CN105355667A - Resonant tunneling diode for generating negative differential resistance - Google Patents

Resonant tunneling diode for generating negative differential resistance Download PDF

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Publication number
CN105355667A
CN105355667A CN201510694974.9A CN201510694974A CN105355667A CN 105355667 A CN105355667 A CN 105355667A CN 201510694974 A CN201510694974 A CN 201510694974A CN 105355667 A CN105355667 A CN 105355667A
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region
gan
emitter
isolated area
collector
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CN201510694974.9A
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Chinese (zh)
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高博
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Sichuan University
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Sichuan University
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861Diodes
    • H01L29/88Tunnel-effect diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/20Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
    • H01L29/2003Nitride compounds

Abstract

The invention discloses a novel structure of an active region of a resonant tunneling diode for generating negative differential resistance. The structure can generate ampere output current, and can generate watt terahertz signal output power when applied to a terahertz signal source design; a quantum well in the active region of the resonant tunneling diode is formed by a AlGaN/GaN/AlGaN double-barrier and single-well structure; the quantum well is clamped between a Al*Ga1-xN isolation region with a ladder heterostructure and a GaN isolation region; the three-layer sandwich structure is also clamped between an n-type AlN emitter region and an n-type GaN collector region; the collector region and the emitter region are ohmic contact regions; heavy doping is adopted by the collector region and the emitter region; and the other regions are not doped. The emitter region and the collector region play a role in forming an ohmic contact and are connected with two electrodes; the quantum well region plays a role in forming a quantum resonant tunneling effect, so as to obtain the negative differential resistance; and the isolation region with the ladder heterostructure plays roles in forming a two-dimensional electron gas, reducing a depletion electric field of the collector region and improving output current. Theoretical analysis and temperature simulation are carried out at a room temperature (300K) to obtain a negative differential resistance region with the maximal current in a research report of an existing resonant tunneling diode.

Description

A kind of resonance tunnel-through diode producing negative differential resistance
Technical field
The present invention relates to electronic component technology field, particularly relate to a kind of GaN base resonance tunnel-through diode device, can be applicable to produce Terahertz oscillator signal.
Background technology
Terahertz frequency range has wide application prospects and is subject to the attention of scientific circles in ultrahigh speed wireless communication technology and spectral imaging technology.In order to realize these application, small and continuous print THz source is key technology place.As one of terahertz sources source electricity device, resonance tunnel-through diode (RTD) is all research focus all the time.There is bottleneck at Terahertz Applied research fields in GaAs base RTD, such as: higher frequency restriction, power output and working temperature.
GaN base RTD, because GaN material has high mobility, temperature stability and broad stopband width characteristic, is expected to design high power THz source under room temperature, receives increasing concern.The theory analysis of the GaN base resonance tunnel-through diode structure of current research and practical devices test show R=-67 Europe, the GaN base RTD of CPVR:1.08, power output 0.53mW.
AlGaN and GaN heterostructure interface produces polarization charge due to lattice defect, forms two-dimensional electron gas.In invention, have employed ladder heterostructure isolated area, improve carrier mobility by two-dimensional electron gas, add emitter region Carrier Injection Efficiency; Decrease collector region simultaneously and exhaust electric field, thus reduce carrier transport time in resonance tunnel-through diode.Theory analysis shows that this device obtains negative differential resistance, and in this region, have the excursion of larger output current and electric current, voltage, can improve power output to W level.
Summary of the invention
The object of the invention is to the deficiency for device architecture in existing result of study, propose one and there is larger output current, produce the GaN base resonance tunnel-through diode structure of negative differential resistance, as shown in Figure 1.
The key of the technology of the present invention is: on the basis of existing GaN base resonance tunnel-through diode structure, and design staged heterostructure is as the isolated area of emitter region to quantum well.
In GaN base resonance tunnel-through diode structure of the present invention, quantum well is by Al 0.2ga 0.8n/GaN/Al 0.2ga 0.8n double potential barrier unipotential well structure forms, and adopts the AlGaN of low al composition to grow Lattice Matching in GaN potential well, thus improves heterojunction quality, reduce polarized electric field, suppress the degradation phenomena of negative differential resistance characteristic.Be clipped in by this quantum well structure between the N-shaped AlN emitter region of 100nm and the N-shaped GaN collector region of 100nm, collector region and emitter region are ohmic contact regions, and adopt heavy doping, doping content is 1 × 10 19cm -3; The Al of the ladder heterojunction of one deck 5nm is devised between quantum well and emitter region xga 1-xn isolated area, in isolated area, the component x of Al is from the close linear x=0 reduced near potential barrier of emitter region end x=1; Collector region end separator adopts GaN, and these regions all undope.Fig. 1 presents the resonance tunnel-through diode structure chart of band heterostructure buffering area, and Fig. 2 presents the static conduction band profile of this structure.
The present invention has carried out theory analysis to designed GaN base resonance tunnel-through diode, adopts sectional area to be 6 × 5um in analytic process to designed device 2, electrode tip contact resistivity is set to 4.36 × 10 -3Ω cm 2in order to consistent with actual parasitic series resistance.At room temperature, as shown in Figure 3, this is the negative differential resistance region that in the report of this device research work at present, gained output current is maximum to gained simulation result for theory analysis and simulated temperature.
Accompanying drawing explanation
Fig. 1 is the GaN base resonance tunnel-through diode active area structure schematic diagram of band staged isolated area.
Fig. 2 is static conduction band profile.
Fig. 3 is I-V performance plot.

Claims (6)

1. one kind produces active area in the resonance tunnel-through diode of negative differential resistance and includes emitter region, collector region, quantum well region, staged heterostructure emitter isolated area and GaN collector electrode isolated area.
2. according to the active area subregion composition active area structure of claims 1: quantum well is clipped between staged heterostructure emitter isolated area and GaN collector electrode isolated area, and resulting structures is clipped in again between emitter region and collector region and forms integrated active district.
3. set up novel GaN base resonance tunnel-through diode theoretical analysis model structure according to claims 2, this structure is described below from top to bottom: the emitter electrode district of device, the emitter region heavily doped region of 100nm thickness, ladder heterostructure form the Al of 5nm isolated area, 1.5nm 0.2ga 0.8the GaN potential well of N potential barrier, 1.5nm, the Al of 1.5nm 0.2ga 0.8the collector electrode district of the GaN isolated area of N potential barrier, 5nm, the collector region heavily doped region of 100nm thickness, device.
4., according to the GaN base resonance tunnel-through diode active area structure of claims 2 and the theoretical analysis model of claims 3, it is characterized in that: the Al having one deck ladder heterostructure between quantum well and emitter region xga 1-xn isolated area, in isolated area, the component x of Al is near the linear x=0 reduced near quantum well potential barrier of emitter region end x=1, divides in order to 5 layers in theoretical analysis model.
5. according to the isolated area of the ladder heterostructure of claims 4, it is characterized in that defining two-dimensional electron gas, improve carrier mobility, reduce collector depletion region electric field, improve output current, obtain the negative differential resistance region of maximum current in the report of this device research at present.
6., according to theory analysis and the simulation result of claims 5, it is characterized in that this device application in the design of terahertz signal source, a watt terahertz signal for level power output can be produced.
CN201510694974.9A 2015-10-26 2015-10-26 Resonant tunneling diode for generating negative differential resistance Pending CN105355667A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105895670A (en) * 2016-04-15 2016-08-24 四川大学 Resonant tunneling diode provided with GaN quantum well
CN110310989A (en) * 2019-07-23 2019-10-08 上海科技大学 A kind of device architecture of double heterojunction unipolar transistor
CN110729394A (en) * 2019-10-12 2020-01-24 深圳第三代半导体研究院 Negative resistance type GaN pressure sensor and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1091945C (en) * 1995-03-07 2002-10-02 摩托罗拉公司 Ultra-small semiconductor devices and methods of fabricating and contacting
US7002175B1 (en) * 2004-10-08 2006-02-21 Agency For Science, Technology And Research Method of making resonant tunneling diodes and CMOS backend-process-compatible three dimensional (3-D) integration
CN104733545A (en) * 2015-02-17 2015-06-24 天津大学 RTD with emitter region In content gradual change collector region and high-In transition layers
CN104752524A (en) * 2015-02-17 2015-07-01 天津大学 Resonant tunneling diode device with ultra-narrow double wells

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1091945C (en) * 1995-03-07 2002-10-02 摩托罗拉公司 Ultra-small semiconductor devices and methods of fabricating and contacting
US7002175B1 (en) * 2004-10-08 2006-02-21 Agency For Science, Technology And Research Method of making resonant tunneling diodes and CMOS backend-process-compatible three dimensional (3-D) integration
CN104733545A (en) * 2015-02-17 2015-06-24 天津大学 RTD with emitter region In content gradual change collector region and high-In transition layers
CN104752524A (en) * 2015-02-17 2015-07-01 天津大学 Resonant tunneling diode device with ultra-narrow double wells

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105895670A (en) * 2016-04-15 2016-08-24 四川大学 Resonant tunneling diode provided with GaN quantum well
CN110310989A (en) * 2019-07-23 2019-10-08 上海科技大学 A kind of device architecture of double heterojunction unipolar transistor
CN110729394A (en) * 2019-10-12 2020-01-24 深圳第三代半导体研究院 Negative resistance type GaN pressure sensor and preparation method thereof

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