CN104900565A - Cavity jointing apparatus for semiconductor deposition device - Google Patents
Cavity jointing apparatus for semiconductor deposition device Download PDFInfo
- Publication number
- CN104900565A CN104900565A CN201510275610.7A CN201510275610A CN104900565A CN 104900565 A CN104900565 A CN 104900565A CN 201510275610 A CN201510275610 A CN 201510275610A CN 104900565 A CN104900565 A CN 104900565A
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- CN
- China
- Prior art keywords
- cavity
- jointing
- support guide
- semiconductor deposition
- docking facilities
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
Abstract
A cavity jointing apparatus for a semiconductor deposition device mainly solves the problem that split type or modularized cavities in a conventional semiconductor film deposition device are difficult for jointing, and inconvenient for precise adjusting, the stability of the device is lowered accordingly, and that the production power and product yield rate may be affected. The cavity jointing apparatus comprises a guiding structure, a slip structure, a detachable clamping shoe plate structure, a clamping structure, a fixing structure, an elevating and adjusting structure and a supporting and guiding structure, wherein the supporting and guiding structure is the main structure of the entire apparatus, the fixing structure is arranged under the supporting and guiding structure, and the fixing structure fixes the entire apparatus onto a main frame of the device to realize jointing operation. The cavity jointing apparatus completes fixing, supporting, slip transporting, elevating and clamping operation and realizes jointing operation and precise adjusting. The cavity jointing apparatus satisfies use functions and saves partial manpower resources, and prevents worker injury during an operation process.
Description
Technical field
The present invention relates to a kind of cavity docking facilities being applied to semiconductor thin film deposition equipment.Adopt a kind of docking facilities of simple type, by simply fixing, support, slippage carrying, jacking, clamping structure, realize split type or modularization reaction cavity, the online docking passing sheet cavity etc.Belong to semiconductive thin film deposition applications and manufacturing technology field.
Background technology
Semiconductor thin film deposition equipment, for enhancing production capacities, often needs the multiple reaction cavity of carry or biography sheet cavity on a large transport module.In the cavity body structure of or modularized design split type at some, be no matter assembling process or plant maintenance time, all may need dismounting and the installation carrying out reaction cavity or pass sheet cavity.On the position not having the scene of hoisting equipment or hoisting equipment to arrive, just there is very large difficulty in docking and the installation of cavity.Even if cavity can be realized to be placed on its desired position by a dead lift, but be very difficult for the precision adjustment of cavity docking.The precision of cavity docking directly determines the precision and reliability that pass sheet, and the stability of equipment in film deposition process.These can affect again the serviceability of equipment to a great extent, and then affect yield and the production capacity of product.
In existing semiconductor thin film deposition equipment, there is the cavity body structure of many split type or modularized designs, and often need to be isolated in assembling or maintenance process, dismantle or the operation such as abutting joint, on the production line not having hoisting equipment, or hoisting equipment be beyond one's reach position need docking time, just can only rely on a dead lift, lift, dock, such merging precision cannot ensure, the precision and reliability that pass sheet can be affected, and the stability of equipment in film deposition process.These can affect again the serviceability of equipment to a great extent, and then affect yield and the production capacity of product.And at a dead lift, lift, docking operation time, more human resources can be used to operate, and this too increases the maintenance cost of equipment undoubtedly.Can produce certain work damage when manually lifting operation for a long time and there is certain potential safety hazard, consider from human oriented design, these all need to avoid.
Summary of the invention
The present invention is for the purpose of solving the problem, mainly solve the split type or modularization cavity docking difficulty existed in existing semiconductor thin film deposition equipment large, precision adjustment is inconvenient, causes stabilization of equipment performance to reduce, and then affects the problem of equipment capacity and product yield.
For achieving the above object, the present invention adopts following technical proposals: a kind of semiconductor deposition equipment cavity docking facilities, comprises guide frame, Sliding Structures, detachable clamping brace plate structure, clamping structure, fixed structure, lifting adjusting structure and support guide structure.This device is the agent structure using support guide structure as whole device, has fixed structure at the envisaged underneath of support guide structure, and fixed structure is for being fixed on whole docking facilities on equipment body framework with the operation that achieves a butt joint.
Above-mentioned support guide structure arranges one to two guide frame, and as the guiding of carrying out at cavity when slippage is carried and supporting role, described guide frame has matrix or convex shape.
Mounting slip structure on above-mentioned guide frame, matrix or the convex shape of Sliding Structures and guide frame match, and are slidably matched.
Above-mentioned support guide structure is designed with lifting adjusting structure, and lifting adjusting structure can realize jacking to cavity, the operation such as decline and adjustment.
Above-mentioned support guide structure is also designed with detachable clamping brace plate structure, mounting clamp locking structure in clamping brace plate structure, clamping structure is used for realizing being fixedly clamped to cavity in cavity docking operation, in order to avoid its position is departed from.Above-mentioned detachable clamping brace plate structure can be designed as demountable structure, to dodge cavity sliding path in cavity slipping, as cavity sliding path does not overlap with required applying clamping force direction, then itself and support guide structure can be manufactured non-dismountable structure.
The present invention, when carrying out the operation of cavity abutting joint, by being placed on equipment body framework by docking facilities, and is fixed on main body frame as the fulcrum in whole docking facilities and docking operation by fixed structure.After fixedly completing by need the cavity of abutting joint to be held in place on guide frame Sliding Structures on.After cavity is slid onto required installation site, lifting adjusting structure is used to carry out jacking operation, so that the whole height of adjustment docking cavity and levelness.The detachable clamping brace plate structure of installation after lift adjustment completes, and adjusted position clamping structure thereon, make cavity Complete Bind.And then the fixed structure of locking cavity itself.When having operated, whole docking facilities is removed.
When carrying out disassembling section, docking facilities need be fixed on Whole Equipment framework equally, then make Sliding Structures be positioned at the lower end of cavity to be removed.By lifting adjusting structure jacking extremely cavity lower surface to be removed after completing.Remove fixing for cavity self after completing, make cavity rely on lifting adjusting structure as support, then make lifting adjusting structure drive cavity slowly to move down, cavity is dropped in the Sliding Structures of below.After cavity drops on Sliding Structures surface completely, promote Sliding Structures and cavity components is pushed to equipment periphery, carry out other operations according to the actual requirements.
Beneficial effect of the present invention and feature:
The present invention is simple and easy with one, easily version complete fixing, support, slippage carrying, jacking, clamp operation, achieve a butt joint operation and precision adjustment.By a kind of cavity docking facilities being applied to semiconductor thin film deposition equipment, a part of human resources can be saved and avoid the harm such as the work damage that produces in human users's process while meeting using function.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Fig. 2 is end view of the present invention.
Fig. 3 is vertical view of the present invention.
Shown in figure: 1, guide frame; 2, Sliding Structures; 3, detachable clamping brace plate structure; 4, clamping structure; 5, fixed structure; 6, lifting adjusting structure; 7, support guide structure.
Below in conjunction with drawings and Examples to further instruction of the present invention.
Embodiment
Embodiment 1
As Figure 1-3, a kind of semiconductor deposition equipment cavity docking facilities, comprises guide frame 1, Sliding Structures 2, detachable clamping brace plate structure 3, clamping structure 4, fixed structure 5, lifting adjusting structure 6 and support guide structure 7.This device is the agent structure using support guide structure 7 as whole device, realizes by modes such as bolt connections after welding or machining.Have fixed structure 5 at the envisaged underneath of support guide structure 7, fixed structure 5 is for being fixed on whole docking facilities on equipment body framework with the operation that achieves a butt joint.Above-mentioned fixed structure 5 is directly connected with main body frame by bolt, and screw thread clamping, hydraulic clamp, air pressure clamping or other clamping mode also can be used to realize.
Above-mentioned support guide structure 7 arranges one to two guide frame 1, as the guiding of carrying out at cavity when slippage is carried and supporting role.Above-mentioned guide frame 1 can be made into matrix or convex shape by section bar, panel beating or machining mode, also can use the guide rail form that line slideway, steel guideway, plastic-sticking guiding rail etc. are general.
Mounting slip structure 2 on above-mentioned guide frame 1, matrix or the convex shape of Sliding Structures 2 and guide frame 1 match, and are slidably matched.Sliding Structures 2 adopts general-purpose type or non-universal formula structure, adopts non-universal formula structure then to install the components such as steel ball, steel ball, needle roller or roller in the lower end of Sliding Structures 2.
So that upper end is the sliding friction that chamber pressure produces when carrying out sliding motion, lower end is rolling friction, because rolling friction makes cavity in whole slipping that play or creeping phenomenon can not occur much smaller than sliding friction.Each slide block can do integrally or separate form by above-mentioned Sliding Structures 2 according to actual needs, to adapt to dissimilar cavity demand.Above-mentioned Sliding Structures 2 is carried out sliding motion by manual mode and is also carried out automatic sliding operation by power units such as cylinder promotion, the promotion of electric cylinder, hydraulic drive, lead screw transmission.
Above-mentioned support guide structure 7 is designed with lifting adjusting structure 6, the operation such as jacking, decline, adjustment that lifting adjusting structure 6 can realize cavity by screw thread jacking, pneumatic jacking, electronic jacking, hydraulic lifting or other mechanical lift-up mode.Above-mentioned support guide structure 7 is also designed with detachable clamping brace plate structure 3, detachable clamping brace plate structure 3 can be designed as demountable structure, to dodge cavity sliding path in cavity slipping, as cavity sliding path does not overlap with required applying clamping force direction, then itself and support guide structure 7 can be manufactured non-dismountable structure.Above-mentioned detachable clamping brace plate structure 3 by be threaded or the mode such as mechanical grip connection realizes, but to need for convenience detach and installs.Above-mentioned clamping brace plate structure 3 can be processed into template or other adapts to the shape of cavity body structure, so that operation, to install.Mounting clamp locking structure 4 in above-mentioned clamping brace plate structure 3, clamping structure 4 is fixedly clamped to cavity, in order to avoid its position is departed from for realizing in cavity docking operation.The operations such as above-mentioned clamping structure 4 can be clamped by screw thread, pneumatic pinch, electronic clamping, hydraulic clamp or other mechanical grip mode realize clamping to cavity, fixing.
Above-mentioned fixed structure 5, Sliding Structures 2, lifting adjusting structure 6 and clamping structure 4 need adopt the material lower than cavity or the hardness of framework own with cavity or equipment body contact therewith position, in order to avoid damage cavity or framework in operation, but it still needs certain intensity and hardness to make to be unlikely to be damaged when being fixed in cavity docking operation or supporting.
When carrying out the operation of cavity abutting joint, support guide structure 7 being placed on equipment body framework, and being fixed on main body frame as the fulcrum in whole docking facilities and docking operation by fixed structure 5.After fixedly completing by need the cavity of abutting joint to be held in place on guide frame 1 Sliding Structures 2 on.Promote Sliding Structures 2 and cavity, after cavity is slid onto required installation site, use lifting adjusting structure 6 to carry out jacking operation, so that the whole height of adjustment docking cavity and levelness.The detachable clamping brace plate structure 3 of installation after lift adjustment completes, and adjusted position clamping structure 4 thereon, make cavity Complete Bind.And then the fixed structure of locking cavity itself.When having operated, whole docking facilities is removed.
When carrying out disassembling section, need support guide structure 7 be fixed on Whole Equipment framework equally, then make Sliding Structures 2 be positioned at the lower end of cavity to be removed.By lifting adjusting structure 6 jacking extremely cavity lower surface to be removed after completing.Remove fixing for cavity self after completing, make cavity rely on lifting adjusting structure 6 as support, then make lifting adjusting structure 6 drive cavity slowly to move down, cavity is dropped in the Sliding Structures 2 of below.After cavity drops on Sliding Structures 2 surface completely, promote Sliding Structures 2 and cavity components is pushed to equipment periphery, carry out other operations according to the actual requirements.
Claims (6)
1. a semiconductor deposition equipment cavity docking facilities, it is characterized in that: it comprises guide frame, Sliding Structures, detachable clamping brace plate structure, clamping structure, fixed structure, lifting adjusting structure and support guide structure, this device is the agent structure using support guide structure as whole device, has fixed structure at the envisaged underneath of support guide structure; Support guide structure arranges guide frame, mounting slip structure on guide frame, matrix or the convex shape of Sliding Structures and guide frame match, and be slidably matched, described support guide structure is also designed with lifting adjusting structure and detachable clamping brace plate structure, mounting clamp locking structure on supporting plate structure.
2. semiconductor deposition equipment cavity docking facilities as claimed in claim 1, is characterized in that: detachable clamping brace plate structure is designed to demountable structure or non-dismountable structure.
3. semiconductor deposition equipment cavity docking facilities as claimed in claim 1, it is characterized in that: described support guide structure arranges one to two guide frame, guide frame adopts section bar, panel beating or machining mode to be made into matrix or convex shape, or the guide rail structure using line slideway, steel guideway, plastic-sticking guiding rail general.
4. semiconductor deposition equipment cavity docking facilities as claimed in claim 1, is characterized in that: described support guide structure is by bolted mode after welding or machining.
5. semiconductor deposition equipment cavity docking facilities as claimed in claim 1, is characterized in that: described fixed structure directly carries out being connected or adopting the mode that screw thread clamps, hydraulic clamp, air pressure clamp with main body frame by bolt.
6. semiconductor deposition equipment cavity docking facilities as claimed in claim 1, is characterized in that: Sliding Structures adopts general-purpose type or non-universal formula structure, adopts non-universal formula structure then to install steel ball, steel ball, needle roller or roller component in the lower end of Sliding Structures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510275610.7A CN104900565A (en) | 2015-05-27 | 2015-05-27 | Cavity jointing apparatus for semiconductor deposition device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510275610.7A CN104900565A (en) | 2015-05-27 | 2015-05-27 | Cavity jointing apparatus for semiconductor deposition device |
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| CN104900565A true CN104900565A (en) | 2015-09-09 |
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| CN201510275610.7A Pending CN104900565A (en) | 2015-05-27 | 2015-05-27 | Cavity jointing apparatus for semiconductor deposition device |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5969441A (en) * | 1996-12-24 | 1999-10-19 | Asm Lithography Bv | Two-dimensionally balanced positioning device with two object holders, and lithographic device provided with such a positioning device |
| CN1929107A (en) * | 2005-09-08 | 2007-03-14 | 周星工程股份有限公司 | Movable transfer chamber and substrate-treating apparatus including the same |
| CN101175682A (en) * | 2003-10-30 | 2008-05-07 | 布鲁克斯自动化公司 | Automated material handling system |
| CN102931120A (en) * | 2012-10-25 | 2013-02-13 | 上海集成电路研发中心有限公司 | Workpiece transmission system |
| KR20140059003A (en) * | 2012-11-07 | 2014-05-15 | 주식회사 에스에프에이 | Loading and exchanging system of large mask frame and method thereof |
-
2015
- 2015-05-27 CN CN201510275610.7A patent/CN104900565A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5969441A (en) * | 1996-12-24 | 1999-10-19 | Asm Lithography Bv | Two-dimensionally balanced positioning device with two object holders, and lithographic device provided with such a positioning device |
| CN101175682A (en) * | 2003-10-30 | 2008-05-07 | 布鲁克斯自动化公司 | Automated material handling system |
| CN1929107A (en) * | 2005-09-08 | 2007-03-14 | 周星工程股份有限公司 | Movable transfer chamber and substrate-treating apparatus including the same |
| CN102931120A (en) * | 2012-10-25 | 2013-02-13 | 上海集成电路研发中心有限公司 | Workpiece transmission system |
| KR20140059003A (en) * | 2012-11-07 | 2014-05-15 | 주식회사 에스에프에이 | Loading and exchanging system of large mask frame and method thereof |
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Application publication date: 20150909 |
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