CN105917145A - Method for producing an electronic module having an interlockingly connected housing part element - Google Patents

Method for producing an electronic module having an interlockingly connected housing part element Download PDF

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Publication number
CN105917145A
CN105917145A CN201480068598.6A CN201480068598A CN105917145A CN 105917145 A CN105917145 A CN 105917145A CN 201480068598 A CN201480068598 A CN 201480068598A CN 105917145 A CN105917145 A CN 105917145A
Authority
CN
China
Prior art keywords
case member
circuit board
member element
board component
subregion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201480068598.6A
Other languages
Chinese (zh)
Inventor
H.奥特
G.韦策尔
G.卡默
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of CN105917145A publication Critical patent/CN105917145A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1432—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface direct heating of the surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1632—Laser beams characterised by the way of heating the interface direct heating the surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1677—Laser beams making use of an absorber or impact modifier
    • B29C65/168—Laser beams making use of an absorber or impact modifier placed at the interface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/56—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits
    • B29C65/60—Riveting or staking
    • B29C65/606—Riveting or staking the rivets being integral with one of the parts to be joined, i.e. staking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/72—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by combined operations or combined techniques, e.g. welding and stitching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/13—Single flanged joints; Fin-type joints; Single hem joints; Edge joints; Interpenetrating fingered joints; Other specific particular designs of joint cross-sections not provided for in groups B29C66/11 - B29C66/12
    • B29C66/131—Single flanged joints, i.e. one of the parts to be joined being rigid and flanged in the joint area
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/303—Particular design of joint configurations the joint involving an anchoring effect
    • B29C66/3032—Particular design of joint configurations the joint involving an anchoring effect making use of protusions or cavities belonging to at least one of the parts to be joined
    • B29C66/30321—Particular design of joint configurations the joint involving an anchoring effect making use of protusions or cavities belonging to at least one of the parts to be joined making use of protusions belonging to at least one of the parts to be joined
    • B29C66/30322—Particular design of joint configurations the joint involving an anchoring effect making use of protusions or cavities belonging to at least one of the parts to be joined making use of protusions belonging to at least one of the parts to be joined in the form of rugosity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/32—Measures for keeping the burr form under control; Avoiding burr formation; Shaping the burr
    • B29C66/322—Providing cavities in the joined article to collect the burr
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/53—Joining single elements to tubular articles, hollow articles or bars
    • B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
    • B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
    • B29C66/53461—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B29C66/712—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined the composition of one of the parts to be joined being different from the composition of the other part
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/721—Fibre-reinforced materials
    • B29C66/7212—Fibre-reinforced materials characterised by the composition of the fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
    • B29C66/7316—Surface properties
    • B29C66/73161—Roughness or rugosity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7394—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoset
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H61/00—Control functions within control units of change-speed- or reversing-gearings for conveying rotary motion ; Control of exclusively fluid gearing, friction gearing, gearings with endless flexible members or other particular types of gearing
    • F16H61/0003—Arrangement or mounting of elements of the control apparatus, e.g. valve assemblies or snapfittings of valves; Arrangements of the control unit on or in the transmission gearbox
    • F16H61/0006—Electronic control units for transmission control, e.g. connectors, casings or circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2309/00—Use of inorganic materials not provided for in groups B29K2303/00 - B29K2307/00, as reinforcement
    • B29K2309/08—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2663/00—Use of EP, i.e. epoxy resins or derivatives thereof for preformed parts, e.g. for inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2677/00—Use of PA, i.e. polyamides, e.g. polyesteramides or derivatives thereof, for preformed parts, e.g. for inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2072—Anchoring, i.e. one structure gripping into another
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material

Abstract

The invention relates to a method for producing an electronic module, wherein a circuit board element (1) is provided and a housing part element (15) is arranged on the circuit board element (1). The housing part element (15) is first separately produced and prepared. The housing part element (15) is formed by a material that can be reversibly plasticised, for example a thermoplastic such as polyamide. At least one portion (18) of a surface of the housing part element (15) is then reversibly plasticised, for example by means of local heating, in particular by irradiating with light. The housing part element (15) is then arranged on the circuit board element (1) by joining the plasticised portion of the surface of the housing part element to a microstructured portion (7) of the circuit board element and subsequently hardening the plasticised portion (18). Thus, an interlocking and hermetically sealed connection is formed between the housing part element (15) and the circuit board element (1).

Description

For the method manufacturing the electronic module with the case member element that form fit connects
Invention field
The present invention relates to a kind of method for manufacturing the electronic module with circuit board component and case member element mounted thereto.
Prior art
Electronic module is typically used to form electric circuit.Electric circuit can be such as a part for controller.Especially in motor vehicles manufacture, electronic module is used to provide for motor vehicles controller.Generally arrange many electronic devices and components in the electronic module on a circuit board component at this, they are electrically connected to each other suitably by means of printed conductor.
Especially for the gearbox controller in motor vehicles, it can be beneficial that arranging corresponding electronic module in a region, it bears Korrosionsmedium in this region.Electronic module gearbox controller can such as be arranged in vehicle transmission inside, and variator machine oil, foul or chip at the most such as chemical corrosivity may contact with electronic module.Due to the components and parts being arranged on electronic module, printed conductor, etc. part be probably sensitivity relative to this Korrosionsmedium or particulate matter, it is thus possible to need to protect them by airtight shell.
It has been proposed that the circuit board component of installation electronic devices and components is used directly as a part for this shell and installs one or more case member elements at this circuit board component.Case member element can be such as lid or framework at this, and they are if desired together with other parts and especially form shell together with circuit board component.Circuit board component can surround a space at this together with this case member element or these case member elements airtightly, and electronic devices and components may be accommodated in wherein, protecteds from the medium influence of environment.
Such as described in the DE102012213917A1, a surface of circuit board component configures a micro structure and then spray plastics on the subregion of this micro-structural in an annular section region, in order to therefore form framework or cap member.The connection of form fit is entered with circuit board component in the plastics of injection hole in this can invade the subregion of micro-structural under first liquid condition and during hardening then.
But whole circuit board component must be placed in injection mold in this method for being arranged on circuit board component by case member element.At this circuit board component and may being likely to be broken or dirty already installed on electronic devices and components thereon during injection moulding process.
Disclosure of the invention
Advise a kind of method for manufacturing electronic module according to the embodiment of the present invention, wherein can cancel in an advantageous manner and circuit board component is placed in injection mold.Correspondingly can make damage or dirty minimizing risk.
At least have steps of according to the method being used for manufacturing electronic module of the present invention: circuit board component is provided, it has at least one electronic devices and components and the subregion of a micro-structural on the surface of circuit board component, and is arranged on circuit board component by case member element.Suggestion method be characterised by, on circuit board component install case member element step have following step by step: first providing separately fabricated case member element, wherein, case member element is configured to by the material that can reversibly plastify.Then at least one subregion on the surface of this case member element is reversibly plastified.Then, by the subregion of the subregion of the plasticizing on the surface of case member element Yu the micro-structural of circuit board component being bonded together and the subregion of the then plasticizing on the surface of solidified shell part member, case member element is arranged on circuit board component.
The design of the method for suggestion can be understood as based on idea described below and understanding among other things:
Circuit board component for electronic module is usually made such as such as thermosets by a kind of material, such as epoxy resin, its can by conventional method the most only under by means of some measures material with other be connected, in these measures, the electronic unit on electronic circuit panel element is likely to be broken.
The circuit board component manufactured by thermosetting plastics such as can up to now great majority only under by means of temperature control step material with other bonding, wherein, may sustain damage under the high temperature that electronic devices and components produce during this period.In particular, in the way of simple and low damage the most not only mechanically stable ground and also airtightly thermosetting circuit board component is bonded together with other material, it has proved that be extremely difficult.
It is therefore proposed that circuit board component is at least ad hoc equipped with micro structure in subregion.This micro structure is with the difference on other smooth surface of circuit board component, and this surface has certain roughness, and it is limited by the micro-recess in surface.Micro structure such as can produce by irradiating by means of laser, and thus the some parts of the material of circuit board component is removed by the absorption of laser beam and thus can form the least recess, and they form micro structure.
But advise up to now on circuit board component, fix case member element, its mode is that case member element should directly be molded on circuit board component in the region of the subregion of micro-structural by means of Shooting Technique, and it is now realized that this being directly moulded in manufacturing technology can bring defect.Or injection moulding process should be implemented before to circuit board component assembling electronic devices and components, wherein, before electronic devices and components are installed, must go to dirty except circuit board component may be produced during this period after injection moulding process.Or alternatively, such as should be protected by protective layer during being molded already installed on the electronic devices and components on circuit board component before injection moulding process, but this requires additional job step and thus produces additional expense.
As the replacement scheme that case member element is molded, therefore advise herein, in advance with regard to separately made case member element, such as by the Shooting Technique individually implemented.Case member element should be configured to by the material that can reversibly plastify in the case.Such as case member element can be manufactured by thermoplastic material such as such as polyamide, such as PA66.This material should be typically firm and for making in the electronic module to be used to say that enough mechanically stables.
On the other hand, this material should reversibly plastify, say, that can reversibly be transformed into a kind of plastic, i.e. viscosity or liquid and the thus state of plastically deformable and can the most again solidify (hardening).Circuit board component or the damaged or dirty danger of electronic devices and components mounted thereto is there is not when manufacturing this case member element in a single Shooting Technique.
In order to be coupled together with circuit board component by separately fabricated case member element, at least one subregion on the surface of case member element is reversibly plastified.
Such as can be heated the most partly for this this subregion.Temporarily plastified by least one layer near surface of this local heating case member element, i.e. deliquescing and deformable.In this state, case member element and circuit board component are joined together.This joint is implemented in this wise, and the subregion of the plasticizing on the surface of case member element is placed in the subregion of the micro-structural with circuit board component and contacts and both the most mutually extrude.The part of the material plastified before case member element now can flow in the recess in the subregion of the micro-structural of circuit board component or microcavities.After the material of the previously plasticizing of case member element is such as solidified again by cooling, between case member element and circuit board component, thus form the connection of form fit at least in part.
In order to temporarily and be locally heated by the subregion on surface of case member element, this subregion can be used up, and especially laser irradiates partly.Irradiate light and should have sufficiently high power density at this, thus produce the heating of thermoplastic material to case member element, until exceeding plasticization temperature.The wavelength of the light used should material behavior with case member element match in this wise at this, and the light i.e. irradiated is absorbed in the layer on the close surface of case member element as fully as possible and this surface is thus heated.Such as can use a kind of pulse laser to irradiate, it has the wavelength in 200nm to 10 μm, the preferably region between 512nm and 1064nm, and the power of about 1 to 100 watt.
But alternatively it is also envisaged that the subregion to be plastified on the surface of case member element plastifies by means of other technology or especially heats.Hot-air, heat radiation such as can be passed through in this subregion, contacts with heating plate or other the hot object etc. that adds, heated.But, in the great majority in these alternative approach, different from using up irradiation, the most always it is to ensure that, the energy for plastifying subregion is only locally introduced in this subregion or this subregion and is dirty.
The subregion of the micro-structural on the surface of circuit board component can have recess, and these recesses have in 0.1 to 500 μm, preferably the physical dimension in the scope between 1 and 100 μm.The material of the plasticizing of case member element can flow well in this recess or miniature hole when it engages with circuit board component, is distributed and is formed after then solidification the connection of form fit wherein.
This recess or miniature hole especially can be produced by the local irradiation by means of laser.Wavelength and power density at laser herein also should be suitably selected, wherein, but are inadequate by making the material of circuit board component only plastify or melt by means of the irradiation of laser.On the contrary, this material should be got rid of partly, such as by evaporating or melting.Correspondingly, the laser beam used for this purpose usually ratio must have higher power density in the case of only plasticized thermoplastic's plastic material.Such as can use the laser of pulsed for this, it has the wavelength in 200nm to 10 μm, the preferably scope between 512nm and 1064nm, and the power of about 1 to 100 watt.
Especially for described in beginning using electronic module as the application of gearbox controller, can be favourable or be necessary that, case member element is the most mechanically fixedly connected with circuit board component, and the inner chamber that will be received between it by means of this connection seals the most airtightly.This contact surface that the subregion to be plastified on the contact surface of ring seal and the surface of case member element can be framework can be had in particular for this case member element.The subregion of the micro-structural on the surface of circuit board component can also be ring seal and in the case at it geometrically corresponding to the contact surface of case member element.Thus case member element and circuit board component can be bonded with each other along the contact surface of a ring seal, wherein, the material of the micro-structural that the material along the plasticizing of whole contact surface case member element flows into circuit board component neutralizes and then can solidify wherein.Thus the contact surface along whole ring seal forms the connection of form fit, and it is also airtight.
Noting, the possible characteristic of embodiment and advantage in method suggested herein can combine in an appropriate manner or exchange, to realize other the embodiment of the present invention.
Accompanying drawing is sketched
Describing embodiments of the present invention referring to the drawings, wherein, this description and accompanying drawing shall not be not understood as limitation of the present invention.
Fig. 1 illustrates for according to the perspective plan view of the circuit board component of electronic module that manufactures of present invention ground.
Fig. 2 illustrates for according to the perspective view seen from below of the case member element of electronic module that manufactures of present invention ground.
The sectional view of the amplification of the line A-A that Fig. 3 is showing along in Fig. 1.
The sectional view of the amplification of the line B-B that Fig. 4 is showing along in Fig. 2.
Fig. 5 is shown in after some regions shown in Fig. 3 and 4 are engaged in the scope according to the manufacture method of the present invention, the sectional view of the amplification in these regions.
Fig. 6 is shown through the sectional view of an electronic module made in accordance with the present invention.
Fig. 7 is shown through the phantom of another electronic module made in accordance with the present invention.
Figure is only schematically and not have according to real scale.Identical reference represents identical in various figures or acts on identical feature.
Embodiments of the present invention
Fig. 1 illustrates the circuit board component 1 for electronic module, is used for example in gearbox controller.Circuit board component 1 has multiple electronic devices and components 3 such as resistance on its surface, coil, electric capacity, IC, etc..Components and parts 3 are connected by the printed conductor 5 of conduction each other.Printed conductor 5 can extend or as the layer layout of intermediate support on the surface of circuit board component 1 in the inside of circuit board component.Circuit board component 1 is made up of thermosets that being strengthened by glass fibre such as epoxy resin, the most also referred to as Prepreg(prepreg, preimpregnation material).
A surface of circuit board component 1 arranges the subregion 7 of ring seal, introduces micro structure in this region.Fig. 3 illustrates that on cross section this is furnished with the subregion of micro structure 97.Micro structure has micro-recess 11, and it such as extends in the surface going deep into circuit board component 1 on several microns.The subregion 7 of micro-structural is ring seal and the part surface 13 around circuit board component 1 is arranged.Can arrange components and parts 3 in this part surface 13, they such as should be protected against being affected by the Korrosionsmedium in environment.
Fig. 2 illustrates the case member element 15 of rectangular frame form.Case member element 15 is made up of thermoplastic material such as polyamide.The rectangular shape of case member element 15 corresponds essentially to the shape of the subregion 7 of the micro-structural of circuit board component 1 at this.
Fig. 4 is shown through the cross-sectional view of case member element 15.In order to temporarily be plastified the subregion 18 adjacent with the contact surface 17 of case member element 15, this contact surface 17 irradiates by means of the laser instrument light 19 of suitable wavelength and power.Light 19 is in the case near being absorbed at contact surface 17 outwardly, and material the most there is heated until the plasticization temperature exceeding it, such as until more than 220 ° of C, best 250 ° of C in the case of using polyamide, and thus becomes plastic.Side is respectively provided with material overflow pit or groove 21 on contact surface 17 side.
Fig. 5 illustrates a sectional view, and the one side circuit board component 1 illustrated the most in figures 3 and 4 and the part of another aspect case member element 15 are connected to each other.Solidify wherein in the recess 11 of the subregion 7 that the material of the plasticizing in the subregion 18 adjacent with contact surface 17 of case member element 15 is now flowed into the micro-structural of circuit board component 1 and in cooling period then.The material of unnecessary plasticizing is partly pushed to side and be may be accommodated in material overflow launder 21.
Fig. 6 is exemplarily illustrated one electronic module 23 made in accordance with the present invention in cross.Plurality of selectable feature shows, how they can be arranged on an electronic module, but are not required to.Circuit board component 1 is shape-ordinatedly connected by the subregion 7 of micro-structural with the case member element 15 being configured to by framework.Installing lid 25 on the framework of the annular of case member element 15, it is such as connected by weld part 27 airtightly with case member element 15.Circuit board component 1, case member element 15 and lid 25 surround inner chamber 13 the most airtightly.By opening 29, inner chamber 13 can selectively be filled protectiveness glue 31.This opening 29 can be then by means of thromboembolism, such as ball, closes.Case member element 15 can be addedly maintained on circuit board component 1 by least one manufactured head 33.When assembling, manufactured head 33 inserts under undeformed state and clogs (compacting) in the opening 35 in circuit board component 1 and then by heat.
Case member element 15 illustrates respectively as annular framework in the illustrated example, but this case member element 15 can also have other suitable shape.Such as case member element 15 may be embodied to cap member, and it can have the shape of basin shape, and thus inner chamber 13 surrounds individually through the case member element 15 implemented integratedly and circuit board component 1.
Alternatively, as case member element 15, can arrange the thin film being such as made up of polyamide, it is plasticized and in the subregion 7 of the micro-structural that is compressed in circuit board component 1 in suitable region.This thin film now can be with overlay electronic components and parts and protected from externalities.This thin film can use metal level coating if desired, and metal level can serve as diffusion barrier and/or as EMV-protective layer.
Figure 7 illustrates the phantom by another electronic module 23 made in accordance with the present invention.In this electronic module 23, the lid being configured to as case member element 15 is two partly to be implemented.The master unit 37 of one basin shape is become by the constructed in plastic material of permeable laser.Edge at this master unit 37 arranges the adnexa 39 being made up of the plastics absorbing laser.This adnexa 39 surrounds master unit 37 circlewise and extends to, in a region, arrange the subregion 7 of micro-structural in this region at circuit board component 1.When installing electronic module 23, laser 41, from the top through the master unit 37 of permeable laser, is launched towards adnexa 39, and herein, it is absorbed.By the heat produced when absorbing laser 41, on the one hand master unit and adnexa 37,39 are welded to each other and the plastics of another aspect adnexa 39 are so plastified in subregion 18, and i.e. it can be connected with the subregion 7 of the micro-structural of circuit board component 1.

Claims (10)

1. the method being used for manufacturing electronic module (23), has a step:
Circuit board component (1) is provided, the surface of circuit board component (1) has the subregion (7) of at least one electronic devices and components (3) and a micro-structural;
At circuit board component (1) upper installation case member element (15);
It is characterized in that, the upper step installing case member element (15) of circuit board component (1) have following step by step:
Thering is provided separately fabricated case member element (15), wherein, case member element (15) material that can reversibly plastify is configured to;
Reversibly at least one subregion (18) on the surface of plasticizing case member element (15);
By the subregion (7) of the subregion (18) of the plasticizing on this surface of case member element (15) Yu the micro-structural of circuit board component (1) being bonded together and case member element (15) is arranged on circuit board component (1) by the subregion (18) of the then plasticizing on this surface of solidified shell part member (15).
Method the most according to claim 1, wherein, the subregion (18) on the surface of case member element (15) is plasticized by temporary transient local heating.
Method the most according to claim 2, wherein, (19), especially laser, local irradiation are passed through to use up in the subregion (18) on the surface of case member element (15), are heated.
The most according to the method in any one of claims 1 to 3, wherein, the subregion (7) of the micro-structural on the surface of circuit board component (1) has recess (11), this recess has between 0.1 and 500 μm, preferably the physical dimension between 1 and 100 μm.
Method the most according to claim 4, wherein, produces described recess (11) by the local irradiation by means of laser.
Method the most according to any one of claim 1 to 5, wherein, case member element (15) has the subregion to be plastified (18) on the contact surface (17) of a ring seal and the surface of case member element (15) and contact surface (17) is disposed adjacent to and wherein, the subregion (7) of the micro-structural on the surface of circuit board component (1) is ring seal and the contact surface (17) corresponding to case member element.
Method the most according to any one of claim 1 to 6, wherein, case member element (15) is configured to thermoplastic.
Method the most according to any one of claim 1 to 7, wherein, circuit board component (1) is configured to thermosets.
Method the most according to any one of claim 1 to 8, wherein, case member element (15) is configured to by the cap member of one or is configured to a framework and single lid (25) some ground.
Method the most according to any one of claim 1 to 9, wherein, case member element (15) is partly configured to the master unit (37) of a permeable laser and adnexa (39) two absorbing laser and wherein, is welded with adnexa (39) by irradiating laser (41) not only master unit (37) but also adnexa (39) is plasticized.
CN201480068598.6A 2013-12-17 2014-11-04 Method for producing an electronic module having an interlockingly connected housing part element Pending CN105917145A (en)

Applications Claiming Priority (3)

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DE102013226150.0 2013-12-17
DE102013226150.0A DE102013226150A1 (en) 2013-12-17 2013-12-17 Method for producing an electronic module with positively connected housing part element
PCT/EP2014/073684 WO2015090711A1 (en) 2013-12-17 2014-11-04 Method for producing an electronic module having an interlockingly connected housing part element

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CN105917145A true CN105917145A (en) 2016-08-31

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EP (1) EP3084272A1 (en)
KR (1) KR20160099577A (en)
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Application publication date: 20160831