CN105163561A - Cooling device for electronic component packaging - Google Patents
Cooling device for electronic component packaging Download PDFInfo
- Publication number
- CN105163561A CN105163561A CN201510492222.4A CN201510492222A CN105163561A CN 105163561 A CN105163561 A CN 105163561A CN 201510492222 A CN201510492222 A CN 201510492222A CN 105163561 A CN105163561 A CN 105163561A
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- CN
- China
- Prior art keywords
- electronic devices
- cooling device
- housing
- components
- hollow structure
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention discloses a cooling device for electronic component packaging. The cooling device comprises a shell and an electronic component body arranged in the shell and is characterized in that the shell is of a hollow structure, and the hollow structure is filled with cooling water. By filling the cooling water in the shell, the electronic component body at the high temperature is cooled using the cooling water. The cooling device is suitable for places of high temperature and heat such as power plants and heating furnaces.
Description
Technical field
The present invention relates to a kind of electronic devices and components encapsulation cooling device, particularly relate to a kind of compact conformation, good cooling results electronic devices and components encapsulation cooling device.
Background technology
Electronic devices and components encapsulation is used for the use of store electrons components and parts, current electronic devices and components encapsulation mostly is closed shell structure, once electronic devices and components because overheated being damaged needs repairing, just need to carry out tweezer by aid, so electronic devices and components are encapsulated as leptosomatic, the problem of tweezer inconvenience will be there is when tweezer, if during the damaged maintenance activity of a certain region occurrence of large-area, work difficulty will increase greatly, therefore how timely to carry out cooling to electronic devices and components encapsulation necessary, especially in power plant, the high temperature height thermal fields such as heating furnace close and use.
Summary of the invention
Technical problem to be solved by this invention is to provide the cooling device of a kind of electronic devices and components encapsulation, has the feature of compact conformation, good cooling results.
For solving the problems of the technologies described above, technical scheme of the present invention is: a kind of cooling device of electronic devices and components encapsulation, the electronic devices and components body comprising housing and arrange in the housing, its innovative point is: described housing is hollow structure, is injected with cooling water in described hollow structure.
Preferably, be provided with several baffler in described hollow structure, described baffler is arranged on the inwall of hollow structure.
Preferably, in described several baffler, baffler and adjacent baffle stagger and arrange.
Preferably, described housing is provided with the water inlet and delivery port that are communicated with described hollow structure, described water inlet is connected with heat exchanger by pipeline.
Preferably, described housing is provided with several air-vent be in communication with the outside.
Preferably, described housing is provided with the maintenance manhole for overhauling the electronic devices and components body be placed in housing.
Preferably, described housing keeps in repair manhole position and be provided with hinged removable cover on the housing, the area of described removable cover is more than or equal to the area of described maintenance manhole.
The invention has the advantages that: the present invention, by injecting cooling water in the housing, utilizes cooling water to lower the temperature to the high temperature that electronic devices and components body produces, cooling device of the present invention is applicable to the use occasion that the high temperature such as power plant, heating furnace height thermal field closes.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.
Fig. 1 is the structural representation of the cooling device of a kind of electronic devices and components encapsulation of the present invention.
In figure: 1-housing, 2-electronic devices and components body, 3-baffler, 4-water inlet, 5-delivery port, 6-air-vent, 7-keep in repair manhole, 8-removable cover.
Embodiment
The cooling device of electronic devices and components encapsulation of the present invention, the electronic devices and components body 2 comprising housing 1 and arrange within the case 1, the temperature that the temperature produced in order to the electronic devices and components that leave in time and the high temperature overall situation at scene are brought, housing 1 is hollow structure, is injected with cooling water in hollow structure.The present invention, by injecting cooling water within the case 1, utilizes cooling water to lower the temperature to the high temperature that electronic devices and components body 2 produces, and cooling device of the present invention is applicable to the use occasion that the high temperature such as power plant, heating furnace height thermal field closes.
In order to extend the time that cooling water stops within the case 1, strengthen cooling effect, be provided with several baffler 3 in hollow structure, baffler 3 is arranged on the inwall of hollow structure.In order to play good drainage effect, in several baffler 3, baffler 3 and adjacent baffle 3 stagger and arrange, can increase cooling water conduct route further by setting of baffler 3 and adjacent baffle 3 being staggered, thus the time of staying of prolongation cooling water.
For the ease of changing water in time to cooling water in housing 1, housing 1 is provided with the water inlet 4 and delivery port 5 that are communicated with hollow structure, water inlet 4 is connected with heat exchanger by pipeline.
The temperature produced due to the enclosed construction of housing 1 cannot leave the very first time, by being provided with several air-vent 6 be in communication with the outside on housing 1, thus can realize thermal convection exchange very well.For the ease of maintenance personal, the electronic devices and components in encapsulation being overhauled, housing 1 being provided with the maintenance manhole 7 for overhauling the electronic devices and components body 2 be placed in housing 1.In order to prevent entering a large amount of dust blocking maintenance manhole 7 in large-area maintenance manhole 7, housing 1 keeps in repair manhole 7 position and be provided with the removable cover 8 be hinged on housing 1, the area of removable cover 8 is more than or equal to the area of maintenance manhole 7.
Finally it should be noted that, above embodiment is only in order to illustrate technical scheme of the present invention and non-limiting technical scheme, those of ordinary skill in the art is to be understood that, those are modified to technical scheme of the present invention or equivalent replacement, and do not depart from aim and the scope of the technical program, all should be encompassed in the middle of right of the present invention.
Claims (7)
1. a cooling device for electronic devices and components encapsulation, the electronic devices and components body comprising housing and arrange in the housing, is characterized in that: described housing is hollow structure, is injected with cooling water in described hollow structure.
2. the cooling device of a kind of electronic devices and components encapsulation as claimed in claim 1, it is characterized in that: be provided with several baffler in described hollow structure, described baffler is arranged on the inwall of hollow structure.
3. the cooling device of a kind of electronic devices and components encapsulation as claimed in claim 2, is characterized in that: in described several baffler, baffler and adjacent baffle stagger and arrange.
4. the cooling device of a kind of electronic devices and components encapsulation as claimed in claim 1, is characterized in that: described housing is provided with the water inlet and delivery port that are communicated with described hollow structure, described water inlet is connected with heat exchanger by pipeline.
5. the cooling device of a kind of electronic devices and components encapsulation as claimed in claim 1, is characterized in that: described housing is provided with several air-vent be in communication with the outside.
6. the cooling device of a kind of electronic devices and components encapsulation as claimed in claim 1, is characterized in that: described housing is provided with the maintenance manhole for overhauling the electronic devices and components body be placed in housing.
7. the cooling device of a kind of electronic devices and components encapsulation as claimed in claim 6, it is characterized in that: described housing keeps in repair manhole position and be provided with hinged removable cover on the housing, the area of described removable cover is more than or equal to the area of described maintenance manhole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510492222.4A CN105163561A (en) | 2015-08-12 | 2015-08-12 | Cooling device for electronic component packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510492222.4A CN105163561A (en) | 2015-08-12 | 2015-08-12 | Cooling device for electronic component packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105163561A true CN105163561A (en) | 2015-12-16 |
Family
ID=54804285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510492222.4A Pending CN105163561A (en) | 2015-08-12 | 2015-08-12 | Cooling device for electronic component packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105163561A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110662312A (en) * | 2019-08-30 | 2020-01-07 | 扬州昊天电热科技有限公司 | Ceramic heating circle cooling device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05267875A (en) * | 1992-03-18 | 1993-10-15 | Nec Corp | Water cooling device for printed board |
| CN2234540Y (en) * | 1995-08-11 | 1996-09-04 | 朱增良 | Automatic air type valve |
| US20040104022A1 (en) * | 2002-11-01 | 2004-06-03 | Cooligy, Inc. | Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device |
| CN101912725A (en) * | 2010-08-12 | 2010-12-15 | 苏州顶裕节能设备有限公司 | Sealing device for maintenance damper of washing tower |
| CN202816913U (en) * | 2012-10-24 | 2013-03-20 | 中国电子科技集团公司第三十八研究所 | Microchannel liquid-cooled heat sink device |
| CN103025134A (en) * | 2012-12-21 | 2013-04-03 | 中国北车集团大连机车研究所有限公司 | Double-wall efficient water-cooling base plate |
| CN202906750U (en) * | 2012-11-07 | 2013-04-24 | 泰州市华强照明器材有限公司 | Isolation and voltage-stabilization single-path/double-path output AC-DC power supply module. |
| CN103137573A (en) * | 2011-11-28 | 2013-06-05 | 三星电机株式会社 | Power module package |
-
2015
- 2015-08-12 CN CN201510492222.4A patent/CN105163561A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05267875A (en) * | 1992-03-18 | 1993-10-15 | Nec Corp | Water cooling device for printed board |
| CN2234540Y (en) * | 1995-08-11 | 1996-09-04 | 朱增良 | Automatic air type valve |
| US20040104022A1 (en) * | 2002-11-01 | 2004-06-03 | Cooligy, Inc. | Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device |
| CN101912725A (en) * | 2010-08-12 | 2010-12-15 | 苏州顶裕节能设备有限公司 | Sealing device for maintenance damper of washing tower |
| CN103137573A (en) * | 2011-11-28 | 2013-06-05 | 三星电机株式会社 | Power module package |
| CN202816913U (en) * | 2012-10-24 | 2013-03-20 | 中国电子科技集团公司第三十八研究所 | Microchannel liquid-cooled heat sink device |
| CN202906750U (en) * | 2012-11-07 | 2013-04-24 | 泰州市华强照明器材有限公司 | Isolation and voltage-stabilization single-path/double-path output AC-DC power supply module. |
| CN103025134A (en) * | 2012-12-21 | 2013-04-03 | 中国北车集团大连机车研究所有限公司 | Double-wall efficient water-cooling base plate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110662312A (en) * | 2019-08-30 | 2020-01-07 | 扬州昊天电热科技有限公司 | Ceramic heating circle cooling device |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151216 |