CN104927732A - Photo/thermal initiation fast curing adhesive - Google Patents
Photo/thermal initiation fast curing adhesive Download PDFInfo
- Publication number
- CN104927732A CN104927732A CN201510295347.8A CN201510295347A CN104927732A CN 104927732 A CN104927732 A CN 104927732A CN 201510295347 A CN201510295347 A CN 201510295347A CN 104927732 A CN104927732 A CN 104927732A
- Authority
- CN
- China
- Prior art keywords
- initiation
- light
- parts
- curing
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000000977 initiatory effect Effects 0.000 title claims abstract description 44
- 239000000853 adhesive Substances 0.000 title abstract description 5
- 230000001070 adhesive effect Effects 0.000 title abstract description 5
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 50
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000003822 epoxy resin Substances 0.000 claims abstract description 13
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 13
- 238000006243 chemical reaction Methods 0.000 claims abstract description 11
- 239000002131 composite material Substances 0.000 claims abstract description 11
- 239000003504 photosensitizing agent Substances 0.000 claims abstract description 6
- 239000000945 filler Substances 0.000 claims abstract description 5
- 238000002360 preparation method Methods 0.000 claims abstract description 5
- 230000009471 action Effects 0.000 claims abstract description 4
- 238000004513 sizing Methods 0.000 claims description 33
- 239000007788 liquid Substances 0.000 claims description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 12
- 230000000284 resting effect Effects 0.000 claims description 11
- 239000004593 Epoxy Substances 0.000 claims description 8
- VTYYLEPIZMXCLO-UHFFFAOYSA-L calcium carbonate Substances [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 8
- 238000007711 solidification Methods 0.000 claims description 8
- 230000008023 solidification Effects 0.000 claims description 8
- 150000002460 imidazoles Chemical class 0.000 claims description 7
- 229920000459 Nitrile rubber Polymers 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 6
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- IHDKBHLTKNUCCW-UHFFFAOYSA-N 1,3-thiazole 1-oxide Chemical compound O=S1C=CN=C1 IHDKBHLTKNUCCW-UHFFFAOYSA-N 0.000 claims description 3
- CWXZAJNUTOBAOI-UHFFFAOYSA-N 1-(2,3-dimethoxyphenyl)-2-hydroxy-2-phenylethanone Chemical compound COC1=CC=CC(C(=O)C(O)C=2C=CC=CC=2)=C1OC CWXZAJNUTOBAOI-UHFFFAOYSA-N 0.000 claims description 3
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 3
- 125000004464 hydroxyphenyl group Chemical group 0.000 claims description 3
- YCWSUKQGVSGXJO-NTUHNPAUSA-N nifuroxazide Chemical group C1=CC(O)=CC=C1C(=O)N\N=C\C1=CC=C([N+]([O-])=O)O1 YCWSUKQGVSGXJO-NTUHNPAUSA-N 0.000 claims description 3
- 125000003748 selenium group Chemical class *[Se]* 0.000 claims description 3
- 229920000260 silastic Polymers 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- 229960001866 silicon dioxide Drugs 0.000 claims description 3
- DMYOHQBLOZMDLP-UHFFFAOYSA-N 1-[2-(2-hydroxy-3-piperidin-1-ylpropoxy)phenyl]-3-phenylpropan-1-one Chemical compound C1CCCCN1CC(O)COC1=CC=CC=C1C(=O)CCC1=CC=CC=C1 DMYOHQBLOZMDLP-UHFFFAOYSA-N 0.000 claims description 2
- 229930185605 Bisphenol Natural products 0.000 claims description 2
- 241000790917 Dioxys <bee> Species 0.000 claims description 2
- 239000004642 Polyimide Substances 0.000 claims description 2
- XAKBSHICSHRJCL-UHFFFAOYSA-N [CH2]C(=O)C1=CC=CC=C1 Chemical group [CH2]C(=O)C1=CC=CC=C1 XAKBSHICSHRJCL-UHFFFAOYSA-N 0.000 claims description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 2
- 239000012965 benzophenone Substances 0.000 claims description 2
- 229910052793 cadmium Inorganic materials 0.000 claims description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000006229 carbon black Substances 0.000 claims description 2
- 150000001768 cations Chemical class 0.000 claims description 2
- 239000000470 constituent Substances 0.000 claims description 2
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 2
- 229920002492 poly(sulfone) Polymers 0.000 claims description 2
- 229920000570 polyether Polymers 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 239000004408 titanium dioxide Substances 0.000 claims description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 2
- 125000005409 triarylsulfonium group Chemical group 0.000 claims description 2
- 238000012360 testing method Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 230000004913 activation Effects 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000010008 shearing Methods 0.000 description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 229920013657 polymer matrix composite Polymers 0.000 description 2
- 239000011160 polymer matrix composite Substances 0.000 description 2
- 238000004321 preservation Methods 0.000 description 2
- 238000007712 rapid solidification Methods 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000011157 advanced composite material Substances 0.000 description 1
- 230000002929 anti-fatigue Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000012690 ionic polymerization Methods 0.000 description 1
- 239000011499 joint compound Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
The invention provides a photo/thermal initiation fast curing adhesive which comprises the following components by mass: 40-70 parts of one or more epoxy resin matrixes, 20-40 parts of a latent thermal initiation curing agent, 0.5-5 parts of one or more photo initiation curing agents, 0.1-2.5 parts of one or more photosensitizers, 15-35 parts of one or more flexibilizers, and 20-40 parts of one or more fillers. A preparation method of the photo/thermal initiation fast curing adhesive comprises the following steps: at first, under the action of ultraviolet light, the photo initiation curing agents are used for initiating part of epoxy resin to perform a curing reaction, under the action of heat released during the curing reaction and an external heat source, the temperature of the cured part reaches the latent imidazole initiation reaction temperature of 70-90 DEG C, a latent imidazole complex is activated, epoxy resin is initiated to be quickly cured within 3 min, the automatic, high-quality and fast-cementing connection requirements of a car composite material are met, and the technical problems such as mismatch between the traditional adhesive curing initiation condition and the connection working condition of the car composite material are solved.
Description
Technical field
The invention belongs to interconnection technique field, be specifically related to the two initiation quick-hardening sizing agent of a kind of light/heat.
Background technology
Glued joint interconnection technique, be completely free of nail, riveted joint, bolt, flange or welding etc. in orthodox car manufacturing process and connected manufacturing process, there is the advantages such as structure is light, joint efficiency is high, antifatigue, promoting the revolution that Global Auto production one is new.This brand-new connection mode becomes the key point of light composite material mass application on automobile, also becomes the developing direction that Global Auto industry lightweight manufactures.
Composite material for vehicle glueds joint syndeton and has a very important role to the safety of car load and reliability.Due to the anisotropy of composite material strength and rigidity, and the feature such as matrix material interlayer intensity is lower, and ductility is little, cause matrix material to connect and connect complicated than metal, new requirement be it is also proposed to matrix material connection sizing agent.
In polymer matrix composites trolley part connection procedure, sizing agent generally adopts the contactless initiation of thermal source and requires that fast shaping solidifies, and traditional thermal initiation curing adhesive can not meet the automatization of automotive industry advanced composite material glue-joint technique, fast beat production requirement.
Summary of the invention
The present invention is directed to the requirement of automotive industry polymer matrix composites components connecting process, two initiation quick-hardening sizing agent of a kind of light/heat and preparation method thereof is provided, meet automotive composite material automatization, high quality, glued joint connection request fast, solve the solidification of traditional sizing agent initiation conditions and automotive composite material parts and glued joint and be connected operating mode and the technical barrier such as do not mate.
The invention provides the two initiation quick-hardening sizing agent of a kind of light/heat, each constituent mass number is as follows: epoxy resin-base 40 ~ 70 parts, 20 ~ 40 parts, resting form thermal initiation solidifying agent, 0.5 ~ 5 part, light-initiated solidifying agent, photosensitizers 0.1 ~ 2.5 part, toughner 15 ~ 35 parts, filler 20 ~ 40 parts.
Solidification required time≤3 minute of the two initiation quick-hardening sizing agent of described light/heat, comprise three phases:
(1) first stage: light-initiated solidifying agent causes part epoxy curing reaction under action of ultraviolet light, and now light-initiated curing reaction is occupied an leading position, 3 ~ 20 seconds time length;
(2) subordinate phase: under the effect of curing exotherm and external heat source, cementing position temperature reaches the resting form imidazole curing agent initiation reaction temperature 70 ~ 90 DEG C designed in advance, 10 ~ 30 seconds time length;
(3) phase III: thermal initiation solidifying agent resting form imidazol complex is activated, and thermal initiation curing reaction is occupied an leading position, cause fast epoxy resin curing and realize automotive composite material parts splicing connection, 30 seconds ~ 120 seconds time length.
Described epoxy resin-base is one or more mixture in liquid bisphenol A type epoxy resin or bisphenol f type epoxy resin;
Described resting form thermal initiation solidifying agent is liquid imidazole complex compound, and preparation method is that imidazoles and vitriol react the polynary co-ordination complex formed;
Described light-initiated solidifying agent is diaryl group iodized salt, triaryl sulfonium salts, triaryl selenium salt, dialkyl group phenacyl sulfosalt, and in dialkyl group hydroxyphenyl sulfosalt, the cation type ultraviolet photo of the mixture composition of one or more causes solidifying agent;
Described photosensitizers is benzophenone, dimethoxybenzoin, thiazolone, the mixture of one or more in Alpha-hydroxy ketone;
Described toughner is one or more mixture in carboxyl liquid acrylonitrile butadiene rubber, carboxyl end of the liquid acrylonitrile-butadiene rubber, thiorubber, liquid silastic, polyethers, polysulfones, polyimide, nano-calcium carbonate, nano titanium oxide;
Described filler is the mixture of one or more in talcum powder, white carbon black, light calcium carbonate, silica powder, titanium dioxide, furnace treated black, dioxy cadmium, silicon-dioxide.
Joint cement is quick, high strength, high precision sizing and solidifying are the keys that automotive composite material efficiently connects.Matrix material connection procedure requires operable time (> 3 months) and high temperature rapid curing (>=150 DEG C under special sizing agent room temperature, < 3 minutes) both well balance, current common formula is epoxy/acid anhydrides/promotor, and curing speed is slower.Latent thermal initiation solidifying agent imidazol complex provided by the invention is that imidazoles and vitriol react formation polynary co-ordination complex, it is at room temperature stablized with epoxy resin solution, imidazoles can be discharged at the temperature set at once, metal ion in complex compound also can carry out ionic polymerization with epoxy group(ing), enters into cured article and forms chelating body.The activation temperature point adjustable extent of imidazol complex of the present invention is 70-190 DEG C, lower than there being good preservation stability during activation temperature, can rapid solidification higher than activation temperature, meet composite part glue-joint technique requirement in automotive industry automatic production process.
Light-initiated solidifying agent provided by the invention be cationic photoinitinator for causing epoxy curing systems, be specially adapted to the solidification of thick film systems and dark colour system.Adding of photosensitizers makes the present invention have remarkable extinction capability, only need minimum concentration just can obtain fabulous surface cure effect and speed, meet automotive industry and efficiently connect application operating mode to sizing agent shearing resistance, fatigue strength, stripping strength, the specific indexes requirements such as good media-resistant, cold-hot alternation, wet and heat ageing resistant, resistance to atmospheric aging.
The two initiation quick-hardening sizing agent tool of light/heat of the present invention has the following advantages:
(1) manufacturability: under room temperature, each component is liquid state, adds mixing convenient, improves the adjustable of formula system;
(2) the controllable joint of solidification value: the molecular structure of imidazol complex is different, and the sizing agent of preparation has different activation temperature points, and adjustable extent is 70-90 DEG C;
(3) curing speed is fast: sizing agent provided by the invention, can rapid solidification higher than activation temperature lower than there being good preservation stability during activation temperature, set time < 3min;
(4) intensity height is applied widely: sizing agent shearing resistance provided by the invention higher (> 30mpa), all there is good adaptability to various base material, meet the connection needs of parts between matrix material, between matrix material and metal material.
Embodiment
In order to understand the present invention better, below in conjunction with embodiment, the present invention will be further explained, but will be clear that the scope that the scope of protection of the invention is not limited to embodiment and represents.
embodiment 1
E51 epoxy resin 50 grams, resting form thermal initiation liquid imidazole salt 30 grams, triaryl selenium salt 1.2 grams, Alpha-hydroxy ketone 1.5 grams, carboxyl end of the liquid acrylonitrile-butadiene rubber 18 grams, furnace treated black 25 grams, adds in agitator by each component order under room temperature, obtains the two initiation quick-hardening sizing agent of light/heat after Homogeneous phase mixing.
The essential property obtaining sizing agent according to above formula is as follows:
| Test event | Testing standard | Test condition | Representative value |
| Color | - | - | Black |
| Smell | - | - | Odorlessness after solidification |
| Density, g/cm 3 | GB/T 12007.5-1989 | 20℃ | 1.20 |
| The storage at room temperature time, the moon | - | - | 3 |
| The sizing and solidifying time, min | - | 150℃ | 1 |
| Final set time, min | - | 150℃ | 2 |
| Shearing resistance, Mpa | GB/T 7124-2008 | Room temperature, 10mm/s | 35 |
| T stripping strength N/mm | GB/T 2791-1995 | Room temperature, 100mm/s | 11 |
| Impact peel strength N/mm | ISO 11343 | Room temperature, 2mm/s | 78 |
embodiment 2
E55 epoxy resin 70 grams, resting form thermal initiation liquid imidazole salt 35 grams, diaryl group iodized salt 1.3 grams, thiazolone 1.2 grams, liquid silastic 11 grams, light calcium carbonate 10 grams, under room temperature, each component order is added in agitator, after Homogeneous phase mixing, obtain the two initiation quick-hardening sizing agent of light/heat.
The essential property obtaining sizing agent according to above formula is as follows:
| Test event | Testing standard | Test condition | Representative value |
| Color | - | - | In vain |
| Smell | - | - | Odorlessness after solidification |
| Density, g/cm 3 | GB/T 12007.5-1989 | 20℃ | 1.20 |
| The storage at room temperature time, the moon | - | - | 3 |
| The sizing and solidifying time, min | - | 150℃ | 1 |
| Final set time, min | - | 150℃ | 2.5 |
| Shearing resistance, Mpa | GB/T 7124-2008 | Room temperature, 10mm/s | 32 |
| T stripping strength N/mm | GB/T 2791-1995 | Room temperature, 100mm/s | 9 |
| Impact peel strength N/mm | ISO 11343 | Room temperature, 2mm/s | 75 |
embodiment 3
F76 epoxy resin 60 grams, resting form thermal initiation liquid imidazole salt 25 grams, dialkyl group hydroxyphenyl sulfosalt 0.5 gram, dimethoxybenzoin 0.1 gram, carboxyl liquid acrylonitrile butadiene rubber 35 grams, silicon-dioxide 40 grams, adds in agitator by each component order under room temperature, obtains the two initiation quick-hardening sizing agent of light/heat after Homogeneous phase mixing.
The essential property obtaining sizing agent according to above formula is as follows:
| Test event | Testing standard | Test condition | Representative value |
| Color | - | - | Black |
| Smell | - | - | Odorlessness after solidification |
| Density, g/cm 3 | GB/T 12007.5-1989 | 20℃ | 1.23 |
| The storage at room temperature time, the moon | - | - | 3 |
| The sizing and solidifying time, min | - | 150℃ | 1.5 |
| Final set time, min | - | 150℃ | 3 |
| Shearing resistance, Mpa | GB/T 7124-2008 | Room temperature, 10mm/s | 29 |
| T stripping strength N/mm | GB/T 2791-1995 | Room temperature, 100mm/s | 10 |
| Impact peel strength N/mm | ISO 11343 | Room temperature, 2mm/s | 85 |
Claims (7)
1. the two initiation quick-hardening sizing agent of light/heat, it is characterized in that, the two initiation quick-hardening sizing agent each constituent mass number of described light/heat is as follows: epoxy resin-base 40 ~ 70 parts, 20 ~ 40 parts, resting form thermal initiation solidifying agent, 0.5 ~ 5 part, light-initiated solidifying agent, photosensitizers 0.1 ~ 2.5 part, toughner 15 ~ 35 parts, filler 20 ~ 40 parts;
Solidification required time≤3 minute of the two initiation quick-hardening sizing agent of described light/heat, comprise three phases:
(1) first stage: light-initiated solidifying agent causes part epoxy curing reaction under action of ultraviolet light, and now light-initiated curing reaction is occupied an leading position, 3 ~ 20 seconds time length;
(2) subordinate phase: under the effect of curing exotherm and external heat source, cementing position temperature reaches the resting form imidazole curing agent initiation reaction temperature 70 ~ 90 DEG C designed in advance, 10 ~ 30 seconds time length;
(3) phase III: thermal initiation solidifying agent resting form imidazol complex is activated, and thermal initiation curing reaction is occupied an leading position, cause fast epoxy resin curing and realize automotive composite material parts splicing connection, 30 seconds ~ 120 seconds time length.
2. the two initiation quick-hardening sizing agent of light/heat, it is characterized in that, described resting form thermal initiation solidifying agent is liquid imidazole complex compound, and its preparation method is that imidazoles and vitriol react the polynary co-ordination complex formed.
3. the two initiation quick-hardening sizing agent of light/heat, it is characterized in that, described light-initiated solidifying agent is diaryl group iodized salt, triaryl sulfonium salts, triaryl selenium salt, dialkyl group phenacyl sulfosalt, in dialkyl group hydroxyphenyl sulfosalt, the cation type ultraviolet photo of the mixture composition of one or more causes solidifying agent.
4. the two initiation quick-hardening sizing agent of light/heat, is characterized in that, described epoxy resin-base is one or more mixture in liquid bisphenol A type epoxy resin or bisphenol f type epoxy resin.
5. the two initiation quick-hardening sizing agent of light/heat, it is characterized in that, described photosensitizers is benzophenone, dimethoxybenzoin, thiazolone, the mixture of one or more in Alpha-hydroxy ketone.
6. the two initiation quick-hardening sizing agent of light/heat, it is characterized in that, described toughner is one or more mixture in carboxyl liquid acrylonitrile butadiene rubber, carboxyl end of the liquid acrylonitrile-butadiene rubber, thiorubber, liquid silastic, polyethers, polysulfones, polyimide, nano-calcium carbonate, nano titanium oxide.
7. the two initiation quick-hardening sizing agent of light/heat, it is characterized in that, described filler is the mixture of one or more in talcum powder, white carbon black, light calcium carbonate, silica powder, titanium dioxide, furnace treated black, dioxy cadmium, silicon-dioxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510295347.8A CN104927732B (en) | 2015-06-02 | 2015-06-02 | A kind of light heat is double to trigger rapid curing adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510295347.8A CN104927732B (en) | 2015-06-02 | 2015-06-02 | A kind of light heat is double to trigger rapid curing adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104927732A true CN104927732A (en) | 2015-09-23 |
| CN104927732B CN104927732B (en) | 2018-03-09 |
Family
ID=54115167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510295347.8A Active CN104927732B (en) | 2015-06-02 | 2015-06-02 | A kind of light heat is double to trigger rapid curing adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104927732B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106928893A (en) * | 2015-10-26 | 2017-07-07 | 黑龙江省科学院石油化学研究院 | A kind of preparation method of cation type ultraviolet photo and hot dual deep cure adhesive |
| CN107987768A (en) * | 2017-12-20 | 2018-05-04 | 广州市嵩达新材料科技有限公司 | A kind of cured selfreparing coating glue of ultraviolet light and its preparation method and application |
| CN108192288A (en) * | 2017-12-29 | 2018-06-22 | 定远县丹宝树脂有限公司 | A kind of resistance to oil epoxy resin and preparation method thereof |
| CN108329876A (en) * | 2018-02-07 | 2018-07-27 | 滕凤琴 | A kind of corrosion-resistant epoxyn and preparation method thereof |
| CN112680122A (en) * | 2020-12-22 | 2021-04-20 | 天能电池(芜湖)有限公司 | UV (ultraviolet) light-cured epoxy glue |
| CN112876998A (en) * | 2021-01-22 | 2021-06-01 | 海泰纳鑫科技(成都)有限公司 | Epoxy resin adhesive for optical electronic packaging and preparation method and application thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4218279A (en) * | 1977-07-05 | 1980-08-19 | Ciba-Geigy Corporation | Bonding method employing film adhesives containing an epoxide resin |
| US20070010601A1 (en) * | 2003-08-29 | 2007-01-11 | Akihiro Horimoto | Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device |
| CN101624463A (en) * | 2008-07-10 | 2010-01-13 | 山荣化学株式会社 | Curable resin composition, halogen-free resin substrate, and halogen-free build-up printed wiring board |
| CN102516501A (en) * | 2011-11-22 | 2012-06-27 | 中国科学院上海有机化学研究所 | Photo-curing material for manufacturing light-emitting diode (LED) lens |
-
2015
- 2015-06-02 CN CN201510295347.8A patent/CN104927732B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4218279A (en) * | 1977-07-05 | 1980-08-19 | Ciba-Geigy Corporation | Bonding method employing film adhesives containing an epoxide resin |
| US20070010601A1 (en) * | 2003-08-29 | 2007-01-11 | Akihiro Horimoto | Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device |
| CN101624463A (en) * | 2008-07-10 | 2010-01-13 | 山荣化学株式会社 | Curable resin composition, halogen-free resin substrate, and halogen-free build-up printed wiring board |
| CN102516501A (en) * | 2011-11-22 | 2012-06-27 | 中国科学院上海有机化学研究所 | Photo-curing material for manufacturing light-emitting diode (LED) lens |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106928893A (en) * | 2015-10-26 | 2017-07-07 | 黑龙江省科学院石油化学研究院 | A kind of preparation method of cation type ultraviolet photo and hot dual deep cure adhesive |
| CN107987768A (en) * | 2017-12-20 | 2018-05-04 | 广州市嵩达新材料科技有限公司 | A kind of cured selfreparing coating glue of ultraviolet light and its preparation method and application |
| CN108192288A (en) * | 2017-12-29 | 2018-06-22 | 定远县丹宝树脂有限公司 | A kind of resistance to oil epoxy resin and preparation method thereof |
| CN108329876A (en) * | 2018-02-07 | 2018-07-27 | 滕凤琴 | A kind of corrosion-resistant epoxyn and preparation method thereof |
| CN112680122A (en) * | 2020-12-22 | 2021-04-20 | 天能电池(芜湖)有限公司 | UV (ultraviolet) light-cured epoxy glue |
| CN112876998A (en) * | 2021-01-22 | 2021-06-01 | 海泰纳鑫科技(成都)有限公司 | Epoxy resin adhesive for optical electronic packaging and preparation method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104927732B (en) | 2018-03-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104927732A (en) | Photo/thermal initiation fast curing adhesive | |
| DE1720438C3 (en) | Epoxy resin compounds | |
| ES2866680T3 (en) | Fast setting thermally activatable adhesive coating | |
| EP3095821B1 (en) | Asphalt mixture, process for production of same, and paving method using same | |
| EP2710049B2 (en) | Structural adhesive and use thereof | |
| TW201700703A (en) | Sealing mass based on mercaptoterminated basis polymer/epoxid compound and process to harden by means of a photolatent catalyst | |
| EP1359202A1 (en) | Temperature curable epoxy resin composition | |
| CN104804693A (en) | Novel high temperature-resistant epoxy resin structure adhesive and preparation method thereof | |
| DE4408865A1 (en) | One-component, adhesive coating compound for equipping fasteners with a reactive adhesive layer | |
| KR20200071070A (en) | Adhesive composition | |
| RU2016115710A (en) | WATER PRIMER COMPOSITION FOR IMPROVED FILMING AND WAYS OF ITS APPLICATION | |
| CN102584109A (en) | Epoxy resin concrete material and microwave-coagulation preparation method thereof | |
| CN106244068A (en) | A kind of epoxy resin hot-metal carburized steel adhesive and preparation method thereof | |
| CN103897643A (en) | Room-temperature cured high heat-proof epoxy adhesive | |
| WO2016145650A1 (en) | Epoxy molding compound with high adhesion for nickel surface, method for preparing the same and uses thereof | |
| CN104911917A (en) | Preparation method of water-based carbon fiber sizing agent suitable for thermoplastic matrix | |
| KR20190075217A (en) | Epoxy resin formulation with fast cure property and high thermal resistance and prepreg comprising the same | |
| CN106221641A (en) | A kind of composite laminboard structural adhesive of cold curing and preparation method thereof | |
| EP2283096B1 (en) | Method for producing a sheet metal structure of components which are glued together | |
| JP6684906B2 (en) | Structural adhesive composition that changes color by heat curing | |
| DE69920618T2 (en) | HARDENER FOR EPOXY RESINS | |
| CN104449516A (en) | Epoxy adhesive | |
| DE102012018630A1 (en) | Heat-activated structural pressure-sensitive adhesive tape | |
| DE1479022A1 (en) | Process for the production of honeycomb structural components | |
| DE1595405A1 (en) | Adhesive masses |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 100083 Beijing, Haidian District School Road, No. 18 Co-patentee after: JIANGSU BRANCH OF CHINA ACADEMY OF MACHINERY SCIENCE & TECHNOLOGY Patentee after: BEIJING NATIONAL INNOVATION INSTITUTE OF LIGHTWEIGHT Ltd. Address before: 100083 Beijing, Haidian District School Road, No. 18 Co-patentee before: Jiangsu Branch of China Academy of Machinery Science & Technology Patentee before: ADVANCED MANUFACTURE TECHNOLOGY CENTER, CHINA ACADEMY OF MACHINERY SCIENCE & TECHNOLOGY |
|
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 100083 No. 18 clear road, Haidian District, Beijing Patentee after: BEIJING NATIONAL INNOVATION INSTITUTE OF LIGHTWEIGHT Ltd. Country or region after: China Patentee after: China National Machinery Institute Group Jiangsu Branch Co.,Ltd. Address before: 100083 No. 18 clear road, Haidian District, Beijing Patentee before: BEIJING NATIONAL INNOVATION INSTITUTE OF LIGHTWEIGHT Ltd. Country or region before: China Patentee before: Jiangsu Branch Co., Ltd. of Mechanical Science Research Institute Address after: 100083 No. 18 clear road, Haidian District, Beijing Patentee after: BEIJING NATIONAL INNOVATION INSTITUTE OF LIGHTWEIGHT Ltd. Country or region after: China Patentee after: Jiangsu Branch Co., Ltd. of Mechanical Science Research Institute Address before: 100083 No. 18 clear road, Haidian District, Beijing Patentee before: BEIJING NATIONAL INNOVATION INSTITUTE OF LIGHTWEIGHT Ltd. Country or region before: China Patentee before: JIANGSU BRANCH OF CHINA ACADEMY OF MACHINERY SCIENCE & TECHNOLOGY |