CN105679922A - LED for enhanced light extraction and non-yellow off-state color in packaging agent with particles - Google Patents
LED for enhanced light extraction and non-yellow off-state color in packaging agent with particles Download PDFInfo
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- CN105679922A CN105679922A CN201610249881.XA CN201610249881A CN105679922A CN 105679922 A CN105679922 A CN 105679922A CN 201610249881 A CN201610249881 A CN 201610249881A CN 105679922 A CN105679922 A CN 105679922A
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- light
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
Abstract
In one embodiment, TiO2, ZrO2 or submicron size particles (34) of other white non-phosphor inert particles and a silicone resin packaging agent (32) are mixed and applied to an LED (10). In one experiment, light output of the GaN LED is enabled to be increased for more than 5% by the particles when the inert material is about 2.5-5% of the packaging agent by weight. Usually, light output begins to reduce by the inert material of the percentage greater than 5%. If the LED has a light yellow YAG phosphor coating layer, the LED is enabled to look more white by the white particles in the packaging agent when the LED is in the off-state, and the color is a more pleasant color when the LED is used as a white flash lamp (42) in a small camera (40). Change of the visual angle and color temperature of the position of the LED can also be reduced through increasing of the particles so as to be important for the application of the camera flash lamp and projection.
Description
The application is application number is 200880131373.5, and the applying date is on October 1st, 2008, and denomination of invention is the divisional application of " LED in encapsulants with granule for the light extraction increased and the off-state color of non-yellow ".
Technical field
The present invention relates to light emitting diode (LED), and in particular to being used for improving the technology of light extraction. The invention still further relates to the off-state color of the non-yellow forming the LED with light yellow phosphor coating.
Background technology
The semiconductor LED of such as GaNLED has the refractive index (such as, for GaN, n=2.2-3.0) more much higher than the refractive index of air (n approximates 1). By being encapsulated in by LED in the transparent material of the such as silicones (n=1.4-1.76) with middle refractive index, light extraction significantly improves. Encapsulants also protects semiconductor LED tube core. It is desired for increasing light extraction further.
High-capacity LED is typically now used as the flash lamp in the compact camera comprising mobile telephone camera. LED emission white light. This LED as flash lamp is typically the one or more GaNLED tube cores covered by one layer of yttrium aluminum oxide garnet (YAG) phosphor, and this GaNLED die emission blue light, this phosphor launches yellow-green light when being encouraged by blue light. The blue light leaked by YAG phosphor and the combination of yellow-green light produce white light.
When LED disconnects, the YAG phosphor coating on LED appears as yellow color-green color under separate white ambient light. This yellow color-green color does not generally possess captivation and is not typically well matched with camera external appearance. Expect the elimination flash lamp yellow color-green color color when being in its off-state in some way.
Summary of the invention
In one embodiment, the particle of the inert material of TiOx, ZrOx or other white non-phosphor mixes with the substantial transparent encapsulants for LED. A kind of suitable encapsulants is silicones. It has been found that when the about 2.5-5%(that inert material is encapsulants by weight) time, inert material (the such as TiO in encapsulants2) nanometer size particles make the brightness (lumen) of GaNLED increase above 5%.Generally, the inert material of greater percentage starts to make light output reduce. This small amount of granule in encapsulants produces astonishing result, and described result has surmounted any result that inventor predicts. TiO in encapsulants2The scope of 0.5%-10% generally increase brightness, this depends on the actual LED used. Higher percentage ratio starts to make the transmission by encapsulants be substantially reduced.
Both titanium dioxide and zirconium oxide are used as the white pigment in paint and enamel. The color being considered as white has a series of colour temperature, and this color is subject to inspecting the impact of light. The term white used in present disclosure is for the observer substantially white under sunlight.
No matter LED is coated with phosphor or is not coated with phosphor, and the light realized by being added on by granule in encapsulants strengthens and all occurs.
In some experiments, by TiO2Adding encapsulants to and be slightly reduced the colour temperature launching light when LED connects, this is unconspicuous. But, TiO2Interpolation make on whole 180 degree of angles of departure colour temperature change significantly reduce (such as, reducing 2/3rds). In photography, this is important, irradiates with substantially uniform light liking because whole.
Additionally, by TiO2Add encapsulants to and also improve packaging color temperature uniformity everywhere. When the optical element of the enlarged drawing picture of projective LED is used, when such as using together with flash lamp or projector, this is even more important.
Due to inert material (such as, TiO2Or ZrO2) it is white, there is the outward appearance of the LED of YAG phosphor coating and look Bai get Duo when this LED disconnects, this is more pleasing than the yellow color-green color color of YAG phosphor.
In one embodiment, flash lamp LED module uses and has the TiO by weight about 5%2Silicone encapsulation agent, wherein encapsulants is formed as having flat surfaces thus the shape (that is, encapsulants is formed without lens) of not appreciable impact LED emission. Camera comprises the lens being positioned on flash lamp to control the optical transmission mode of flash lamp. In another embodiment, silicone encapsulation agent can be shaped to lens so that optical transmission mode shapes.
Accompanying drawing explanation
Fig. 1 is the cross sectional view of the prior art flash lamp LED comprising blue LED dice, YAG phosphor coating, base and silicone encapsulation agent.
Fig. 2 is the cross sectional view of the flash lamp LED according to the embodiment of the present invention, wherein TiO2Granule mixes with encapsulants.
Fig. 3 is for illustrating by adding TiO in encapsulants2, the flash lamp color appearance when being in its off-state is from yellow color-green color to the curve chart of the change of white.
Fig. 4 is for illustrating by adding TiO in encapsulants2, the curve chart of the decline of the decline of flash lamp colour temperature when being in its on-state and the colour temperature deviation on visual angle.
Fig. 5 is for illustrating to work as TiO2The curve chart that when adding in encapsulants, LED packaging color temperature uniformity everywhere improves.
Fig. 6 is the cross sectional view of the blue LED dice without phosphor coating according to the embodiment of the present invention, wherein TiO2Granule mixes with encapsulants.
Fig. 7 is the curve chart of the luminous power output of the LED of Fig. 5, it illustrates along with TiO in encapsulants2The increase of quantity, power output improves.
Fig. 8 is the front view of the camera with the flash lamp according to one embodiment of the invention, wherein TiO2Granule mixes with encapsulants.
Element similar or identical in each figure carrys out labelling by identical numeral.
Detailed description of the invention
Although present invention can apply to any kind of LED, but will be described in a kind of concrete LED used in all examples.Fig. 1 is the cross sectional view of the conventional white coloured light LED10 being encapsulated in silicones.
In this example, the active layer of LED10 produces blue light. LED10 is formed on the initial growth substrate of such as sapphire, SiC or GaN. Generally, grow n layer 12, be followed by active layer 14, be followed by p layer 16. P layer 16 is etched away to expose the n layer 12 being located below of a part. Reflective metal electrodes 18(such as, silver, aluminum or alloy) be subsequently formed on the surface of LED thus contacting n layer and p layer. Can there is many distributed electrodes thus more uniformly dissufion current. When the diode is forward biased, active layer 14 launches light, and the wavelength of this light is to be determined by the composition (such as AlInGaN) of active layer. Forming this LED is known and without more detailed description. The additional detail of formation LED is described in the U.S. Patent No. 6 of the U.S. Patent No. 6,828,596 and Bhat et al. of Steigerwald et al., and 876,008, the two United States Patent (USP) all transfers present assignee and incorporated herein by reference.
Semiconductor LED is then arranged on base 22 becomes flip-chip. The top surface of base 22 contains metal electrode, and this metal electrode is soldered via solder ball or the ultrasonic metal electrode 18 being soldered on LED. Other type of combination can also be used. If electrode itself can be soldered to together by ultrasonic, then solder ball can be left out.
Base electrode is electrically connected to the negative electrode on base bottom and anode bond pad 24 by path, and therefore base can be surface mounted to the metal pad on printed circuit board (PCB), and this printed circuit board (PCB) is typically formed a part for the flash modules for camera. Pad is electrically coupled to power supply by the metal trace on circuit board. Base 22 can be formed by any suitable material, such as pottery, silicon, aluminum etc. If submount material is conducted electricity, then insulating barrier is formed on backing material, and metal electrode pattern is formed on insulating barrier. Base 22 serves as mechanical support, it is provided that the electrical interface between exquisite n and p-electrode and power supply on LED chip, and provides heat sink. Base is known.
In order to cause LED10 have low profile and prevent the grown substrate of light from absorbing, growth substrates is removed, as by CMP or utilize laser-stripping method, in laser-stripping method, the interface of LASER HEATING GaN and growth substrates is to form gases at high pressure, and substrate is pushed away GaN by these gases at high pressure. In one embodiment, removing of growth substrates is carried out before singulation (such as, passing through sawing) after LED array is arranged in submount wafer and at LED/ base. The final thickness of semiconductor layer may be about 40 microns. LED layer adds the thickness of upper bed-plate and may be about 0.5mm.
The process of LED semiconductor layer can carry out before or after LED is arranged on base 22.
After growth substrates removes, phosphor layer 30 is formed on LED top, for the blue light that wavelength convert is launched from active layer 14. Phosphor layer 30 can jet deposition, spin coating, the thin film deposition by electrophoresis, pre-formed for ceramic wafer and be fixed to LED layer top or utilize other technology any to be formed. Phosphor layer 30 can be the phosphor particles in transparent or semitransparent bonding agent (it can be organic or inorganic), or can be sintered phosphor granule. The light launched by phosphor layer 30 forms white light or another desired color with blue light when mixing. In this example, phosphor is yttrium aluminum oxide garnet (YAG) phosphor (Y+B=white) producing sodium yellow.This phosphor can be the combination of other phosphor any or multiple phosphor, and such as red-emitting phosphor and green phosphor (R+G+B=white), thus forming white light. In all examples, the thickness of phosphor layer 30 may be about 20 microns.
Utilizing YAG phosphor (that is, Ce:YAG), the colour temperature of white light depends greatly on the thickness of the Ce doping in phosphor and phosphor layer 30.
Silicone encapsulation agent 32 is subsequently formed on LED structure to protect LED and to increase light extraction. In one embodiment, encapsulants is spun on. In another embodiment, encapsulants is molded directly within LED and phosphor. If it is desire to use encapsulants as lens, encapsulants can utilize mould to shape.
The prior art LED structure of Fig. 1 is used as baseline, thus illustrating the improvement characteristic of this structure when using the present invention.
Fig. 2 is the cross sectional view of LED structure, and this LED structure is identical with the LED structure of Fig. 1, but wherein before encapsulation LED, TiO2Granule 34 mixes with silicone encapsulation agent 32. Depend on the characteristic of LED structure, TiO2Optimal number can between the 1-10% of the weight of silicones optional position change. In one embodiment, containing TiO2Encapsulants be spun on. In another embodiment, containing TiO2Encapsulants be molded directly within LED and phosphor. If it is desire to use encapsulants as lens, then encapsulants can use mould to shape.
In one embodiment, average TiO2Particle size is 0.25 micron, and granule is randomly shaped. In an exemplary embodiment, the thickness of silicones is about 100 microns.
Work as TiO2Percentage by weight when increasing to about 5%, the light output of LED structure increases. In some experiments, after 5%, light output reduces. In testing at one, the light of sample exports for 0%TiO2It is 90 lumens, for 5%TiO2It is 96 lumens, and for 7%TiO2Being 93 lumens, light exports along with TiO subsequently2Quantity increases and reduces. Colour temperature (CCT) is also with TiO2Percentage ratio change. In testing at one, CCT is at 0%TiO2Time be 5815K, at 5%TiO2Time be 5332K, and at 7%TiO2Time be 5486K, it was demonstrated that at TiO2Peak efficiency percentage ratio place CCT be minimum.
In another experiment, the light of sample exports for 0%TiO2It is 145 lumens, for only 1%TiO2Rising to 154 lumens, this increases 6% on light exports. In another experiment, only for 0.5%TiO2, it is seen that enlarging markedly of light output. In another experiment, for 5%TiO2, light output increase 6%. For each type LED, the material used and application, it is possible to empirically determine TiO2Optimal number.
Fig. 3 uses CIExy colorimeter system (1931 version) to draw for explanation, the curve chart of the LED structure of Fig. 2 color appearance change when being in its off-state. This phosphor is YAG phosphor. Heated blackbody curve (also referred to as Planckian locus) is also shown as reference, and wherein coordinate 0.32,0.33 is corresponding to the colour temperature of about 5500-6000K. When x and y value increases towards body phosphor color value (not drawing) of 0.42,0.54 together, LED color becomes yellow color-green color generally more. When thin layer phosphor (such as, about 20 microns) is formed on LED die and LED is with having 0%TiO2Neat silicone (thickness about 100 microns) encapsulation time, as shown in fig. 1, LED(such as, magazine flash lamp) outward appearance when being in its off-state is yellow color-green color color, but more shallow than the yellow color-green color of body phosphor.As encapsulants and 5%TiO2During mixing, flash lamp is substantially white. As encapsulants and 7%TiO2During mixing, flash lamp even whiter (further from yellow color-green color).
Although when submitting this disclosure to, the reason that inventor still improves at analytical performance, but it is believed that: by TiO2Adding encapsulants to makes the refractive index of encapsulants somewhat increase, and TiO2Color (white) cause the outward appearance of LED/ phosphor closer to pure white.
Fig. 4 is on the visual angle of-90 degree to+90 degree, the curve chart of the LED structure of Fig. 2 colour temperature when this LED connects. This curve chart illustrates that how the LED structure of Fig. 2 colour temperature (CCT) when its on-state is with the TiO added2Quantity and nonlinear change. For 5%TiO2, it is minimum (about 150K) that the expectation of the misalignment on this visual angle reduces. For photography, this is advantageous for, because the whole field being taken is to irradiate with substantially the same Color flash lamp. 0%TiO2Curve has the deviation of highly significant, and this deviation is about use 5%TiO2Three times of deviation. Think TiO2Granule scattering is from the light of LED, and this helps mixed light output to form on visual field brightness evenly and color.
Substitute TiO2, it is possible to use such as ZrO2Other shallow white inert granule.
Use although the present invention is especially desired to together with LED flash, due to TiO2One effect of granule is that the outward appearance making the yellow color-green color YAG phosphor on LED die bleaches, but present invention also improves the overall light output of the LED not using phosphor coating.
TiO in encapsulants2Effect also effectively filter out LED packaging everywhere notable color change, wherein viewing angles-both vertical is in LED surface. Fig. 5 is the curve chart of approximate actual experiment result, wherein measures the colour temperature of LED packaging (the about 3mm of span) everywhere. To not having TiO in encapsulants2LED and to having TiO in encapsulants2Similar LED carry out this measurement. Encapsulants forms the Overmolded hemispherical lens being positioned on LED. This LED is blue led, and phosphor plate is fixed to the top of LED chip, wherein phosphor and the blue light combination producing orange emission leaked through. Phosphor plate does not cover the edge of LED layer.
As in the curve chart of Fig. 5 see that not there is TiO in encapsulants2LED left hand edge near there is colour temperature spike, this is owing to being launched from the blue light of the unconverted at LED edge. The less serious colour temperature that the right has at LED adjacent edges increases. If this LED is used in flash lamp or projector (wherein optical element significantly amplifies LED image), the Blue of adjacent edges will be visible in projection picture. Compare with it, as having TiO in encapsulants2LED colour temperature measurement in seen there is no obvious colour temperature spike at LED adjacent edges because TiO2Effectively filter out any spike.
Fig. 6 is the cross sectional view of the LED die without phosphor layer, wherein TiO2Granule 34 mixes with silicone encapsulation agent 32. LED die launches blue light. Except phosphor layer, all aspects of this LED are identical with Fig. 2.
In the curve chart of Fig. 7, square data points represents when 1000mA drives electric current, TiO in the optical output power (unit is mW) of the LED structure of Fig. 6 and encapsulants2The relation of percentage ratio. Circle is reference data points, and it is shown without the optical output power of LED die of encapsulants.Data point at 0% place is to estimate; Other data point is to measure. As can be seen, the encapsulants on naked LED die comprises TiO2Granule enlarges markedly the optical output power of LED, even at TiO2Quantity when being about 0.5%.
Fig. 8 is the diagram of the camera 40 utilizing invention described herein, and this camera can be mobile telephone camera. Flash modules 42 comprises three the blue emission LED44 for increasing luminous power output being arranged on single-base, and this floor installation is on circuit boards. YAG phosphor layer covers LED. Esd protection circuit can also be arranged on base and be covered by phosphor. LED, phosphor and ESD circuit utilize and TiO2The silicones of mixing encapsulates, thus realizing benefit described herein. It is also shown for camera lens 48.
Test shows, the reliability of the LED structure adding inert particle in encapsulants does not reduce.
TiO in encapsulants2Or ZrO2The additional purpose of granule can be through encapsulants and stops or reflection light. By making the percentage ratio of granule increase above 10%, become highly significant (from having 0%TiO by the reduction of the absorbance of encapsulants290% absorbance to having 10%TiO225% absorbance). Percentage ratio such as fruit granule constantly increases, and encapsulants becomes increasingly as diffusion reflector, returns in LED by most of luminous reflectance and leaves from side. This edge-emitting LED is useful in some application of such as LCD backlight. In one embodiment, the percentage ratio of granule more than 25% thus forming substantially edge-emitting LED.
The present invention is described in detail, it will be understood by those skilled in the art that in view of present disclosure, it is possible to the present invention is modified without departing from spirit described herein and inventive concept. Therefore, it is not intended that limit the scope of the present invention to illustrated and described specific embodiment.
Claims (14)
1. a light-emitting device, comprises:
Semiconductor light-emitting-diode (10);
Phosphor (30) layer at least top surface of this semiconductor light-emitting-diode (10), this phosphor has light yellow color under separate white ambient light; And
Encapsulants (32) on this phosphor (30) layer, this encapsulants comprises the transparent material (32) containing the non-phosphor particles of inertia (34), this granule is the 0.5%-10% by weight of this encapsulants, this granule has white colours under separate white ambient light, this encapsulants (32) wherein containing this granule (34) makes the outward appearance of this phosphor bleach when this semiconductor light-emitting-diode is off, wherein this granule (34) is blended in this encapsulants (32), spreads all over the whole volume of this encapsulants of solidification.
2. light-emitting device as claimed in claim 1, wherein this granule (34) comprises TiOxOr ZrOx。
3. light-emitting device as claimed in claim 1, wherein this granule (34) comprises the 2.5% to 7% of this encapsulants (32).
4. light-emitting device as claimed in claim 1, wherein this encapsulants (32) has the flat surfaces on this semiconductor light-emitting-diode (10).
5. light-emitting device as claimed in claim 1, wherein the average diameter of this granule (34) is 0.25 micron.
6. light-emitting device as claimed in claim 5, wherein this phosphor (30) comprises yttrium aluminum oxide garnet (YAG) phosphor.
7. light-emitting device as claimed in claim 1, wherein compared with the encapsulants of the granule with 0%, this granule (34) this semiconductor light-emitting-diode in an ON state time increase the optical output power leaving this encapsulants.
8. light-emitting device as claimed in claim 1, wherein compared with the encapsulants of the granule with 0%, this granule (34) this semiconductor light-emitting-diode (10) in an ON state time reduce the colour temperature that the light from this encapsulants (32) exports.
9. light-emitting device as claimed in claim 1, wherein compared with the encapsulants of the granule with 0%, this granule (34) this semiconductor light-emitting-diode (10) in an ON state time reduce the colour temperature deviation at visual angle exported relative to the light from this encapsulants (32).
10. light-emitting device as claimed in claim 1, wherein compared with this encapsulants (32) of the granule with 0%, this granule (34) this semiconductor light-emitting-diode in an ON state time reduce the colour temperature deviation of position of top surface relative to vertical this semiconductor light-emitting-diode (10).
11. light-emitting device as claimed in claim 1, wherein this semiconductor light-emitting-diode (10) and encapsulants (32) comprise the flash light source (42) in camera (40).
12. light-emitting device as claimed in claim 1, wherein the semiconductor portions of this semiconductor light-emitting-diode (10) launches blue light.
13. the method manufacturing light-emitting device, comprise:
Phosphor (30) layer is formed at least top surface of semiconductor light-emitting-diode (10); And
Encapsulants (32) is formed on this phosphor (30) layer, this encapsulants comprises the transparent material containing the non-phosphor particles of inertia (34), this granule is the 0.5%-10% by weight of this encapsulants, this granule has white colours under separate white ambient light, this phosphor has light yellow color under separate white ambient light, and this encapsulants (32) containing this granule (34) makes the outward appearance of this phosphor bleach when this semiconductor light-emitting-diode is off, wherein this granule (34) is blended in this encapsulants (32), spread all over the whole volume of this encapsulants of solidification.
14. method as claimed in claim 13, wherein this granule (34) has the average diameter of 0.25 micron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610249881.XA CN105679922B (en) | 2008-10-01 | 2008-10-01 | The LED with particle in encapsulant for the off-state color of increased light extraction and non-yellow |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008801313735A CN102171844A (en) | 2008-10-01 | 2008-10-01 | LED with particles in encapsulant for increased light extraction and non-yellow off-state color |
| CN201610249881.XA CN105679922B (en) | 2008-10-01 | 2008-10-01 | The LED with particle in encapsulant for the off-state color of increased light extraction and non-yellow |
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| CN2008801313735A Division CN102171844A (en) | 2008-10-01 | 2008-10-01 | LED with particles in encapsulant for increased light extraction and non-yellow off-state color |
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| CN105679922A true CN105679922A (en) | 2016-06-15 |
| CN105679922B CN105679922B (en) | 2018-07-17 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040097006A1 (en) * | 2000-10-13 | 2004-05-20 | Lowery Christopher H. | Stenciling phosphor layers on light emitting diodes |
| US20040094757A1 (en) * | 2002-05-06 | 2004-05-20 | Bert Braune | Light emitting diode with wavelength conversion |
| US20070045761A1 (en) * | 2005-08-26 | 2007-03-01 | Lumileds Lighting U.S, Llc | Color converted light emitting diode |
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2008
- 2008-10-01 CN CN201610249881.XA patent/CN105679922B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040097006A1 (en) * | 2000-10-13 | 2004-05-20 | Lowery Christopher H. | Stenciling phosphor layers on light emitting diodes |
| US20040094757A1 (en) * | 2002-05-06 | 2004-05-20 | Bert Braune | Light emitting diode with wavelength conversion |
| US20070045761A1 (en) * | 2005-08-26 | 2007-03-01 | Lumileds Lighting U.S, Llc | Color converted light emitting diode |
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| CN105679922B (en) | 2018-07-17 |
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