parameter of described change wafer.Described technological process parameter mainly refers to the content of the every procedure often criticized performed by wafer and the technological parameter of every procedure, and the execution of described technological process parameter and wafer batch is relevant.
Continue with reference to figure 1, the variation of the technological process of the present embodiment also comprises:
Step S104, based on described wafer set in batches result perform described technological process.
Perform described technological process to carry out according to the change wafer data of the wafer batch information changed in wafer set in batches result and change.The wafer batch information spinner of described change will refer to the information of the request of changing by identification code one class in wafer batch information and the wafer batch association of the applicable described modification application chosen, and the change wafer data of described change mainly refers to change the corresponding information changing wafer technique parameter.
In addition, because the execution of technological process is carried out on a succession of manufacture board, wafer batch can be assigned to corresponding manufacture board, after the above-mentioned wafer set of acquisition in batches result, the wafer batch (wafer batch of change comprises to the change of wafer batch information with to the change of changing wafer data) to changing also is needed to carry out board distribution.This distribution realization can be passed through executive system (Splict Runcard, Split RC) in batches and perform, to complete the execution of technological process smoothly.
Concrete, with reference to figure 5, described based on described wafer set in batches result perform described technological process and comprise the steps:
Step S140, upgrades and preserves the wafer batch information and change wafer data that change.
Step S141, by described wafer set in batches result transfer to described in executive system in batches.
Step S142, to breathe out fill order in batches based on described modification application, described fill order is in batches provided to the odd numbers of described modification application list, and the wafer batch described in automatic acquisition selected by modification application.
Step S143, the wafer got batch corresponds to and manufactures board and carry out carrying wafers by fill order in batches.
Step S144, according to each wafer technological process parameter configuration described in each wafer of wafer batch.
Step S145, arranging described wafer batch each wafer is duty.
The carrying of this race goods process implementation of the described executive system in batches wafer selected by modification application batch, can strictly based on wafer set in batches result perform wafer in batches.
Utilize above-mentioned executive system in batches can also utilize fill order in batches, simplify and manufacture board and obtain the wafer batch of its correspondence and the acquisition process of wafer: as shown in Figure 6, composition graphs 7, from distribution menu p3 and distribution portion p30 thereof, executive system is in batches suitable for if get rid of, then need the distribution (in Fig. 6, described in Runcard represents in batches fill order) that just can be got fill order and wafer in batches batch by special test application (STR) and batch particular applications (MSTR) Coordination Decision; Fill order is numbered 0409112400012 in batches, corresponding wafer batch is E36636), but can in the distribution menu p4 under executive system in batches, by system directly obtain in batches fill order (see selection part p40, fill order catalogue catalogue in batches, 0409112400012) and with this wafer batch that fill order is corresponding in batches.
In other embodiments, also can not relate to executive system in batches, as shown in Figure 8, described above based on described wafer set in batches result perform described technological process and can also direct following steps realize:
Step S140 ', upgrades and changes the technological process parameter of wafer in preserving described wafer batch;
Step S141 ', the wafer batch selected by described modification application is carried to corresponding board;
Step S142 ', according to each wafer technological process parameter configuration described in each wafer of wafer batch;
Step S143 ', arranging described wafer batch each wafer is duty.
Now, the handling process of step S141 ' is the selection course of fill order in batches based on Fig. 6, namely need by special test application (STR) and in batches particular applications (MSTR) Coordination Decision just can get the distribution of fill order and wafer in batches batch.
Embodiment 2
A variation for technological process, based on modification application at least one times, as shown in Figure 9, comprising:
Step S200, carries out in advance in batches wafer set, to obtain some wafers batch.
The embodiment of this step can reference example 1.
Step S201, selects the wafer batch of applicable described modification application according to current modification application.
The selection mode of the wafer of described applicable described modification application batch can reference example 1, and the present embodiment is also classified to described wafer batch, and the wafer batch and second that namely described wafer batch comprises the first change grade changes the wafer batch of grade.
Step S202, the wafer of described wafer batch comprises the wafer of benchmark wafer and applicable described modification application, selects to change wafer from the wafer of the applicable described modification application of the wafer batch of selected applicable described modification application.
Be different from embodiment 1, the change wafer of the present embodiment is the wafer of applicable described modification application, namely all wafers not except described benchmark wafer all belongs to the wafer of described applicable described modification application, wafer in the wafer of the present embodiment batch comprises two classes, namely first changes the wafer batch of grade and the wafer batch of the second change grade.In other words, the present embodiment is under the prerequisite of classifying to wafer batch, also to change in the wafer batch of grade wafer except described benchmark wafer to second and carry out again the classification of wafer-level, second to change in the wafer batch of grade wafer except described benchmark wafer except comprises the wafer of the first change grade and the wafer of the second change grade, described first wafer changing grade only can be suitable for a modification application simultaneously, and the described second wafer changing grade can be suitable for repeatedly modification application simultaneously.
Above-mentioned wafer sort mode is different from the mode classification of wafer batch, and it is the assessment again to changing wafer influence power, to constructing system for the control power changing workflow; Particularly, for the change wafer of lozenge number restriction, this wafer sort mode can assess the impact of selected change wafer for system better, and the wafer selecting impact less is as change wafer.
Based on above-mentioned, with reference to Figure 10, select to change wafer the wafer of the applicable described modification application of the described wafer from selected applicable described modification application batch and comprise step:
Step S220, the classification of the wafer of the applicable described modification application selected by judgement batch: when the wafer batch of described applicable described modification application is the wafer batch of the first change grade, then perform step S221; When the wafer batch that the wafer batch of described applicable described modification application is the second change grade, then perform step S222;
Step S221, the wafer of described applicable described modification application is the wafer in this wafer batch except described benchmark wafer, according to the change wafer that the sheet number of input is selected wherein;
Step S222, judge the wafer classification of wafer except described benchmark wafer in this wafer described batch: if described wafer classification is the wafer of the first change grade, then perform step S223, if described wafer classification is the wafer of the second change grade, then perform step S224;
Step S223, the wafer of described applicable described modification application is except described benchmark wafer, is not applied to the wafer of other modification applications, according to the change wafer that the sheet number of input is selected wherein;
Step S224, the wafer of described applicable described modification application is the wafer except described benchmark wafer, according to the sheet number selection change wafer wherein of input.
Continue with reference to figure 9, the variation of the technological process of the present embodiment, also comprises:
Step S203, according to the wafer batch of selected applicable described modification application and change wafer and obtain wafer set result in batches.
Step S204, based on described wafer set in batches result perform described technological process.
The further content of step S203 to S204 can reference example 1.
Embodiment 3
A variation for technological process, based on modification application at least one times, as shown in figure 11, comprising:
Step S300, carries out in advance in batches wafer set, to obtain some wafers batch.
Step S301, the wafer batch and the 3rd that the wafer batch, second that the type of described wafer batch comprises the first change grade changes grade changes the wafer batch of grade, and the type based on described wafer batch is selected to change wafer from the wafer batch of applicable described modification application.
The present embodiment is based on the wafer batch of the applicable current modification application of modification information search in modification application or modification application list, wherein, the classification situation to described wafer batch is included in modification information, this gives the another kind of mode classification of described wafer batch, this mode classification combines embodiment 1 and embodiment 2 is distributed with the type of wafer for wafer batch:
The wafer batch and the 3rd that the wafer batch, second that described wafer batch comprises the first change grade changes grade changes the wafer batch of grade.
Described first wafer batch changing grade time to be equal to embodiment 1 changes the wafer batch of grade definition for first.
When current wafer batch is the described first wafer batch changing grade, the wafer of described applicable described modification application batch and change wafer selection course and comprise: search all ongoing modification application lists, check whether current wafer batch has been used in other modification application lists.If used, reminding user goes to change wafer batch or waits for that other modification application lists of this wafer batch carry out selections change wafer after completing again.
Described second wafer batch changing grade can be suitable for repeatedly modification application simultaneously, and its change influence power is smaller relative to the first change grade, not serious on the impact of other technological processes, when carrying out alter operation to it, the wafer batch can ignoring the second change grade in the service condition of other modification applications or modification application list, and is applied to this modification application or modification application list.But the second characteristic changing the wafer batch of grade is that its wafer only can be applicable to a modification application or a modification application list.
When current wafer batch is the described second wafer batch changing grade, the wafer of applicable described modification application batch and the selection course changing wafer comprise: search all ongoing modification application lists, check the service condition of wafer in modification application list of current wafer batch, namely which wafer is used by other modification application lists, which wafer is not used by other modification application lists, and which wafer is benchmark wafer; Again according to the wafer number that user inputs, from the wafer that other modification application lists of present lot use, select appropriate wafer as change wafer.
Described 3rd changes the wafer batch of grade can be suitable for repeatedly modification application simultaneously, and its wafer also can be applicable to repeatedly modification application, and the wafer of the 3rd change grade batch and wafer thereof are minimum for the influence power of other technological processes.
When current wafer batch is the described 3rd wafer batch changing grade, the wafer of applicable described modification application batch and the selection course changing wafer comprise: the benchmark wafer checking current wafer batch definition, again according to the number of the change wafer of user's needs, in all available wafer from this wafer except benchmark wafer, select appropriate change wafer.
Here, the classification of wafer batch is not only conducive to wafer batch whether selection applicatory, also marks the influence power characteristic of wafer.The present embodiment be in fact by embodiment 2 for the defined label of wafer sort to the classification of wafer batch, again embodiment 2 second is changed the classified information that wafer and second that first of the wafer batch of grade changes grade changes the wafer of grade and its wafer batch to it and combines, to improve system identification power and processing speed.
Continue with reference to Figure 11, the variation of the technological process of the present embodiment also comprises:
Step S302, obtains wafer set result in batches according to the wafer batch of described applicable described modification application and selected change wafer.
The result in batches of wafer set comprises by the information of the wafer of described applicable described modification application batch and the information changing wafer.The specific descriptions of the information of described wafer batch and the information that changes wafer can reference example 1.
Step S303, based on described wafer set in batches result perform described technological process.
The particular content of step S303 can reference example 1, and the present embodiment repeats no more.
Embodiment 4
To the method that the technological process of changing is monitored, the technological process that can perform the variation based on technological process is monitored, and as shown in figure 12, comprising:
Step S400, performs the change of technological process.
The concrete mode that changes of technological process can at least one mode in reference example 1 to 3.
Step S401, obtains wafer set result in batches in described technological process change process.
Described wafer set in batches result comprise the wafer batch of described applicable described modification application information and with benchmark wafer in described applicable described modification application with change wafer relevant information.
Described technological process changes the execution of process based on the wafer set got according to described alter mode result in batches, is also batch data.
Based on the allotment of executive system or the execution of executive system in batches, the acquisition of batch data can based on the sample distributing data as shown in fig. 13 that, i.e. tables of data d0.Tables of data d0 illustrates batch data first, that includes fill order (in Figure 13, fill order in batches described in eRunCard representative) in batches, corresponding with the fill order in batches data message being applied to change wafer batch (Lot ID), change wafer (Wafer) in this wafer batch and the benchmark wafer (BaseLine) of asking.Such as, wafer corresponding to fill order in batches batch being numbered 137715857 is E36191, and it changes wafer is " #01 ", " #02 ", " #04 ", " #05 ", " #06 "; Benchmark wafer is " #03 ", " #08 ", " #13 ", " #14 ", " #17 ", " #18 ", " #19 ", " #20 ", " #22 ", " #23 ", " #25 ".
Continue with reference to Figure 12, the present embodiment the method that the technological process of changing is monitored also is comprised:
Step S402, compares the Parameters variation of described benchmark wafer and the Parameters variation changing wafer, to monitor the technological process of described change.
Step S400 to S402 mainly monitors the core data in the change process of technological process: the most crucial data of the change of technological process are exactly by changing to wafer batch and wafer thereof the above-mentioned wafer set result in batches obtained, also be batch data, comprise and the wafer batch of which project or wafer are changed, and which wafer does not participate in this as benchmark wafer (with reference to wafer) and changes.
Except the monitoring of above-mentioned batch data, continue with reference to Figure 12, the present embodiment the method that the technological process of changing is monitored also is comprised:
Step S403, gathers the WAT test data in described technological process implementation and CP test data.
The test data of described WAT test data to be WAT be electrical conformity testing, CP test data is the test data that CP test is tested for yield.
Step S404, Parameters variation and the comparative result of the Parameters variation changing wafer based on described WAT test data, CP test data and benchmark wafer obtain the change conclusion of the technological process of described change.
Step S405, feeds back the technological process of change conclusion to described change of the technological process of described change.
Step S403 to S405 is with reference to WAT test data and CP test data, and the correlation parameter contrasting benchmark wafer and the change of changing between wafer correlation parameter, change the final conclusion performed.Can alteration be known by this conclusion, whether successfully perform with the change obtaining technological process.
Yield analysis system can be utilized to realize above-mentioned monitor procedure, and wherein, WAT test data and CP test data are all the data provided in yield analysis system.
Embodiment 5
An altering system for the technological process of corresponding embodiment 1, as shown in figure 14, comprising:
Change suggesting system for wearing (FECP), be suitable for performing step S100 to S103;
Operational system (Split RC) in batches, is suitable for performing in step S104, the board assigning process of wafer batch;
Manufacturing execution system (MES), is suitable for, based on the wafer batch and the wafer thereof that are dispensed to board, performing described technological process.
More specifically, corresponding step S140 to S145, the change suggesting system for wearing (FECP) of technological process is also suitable for performing step S140 and S141, operational system (Split RC) is suitable for performing step S142 to S144 in batches, and manufacturing execution system (MES) is suitable for performing step S145.
Similar, in other embodiments, can also provide:
An altering system for the technological process of corresponding embodiment 2, comprising:
Change suggesting system for wearing (FECP), be suitable for performing step S200 to S203;
Operational system (Split RC) in batches, is suitable for performing in step S204, the board assigning process of wafer batch;
Manufacturing execution system (MES), is suitable for, based on the wafer batch and the wafer thereof that are dispensed to board, performing described technological process.
Wherein, system integration parts play connection between system and the effect communicated.
An altering system for the technological process of corresponding embodiment 3, comprising:
Change suggesting system for wearing (FECP), be suitable for performing step S300 to S302;
Operational system (Split RC) in batches, is suitable for performing in step S303, the board assigning process of wafer batch;
Manufacturing execution system (MES), is suitable for, based on the wafer batch and the wafer thereof that are dispensed to board, performing described technological process.
Embodiment 6
A kind of system, as shown in figure 15, comprising:
Change suggesting system for wearing (FECP);
Operational system (Split RC) in batches;
Manufacturing execution system (MES); And,
Yield analysis system, is suitable for realizing monitor procedure as described in Example 4, and monitored results is fed back to the change suggesting system for wearing (FECP) of technological process.
Described monitored results can be the Parameters variation of described benchmark wafer and at least one data changed in the comparative result of Parameters variation of wafer and the change conclusion of the technological process of described change.
The concrete execution content of the change suggesting system for wearing of described technological process, in batches operational system and manufacturing execution system can the discussion of reference example 5.
Although the present invention with preferred embodiment openly as above; but it is not for limiting the present invention; any those skilled in the art without departing from the spirit and scope of the present invention; the Method and Technology content of above-mentioned announcement can be utilized to make possible variation and amendment to technical solution of the present invention; therefore; every content not departing from technical solution of the present invention; the any simple modification done above embodiment according to technical spirit of the present invention, equivalent variations and modification, all belong to the protection domain of technical solution of the present invention.
Claims (20)
1. a variation for technological process, based on modification application at least one times, is characterized in that, comprising:
Wafer set is carried out in advance in batches, to obtain some wafers batch;
Select the wafer batch of applicable described modification application according to current modification application, the wafer of described wafer batch comprises benchmark wafer;
The change wafer except described benchmark wafer is selected, to obtain wafer set result in batches from the wafer batch of selected applicable described modification application;
Based on described wafer set in batches result perform described technological process.
2. the variation of technological process as claimed in claim 1, is characterized in that, the wafer batch and second that described wafer batch comprises the first change grade changes the wafer batch of grade; Described first wafer batch changing grade only can be suitable for a modification application simultaneously, and the described second wafer batch changing grade can be suitable for repeatedly modification application simultaneously.
3. the variation of technological process as claimed in claim 2, is characterized in that, the described wafer batch according to the applicable described modification application of current modification application selection comprises:
Search ongoing modification application list;
Detect this wafer batch whether applicable described ongoing modification application list:
When the wafer batch that this wafer described batch is the first change grade, check whether this wafer batch has been applied in other modification application lists: continue detect or wait for that this wafer batch is applied complete in other modification application lists if then change next wafer batch, then select the wafer batch that this wafer batch is described applicable described modification application if not;
When the wafer batch that this wafer described batch is the second change grade, select the wafer batch that this wafer batch is described applicable described modification application.
4. the variation of technological process as claimed in claim 1, is characterized in that, the benchmark wafer of described wafer batch is selected from described wafer batch based on random algorithm.
5. the variation of technological process as claimed in claim 1, is characterized in that, selected change wafer has the restriction of sheet number, and the selection sheet base of described change wafer is in input chip number.
6. the variation of technological process as claimed in claim 5, it is characterized in that, selected change wafer is automatically selected or artificial selection based on described input chip number.
7. the variation of technological process as claimed in claim 1, is characterized in that, described based on described wafer set in batches result perform described technological process and comprise:
Upgrade and change the technological process parameter of wafer in preserving described wafer batch;
Described wafer batch is carried to respective board respectively;
According to each wafer technological process parameter configuration described in each wafer of wafer batch;
Arranging described wafer batch each wafer is duty.
8. the variation of technological process as claimed in claim 7, it is characterized in that, described described wafer batch of stating is carried to respective board respectively and comprises: based on described wafer set result in batches, provide the required wafer batch performed to the fill order in batches corresponding with described modification application.
9. a variation for technological process, based on modification application at least one times, is characterized in that, comprising:
Wafer set is carried out in advance in batches, to obtain some wafers batch;
Select the wafer batch of applicable described modification application according to current modification application, the wafer of described wafer batch comprises the wafer of benchmark wafer and applicable described modification application;
Select to change wafer, to obtain wafer set result in batches from the wafer of the applicable described modification application of the wafer batch of selected applicable described modification application;
Based on described wafer set in batches result perform described technological process.
10. the variation of technological process as claimed in claim 9, is characterized in that, the wafer batch and second that described wafer batch comprises the first change grade changes the wafer batch of grade; Described first wafer batch changing grade only can be suitable for a modification application simultaneously, and the described second wafer batch changing grade can be suitable for repeatedly modification application simultaneously;
Described second to change in the wafer batch of grade wafer except described benchmark wafer except comprises the wafer of the first change grade and the wafer of the second change grade, described first wafer changing grade only can be suitable for a modification application simultaneously, and the described second wafer changing grade can be suitable for repeatedly modification application simultaneously.
The variation of 11. technological processes as claimed in claim 10, is characterized in that, the described wafer batch according to the applicable described modification application of current modification application selection comprises:
Search ongoing modification application list;
Detect this wafer batch whether applicable described ongoing modification application list:
When the wafer batch that this wafer described batch is the first change grade, check whether this wafer batch has been applied in other modification application lists: continue detect or wait for that this wafer batch is applied complete in other modification application lists if then change next wafer batch, then select the wafer batch that this wafer batch is described applicable described modification application if not;
When the wafer batch that this wafer described batch is the second change grade, select the wafer batch that this wafer batch is described applicable described modification application.
The variation of 12. technological processes as described in claim 10 or 11, it is characterized in that, when the wafer batch that the wafer batch of described applicable described modification application is the first change grade, the wafer of described applicable described modification application is the wafer in this wafer batch except described benchmark wafer;
Wafer batch when the wafer batch of described applicable described modification application is the second change grade:
If except described benchmark wafer, wafer is the wafer of the first change grade in this wafer batch, then the wafer of described applicable described modification application is except described benchmark wafer, is not applied to the wafer of other modification applications;
If except described benchmark wafer, wafer is the wafer of the second change grade in this wafer batch, then the wafer of described applicable described modification application is the wafer except described benchmark wafer.
The variation of 13. technological processes as claimed in claim 9, is characterized in that, the benchmark wafer of described wafer batch is selected from described wafer batch based on random algorithm.
The variation of 14. technological processes as claimed in claim 9, is characterized in that, selected change wafer has the restriction of sheet number, and the selection sheet base of described change wafer is in input chip number.
The variation of 15. technological processes as claimed in claim 14, it is characterized in that, selected change wafer is automatically selected or artificial selection based on described input chip number.
The variation of 16. technological processes as claimed in claim 9, is characterized in that, described based on described wafer set in batches result perform described technological process and comprise:
Upgrade and the technological process parameter of wafer in preserving described change wafer batch;
Described wafer batch is carried to respective board respectively;
According to each wafer technological process parameter configuration described in each wafer of wafer batch;
Arranging described wafer batch each wafer is duty.
The variation of 17. technological processes as claimed in claim 16, it is characterized in that, described described wafer batch of stating is carried to respective board respectively and comprises: based on described wafer set result in batches, provide the required wafer batch performed to the fill order in batches corresponding with described modification application.
The variation of 18. 1 kinds of technological processes, based on modification application at least one times, is characterized in that, comprising:
Wafer set is carried out in advance in batches, to obtain some wafers batch;
The wafer batch and the 3rd that the wafer batch, second that the type of described wafer batch comprises the first change grade changes grade changes the wafer batch of grade, type based on described wafer batch is selected to change wafer, to obtain wafer set result in batches from the wafer batch of applicable described modification application;
Based on described wafer set in batches result perform described technological process.
19. 1 kinds of methods monitored the technological process of changing, is characterized in that, comprising:
Variation based on the technological process described in claim 1 to 18 performs technological process;
Obtain the result and with the benchmark wafer in described wafer batch with change wafer relevant information in batches of wafer set in described technological process implementation;
The Parameters variation of described benchmark wafer and the Parameters variation changing wafer are compared, to monitor the technological process of described change.
20., as claimed in claim 19 to the method that the technological process of changing is monitored, is characterized in that, also comprise:
Gather the WAT test data in described technological process implementation and CP test data;
Parameters variation and the comparative result of Parameters variation changing wafer based on described WAT test data, CP test data and benchmark wafer obtain the change conclusion of the technological process of described change;
Feed back the technological process of change conclusion to described change of the technological process of described change.
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| CN1855358A (en) * | 2005-04-18 | 2006-11-01 | 力晶半导体股份有限公司 | Reserved chip batching method and system for computer |
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