CN105719831A

CN105719831A - Integration construction type dielectric plane type high energy resonant capacitor

Info

Publication number: CN105719831A
Application number: CN201510191574.6A
Authority: CN
Inventors: 周景振
Original assignee: Individual
Current assignee: Individual
Priority date: 2015-04-22
Filing date: 2015-04-22
Publication date: 2016-06-29

Abstract

The invention relates to an integration construction type dielectric plane type high energy resonant capacitor, comprising a plurality of layers of electrode plates and charge medium plates. The integration construction type dielectric plane type high energy resonant capacitor is characterized in that: the resonant capacitor adopts a neutral hole (1) and a '+' electrode connection hole (6,2) to serially connect a stack polarity plate of the capacitor; a '-' polarity connection hole (5,3) is serially connected to another stack polarity plate of the capacitor; 'M' is a neutral connection hole (1,7) for installing, fixing and embedding a temperature sensor; the electrode plate (9) is an A1098 metal plate; the charge medium plate (8) is a charge medium surface of a capacitor made of the tetrafluoroethylene thin plate; and a metal support ring (4) is adopted between the upper metal electrode plate and the lower metal electrode plate of each layer in order to form the charge medium surface. The invention brings forward the charge dielectric plane concept design and the welding-free integration construction method, which not only can standardize the assemblies, but also better adapts to the need for the high voltage and big current resonant circuit, and is applicable to the oscillation circuit of several kilowatts.

Description

Integrated structure type dielectric plane formula high energy resonant capacitor

Technical field

The present invention relates to a kind of high power resonant capacitor design, particularly with regard to a kind of new ideas design can the high-voltage large current planar dielectric resonant capacitor of the integrated structural formula of modularity, belong to capacitor manufacturing technology field.

Background technology

Realizing wireless power transmission, magnetic resonance transmission means is the one of most highly effective and safe, and magnetic resonance produces to need a kind of high-energy high-tension, adapts to the high-frequency resonant capacitor of 100kHz.Before the present invention proposes, high voltage large capcity resonant capacitor all adopts metal film winding method, its thermal losses is high, Q-value is low, the existence of many solder joints of winding end, add again higher distributed inductance and dielectric loss, thus the LC that cannot adapt to the high-frequency high-power of thousands of watts of ranks shakes loop needs.

Summary of the invention

The invention aims to improve the design defect of high-frequency resonant electric capacity high-power, propose the capacitor design manufacture method of a kind of novel concept, it is characterized in that: (1) proposes the designing and calculating concept of a kind of new charge mediator plane so that the resonant capacitance of integrated structured calculates to be simplified；(2) propose a kind of unjointed capacitor plate concatenation make, and with "+" and "-" electrode company put be been described by；(3) concept of a kind of neutral connecting hole is proposed, in order to the detecting elements such as mounting temperature sensor or fixing in order to install；(4) accounting method bearing voltage and current of a kind of new resonant capacitance is proposed.

Accompanying drawing explanation

Fig. 1 is pole distribution position, front and the link layout of resonant capacitance

Fig. 2 is charge mediator plane conceptual schematic view

Fig. 3 be "+" concatenation and "-" concatenation and neutral concatenation principle schematic, "+" and "-" polarity be connection identifier, and the positive and negative character of non-real power electrode.

Fig. 4 is an embodiment structural map

In Fig. 2,1,3 is 0.6-1.0mm pure aluminum metal thin plate, and the charge mediator plane that the tenon sheet that 2 is thick for 0.3-0.6mm is constituted, the capacitance in an electric charge face is 5.3-5.6pF/ square centimeter.

In Fig. 3,1 is neutral concatenation body, and 2 is "-" polarity charge pole plate red copper connector, 3 be "+" polarity charge pole plate red copper connector；

In Fig. 3,4,5 interconnect ring shaped conductor for same polarity pole plate

In Fig. 3,7 is Semi-polarity pole plate hole, can be used for installing fixing or inserting temperature sensor etc..

In Fig. 3,8 is electrolyte plane tenon sheet.

Detailed description of the invention

Referring to Fig. 4, one flat resonant capacitor structure with 10 electric charge interfaces, if selecting dielectric plane polyfluortetraethylene plate 0.3mm, then can carry 3000V DC voltage according to the dielectric property of politef, 10 electric charge interfaces are exactly the bearing capacity of 30000V DC voltage.

Referring in Fig. 21,3,5.3pF/ square centimeter during each 0.3mm electrolyte plane, such as polar plate area 36X20=720 square centimeter, then 5.3X720=3816pF is the capacitance of each dielectric plane, 10 plane 38160pF, i.e. 38.16nF

Referring to the 1 of Fig. 4,2,3, electric capacity "+" and "-" extraction electrode binding post, it is achieved that the run-in index resonant tank of whole capacitance body neither one pad connects.

Referring to the 3 of Fig. 4, neutral connecting hole as installing fixing hole, can also insert temperature sensor simultaneously.

Claims

1. the dielectric plane type high energy resonant capacitor of an integrated structure, it has the large-area fine aluminium conductive plate of multi-disc and multi-disc politef dielectric sheet superposition, but no one needs welding, and conductive connecting element is all at rectangular capacitive pole plate planar inner, it is effectively improved under high-voltage large current electric charge diffusion velocity, it is characterized in that, it includes:

-integral capacitor constitutes the integrated installation being all to adopt modularity, and its module diagnostic is in that: through capacitor plate specification assembly (9) that 0.6 to the 1.0mm of dielectric optimization is thick；Conduction connection ring (4,5) is supported between pole plate；0.3mm thickness politef dielectric plate (8) that electric Field Optimization is analyzed；

The connected mode of-capacitance body is characterised by: the design of only three kinds of vias on capacitor conductor pole plate, one be called "+" (2,6) polarity via, one is called "-" (5,3) polarity hole, one is called the medium-sized via (1,7) of " M "；Only just constitute complete capacitance body link with these three hole.

2. a kind of resonant capacitor as claimed in claim 1, it disclosure satisfy that the big electric current of high frequency and high being characterized mainly in that of dielectric Q-value: the proposition of a kind of capacitor plate (9) and charge mediator plane (8) new ideas, in multi-layer planar electrode additive process, an electric charge interface layer (8) is defined by an insulation medium board between the bottom crown of any two mountain, one insulation board of two-plate forms an electric charge interface layer (8), two insulation boards of tri-electrode form two electric charge interface layer (8), by that analogy, and the worthwhile of capacitance is the pF number calculating amassed with unit charge aspect.

3. the capacitor plate (9) described in a kind of resonant capacitor as claimed in claim 1 and claim 2 and charge mediator plate (8), its material and fastening connection piece (2,3,1) it is characterised by: capacitor conductive pole plate adopts the A1098 pure aluminum plate that 0.6 to 1.0mm is thick；Conduction link screw adopts T199% red copper M10 screw rod；Electric charge interface flat board is only with 0.3mm thickness tenon sheet.