CN105655498A - OLED display device and packaging method thereof - Google Patents
OLED display device and packaging method thereof Download PDFInfo
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- CN105655498A CN105655498A CN201410714360.8A CN201410714360A CN105655498A CN 105655498 A CN105655498 A CN 105655498A CN 201410714360 A CN201410714360 A CN 201410714360A CN 105655498 A CN105655498 A CN 105655498A
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Abstract
The invention discloses an OLED display device and a packaging method thereof. The OLED display device is composed of a first substrate, a second substrate, a first packaging structure and a second packaging structure. The first packaging structure is arranged between the first substrate and the second substrate; and thus at least one organic luminescence display element is sealed into the space encircled by the first substrate, the second substrate and the first packaging structure. The second packaging structure is arranged in a predetermined area between the first substrate, the second substrate and the first packaging structure. According to the invention, a spraying range and a spraying value of a packaging material can be controlled precisely; the sealing performance and the mechanical strength of the OLED display device can be guaranteed; and the packaging material amount and the production cost can be reduced.
Description
Technical field
The present invention relates to a kind of display unit and method for packing, espespecially a kind of for OLED display and OLED encapsulation method.
Background technology
OLED display device is a kind of current mode light emitting semiconductor device based on organic materials. Its typical structure is that the luminous organic material making one layer of tens nanometer thickness on ito glass makes luminescent layer, has the metal electrode of one layer of low-power consumption above luminescent layer. When being added with voltage on electrode, luminescent layer just produces optical radiation. The luminescence mechanism of OLED and process inject electronics and hole respectively, and the electronics being injected into and hole are transmitted in organic layer, and in luminescent layer compound, thus stimulated luminescence layer molecule produce singlet exciton, singlet exciton attenuation and luminous. The luminous organic material and the cathode material that use in OLED are responsive especially to water and oxygen, too moist or oxygen content is too high all will affect the work-ing life of OLED. Extending to reach the work-ing life of design, the encapsulation of OLED is just had higher requirement by this.
Existing coating housing glue adopts immerseable substantially. As shown in Figure 1; it is that the structure 20 tentatively encapsulated by glass cement is immersed in packaged material 151; with immersion way (siphon principle), packaged material 151 is covered to the substrate outside glass cement and the region between cover plate, but immersion way needs extra to increase light resistance protection packaged material pollutes luminous zone to avoid.
Summary of the invention
For prior art Problems existing, an object of the present invention is the OLED display providing a kind of good airproof performance, physical strength high.
The OLED encapsulation method another object of the present invention is to provide a kind of good airproof performance, saving packaged material.
The OLED display of the present invention, comprising:
One first substrate;
One second substrate;
One first encapsulation structure, is arranged between described first substrate and described second substrate, to be sealed in by least one organic luminescence display unit in described first substrate, described second substrate and described first space that surrounds of encapsulation structure;
One the 2nd encapsulation structure, the prospective region being arranged between the outside surface of described first substrate, described second substrate and described first encapsulation structure.
Further, described first encapsulation structure and described 2nd encapsulation structure are arranged between described first substrate and described second substrate annularly, and described 2nd encapsulation structure is in close proximity to described first encapsulation structure.
Further, described 2nd encapsulation structure is arranged at described prospective region by ink-jetting style.
Further, described prospective region is the recess region that formed of outside surface of described first substrate, described second substrate and described first encapsulation structure; Described 2nd encapsulation structure is full of described recess region by described ink-jetting style, makes the described 2nd encapsulation outside surface of structure and described first substrate, the edge of second substrate flushes.
The OLED encapsulation method of the present invention, comprises the steps:
1) one first encapsulation structure is set between a first substrate and a second substrate, to be sealed in by least one organic luminescence display unit in described first substrate, described second substrate and described first space that surrounds of encapsulation structure;
2) utilize ink-jetting style described first substrate, described second substrate and described first encapsulation structure outside surface between prospective region arrange one the 2nd encapsulation structure.
Further, the described one first encapsulation structure that arranges between a first substrate and a second substrate is specially: coated glass glue between described first substrate and described second substrate, and on described second substrate, utilize glass cement described in laser illumination, make described glass cement and described first substrate and described second substrate sealed sintering.
Further, described glass cement is arranged between described first substrate and described second substrate annularly, and described 2nd encapsulation structure is in close proximity to described first encapsulation structure.
Further, described utilize the prospective region of ink-jetting style between the outside surface of described first substrate, second substrate and described first encapsulation structure to arrange one the 2nd encapsulation structure to be specially: adjustment shower nozzle is at a distance of the distance of described prospective region, the packaged material of a predetermined amount is sprayed so that it is fill described prospective region to form described 2nd encapsulation structure to described prospective region.
Further, described prospective region is the recess region that formed of outside surface of described first substrate, described second substrate and described first encapsulation structure, described 2nd encapsulation structure is full of described recess region by described ink-jetting style, makes the described 2nd encapsulation outside surface of structure and described first substrate, the edge of second substrate flushes.
Further, the described predetermined amount spraying packaged material depends on the distance of described shower nozzle at a distance of described prospective region.
The present invention is convenient to accurately control spray range and the spraying amount of packaged material, while ensure that OLED display stopping property, physical strength, reduces consumption and the production cost of packaged material.
Accompanying drawing explanation
Fig. 1 is the existing schematic diagram being coated with housing glue by immersion way;
Fig. 2 is the schematic diagram of the OLED encapsulation method of the present invention;
Fig. 3 is A portion enlarged diagram in Fig. 2;
Fig. 4 is the schematic diagram of two layers of encapsulation structure of the OLED display of the present invention.
Embodiment
As shown in Figure 4, the OLED display 10 of the present invention, comprise: first substrate 11, second substrate 12, first encapsulation structure 14 and the 2nd encapsulation structure 15, described first encapsulation structure 14 is arranged between described first substrate 11 and described second substrate 12, to be sealed in by least one organic luminescence display unit 13 in described first substrate 11, described second substrate 12 and described first space that surrounds of encapsulation structure 14. Described 2nd encapsulation structure 14 is arranged at described first substrate 11 and the prospective region 16 between second substrate 12 and described first encapsulation structure 14.
Described first encapsulation structure 14 and described 2nd encapsulation structure 15 can in being arranged between described first substrate 11 and described second substrate 12 annularly, and described 2nd encapsulation structure 15 be in close proximity to described first encapsulate structure 14. Described 2nd encapsulation structure 15 is arranged at described prospective region 16 by ink-jetting style, to improve the thrust of spraying packaged material. So can accurately control spraying position and the consumption of packaged material, and then ensure that the 2nd encapsulation structure 15 can be close to described first encapsulation structure 14. Therefore, it is possible to eliminate in encapsulation structure the gap stayed between the first encapsulation structure and the 2nd encapsulation structure, it is to increase the physical strength simultaneously contributing to improving the display unit of OLED of stopping property.
As shown in Figure 3, described prospective region 16 be a part 111 for described first substrate 11, the recess region that formed of outside surface 141 of a part 121 for second substrate 12 and described first encapsulation structure 14; By controlling, shower nozzle in described ink-jetting style can be full of described recess region at a distance of distance and the flow of prospective region 16 to described 2nd encapsulation structure 15, make the described 2nd encapsulation outside surface of structure 15 and described first substrate 11, the edge of second substrate 12 flushes, thus saves follow-up cleaning further.
The OLED display of the present embodiment has good airproof performance, physical strength advantages of higher.
The OLED encapsulation method of the present invention, as shown in Figure 2, comprises the steps:
1) the first encapsulation structure 14 is set between first substrate 11 and second substrate 12, to be sealed in by least one organic luminescence display unit 13 in described first substrate 11, described second substrate 12 and described first space that surrounds of encapsulation structure 14;
2) utilize ink-jetting style that the 2nd encapsulation structure 15 is set at described first substrate 11 and the prospective region 16 between second substrate 12 and described first encapsulation structure 14.
In the present embodiment, the first encapsulation structure 14 is selectively glass cement, coated glass glue between described first substrate 11 and described second substrate 12, and above described second substrate 12, utilize glass cement described in laser illumination, make described glass cement and described first substrate 11 and described second substrate 12 sealed sintering. Wherein, described glass cement is arranged between described first substrate 11 and described second substrate 12 annularly.
Needed to adjust the distance of shower nozzle 22 at a distance of described prospective region 16 before spraying, the packaged material of a predetermined amount is sprayed to described prospective region 16, can ensure that packaged material fills up described prospective region 16 just, the edge making the formed in prospective region 16 the 2nd encapsulation structure 15 just and substrate 11, cover plate 12 edge put down together, and so that the outside surface of the first encapsulation structure 14 is in close proximity to the internal surface of the 2nd encapsulation structure 15, display unit 10 as shown in Figure 4 can be obtained. Wherein, the recess region that the outside surface 141 of a part 111, a part 121 for described 2nd cover plate 12 and described first encapsulation structure that prospective region 16 is described first substrate 11 is formed, due to first encapsulation structure annular be arranged between substrate 11, cover plate 12, prospective region 16 is also correspondingly an annular groove. Shower nozzle 22 is relevant to the spray speed of the predetermined amount of spraying packaged material and shower nozzle 22 at a distance of the distance of described prospective region 16, can accurately control spray range and the consumption of packaged material by adjusting above three parameters of shower nozzle 22.
The method for packing of the present embodiment is convenient to accurately control spray range and the spraying amount of packaged material, while ensure that OLED display panel stopping property, reduces consumption and the production cost of packaged material.
Below illustrate and describe the illustrative embodiments of the present invention specifically. It is to be understood that the invention is not restricted to disclosed enforcement mode, on the contrary, the invention is intended to contain the various amendment comprised within the scope of the appended claims and equivalent replacement.
Claims (10)
1. an OLED display, it is characterised in that, comprising:
One first substrate;
One second substrate;
One first encapsulation structure, is arranged between described first substrate and described second substrate, to be sealed in by least one organic luminescence display unit in described first substrate, described second substrate and described first space that surrounds of encapsulation structure; And
One the 2nd encapsulation structure, the prospective region being arranged between the outside surface of described first substrate, described second substrate and described first encapsulation structure.
2. OLED display as claimed in claim 1, it is characterized in that, described first encapsulation structure and described 2nd encapsulation structure are arranged between described first substrate and described second substrate annularly, and described 2nd encapsulation structure is in close proximity to described first encapsulation structure.
3. OLED display as claimed in claim 1, it is characterised in that, described 2nd encapsulation structure is arranged at described prospective region by ink-jetting style.
4. OLED display as claimed in claim 3, it is characterised in that, described prospective region is the recess region that the outside surface of described first substrate, described second substrate and described first encapsulation structure is formed; Described 2nd encapsulation structure is full of described recess region by described ink-jetting style, makes the described 2nd encapsulation outside surface of structure and described first substrate, the edge of second substrate flushes.
5. an OLED encapsulation method, it is characterised in that, comprise the steps:
1) one first encapsulation structure is set between a first substrate and a second substrate, to be sealed in by least one organic luminescence display unit in described first substrate, described second substrate and described first space that surrounds of encapsulation structure;
2) utilize ink-jetting style described first substrate, described second substrate and described first encapsulation structure outside surface between prospective region arrange one the 2nd encapsulation structure.
6. OLED encapsulation method as claimed in claim 5, it is characterized in that, the described one first encapsulation structure that arranges between a first substrate and a second substrate is specially: coated glass glue between described first substrate and described second substrate, and on described second substrate, utilize glass cement described in laser illumination, make described glass cement and described first substrate and described second substrate sealed sintering.
7. OLED encapsulation method as claimed in claim 6, it is characterised in that, described glass cement is arranged between described first substrate and described second substrate annularly, makes described 2nd encapsulation structure be in close proximity to described first encapsulation structure.
8. OLED encapsulation method as claimed in claim 5, it is characterized in that, described utilize the prospective region of ink-jetting style between described first substrate and described second substrate and the outside surface of described first encapsulation structure to arrange one the 2nd encapsulation structure to be specially: adjustment shower nozzle is at a distance of the distance of described prospective region, the packaged material of a predetermined amount is sprayed so that it is fill described prospective region to form described 2nd encapsulation structure to described prospective region.
9. OLED encapsulation method as claimed in claim 5, it is characterized in that, described prospective region is the recess region that formed of outside surface of described first substrate, described second substrate and described first encapsulation structure, described 2nd encapsulation structure is full of described recess region by described ink-jetting style, makes the described 2nd encapsulation outside surface of structure and described first substrate, the edge of second substrate flushes.
10. OLED encapsulation method as claimed in claim 8, it is characterised in that, the described predetermined amount of injection packaged material depends on the distance of described shower nozzle at a distance of described prospective region.
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| CN201410714360.8A CN105655498B (en) | 2014-11-28 | 2014-11-28 | A kind of OLED display and method for packing |
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| CN201410714360.8A CN105655498B (en) | 2014-11-28 | 2014-11-28 | A kind of OLED display and method for packing |
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| CN105655498A true CN105655498A (en) | 2016-06-08 |
| CN105655498B CN105655498B (en) | 2017-11-17 |
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Citations (8)
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| US5687465A (en) * | 1991-08-01 | 1997-11-18 | Seiko Epson Corporation | Method of removing a bubble from a liquid crystal display element |
| US20030062518A1 (en) * | 1999-12-17 | 2003-04-03 | Mark Auch | Method for encapsulation of electronic devices |
| CN1414643A (en) * | 2001-10-24 | 2003-04-30 | 翰立光电股份有限公司 | Packaged structure of display element and its packaging method |
| CN1505443A (en) * | 2002-12-03 | 2004-06-16 | 铼宝科技股份有限公司 | Organic electroluminescent cell, packaging method thereof, and coater station thereof |
| US20100141135A1 (en) * | 2008-12-04 | 2010-06-10 | Hitachi Displays, Ltd. | Display device manufacturing method and apparatus thereof |
| US20100258346A1 (en) * | 2009-04-10 | 2010-10-14 | Industrial Technology Research Institute | Package of environmentally sensitive electronic device and fabricating method thereof |
| CN101931058A (en) * | 2010-07-06 | 2010-12-29 | 电子科技大学 | Packaging structure and packaging method of organic electroluminescent device |
| CN102231427A (en) * | 2011-06-30 | 2011-11-02 | 四川虹视显示技术有限公司 | OLED (Organic Light Emitting Diode) display device as well as packaging structure and method thereof |
-
2014
- 2014-11-28 CN CN201410714360.8A patent/CN105655498B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5687465A (en) * | 1991-08-01 | 1997-11-18 | Seiko Epson Corporation | Method of removing a bubble from a liquid crystal display element |
| US20030062518A1 (en) * | 1999-12-17 | 2003-04-03 | Mark Auch | Method for encapsulation of electronic devices |
| CN1414643A (en) * | 2001-10-24 | 2003-04-30 | 翰立光电股份有限公司 | Packaged structure of display element and its packaging method |
| CN1505443A (en) * | 2002-12-03 | 2004-06-16 | 铼宝科技股份有限公司 | Organic electroluminescent cell, packaging method thereof, and coater station thereof |
| US20100141135A1 (en) * | 2008-12-04 | 2010-06-10 | Hitachi Displays, Ltd. | Display device manufacturing method and apparatus thereof |
| US20100258346A1 (en) * | 2009-04-10 | 2010-10-14 | Industrial Technology Research Institute | Package of environmentally sensitive electronic device and fabricating method thereof |
| CN101931058A (en) * | 2010-07-06 | 2010-12-29 | 电子科技大学 | Packaging structure and packaging method of organic electroluminescent device |
| CN102231427A (en) * | 2011-06-30 | 2011-11-02 | 四川虹视显示技术有限公司 | OLED (Organic Light Emitting Diode) display device as well as packaging structure and method thereof |
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| CN105655498B (en) | 2017-11-17 |
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Address after: 201506, No. nine, No. 1568, Jinshan Industrial Zone, Shanghai, Jinshan District Patentee after: Shanghai Hehui optoelectronic Co., Ltd Address before: 201500, building two, building 100, 1, Jinshan Industrial Road, 208, Shanghai, Jinshan District Patentee before: EverDisplay Optronics (Shanghai) Ltd. |
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