CN104966691B - Glue injection device and manufacturing method of light-emitting device - Google Patents
Glue injection device and manufacturing method of light-emitting device Download PDFInfo
- Publication number
- CN104966691B CN104966691B CN201510454438.1A CN201510454438A CN104966691B CN 104966691 B CN104966691 B CN 104966691B CN 201510454438 A CN201510454438 A CN 201510454438A CN 104966691 B CN104966691 B CN 104966691B
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- Prior art keywords
- glue
- colloid
- cavity plate
- injecting
- filling device
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- 239000003292 glue Substances 0.000 title claims abstract description 304
- 238000002347 injection Methods 0.000 title claims abstract description 18
- 239000007924 injection Substances 0.000 title claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 22
- 238000005507 spraying Methods 0.000 claims abstract description 32
- 239000000084 colloidal system Substances 0.000 claims description 94
- 239000000463 material Substances 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 23
- 238000010438 heat treatment Methods 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 6
- 238000007711 solidification Methods 0.000 claims description 6
- 230000008023 solidification Effects 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- 239000004760 aramid Substances 0.000 claims description 3
- 229920003235 aromatic polyamide Polymers 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 3
- 239000002861 polymer material Substances 0.000 claims description 3
- 238000004020 luminiscence type Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000004954 Polyphthalamide Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 229920006375 polyphtalamide Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000005574 cross-species transmission Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
A glue injection device is used for injecting glue into a bearing female die and comprises a glue injection head body, a glue spraying head and a glue source. The glue injection head body is provided with a glue injection surface which is used for facing the bearing concave die, and the glue injection surface is a convex cambered surface. The glue spraying head is arranged in the glue injection head body and is provided with an outlet positioned on the glue injection surface. The glue source is connected with the glue spraying head and used for providing glue to the glue spraying head, so that the glue can be injected into the bearing concave die through an outlet of the glue spraying head, and the glue injection surface of the glue injection head body is used for enabling the upper surface of the glue injected into the bearing concave die to be defined into a concave arc surface.
Description
Technical field
The present invention is the manufacture method about a kind of glue filling device and light-emitting device, and more particularly to a kind of light-emitting diodes
The glue filling device of pipe and the manufacture method of light-emitting device.
Background technology
Light emitting diode (Light emitting diode, LED) is a kind of semiconductor element, is largely used in recent years
In illumination and display backlight equipment.When light fixture is light source using light emitting diode, compared with conventional bulb lamp source, with small
The advantages of size, lighter in weight, low power consumption and long life.
In general, the light-emitting diode assembly made using injecting glue technology, its colloid due to processing procedure, equipment, it is artificial,
The factor such as material or environment, is typically only capable to be formed the surface of out-of-flatness in carrying groove or support.Due to light emitting diode hair
The flatness of smooth surface colloid can influence the light extraction situation of light guide plate, therefore the surface of out-of-flatness can cause display to produce hot spot
(mura) or Luminance Distribution it is uneven probability increase, or cause light emitting diode (LED) light efficiency be limited.In addition, liquid glue
The total amount that body inserts carrying groove is not easy to the factors such as control, and other processing procedures, equipment, artificial, material or environment, easily makes
On the edge for being attached to carrying groove into excessive glue or colloid, the display brightness using light emitting diode as backlight is caused to be distributed not
Uniformly, the quality of image stability of product is caused to be difficult to maintain.
The content of the invention
It is an object of the invention to provide the manufacture method of a kind of glue filling device and light-emitting device, can effectively it solve above-mentioned existing
The shortcoming of technology.
According to an embodiment of the present invention, a kind of glue filling device is to carrying cavity plate injection colloid, glue filling device is included
Glue injecting head body, glue spraying head and colloid source.Glue injecting head body has injecting glue face in face of carrying cavity plate, wherein injecting glue face is convex
Cambered surface.Glue spraying head is arranged in glue injecting head body, and is located at injecting glue face with outlet.Colloid source, connects glue spraying head, to provide
Colloid is to glue spraying head so that colloid can be by the outlet injection carrying cavity plate of glue spraying head, the wherein injecting glue of glue injecting head body
Face system is used for causing the upper surface for the colloid being injected into carrying cavity plate to be defined as cancave cambered surface.
In an embodiment of the present invention, above-mentioned glue injecting head body has an excessive glue passage.
In one or more embodiments of the invention, above-mentioned excessive glue passage annularly surrounds injecting glue face.
In an embodiment of the present invention, above-mentioned glue filling device further includes check valve connection excessive glue passage.Check valve is permitted
Many remaining colloids flow to excessive glue passage, but do not allow colloid to be back to carrying cavity plate from excessive glue passage.
In an embodiment of the present invention, above-mentioned glue filling device further includes vacuum suction device.Vacuum suction device connects
Excessive glue passage is connect, the colloid to attract to be located in excessive glue passage leaves glue injecting head body.
In an embodiment of the present invention, above-mentioned glue filling device further includes a heater.Heater connection glue injection
Head body, to the colloid being heating and curing in carrying cavity plate.
In an embodiment of the present invention, the material of above-mentioned glue injecting head body is Heat Conduction Material so that heater institute
The heat of offer, can be through glue injecting head body heat transfer to the colloid carried in cavity plate.
In an embodiment of the present invention, the material of above-mentioned glue injecting head body is metal.
In an embodiment of the present invention, above-mentioned glue filling device further includes heat-insulated material around glue spraying head, to completely cut off glue
Body and glue injecting head body.
In an embodiment of the present invention, above-mentioned heat-insulated material is ceramic fibre, high polymer material, polymer composite
Or above-mentioned any combination.
In an embodiment of the present invention, above-mentioned heat-insulated material is aromatic polyamide.
According to an embodiment of the present invention, a kind of manufacture method of light-emitting device is included：Glue filling device, wherein injecting glue are provided
Device has injecting glue face, and injecting glue face is convex globoidal；Glue filling device is arranged on the carrying cavity plate of light-emitting device, wherein injecting glue
The injecting glue face of device is extending at least partially into carrying cavity plate；By in colloid injection carrying cavity plate；And in solidification carrying cavity plate
Colloid, and the upper surface of the colloid carried in cavity plate is defined as cancave cambered surface by injecting glue face.
In an embodiment of the present invention, the manufacture method of above-mentioned light-emitting device is further included：By glue filling device extremely
A few excessive glue passage allows unnecessary colloid to overflow carrying cavity plate.
In an embodiment of the present invention, the above-mentioned step being arranged at glue filling device on the carrying cavity plate of light-emitting device
Further include：Align the excessive glue passage of glue filling device and the edge of opening of carrying cavity plate.
In an embodiment of the present invention, the above-mentioned excessive glue passage by glue filling device allows unnecessary colloid to overflow carrying
The step of cavity plate, includes：Allow unnecessary colloid to flow to excessive glue passage from cavity plate is carried, but do not allow colloid to be flowed back from glue passage
To carrying cavity plate.
In an embodiment of the present invention, the above-mentioned note excessive glue passage by glue filling device allows unnecessary colloid to overflow and held
The step of carrying cavity plate system causes unnecessary colloid to overflow carrying cavity plate using vacuum attraction.
In an embodiment of the present invention, the step of colloid in above-mentioned solidification carrying cavity plate system using be heating and curing by
Colloid in injection carrying cavity plate.
In an embodiment of the present invention, it is above-mentioned be heating and curing be injected into carrying cavity plate in colloid the step of include：Borrow
Colloid of the heat to carrying in cavity plate is provided by glue filling device, and the colloid in carrying cavity plate is solidified because of heat.
In an embodiment of the present invention, above-mentioned being heating and curing is injected into the step of carrying the colloid in cavity plate and included：
The trap heat heat transfer colloid stored into glue filling device so that and the colloid stored by glue filling device not consolidate by reason heat
Change.
In an embodiment of the present invention, above-mentioned light-emitting device is light emitting diode, and colloid is phosphor gel.
Below in conjunction with the drawings and specific embodiments, the present invention will be described in detail, but not as a limitation of the invention.
Brief description of the drawings
Figure 1A illustrates the diagrammatic cross-section before the glue filling device injecting glue according to an embodiment of the present invention.
Figure 1B illustrates the diagrammatic cross-section during glue filling device injecting glue in Figure 1A.
Fig. 1 C illustrate the diagrammatic cross-section after the completion of the glue filling device injecting glue in Figure 1B.
Fig. 2 illustrates the bottom view of the glue filling device according to an embodiment of the present invention.
Fig. 3 is the flow chart for the manufacture method for illustrating the light-emitting device according to an embodiment of the present invention.
100：Glue filling device
110：Glue injecting head body
111：Injecting glue face
112：Excessive glue passage
120：Glue spraying head
121：Outlet
130：Colloid source
140：Check valve
150：Vacuum suction device
160：Heater
170：Heat-insulated material
200：Carry cavity plate
210：Luminescence chip
211：Metal wire
300：Colloid
310：Cancave cambered surface
320：Excessive glue
S101~S107：Step
Embodiment
Multiple embodiments of the present invention, as clearly stated, the details in many practices will be disclosed with schema below
It will be explained in the following description.It should be appreciated, however, that the details in these practices is not applied to limit the present invention.Also
It is to say, in some embodiments of the present invention, the details in these practices is non-essential.In addition, for the sake of simplifying schema, one
A little existing usual structures will illustrate it in the way of simply illustrating in the drawings with element.
It refer to Figure 1A to Fig. 1 C.The section that Figure 1A illustrates before the glue filling device injecting glue according to an embodiment of the present invention shows
It is intended to.Figure 1B illustrates the diagrammatic cross-section during glue filling device injecting glue in Figure 1A.Fig. 1 C illustrate the glue filling device injecting glue in Figure 1B
After the completion of diagrammatic cross-section.
As shown in Figure 1A to Fig. 1 C, in present embodiment, glue filling device 100 includes glue injecting head body 110.Glue injecting head sheet
Body 110 has injecting glue face 111 in face of carrying cavity plate 200, and wherein injecting glue face 111 is convex globoidal.Glue filling device 100 is further wrapped
Containing glue spraying head 120.Wherein, glue spraying head 120 is arranged in glue injecting head body 110, and its outlet 121 is arranged on injecting glue face 111.
Glue filling device 100 also includes colloid source 130.Colloid source 130 connects glue spraying head 120, to provide colloid 300 to spray
Glue first 120 so that colloid 300 can be by the injection carrying cavity plate 200 of glue spraying head 120.Wherein, the note of glue injecting head body 110
Glue surface 111 can be used to the upper surface of the colloid 300 injected in carrying cavity plate 200 being defined as cancave cambered surface, such as Figure 1B and Fig. 1 C
It is shown.
Fig. 2 is refer to, it is the bottom view for illustrating the glue filling device according to an embodiment of the present invention.Such as Figure 1A to Fig. 2
It is shown, glue injecting head body 110 also have an at least excessive glue passage 112 in wherein, allow whereby be injected into carrying cavity plate 200 in glue
Body 300 can overflow carrying cavity plate 200 by excessive glue passage 112.In present embodiment, excessive glue passage 112 is annularly surrounded
Injecting glue face 111.As shown in Fig. 2 in the bottom view of glue injecting head body 110, the ring-type of excessive glue passage 112 surrounds glue injecting head body
110 injecting glue face 111.However, the present invention is not limited thereto, in practical application, glue injecting head body 110 can also have multiple
Independent excessive glue passage, and these excessive glue passages be annular arrangement in the edge in injecting glue face 111, equally can reach to allow be injected into and hold
The colloid 300 carried in cavity plate 200 overflows the purpose for carrying cavity plate 200 by excessive glue passage.In the present embodiment, it is recessed when carrying
The size of the opening of mould 200 is 2.6 × 1.0mm2When, excessive glue passage 112 can be x apart from the center in injecting glue face 111, and wherein x is about
For 0≤x ＜ 1.3mm.It is noted that glue filling device 100 and its each element included (include glue injecting head body 110, excessive glue
Passage 112 and outlet shape 121) in bottom view are not limited with square shown in Fig. 2.In practical application, injecting glue dress
Put 100 and its shape in bottom view of each element for being included is alternatively circle, rectangle, trapezoidal, polygonal or with height
The specific shape of low head.
As shown in Figure 1A to Fig. 1 C, the above-mentioned glue filling device 100 referred to further includes check valve 140 and vacuum suction device
150.Wherein, check valve 140 is arranged in excessive glue passage 112, for example the exit of excessive glue passage 112 positioned at injecting glue face 111, is used
To allow unnecessary colloid 300 (i.e. excessive glue 320, is shown in Figure 1B) to flow to excessive glue passage 112, but do not allow excessive glue 320 logical from excessive glue
Road 112 is back to carrying cavity plate 200.The connection excessive glue of vacuum suction device 150 passage 112, to attract to be located at excessive glue passage 112
Interior unnecessary excessive glue 320 leaves glue injecting head body 110.
Glue filling device 100 further includes heater 160.The connection glue injection head body 110 of heater 160, is used to
Be heating and curing the colloid 300 being injected into carrying cavity plate 200.In other words, colloid 300 is thermosets.Wherein, glue injecting head sheet
The material of body 110 is heat-conducting so that the heat that heater 160 is provided, can be by the heat transfer of glue injecting head body 110 extremely
Carry the colloid 300 in cavity plate 200.
In glue spraying head 120 and excessive glue passage 112 around heat-insulated material 170 is provided with, provided to completely cut off heater 160
Heat pass through the (figure of colloid 300 of the colloid 300 in the heat transfer of glue injecting head body 110 to glue spraying head 120 and excessive glue passage 112
Do not show), therefore the colloid 300 of non-injecting glue is not produced with the excessive glue 320 of excessive glue passage 112 by heating processing in glue spraying head 120
Raw solidification.For the thermal conduction effect reached, in present embodiment, the material of the above-mentioned glue injecting head body 110 referred to is
Metal, but the present invention is not limited thereto.
The above-mentioned material of heat-insulated material 170 is ceramic fibre, high polymer material, polymer composite or above-mentioned any group
Close.Polymer composite such as aromatic polyamide, but the present invention is not limited thereto.
Fig. 3 is refer to, it is the flow chart for the manufacture method for illustrating the light-emitting device according to an embodiment of the present invention.Such as
Shown in Fig. 3, and coordinate reference picture 1A to Fig. 1 C, the manufacture method of light-emitting device comprises at least step S101 to step S107, such as
Shown in lower.
Step S101：Glue filling device 100 is provided, wherein glue filling device 100 has injecting glue face 111, and injecting glue face 111 is convex
Cambered surface (as depicted in Figure 1B).
Step S102：Glue filling device 100 is arranged on the carrying cavity plate 200 of light-emitting device, wherein glue filling device 100
Injecting glue face 111 is extending at least partially into carrying cavity plate 200.
Before injecting glue, glue injecting head body 110 can be made to be extended partially into carrying cavity plate 200, and make the end of glue injecting head body 110
Face (i.e. in Figure 1A, the bottom surface positioned at the edge of injecting glue face 111 of glue injecting head body 110) patch is neat (to be schemed in the carrying end face of cavity plate 200
In 1A, the top surface of cavity plate 200 is carried), you can proceed by injecting glue.
Step S103：Colloid 300 is injected in carrying cavity plate 200 (as depicted in Figure 1B).
Step S104：Colloid 300 in solidification carrying cavity plate 200, and will be carried by injecting glue face 111 in cavity plate 200
The upper surface of colloid 300 is defined as cancave cambered surface 310 (as depicted in Figure 1B).
Now, colloid 300 is injected carrying cavity plate 200 by glue spraying head 120, and the empirically discreet value of injecting glue amount makes carrying recessed
When colloid 300 in mould 200 reaches spill-over, the excessive glue 320 in carrying cavity plate 200 is squeezed out through injecting glue face 111, and by excessive glue 320
At the edge of opening for being concentrated to carrying cavity plate 200.
In order to prevent excessive glue 320 from undeservedly being flowed at the edge of opening of carrying cavity plate 200, glue injecting head body 110 has
An at least excessive glue passage 112 is in wherein, and the manufacture method of the light-emitting device of the present invention can also include step S105.
Step S105：Allow excessive glue 320 to flow to excessive glue passage 112, but do not allow excessive glue 320 to be flowed back from excessive glue passage 112
To carrying cavity plate 200 (as depicted in Figure 1B).
In order to reach step S105 purpose, check valve 140 can be set in the porch of excessive glue passage 112.Implement in one
In mode, when excessive glue 320 touches the unlatching of check valve 140 (for example, excessive glue 320 applies pressure to check valve 140 and opened), very
Suction leading-in device 150 will synchronously be activated and produce attraction.By the attraction of vacuum suction device 150, you can by position
Attract to leave glue injecting head body 110 in the excessive glue 320 in excessive glue passage 112.When there is no excessive glue 320 by check valve 140,
Vacuum suction device 150 is close synchronously, prevents excessive glue 320 to be back to from excessive glue passage 112 in carrying cavity plate 200.Above-mentioned
The material of colloid 300 is phosphor gel.
When extruding the colloid 300 in carrying cavity plate 200 due to injecting glue face 111, excessive glue 320 can be concentrated to carrying cavity plate
At 200 edge of opening.Therefore, in order that excessive glue 320 can more smoothly enter excessive glue passage 112, alignment note can also be carried out
The step of edge of opening of the excessive glue passage 112 of adhesive dispenser 100 and carrying cavity plate 200.
Then, in order that the colloid 300 in carrying cavity plate 200 solidifies, the manufacture method of light-emitting device of the invention may be used also
Include step S106 (as depicted in Figure 1B).
Step S106：Colloid 300 of the heat to carrying in cavity plate 200 is provided by glue filling device 100, and make it that carrying is recessed
Colloid 300 in mould 200 solidifies because of heat.
After injecting glue is finished, heat can be provided by heater 160 and give glue injecting head body 110.The heat of heating processing
The colloid 300 conducted heat to by glue injecting head body 110 in carrying cavity plate 200 so that the colloid 300 in carrying cavity plate 200
Solidify because of heat.It follows that colloid 300 of the present invention is thermosets.
Step S107：Glue filling device 100 is separated (as depicted in Fig. 1 C) with carrying cavity plate 200.
Now, the colloid 300 in the separation of glue injecting head body 110 and carrying cavity plate 200, carrying cavity plate 200 is carried out through note
The injecting glue face 111 of glue head body 110 defines cancave cambered surface 310, and then can reach improvement light emitting diode light extraction is uneven and show
As.In addition, because the end face of glue injecting head body 110 patch is neat in the carrying end face of cavity plate 200, can avoid carrying the end face of cavity plate 200
Cull is produced, causes display brightness uneven.
Above-mentioned light-emitting device is light emitting diode.Specifically, above-mentioned light emitting diode comprising carrying cavity plate 200 with
And the luminescence chip 210 of setting in the inner and metal wire 211.The material of luminescence chip 210 is semi-conducting material, such as blue light emitting two
Pole pipe chip, but the present invention is not limited thereto.
Further illustrate, solidify because needing heating processing to carry colloid 300 in cavity plate 200 after the completion of injecting glue,
The material of glue injecting head body 110 is Heat Conduction Material, such as metal.And, carrying cavity plate 200 material has the resin material of high-fire resistance, such as
Polyphthalamide (polyphthalamide).The inner surface of the inner surface of glue spraying head 120 and excessive glue passage 112, which is surrounded, to be set
Heat-insulated material 170 is equipped with, to when applying heating processing, it is to avoid the colloid 300 of the storage in glue spraying head 120 and excessive glue passage
Excessive glue 320 in 112 is also cured simultaneously, and causing glue spraying head 120, subsequently cleaning is difficult with excessive glue passage 112.In other words, when applying
Plus during heating processing, glue spraying head 120 is with excessive glue passage 112 because there is heat-insulated material 170 to protect so that the colloid in glue spraying head 120
300 are not influenceed by heating processing with the excessive glue 320 in excessive glue passage 112 and produce solidification.
For the detailed description of embodiment of the invention more than, it is apparent that the glue filling device of the present invention
It can will be solidified with the manufacture method of light-emitting device using the injecting glue face of glue injecting head body in the upper surface for carrying the colloid in cavity plate
Cancave cambered surface is defined as, therefore the probability that can be totally reflected the light of the luminescence chip in carrying cavity plate is greatly reduced.Also,
Configured by the structure of glue injecting head body, can effectively control colloid to insert the total amount of carrying groove, therefore excessive glue attachment can be reduced
In on the end face of carrying groove, and then the illuminance distribution of light emitting diode can be maintained, and lift the image of display product
Steady quality degree.
Certainly, the present invention can also have other various embodiments, ripe in the case of without departing substantially from spirit of the invention and its essence
Various corresponding changes and deformation, but these corresponding changes and deformation can be made according to the present invention by knowing those skilled in the art
The protection domain of the claims in the present invention should all be belonged to.
Claims (18)
1. a kind of glue filling device, to a carrying cavity plate injection colloid, it is characterised in that the glue filling device is included：
One glue injecting head body, the glue injecting head body has an injecting glue face in face of the carrying cavity plate, the injecting glue face is a convex arc
Face；
One glue spraying head, is arranged in the glue injecting head body, and is exported with one positioned at the center in the injecting glue face；And
Colloid source, connects the glue spraying head, to provide colloid to the glue spraying head so that the colloid can pass through the glue spraying head
The outlet inject in the carrying cavity plate,
Wherein, the injecting glue face of the glue injecting head body is used for make it that the upper surface for the colloid being injected into the carrying cavity plate is determined
Justice is into a cancave cambered surface, and the glue injecting head body has an excessive glue passage, and the excessive glue passage annularly surrounds the injecting glue face.
2. glue filling device according to claim 1, it is characterised in that further include：
One check valve, is arranged at the excessive glue passage, to allow the unnecessary colloid to flow to the excessive glue passage, but does not allow the glue
Body is back to the carrying cavity plate from the excessive glue passage.
3. glue filling device according to claim 1, it is characterised in that further include：
One vacuum suction device, connects the excessive glue passage, and the colloid to attract to be located in the excessive glue passage leaves the injecting glue
Head body.
4. glue filling device according to claim 1, it is characterised in that further include：
One heater, connects the glue injecting head body, and the colloid in the carrying cavity plate is injected into be heating and curing.
5. glue filling device according to claim 4, it is characterised in that the material of the glue injecting head body is Heat Conduction Material, is made
The heat that the heater is provided is obtained, the colloid that can be by the glue injecting head body heat transfer into the carrying cavity plate.
6. glue filling device according to claim 5, it is characterised in that the material of the glue injecting head body is metal.
7. glue filling device according to claim 4, it is characterised in that further include：
One heat-insulated material, around the glue spraying head, to completely cut off the colloid and the glue injecting head body.
8. glue filling device according to claim 7, it is characterised in that the heat-insulated material is ceramic fibre, high polymer material, height
Molecular composite material or above-mentioned any combination.
9. glue filling device according to claim 7, it is characterised in that the heat-insulated material is aromatic polyamide.
10. a kind of manufacture method of light-emitting device, it is characterised in that include：
A glue filling device is provided, wherein the glue filling device has an injecting glue face, a glue spraying head and an excessive glue passage, and the injecting glue face
For a convex globoidal, the glue spraying head has an outlet positioned at the center in the injecting glue face, and the excessive glue passage annularly surrounds the injecting glue face；
The glue filling device is arranged on a carrying cavity plate of a light-emitting device, wherein the injecting glue face at least portion of the glue filling device
Divide and stretch into the carrying cavity plate；
Colloid is injected in the carrying cavity plate；And
Solidify the colloid in the carrying cavity plate, and define the upper surface of the colloid in the carrying cavity plate by the injecting glue face
For a cancave cambered surface.
11. the manufacture method of light-emitting device according to claim 10, it is characterised in that further include：
The unnecessary colloid is allowed to overflow the carrying cavity plate by an at least excessive glue passage for the glue filling device.
12. the manufacture method of light-emitting device according to claim 11, it is characterised in that above-mentioned to set the glue filling device
The step being placed on the carrying cavity plate of the light-emitting device is included：
Align the excessive glue passage of the glue filling device and the edge of opening of the carrying cavity plate.
13. the manufacture method of light-emitting device according to claim 11, it is characterised in that above-mentioned to pass through the glue filling device
The excessive glue passage include the step of allow the unnecessary colloid to overflow the carrying cavity plate：
Allow the unnecessary colloid to flow to the excessive glue passage from the carrying cavity plate, but do not allow the colloid to be flowed back from the excessive glue passage
To the carrying cavity plate.
14. the manufacture method of light-emitting device according to claim 11, it is characterised in that above-mentioned to pass through the glue filling device
The excessive glue passage be using vacuum attraction the step of allow the unnecessary colloid to overflow the carrying cavity plate so that the unnecessary colloid
Overflow the carrying cavity plate.
15. the manufacture method of light-emitting device according to claim 10, it is characterised in that the above-mentioned solidification carrying cavity plate
In the colloid the step of be to utilize the colloid that is injected into the carrying cavity plate of being heating and curing.
16. the manufacture method of light-emitting device according to claim 15, it is characterised in that be heating and curing and be injected into the carrying
The step of colloid in cavity plate, includes：
The colloid of a heat into the carrying cavity plate is provided by the glue filling device, and causes the colloid in the carrying cavity plate
Solidify because of the heat.
17. the manufacture method of light-emitting device according to claim 16, it is characterised in that be heating and curing and be injected into the carrying
The step of colloid in cavity plate, includes：
Obstruct heat heat transfer colloid stored into the glue filling device so that the colloid stored by the glue filling device
Not the reason heat and solidify.
18. the manufacture method of light-emitting device according to claim 10, it is characterised in that the light-emitting device is one luminous two
Pole pipe, the colloid is phosphor gel.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104120334 | 2015-06-24 | ||
| TW104120334A TWI555236B (en) | 2015-06-24 | 2015-06-24 | Injection apparatus and manufacturing method of light-emitting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104966691A CN104966691A (en) | 2015-10-07 |
| CN104966691B true CN104966691B (en) | 2017-10-13 |
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ID=54220710
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510454438.1A Active CN104966691B (en) | 2015-06-24 | 2015-07-29 | Glue injection device and manufacturing method of light-emitting device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104966691B (en) |
| TW (1) | TWI555236B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112474199A (en) * | 2020-12-08 | 2021-03-12 | 南京欧伊工程技术有限公司 | Integrated circuit production and processing equipment with quantitative dispensing function |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| CN103378257A (en) * | 2012-04-16 | 2013-10-30 | 展晶科技(深圳)有限公司 | Light emitting diode packaging method |
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| CN102569552B (en) * | 2011-12-30 | 2014-08-06 | 广东德豪润达电气股份有限公司 | Production process of LED (light-emitting diode) packaging bracket and glue injection mould |
| CN204088374U (en) * | 2014-08-21 | 2015-01-07 | 木林森股份有限公司 | A kind of LED injecting glue mould |
| CN104201273B (en) * | 2014-09-02 | 2017-06-09 | 木林森股份有限公司 | LED lamp bead manufacture method, can injection moulding LED support electrically-conductive backing plate and high density LED support module |
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| US6407461B1 (en) * | 1997-06-27 | 2002-06-18 | International Business Machines Corporation | Injection molded integrated circuit chip assembly |
| CN101223634A (en) * | 2005-07-13 | 2008-07-16 | 首尔半导体株式会社 | Mold for forming a molding member and method of fabricating a molding member using the same |
| CN103378257A (en) * | 2012-04-16 | 2013-10-30 | 展晶科技(深圳)有限公司 | Light emitting diode packaging method |
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