CN105022234A - Cross-scale microstructure fabrication method based on multiple exposures - Google Patents
Cross-scale microstructure fabrication method based on multiple exposures Download PDFInfo
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- CN105022234A CN105022234A CN201510414018.0A CN201510414018A CN105022234A CN 105022234 A CN105022234 A CN 105022234A CN 201510414018 A CN201510414018 A CN 201510414018A CN 105022234 A CN105022234 A CN 105022234A
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Abstract
The invention discloses a cross-scale microstructure fabrication method based on multiple exposures. The fabrication method comprises the following steps of: (1) classifying cross-scale microstructures to be processed according to size dimensions, and respectively fabricating a primary structure mask and a secondary structure mask, wherein a small-sized structure is a primary structure, and a large-sized structure is a secondary structure; and (2) placing the masks in a photosensitive stamp machine, and carrying out exposure treatment on a photosensitive stamp pad in the photosensitive stamp machine, in which the primary structure mask is firstly used for exposing and transferring to obtain the stamp pad of the primary structure, and then based on the stamp pad, the stamp pad of the cross-scale structure is finally acquired by using the secondary structure mask. In the cross-scale microstructure fabrication method based on photosensitive stamping, proposed by the invention, the photosensitive stamp which is very mature at present is used as a core template for microfabrication. The cross-scale microstructure fabrication method has the advantages of flexibility and convenience in operation, high in processing accuracy and the like, and a severe condition for a clean room, an absolutely-flat surface and an expensive photoetching technology are not needed.
Description
Technical field
The present invention relates to a kind of micro-manufacture method, especially relate to a kind of based on photosensitive seal across scale micro-structure method for making.
Background technology
The structure being also dispersed with less one-level size on the surface of larger one-level dimensional structure is referred to across dimensional structure, for lotus leaf surface, its surface distributed has size to be about the protruding column structure of tens microns, on these column structure surfaces, is dispersed with again micron-sized micro-structure.Micro-manufacture across dimensional structure is the study hotspot of academia, has huge potential using value, occurring in nature, of common occurrence across dimensional structure, and leaf surface Wei Satisfied structure, the sandwich construction of gecko pin is Typical Representative.At present, the method made across dimensional structure common are following several.
Manufacturing technology based on silicon materials is come from microelectric technique development, take silicon materials as manufacturing object, main is core with photoetching technique, the pattern of needs is optionally etched on a photoresist by litho machine and mask, then develop, follow-uply carry out further dry method or wet etching, final obtain required for microstructure.Micro-fabrication technology principal feature based on silicon is that manufacturing accuracy is high, and expense is large, and need the equipment set of specialty, technology maturation is stablized, and remains the prefered method of the micro-manufacture of batch at present.
LBL self-assembly method, is generally fitted together by the different layers of electrostatic force by polyanion and polycation.Nano particle is introduced to form composite structure in assembling process.Such as first modify polyelectrolyte multilayer film on ito glass surface, then utilize electrochemical method to deposit the composite structure obtaining gold nanoclusters and obtain above.LBL self-assembly method is widely used in preparing micro-enzyme electrode.
Template first obtains template by optics or beamwriter lithography, and the precursor of die material solidifies in a template, departs from after polymerization forming from template.Or directly copy biological surface structure, common used material is PDMS, such as: be cast on lotus leaf by liquid PDMS, cautiously after solidification take PDMS off, obtain the PDMS seal reverse with lotus leaf surface structure.Again with this PDMS seal for template, high molecular polymer utilizes the method for micro-contact printing again impress, just can obtain composite microstructure identical with lotus leaf pattern.The shortcoming of this technique mainly cannot ensure the consistance between twice seal at present, the tear it down distortion and damage that easily cause microstructure on PDMS of PDMS seal.This makes this technical sophistication microstructure be main mainly with single-piece production, is difficult to realize short run processing, is difficult to realize commercial applications.
Summary of the invention
The invention provides a kind of based on multiexposure, multiple exposure across scale micro-structure manufacture method, use photosensitive seal very ripe at present as the core masterplate of micro-manufacture, by design and the multiexposure, multiple exposure of mask structure, the making completed across scale micro-structure that can be simple and quick, is suitable for batch production.
Based on multiexposure, multiple exposure across a scale micro-structure manufacture method, comprise the steps:
(1) according to size, classify across size microstructures to be processed, undersized structure is primary structure, and large-sized structure is secondary structure, makes the primary structure mask corresponding with primary structure and the secondary structure mask corresponding with primary structure respectively;
(2) mask is placed in photosensitive seal machine, exposure-processed is carried out to the photosensitive seal pad in it, first use primary structure mask, exposure transfer printing obtains the Stamp pad containing primary structure, then based on this Stamp pad, use secondary structure mask exposure, finally obtain across mesostructure.On photosensitive seal pad, there is certain difference in height exposure region and unexposed area, obtain the photosensitive seal pad with microstructure;
Below the preferred technical scheme of the present invention is described further:
As preferably, in step (1), adopt laser or inkjet printing micro structured pattern to be processed to be printed on translucent template or film film, make and obtain mask.Use the black and white paper that laser or printing of inkjet printer will be processed, the resolution of current laser printer can reach 1200DPI, and ink-jet printer can reach 2400DPI, and the resolution of the pattern thus printed can reach 20 μm.Printer paper can select film paper special in translucent template or printing.For the mask (microstructure size <20 μm) that accuracy requirement is higher, metal mask conventional in photoetching also can be used, as chromium film.Typically, across the large one-level microstructure size of size microstructures in hundred micron dimensions, and little one-level microstructure size is in 10 micron dimensions and even sub-micrometer scale.
In step (2), mask exposure process: need successively by mask being placed on the middle, exposure area of photosensitive seal machine, so that uniform exposure.Be covered with transparent film above, put onesize photosensitive seal pad topmost, cover exposure machine lid, expose.The key of this step is first to expose primary structure mask, the Stamp pad with small scale structures obtained after exposure.Based on this Stamp pad, use secondary structure mask again to expose, make coarse scale structures also be transferred to Stamp pad surface, thus obtain the composite structure across size.Because the degree of depth of exposure frequency to microstructure has a direct impact, in order to ensure to obtain the composite structure quality across yardstick, when transfer printing small scale structures, exposure frequency is greater than the exposure frequency of follow-up transfer printing coarse scale structures.As preferably, primary structure exposure power is 85-87; Exposure frequency controls for 7-9 time, and secondary structure exposure power is at 83-85; Exposure frequency controls at 1-3 time.
The forming principle of photosensitive seal pad is: photosensitive seal pad is a kind of ultra micro foam material, and the micropore size on its surface is very little, and average pore size is less than 30 μm.Itself there is oil storage oil impregnate and characteristic is melted in color break-up.Photochromics, when being subject to strong illumination, can absorbing luminous energy and convert heat energy to, and the energy that color more secretly absorbs is more.During exposure, after the luminous energy that light part transient absorption is a large amount of is seen on photosensitive seal pad surface, temperature rises rapidly and reaches fusing point, after flash of light terminates, the temperature of Surface melt reduces rapidly, and surface caves inward simultaneously, forms the film of certain thickness and intensity, this layer film plays the effect of sealing of hole closed pore simultaneously, and the infiltration of isolated stamp-pad ink.Because on photosensitive seal pad, the difference in height of exposure region and unexposed area is 10-90 μm, exposure can realize microstructure and be transferred to Stamp pad surface successively from small to large successively, thus realizes the compound of several order of magnitude microstructure in Stamp pad surface.
The region of corresponding primary structure or secondary structure on primary structure mask, secondary structure mask can be transparent region, also can be zone of opacity.For the primary structure needing processing, if need the pattern after processing to be the structure caved in, then need to process transparent primary structure on primary structure mask.Otherwise, if need to obtain protruding primary structure, then need to process opaque primary structure on primary structure mask.For secondary structure, there is same reason.Above-mentioned zone of opacity all plays realization by laser or ink-jet printer.But, impact on primary structure when processing secondary structure to reduce, as preferably, the region that on secondary structure mask, secondary structure is corresponding is zone of opacity, when exposing with secondary structure mask, the primary structure of secondary structure inside can not be exposed, substantially not by the impact of re-expose.
In step (2), be ensure photosensitive seal pad smooth surface, as preferably, before utilizing mask to the exposure of photosensitive seal pad, can first carry out without mask pre-exposure to photosensitive seal pad, pre-exposure power be 85-87; Exposure frequency is 2-3 time, and object forms smooth surface on Stamp pad surface.
The innovation of this application is to have found that photosensitive pad can still keep good size transitivity in multiexposure, multiple exposure.
As preferably, can to of the present invention across the further processing and utilization of mesostructure, such as the microstructure on photosensitive seal can be used transfer materials transfer printing, conventional transfer materials can select PDMS (dimethyl silicone polymer), then obtain corresponding photosensitive seal and bear structure, concrete steps comprise:
I liquid PDMS and hardening agent mix according to certain mass ratio by (), be generally 8-15:1, select 10:1 further, stir and put into vacuum drying chamber de-bubble, be generally half an hour.Then be poured into the photosensitive seal surface that (2) obtain, take off after solidification to be heated, heating-up temperature is 60-80 DEG C, and the heat time is generally 1.5-3 hour, and the photosensitive seal that namely acquisition (2) obtains on PDMS seal bears structure.
Cell is difficult to attachment on smooth surface, be unfavorable for cultivating.Cell is inoculated on the PDMS seal of (i) gained, passes into nutrient solution.Composite structure surface on PDMS seal, large-sized structure is conducive to cell attachment, and small scale structures is conducive to cell attachment.
Compared with prior art, beneficial effect of the present invention is embodied in:
The present invention propose based on photosensitive seal across the micro-manufacture method of size, use at present very ripe photosensitive seal as the core masterplate of micro-manufacture.The present invention does not need the harsh conditions of clean room, does not need absolute even curface, does not need expensive photoetching technique, have flexible and convenient operation, machining precision advantages of higher.
Core part of the present invention is to have found that photosensitive pad material is through multiexposure, multiple exposure, still do not lose the performance of size transmission (mask transfer printing).Thus can utilizing this characteristic, by exposing different size structure mask successively, realizing going out two-stage and even multilevel hierarchy in same Stamp pad surface transfer.
Accompanying drawing explanation
Fig. 1 is the structural representation of multistage composite structure;
Fig. 2 is that photosensitive seal two-layer configuration makes schematic diagram; Wherein (a) is depicted as the structural drawing making mask N1; B () carries out for utilizing mask N1 the structural representation exposed in photosensitive seal machine; C () is for utilizing the structural representation of the photosensitive seal pad after mask N1 exposure; D () is depicted as the structural drawing making mask N2; E () carries out for utilizing mask N2 the structural representation exposed in photosensitive seal machine; F () is for utilizing the structural representation of the photosensitive seal pad after mask N2 exposure;
Fig. 3 is the photosensitive seal two-layer configuration figure that embodiment makes, and wherein (a) is the structural representation of the mask N1 being 10 microns of opaque circles with diameter; B () is the structural representation of the mask N2 being 230 microns of opaque circles with diameter; C () is photosensitive seal surface two-layer configuration planimetric map after exposure, d) be the three-dimensional configuration figure of the photosensitive seal pad after the exposure that obtains, e () is partial enlarged drawing in (c), (f) is the partial enlarged drawing of (d).
Embodiment
According to embodiment, the present invention will be further described below:
The present invention also can be applicable to the making across scale micro-structure of more than three grades or three grades, and method is as follows:
Based on multiexposure, multiple exposure across a scale micro-structure manufacture method, step mainly comprises:
(1) microstructure of first design, the size of microstructure is classified, assuming that be of a size of i (i1<i2<i3 ... <in) for each size, in mask substrate, make mask respectively, mask correspondence is followed successively by N1, N2, N3 ... Nn.
(2) be placed in photosensitive seal machine to photosensitive pad, carry out without mask pre-exposure, such as arranging exposure power is 87, and exposure frequency is 2, makes seal smooth surface.
(3) N1 and the photosensitive pad after (2) process are fitted tightly and be placed in photosensitive seal machine, expose, obtain seal surface and have i1 dimensional structure, again the photosensitive pad laminating of N2 mask and previous step process is exposed, obtain seal surface and have composite structure, this multiple structural features for have i1 dimensional structure on i2 dimensional structure.The photosensitive pad laminating of N3 mask and previous step process exposed, obtaining seal surface has 3 grades of composite structures, and this multiple structural features has i2 dimensional structure for stacking on i3 dimensional structure, i2 dimensional structure has i1 dimensional structure again.The photosensitive pad laminating of Nn mask and previous step process exposed, obtaining seal surface has n level composite structure, and its size characteristic is that in-i1 stacks gradually up again.As shown in Figure 1.
Now in conjunction with schematic view illustrating two-stage composite structure method for making:
(1) according to required microstructure size, classify, size is i1, i2; I1<i2, respective production mask N1, N2; As shown in (a), (d) in Fig. 2.
(2) be placed in photosensitive seal machine to photosensitive pad, carry out without mask pre-exposure, arranging exposure power is 87, and exposure frequency is 2, makes seal smooth surface.
(3) N1 and the photosensitive pad after (2) process are fitted tightly and be placed in photosensitive seal machine glass surface middle, make its uniform exposure, obtaining seal surface has i1 dimensional structure, as shown in (b), (c) in Fig. 2.
(4) photosensitive pad processed through (3) by N2 mask again fits tightly and is placed in photosensitive seal machine glass surface middle, make its uniform exposure, obtain seal surface and have composite structure, this multiple structural features for have i1 dimensional structure on i2 dimensional structure.As shown in (e), (f) in Fig. 2.
Concrete case study on implementation: two-stage composite structure
(1) microstructure of design, classifies to microstructure size, and required small scale structures is the cylinder of diameter 10 microns, coarse scale structures to be diameter the be cylinder of 230 microns.For two kinds of sizes, mask substrate obtains mask, for diameter is 10 microns of circles on N1 mask, wherein circle is light tight, as shown in (a) in Fig. 3; N2 mask is the circle that diameter is 230 microns, wherein circle is light tight, as shown in (b) in Fig. 3.This example uses mask to be metal chromium plate mask.
(2) photosensitive pad is cut to suitable dimension, is placed in photosensitive seal machine glass surface middle, carries out without mask pre-exposure.Exposure power is 87, and exposure frequency is 2, makes seal smooth surface.
(3) photosensitive pad after being processed in N1 mask and (2) fits tightly, and arranges exposure power, and be preferably 85-87, exposure frequency is 7-9, and it is 87 that this example implements exposure power, and exposure frequency is 7.The small column projection that diameter is 10 microns is obtained after exposure.
(4) photosensitive pad after being processed in N2 mask and (3) fits tightly, and arranges exposure power, and be preferably 83-85, exposure frequency is 1-3, and it is 85 that this example implements exposure power, and exposure frequency is 2.
(5) photosensitive seal obtained has two-stage composite structure, and 230 microns of cylinders are superimposed with 10 microns of small columns.As shown in Fig. 3 (c)-(f).Wherein (c) is photosensitive seal surface two-layer configuration planimetric map, and (e) is partial enlarged drawing in (c), and (d) three-dimensional configuration figure for obtaining, (f) is the partial enlarged drawing of (d).Large scale height is at micron order, and small size height is at nanoscale.In the present embodiment, 230 microns of cylinder height are 1.2 microns, and 10 microns of cylinder height are 177.2 nanometers.
The application of two-stage composite structure is a lot, is used for hydrophobic treatments and the cell and tissue structrue on surface.The structure of occurring in nature lotus leaf is micro-nano compound structure, is now further elaborated for cell and tissue structrue.The PDMS chip of two-stage composite structure is had to be that the growth of cell provides one and for its attachment and the environment supported, can be conducive to cell chulture.Wherein large structure can be beneficial to cell attachment growth, and the sucker that little structure is then conducive to cell adheres on it creeps.
(1) liquid PDMS and hardening agent are mixed according to certain mass ratio, be generally 10:1, stir and put into vacuum drying chamber de-bubble, be generally half an hour.Then be poured into the photosensitive seal surface that (5) obtain, take off after solidification to be heated, heating-up temperature is 75 degree, and the heat time is generally 2 hours, and the photosensitive seal that namely acquisition (5) obtains on PDMS seal bears structure.
(2) cell is difficult to attachment on smooth surface, is unfavorable for cultivating.Cell is inoculated on the PDMS seal of (6) gained, passes into nutrient solution.Composite structure surface on PDMS seal, 230 micrometer structures are conducive to cell attachment, and small scale structures is conducive to cell attachment.
Claims (9)
1. based on multiexposure, multiple exposure across a scale micro-structure manufacture method, it is characterized in that, comprise the steps:
(1) according to size, classify across size microstructures to be processed, undersized structure is primary structure, and large-sized structure is secondary structure, makes the primary structure mask corresponding with primary structure and the secondary structure mask corresponding with primary structure respectively;
(2) mask is placed in photosensitive seal machine, exposure-processed is carried out to the photosensitive seal pad in it, first use primary structure mask, exposure transfer printing obtains the Stamp pad containing primary structure, then based on this Stamp pad, use secondary structure mask exposure, the final photosensitive seal pad obtained across mesostructure.
2. according to claim 1 based on multiexposure, multiple exposure across scale micro-structure manufacture method, it is characterized in that, in step (1), adopt laser or inkjet printing primary structure to be processed or secondary structure to be printed on translucent template or film film, make respectively and obtain primary structure mask or secondary structure mask.
3. according to claim 1 based on multiexposure, multiple exposure across scale micro-structure manufacture method, it is characterized in that, primary structure mask or secondary structure mask adopt metal mask.
4. according to claim 1 based on multiexposure, multiple exposure across scale micro-structure manufacture method, it is characterized in that, in step (2), primary structure adds man-hour, and exposure power is 85-87, and exposure frequency is 7-9 time; Secondary structure adds man-hour, and exposure power is 83-85, and exposure frequency is 1-3 time.
5. according to claim 1 based on multiexposure, multiple exposure across scale micro-structure manufacture method, it is characterized in that, in step (2), on photosensitive seal pad, the difference in height of exposure region and unexposed area is 10-90 μm.
6. according to claim 1 based on multiexposure, multiple exposure across scale micro-structure manufacture method, it is characterized in that, the region that on described secondary structure mask, secondary structure is corresponding is zone of opacity.
7. according to claim 1 based on multiexposure, multiple exposure across scale micro-structure manufacture method, it is characterized in that, in step (2), before utilizing primary structure mask to the exposure of photosensitive seal pad, first carry out without mask pre-exposure to photosensitive seal pad, pre-exposure power is 85-87, and exposure frequency is 2-3 time.
8. according to claim 1 based on multiexposure, multiple exposure across scale micro-structure manufacture method, it is characterized in that, after step (2) completes, also comprise: liquid transfer film material is poured into the photosensitive seal pad surface that step (2) obtains by (i), heating-up temperature is 60-80 DEG C, heat time is 1.5-3 hour, solidifies the photosensitive seal obtained and bears structure.
9. according to claim 8 based on multiexposure, multiple exposure across scale micro-structure manufacture method, it is characterized in that, described liquid transfer film material is the curing agent mixture of liquid PDMS and its correspondence, and the mass ratio of PDMS and hardening agent is 8-15:1.
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| US20040165159A1 (en) * | 2002-11-12 | 2004-08-26 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| CN101258447A (en) * | 2005-09-09 | 2008-09-03 | 株式会社Ⅴ技术 | Exposure apparatus |
| CN102289155A (en) * | 2011-08-12 | 2011-12-21 | 中国科学技术大学 | Photoetching machine based on ultraviolet LED (Light Emitting Diode) light source |
| JP2014013303A (en) * | 2012-07-04 | 2014-01-23 | Toppan Printing Co Ltd | Exposure device for color filter and method for manufacturing color filter |
| CN104437689A (en) * | 2014-11-21 | 2015-03-25 | 浙江大学 | Manufacturing method for microfluidic paper-based analytical device based on photosensitive seal printing |
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2015
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040165159A1 (en) * | 2002-11-12 | 2004-08-26 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| CN101258447A (en) * | 2005-09-09 | 2008-09-03 | 株式会社Ⅴ技术 | Exposure apparatus |
| CN102289155A (en) * | 2011-08-12 | 2011-12-21 | 中国科学技术大学 | Photoetching machine based on ultraviolet LED (Light Emitting Diode) light source |
| JP2014013303A (en) * | 2012-07-04 | 2014-01-23 | Toppan Printing Co Ltd | Exposure device for color filter and method for manufacturing color filter |
| CN104437689A (en) * | 2014-11-21 | 2015-03-25 | 浙江大学 | Manufacturing method for microfluidic paper-based analytical device based on photosensitive seal printing |
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