CN1066386C

CN1066386C - Apparatus and method for forming films

Info

Publication number: CN1066386C
Application number: CN95115918A
Authority: CN
Inventors: 中裕之; 三浦真芳; 小仓洋; 松田直子
Original assignee: Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Holdings Corp
Priority date: 1994-09-09
Filing date: 1995-09-11
Publication date: 2001-05-30
Anticipated expiration: 2015-09-11
Also published as: KR960012303A; CN1127696A; KR100212089B1

Abstract

An apparatus, for forming a film, includes an ink jet head having a plurality of nozzles for discharging a liquid, a rotating device for rotating about a rotary axis a coating-object substrate onto which liquid discharged from the ink jet head is deposited, a relatively moving device for moving the ink jet head and the coating-object substrate relatively to each other between a nearby region of the coating-object substrate near the rotary axis and a separate region of the coating-object substrate separate from the rotary axis, and a relative movement control device for controlling the relatively moving device so that an angular velocity of rotation by the rotating device is reduced responsively as a relative position of the ink jet head and the coating-object substrate therebetween makes relative movement from the nearby region toward the separate region, and an angular velocity of rotation by the rotating device is reduced responsively as the relative position of the ink jet head and the coating-object substrate therebetween moves relatively from the nearby region toward the separate region. According this invention, even thin film can be prepared by a simple control.

Description

Film forming device

The present invention relates to a kind of film forming device and method, more particularly, the present invention relates to a kind of by small spray orifice ejection solution shape material, on substrate or analog, form the method and apparatus of film (this film its thickness in a broad sense is equal to or less than 100 μ m, be generally equal to or less than 10 μ m).For example the present invention can be used for being suitable for making in the film formation operation of of such as hybrid integrated circuit, semiconductor circuit or micromachine.

In recent years, film formation technology is widely used.Except needing as sputter and deposition system etc. the formation method of vacuum plant, comprise that the actual film formation system of spinning coating, printing coating, mouthful pattern extrusion molding coating etc. also is able to broad research.

Wherein, particularly the spinning application system is usually used in the formation of barrier layer and diaphragm etc. in the semiconductor fabrication process.

Below, the spinning applying device of just commonly using is done an explanation.

Figure 20 A, 20B and 20C are the structure and the application drawing of the spinning applying device generally commonly used.

In Figure 20 A, 20B and 20C, 101 is the rotating shaft of spinning applying device, and 102 is the sample fixed base plate, 103 spray orifices for ejection coating liquid, and 104 are film formation substrate, and 105,106 are coating liquid, and 107 is film, and 108 is splash droplet.

In said apparatus, shown in Figure 20 A, at first from spray orifice 103 to substrate 104 spraying and applying liquid 105 and it is stated from the substrate 104.

Secondly, shown in Figure 20 B, the spinning applying device intersperses among on this substrate 104 coating liquid 106 with low speed ω 1 rotation.

Then, shown in Figure 20 C, the blade applying device forms film 107 with higher speed ω 2 further turns on substrate 104.

Yet in the above-mentioned device of commonly using, shown in Figure 20 C, scattering and disappearing of splash droplet 108 and cause meaningless waste causes applying liquid loss 80～90%.

It is former because if not a large amount of spraying and applying liquid 105, then the relatively poor place of substrate 104 and these liquid 105 compatibilities can produce the part of uncoated.

As above as seen, but the spinning applying device of commonly using, the service efficiency of its coating liquid is low, and the result has wasted most of coating liquid.

In addition, using the spinning applying device when forming film, liquid is Zhou Liudong from inside to outside always, causes outer peripheral portion film thickness thickening, and chassis itself is out of shape.

On the other hand, using device, past people to develop energetically as printing uses small spray orifice to spray the liquid injection apparatus of masking liquid.In recent years, as an application of this liquid injection apparatus, people have developed liquid injection apparatus or the circuit formation method of using solution rather than masking liquid, for example, the diaphragm of sprayed solution formation are applied to the manufacturing of IC circuit etc.

Below, as prior art, the aqueous material applying device of opening flat 5-104052 number with the open communique spy of Japan Patent is that example is done an explanation.

The structure chart that discloses for flat 5-104052 number of opening for the open communique spy of Japan Patent shown in Figure 21.

In Figure 21,201 is the liquid material supply part, and 202 for being connected in the injector head of liquid

material supply part

201, and 203 is coated parts (hereinafter referred to as substrates).X-Y framework 204 is used for the location of injector head 202 and substrate 203, and it is decided mutually relatively.

Injector head 202 comprises: be communicated with liquid material supply part 201, in be full of the balancing gate pit 206 of liquid material 205, be arranged at the axial midpoint, opening of balancing gate pit 206 spray orifice 207 towards injector head 202 lower surfaces, the displacement that acceptance is produced by piezoelectric element 208 is also amplified chamber 209 to the displacement that this displacement is amplified, and is located at balancing gate pit 206 and displacement and amplifies diaphragm 210 on the boundary of chamber 209.

Like this, piezoelectric element 208 controlled parts 211 drive, and consequent displacement is amplified chamber 209 and diaphragm 210 through displacement, sends on the liquid material 205 in the balancing gate pit 206, cause making liquid material 205 be the downward splash of drop 205a shape from spray orifice 207 to 205 pressurizations of the liquid material in the balancing gate pit 206.

Adopt said structure, can make the liquid material 205 in the spray orifice 207 be the splash of drop 205a shape on substrate 203, and liquid material 205 is coated on the substrate 203 with any given model.

Notice that X-Y framework 204 should be controlled at desired area by control assembly 211.

Simultaneously, in the above-mentioned structure of commonly using,, therefore, there is following deficiency to still need and overcomes because of injection method mainly is to have utilized piezo-electric effect.

In the jet method in the adding pressure type that has utilized piezo-electric effect (to call piezoelectric type in the following text), the solution of ejection sprays from spray orifice, form the diameter liquid droplets bigger 2～3 times than nozzle diameter, with the circuit model that this liquid droplets forms, its microminiaturized degree and precision just are restricted.

Secondly, in order to improve the microminiaturized degree and the precision of circuit model, just must reduce nozzle diameter, but in the injection method of piezoelectric type, nozzle diameter reduces, and then to stick to the loss at spray orifice position bigger for liquid, therefore, in the occasion of high viscosity solution, it is limited reducing nozzle diameter especially.

In addition, in the piezoelectric type injection method, as use the molten organic solvent of depositing a large amount of air as sprayed solution, cavitation then takes place, cause the poor stability that sprays, therefore, this class solution that can be used for spraying is restricted greatly.

The objective of the invention is, provide a kind of film to form method and apparatus, this method and apparatus adopts novel jet head liquid, can use coating liquid efficiently.

According to a first aspect of the invention, provide a kind of film forming device, described device comprises following critical piece:

What have spray orifice that a plurality of atomizing of liquids use is coated with (applying) liquid injector head;

Make and deposited the whirligig that rotates around deciding rotating shaft from the coated substrate of the liquid of above-mentioned masking liquid injector head ejection;

Make above-mentioned masking liquid injector head and above-mentioned coated substrate make the relative movement device that relatively moves between the zone mutually at the near zone of the coated substrate of contiguous rotating shaft place and the leaving of coated substrate of leaving rotating shaft place;

The control device that relatively moves of controlling above-mentioned relative movement device makes the relative position corresponding to above-mentioned seal China ink injector head and above-mentioned coated substrate relatively move to leaving the zone near zone, reduces the relative moving speed that is produced by relative movement device.

According to a second aspect of the invention, provide a kind of film forming device, described device comprises:

Masking liquid injector head with spray orifice that a plurality of atomizing of liquids use;

The control device that relatively moves of controlling above-mentioned relative movement device makes the relative position corresponding to above-mentioned seal China ink injector head and above-mentioned coated substrate relatively move to leaving the zone near zone, reduces the angular velocity of rotation that is produced by whirligig.

According to a third aspect of the present invention, a kind of film forming device is provided, this device ties up in a first aspect of the present invention, the control device that relatively moves has been controlled relative movement device makes the relative position corresponding to above-mentioned masking liquid injector head and above-mentioned coated substrate relatively move towards leaving the zone near zone, reduces the angular velocity of rotation that is produced by whirligig.

According to a fourth aspect of the present invention, the method that provides a kind of film to form, this method comprises the following steps:

The coated substrate that deposits coating liquid is rotated around the axis, and this coating liquid has the liquid injecting-unit ejection that sprays into the hole that a plurality of atomizing of liquids are used from one; And

At the near zone of the coated substrate of contiguous rotating shaft place with leave the leaving between the zone of coated substrate of rotating shaft place, described liquid injecting-unit and coated substrate relatively move, and relatively move by this way: promptly from described near zone to described leave the zone the process that relatively moves big more, then this relative moving speed reduces manyly more.

According to a fifth aspect of the present invention, the method that provides a kind of film to form, this method may further comprise the steps:

The coated substrate that deposits coating liquid is rotated around the axis, and this coating liquid sprays from the liquid injecting-unit of the spray orifice that has a plurality of atomizing of liquids and use; And

At the near zone of the coated substrate of contiguous rotating shaft place with leave the leaving between the zone of coated substrate of rotating shaft place, described liquid injecting-unit and coated substrate relatively move, and relatively move by this way: promptly from described near zone to described leave the zone the process that relatively moves big more, then this coated substrate rotational angular reduces manyly more.

According to a sixth aspect of the invention, the method that provides a kind of film to form, this method tie up in the mobile step of method of the 4th aspect of the present invention, and described coated substrate rotational angular is reduced manyly.

According to a seventh aspect of the present invention, the method that provides a kind of film to form, this method comprises the following steps:

Enough to make aforesaid liquid be deposited on first relative velocity on the described substrate surface, rotation has the masking liquid injector head of the spray orifice that a plurality of atomizing of liquids use and deposits the basic of described liquid, and aforesaid liquid roughly is coated on the roughly whole surface of described substrate equably; Thereby finish the applying step of first coating state.

After above-mentioned applying step, with second relative velocity greater than above-mentioned first relative velocity, rotate the substrate of described masking liquid injector head and deposit liquid, on described substrate, form the step of the film of second coating state, in this second coating state, when the coating liquid that makes too much coating splashes under the first coating state, make second coating state more even than first coating state.

According to an eighth aspect of the present invention, the device that provides a kind of film to form, this device ties up in a first aspect of the present invention, its masking liquid injector head has the injecting-unit that is made of a plurality of spray orifices, and be the configuration of direction by following mode, the emitted dose that promptly applies liquid increases gradually to an aspect, and the injecting-unit of minimum injection limit is configured in a side of substrate near zone.

With reference to accompanying drawing, following description in conjunction with the preferred embodiments will make above-mentioned aspect of the present invention and other aspect and feature disclose clearlyer.

Fig. 1 is the floor plan according to the film forming device of the first embodiment of the present invention.

Fig. 2 is the sectional view of the masking liquid injector head of this film forming device.

Fig. 3 A and 3B are the spray orifice sectional view of the masking liquid injector head of this film forming device.

Fig. 4 is the floor plan of pressure conditioning equipment of the masking liquid injector head of this film forming device.

Fig. 5 is the general arrangement plan of this film forming device.

Fig. 6 is the application drawing of this film forming device.

Fig. 7 is the floor plan according to the film forming device of second embodiment of the present invention.

Fig. 8 is the key diagram of the film forming device among Fig. 7.

Fig. 9 is the key diagram according to the film forming device of the 3rd embodiment of the present invention.

Figure 10 A, 10B and 10C are the key diagram that is used for illustrating the ejector principle of the 4th embodiment of the present invention.

Figure 11 is used for the floor plan that solution sprays, and this figure understands identical ejector principle specifically.

Figure 12 is for concerning the solution spray characteristic table of being done according to the resistance that obtains from above-mentioned configuration-electric field, and this chart has embodied the solution ejector principle too.

Figure 13 is used for the floor plan that solution sprays for another, and this figure has embodied ejector principle too.

Figure 14 is the general arrangement plan of a film forming device, and this figure has embodied ejector principle too.

Figure 15 is another floor plan according to the 8th embodiment of solution injection of the present invention, and this figure has embodied ejector principle too.

Figure 16 is the solution spray characteristic table that a pressure that obtains according to the configuration of Figure 15 is made electrostatic force relation.

Figure 17 is the solution dispersion characteristic table that the resistance of joining acquisition according to Figure 15-the electric field relation is made.

Figure 18 one is used for the horizontal layout schematic diagram according to the spinning applying device of the film formation method of the ninth embodiment of the present invention.

Figure 19 is a sectional view according to the seal China ink injector head of the film formation method of the of the present invention ten embodiment.

Figure 20 A, 20B and 20C are the key diagram of the film forming device commonly used.

Figure 21 is the key diagram of the film formation method commonly used.

Figure 22 is a perspective view according to the film forming device of the 11st embodiment of the present invention.

Figure 23 is the perspective view of this injector head.

Figure 24 is the block diagram of expression control assembly structure.

Figure 25 is the control flow chart of this film forming device.

Figure 26 is the diagram that is equivalent to another embodiment of Figure 23.

Figure 27 is the diagram that is equivalent to another embodiment of Figure 23.

Figure 28 is the diagram that is equivalent to another embodiment of Figure 23.

Before explanation the present invention, note that same parts is represented with identical reference number in institute's drawings attached.

Embodiment 1

Fig. 1 is the horizontal layout schematic diagram of the spinning applying device among first embodiment of the present invention.

In Fig. 1,10 is discoid coated substrate, and 11 is the masking liquid injector head, and 12 is the fixed base plate of

coated substrates

10, and 13 is the rotating shaft of erecting bed 12, and a motor 50 is as the rotating machinery example.

Masking liquid injector head described herein makes liquid from small spray orifice (usually, its aperture is 0.2mm, or 0.1mm, or below 0.1mm) ejection, and by the spray regime of signal of telecommunication control liquid, makes liquid deposition on the recording medium of desiring to note down.

In the present embodiment, the masking liquid shower nozzle has a plurality of so small spray orifices, and specifically, 48 nozzle holes are disposed at coated substrates 10 radially with the spacing of every millimeter 10 spray orifices.The example of the configuration of above-mentioned small spray orifice is: 50 apertures are not more than the spray orifice as 50～60 μ m of 200 μ m, with the spacing configuration of 0.5mm.

The spray orifice aperture of the spinning applying device of in the past the commonly using 0.5～1mm that is everlasting is difficult to control trace and sprays, and as the present invention, use the masking liquid injector head of above-mentioned definition, can when making exquisite pattern, can form evenly as described below, film as thin as a wafer.

In the present embodiment, at first, as shown in Figure 1, coated substrates 10 is rotated with angular speed θ, masking liquid injector head 11 is upwards relatively moved with speed V in the footpath of coated substrates 10, and the coating liquid that is at this moment moving sprays from spray orifice, and is deposited on the coated substrates 10.

Then, rotate together coated substrates 10, then produce 48 coating lines that spacing is 100 μ m by masking liquid injector head 11, its result, having provided width is the striped of 4.8mm.

Further, suitable as the selection of each lines fabric width among the figure in the present embodiment, each adjacent lines is connected each other, then form certain thickness film.

Therefore, if find out appropriate condition, and masking liquid injector head 11 is during coated substrates 10 rotates a circle, and the amount of movement that is produced by relative moving speed V is set in 4.8mm, then can so-called spiral primary form film.

Also can be by repeatedly repeating to paint work, rather than above-mentioned once painting makes to form film.

More specifically, the setting of the relative moving speed V of mat masking liquid injector head 11 and the angular speed of coated substrates 10, relatively move by particular value, for example 4.8mm by masking liquid injector head 11, rotate coated substrates 10 simultaneously for several times, repeat to paint work, thereby can form film, like this, can paint and make fineness and density, be more suitable for forming reliably thinner film simultaneously greater than the intensive lines of 10/mm.

More specifically, with reference to Fig. 1, as with the center of rotation of coated substrates 10 as initial point O, radius is x, and coated substrates 10 is rotated with angular speed θ then, and while masking liquid injector head 11 is with speed V, radially (x direction) in coated substrates goes up mobile, at position xs place beginning atomizing of liquids, stop atomizing of liquids at the circumferential position xe place of coated substrates 10, pre-membrane forms and finishes.

In this operation,, when the emitted dose of masking liquid injector head is certain value Q, must satisfy following formula (1) on entire coating substrate 10, forming the uniform film of thickness.

V=K ₁/ x (formula 1) (K wherein ₁Be constant, and K ₁＞0)

Make lines on entire coating substrate 10, painting, also must satisfy following formula (2) with same definition.

θ=K ₂/ x (formula 2) (wherein, K ₂Be constant, and K ₂＞0)

Therefore, because disc-shaped substrate, its surface covered than increasing at the center, along with applying by carry out of center to periphery, is necessary to reduce gradually speed V in periphery.Equally, because under the certain situation of rotating speed, greater than the center, rotating speed also must slow down along with the increase of X value peripheral speed in the periphery, so that constant in the peripheral speed maintenance of the masking liquid injector head of enrollment.

For example, when V, O were definite value, because nearly center peripheral speed is lower, even the density of coating lines is identical, the lines of its centre also can chap, thereby generates the film that central part is thick, the periphery position is thin.Sometimes, the periphery lines are not overlapping, and keep the lines original state.

When meeting formula (I), when θ and maintenance constant, then will keep one to be at the on-chip coating amount of entire coating, yet, the lines that its centre is thicker because of peripheral speed is coated in, density is less, simultaneously, its periphery position is coated in and approaches, high, the big lines of density.Like this, the coating lines are fine overlapping in the peripheral part position, form homogeneous film, and in the centre, lines are overlapping relatively poor, and easily the generation coating is irregular.

By above-mentioned example as seen, for form uniform, certain thickness film on the entire coating substrate, requiring to satisfy in formula (I) and the formula (2) at least one, is that this two formula all satisfies better.

Below, the representative floor plan of the masking liquid injector head in the present embodiment shown in Figure 2.

Shown in Figure 2,11 is the masking liquid injector head, and 21 is the air supply source, and 22 is fluid storage tank, and 23 is pressure regulating mechanism, is used to regulate the appearance gas velocity that enters masking liquid injector head 11, and 24 is liquid-inlet, and 25 is air intlet, and 26 is air exhaust port, and 27 is liquid spraying outlet.

Here, mouth spray 27 and the exhaust outlet of being located on the masking liquid injector head 11 26 is concentric.

For masking liquid injector head 11, from the circulation of air excess pressure governor motion 23 of air supply source 21, flow into by air intlet 25, flow out with certain flow velocity from exhaust outlet 26 again.

On the other hand, coating liquid is supplied with from fluid storage tank 22 through liquid-inlet 24.

Air supply source 21 also is connected with fluid storage tank 22.To the pressurization of the liquid in the masking liquid injector head 11, this pressure is with mouth spray 27 near, and the air pressure balance by the air miscarriage is given birth to like this, applies liquid and remained on mouth spray 27 places.

Secondly, Fig. 3 A and 3B are the enlarged drawing of the spray orifice part among Fig. 2.

As shown in Figure 3A, the exhaust outlet 26 of setting and mouth spray 27 are concentric shape, and the air stream of certain flow rate blows out from exhaust outlet 26, along with blowing out of this air stream, produce the pressure Pa that is formed by this air stream in the exit of mouth spray 27.

Simultaneously, owing in fluid storage tank 22, execute air pressure, form pressure P i on the liquid in mouth spray 27.

Because of Pa and Pi about equally, pressure balance makes coating liquid keep stable meniscus at mouth spray 27 places.

On the other hand, shown in Fig. 3 B, when the air mass flow that is conducted to masking liquid injector head 11 reduced it by pressure regulating mechanism 23, the pressure P b that forms in mouth spray 27 exits was less than Pa, thereby (Pi-Pb) breaks meniscus by this pressure differential, causes the application of liquid ejection.

Below, Figure 4 shows that the representative horizontal layout example of pressure regulating mechanism 23.

In Fig. 4, flow into the inlet A of magnetic valve 41 from the air of air supply source stream, again by this magnetic valve 41, flow out via flow export B or C.

Herein, magnetic valve 41 is by the signal of telecommunication flow export to be switched to B or C.

Under the state of Fig. 3 A, when inflow entrance A was communicated with flow export C, the pressure P i of fluid storage tank and the pressure Pa that formed by air stream were about equally.

Then, when importing injection signal on magnetic valve 41, stream promptly switches to B from C.

As shown in Figure 4, on flow export B, be connected with the stream stopper 42 that causes a large amount of pressure losses of stream, as choke valve, when flowing through this stream stopper 42, air produces pressure loss, thereby, air flow pressure at masking liquid injector head place is reduced to Pb from Pa, and the result forms the state of Fig. 3 B, promptly applies the liquid ejection.

Below, just use the masking liquid injector head of said structure, ejection coating liquid, and the object lesson that applies on coated substrates is done an explanation.

In the present embodiment, coated substrates is used phase-change type (light crystal type) CD of Merlon system, and coating liquid uses UV (ultraviolet ray) hardening bath, with the diaphragm as metal evaporation face.

Again, cd diameter is 130mm, and the coating scope of UV hardening bath is the part beyond the about 20mm of radius.

Thereby, in Fig. 1, x _s=20mm, x _e=65mm.

Above-mentioned UV hardening bath is a resin solution that can be hardened and be solidified by ultraviolet ray irradiation.More specifically, can use acrylate composition, its physical property is viscosity 23cp, proportion 1.07, surface tension 29 dyne/cm, sclerosis shrinkage factor 9.8%.

Under these conditions, for forming the thick diaphragm of 5 μ m, fluid volume estimates to be about 70mg.

Thereby, because the about 300mg/ branch of spouting liquid of masking liquid injector head, so in 20 seconds, finish coating process, and form the diaphragm about 7 μ m.

V=95.6/x (formula 3) wherein, V is with mm/S, x is in mm)

Here, constant K once is described ₁How to measure.

Suppose, state that coating is from the radius x=20 (mm) of the initial point O of distance coated substrates 10 beginning, and end at x=65 (mm) and locate as preceding, and hypothesis, the coating time is 20 seconds.The coating time is depended on film thickness and surface covered.Like this, variable being changed to of formula (1):

(dx/dt)·x=K ₁

Separate this differential equation,

(1/2) x ²=K ₁T+C is wherein: C is a constant.

If the coating zero-time is t=0 (second), x=20, then,

(1/2)·20 ²=C

C=200

If the coating termination time is got t=20 (second), x=65, then:

(1/2)·65 ²=K ₁·20+C

With above-mentioned C=200 substitution following formula, then

K ₁={(1/2)·65 ²-200}/20=95.6

Like this, state down, can record K in aforementioned vacation ₁Be 95.6.

On the other hand, about formula (2), the line weight when relating to coat operations and repeat to apply number of times (or line density) is with regard to K ₂Three kinds of situations of=32000,36000 and 40000 (θ is in rpm, and x is in mm) are studied.

Particularly, use personal computer, program calling and controlling x axial velocity V and angular speed θ by establishment make it satisfy formula (2) and formula (3) respectively.

More specifically, for by formula (3) control V, V can be expressed as the function of time.

That is, because of V=dx/dt, the variable following relationship formula (4) that is changed to of formula (3):

x·dx/dt=95.6 (4)

Then, separate the differential equation shown in the formula (4), during substitution t=0, x=20mm makes x with following formula (5) expression, and V promptly can represent by following formula (6):

X=(191.2t+400) Formula (5)

V=95.6 (191.2t+400) Formula (6) like this, promptly available personal computer control V to satisfy the relation of formula (6), applies.Fig. 5 uses the floor plan of the applying device of personal computer in the present embodiment.In Fig. 5, represent with same numbering that with parts identical among Fig. 1 in addition, 51 is motor, 52 is the motor drive source, and 53 is personal computer, and as control device, 54 is travelling carriage.

In this configuration, be coated with and rotate after application substrate 10 is driven by motor 50, relatively moving of masking liquid injector head 11 coated substrates 10 finished by motor 51 simultaneously.

Again,

motor

50,51 is by motor drive 52 controls, and motor drive 52 is connected in personal computer 53, is driven by the programme-control that is arranged on establishment in the small computer 53.

Fig. 6 represents example that V, θ and hydrojet signal are controlled.

Among Fig. 6, transverse axis is represented the position x radially apart from cd centre, the X that the longitudinal axis is represented the masking liquid injector head to speed V and disk rotation speed θ.

At first, under original state, the masking liquid injector head is positioned at the x=10mm position, and CD rotates with 1800rpm.

Then, the masking liquid injector head begins to relatively move with V=290mm/s, when it arrives the x=20 position, and input hydrojet signal, ejection coating liquid prints black injector head and CD simultaneously as shown and moves along with V, θ and X slow down inversely proportionally and the rotation of slowing down.

Then, when arriving x=65 (mm) when locating, input stops the hydrojet signal, makes speed V and angular speed O be decelerated to 0.

When above-mentioned condition, K ₂Measured result under three kinds of situations of=32000,36000 and 40000 (θ, in rpm, x is in mm) is as follows.

At first, at K ₂=32000 o'clock, because rotating speed is low, the density of coating lines was little, and easily residual have striated concavo-convex.

Secondly, at K ₂, can form films level and smooth, thick 6～8 μ m at=36000 o'clock.

Again, at K ₂=40000 o'clock, because rotating speed is too high, generate excessive centrifugal force, so producing in coating process, the coating liquid that has deposited flows, flow to the outside, cause easily generating radial striped.

Therefore, in this embodiment, preferably adopt K ₂=36000 condition certainly also can be according to the type difference of formed film, at other K ₂Form film under the value condition.

Again,, preferably satisfy formula (I) and formula (2) simultaneously on the entire coating substrate, forming even, certain thickness film, but sometimes also can be according to the film class difference that forms, and only need in above-mentioned two equations, satisfy one at least.

As mentioned above, in the present embodiment, at least satisfy the same form in formula (1) and the formula (2), or two formula all satisfy, promptly, relative velocity V increases along with the outside distance of decentre and reduces gradually, that is relative velocity V is along with outwards shifting to the distance of leaving the zone of leaving rotating shaft and increase and reduce gradually from being positioned near the main rotating shaft substrate near zone.And/or rotating speed θ increases with x and reduces, and thus, can form uniform, certain thickness film on the entire coating substrate.

Embodiment 2

Below, do one with regard to the second embodiment of the present invention and describe in detail.

As described in the embodiment 1,,, set suitable K by the condition of formula (1) and formula (2) according to coated film forming type of layer and thickness etc. ₁, K ₂Thereby, can form required film.Yet, certain situation is done further investigation about being necessary according to film forming process etc.

For example, in about 10 seconds, finish coating, and can form the middle K of formula (1) of the thick film of about 3,5 μ m ₁=191.2 occasion makes the K in the formula (2) ₂Be changed to up to 60000, test, its result can not obtain level and smooth film, but leaves circle-shaped candy strip.

Above-mentioned phenomenon can be considered the microminiaturization degree of liquid droplets that betides coating liquid to be had in limited time, or the occasion crossed when low etc. of rotating shaft rotating speed.

In the present embodiment, when only applying with the masking liquid injector head, can not form the well-proportioned film of thickness, disposed can be with the smooth or smooth uniform equipment in concavo-convex position for this reason.

Fig. 7 is the horizontal layout schematic diagram of the spinning applying device in the second embodiment of the present invention.

In Fig. 7, as embodiment 1, in the coated substrates 10 of the Merlon system of rotation, the limit relatively moves the coating liquid shower nozzle 70 as the masking liquid injector head, and the limit forms film with the coating liquid with UV hardening bath.

In the second embodiment of the present invention, again air is flowed out 71 and be arranged near the coating injector head.Thus, after coating liquid is deposited on the coated substrates 10, blow immediately with air stream, coating liquid is flowed, coating filmform is smooth.

More specifically, in the second embodiment of the present invention, use seal China ink injector head and coating liquid as embodiment 1, and K in the setting formula (1) ₁=191.2, K in the formula (2) ₂=60000, study.

At first, flow out 71 as no air, then residual have a candy strip, can not obtain smooth overlay.

To this, as Fig. 7, be provided with air again and flow out 71, form the homogeneous film of 3～4 μ m.

More specifically, described air flows out the spray orifice that head disposes 24 aperture 100 μ m, at about 0.15kg/cm ³The dirty clearancen air-flow of pressure can be thought, the rate of outflow of air is in 100～200m/ scope second, and flow regime is an air turbulence laminar flow seldom.

Fig. 8 has shown how to form uniform coated film by air stream.

Among Fig. 8, at first, after jetting fluid was deposited on the coated substrates, adjacent lines was released state each other immediately shown in the a-quadrant.

Thereafter, prolong in time, coating liquid spreads, moistening substrate 10, and cause being the state shown in another area B.As not adding other measure, then just not dry, the sclerosis of jog by cancellation.

If before jog drying and sclerosis, coating liquid to be blown with air stream, the coated film that is in the B zone of concavo-convex state recurs and flows, and causes microvibration, and its result forms the homogeneous film as zone C.

As mentioned above in second embodiment of the invention, air flows out head and is arranged on coating liquid injector head 70 vicinities, like this, after coating liquid is deposited on coated substrates 10, and before its drying and sclerosis, blow out air flows immediately, so, thereby coating liquid flows and vibration can form uniform coated film.

Embodiment 3

Below, do one with regard to the third embodiment of the present invention and describe in detail.

Present embodiment is for improving the uniformity of the film that forms as embodiment 2.In the 3rd embodiment, make atomizing of liquids charged, to obtain the uniformity of film.

More specifically, with the surface of the exhaust outlet 92 of the essentially identical masking liquid injector head of embodiment 1 structure on electrode 93 is set, at this electrode 93 with remain between the jetting fluid 94 in the mouth spray 91 and produce potential difference, make liquid droplets 95 charged by power supply 90.Identical among coated substrates 10 that present embodiment adopted and atomizing of liquids 94 and the embodiment 1.

Fig. 9 is the spray orifice enlarged drawing partly of the masking liquid injector head of present embodiment.

Among Fig. 9, mouth spray 91 and exhaust outlet 92 usefulness insulating materials are made, and are provided with electrode 93 on the outlet side surface of exhaust outlet 92.

In addition, be connected with power supply 90 among the figure, thereby at electrode 93 with remain between the jetting fluid 94 at mouth spray 91 places and be applied with potential difference.

In above-mentioned configuration, when being applied with potential difference with power supply 90, then jetting fluid 94 carried charges are relevant with the static capacity between electrode 93 and the jetting fluid 94.

Spray to the drop 95 in the outside and disperse after charged, arrive and be deposited on the coated substrates 10.

The drop 95 charged as above-mentioned method is in the time of on being deposited on as the substrate made of insulating material of the number of Merlon, with the retainer belt electricity condition.

According to, the previous deposition part that on coated substrates 10, has deposited drop 95, and secondly arrive between the drop 95 of coated substrates 10, repel each other because of having identical charges, its result is in deposited liquid generation effect on the direction of expansion on the coated substrates 10.

More specifically, in the present embodiment, used the CD and the UV hardening bath of Merlon system, and K in the setting formula (1) ₁=191.2, K in the formula (2) ₂=60000, between electrode 93 and jetting fluid 94, have the potential difference of about 600V, finish coating 10 seconds.

In the not charged occasion of liquid, residual have a candy strip, can not form flat film, when produce potential difference between electrode 93 and jetting fluid 94, makes jetting fluid charged, then can form the smooth film of 3～4 μ m.

As mentioned above, in the present embodiment,, make jetting fluid charged, can form uniform coated film by being arranged on the potential difference that produces between electrode around the exhaust outlet and the jetting fluid.

In addition, self-evident, owing to disposed the equipment that makes jetting fluid charged in the present embodiment, and be provided with embodiment 2 described air outflow heads, thereby after coating liquid is deposited on the coated substrates, and in its drying, can blow immediately with air before the sclerosis and flow.By the combination of above-mentioned facility, more can form more reliable, more uniform coated film.

Again, in above-mentioned arbitrary embodiment, the scope that the kind of coated substrates and coating liquid is not limited to exemplify.The present invention forms the functional film with electricity, optical function above also being coated in diaphragm on the silicon chip and glass substrate, ceramic substrate, metal substrate etc. applicable to formation.But, do not stop up the preferably non-quick-dry type resin solution of coating liquid in order in coating process, not make nozzle.

In the present invention, under the condition of pilot angle speed and portable cord speed, coated substrates and masking liquid injector head are done relative each other moving between in the zone of contiguous rotating shaft with gradually away from another zone of rotating shaft, and meanwhile, they keep relatively rotating each other.In this motion, coating liquid sprays, is injected on the coated substrates through a plurality of nozzle of masking liquid injector head, thereby, on this coated substrates, form coated film very uniformly.

Further, when being provided with air and flowing out,, immediately air stream is blown out applying after liquid is sprayed on the coated substrates.

Further, when being provided with when making from the charged charging device of the liquid of masking liquid injector head ejection, before be deposited on the deposition part of the drop on the coated substrates and arrive thereafter take place between the drop of this coated substrates mutually exclusive.Its result, this liquid is deposited on on-chip liquid spread direction at it and moves.

As mentioned above, the invention provides a kind of film forming device, this apparatus structure is very simple, can form uniform film on the whole surface of coated substrates, and can not waste coating liquid, and cause that the outer peripheral portion of film thickens.

The present invention also provides a kind of film forming device with high degree of flexibility, thereby this device can change operating condition in every way by application target, forms the film with specific thicknesses.

Embodiment 4

The following stated is as the fourth embodiment of the present invention, uses than resistance greater than the film forming method of the solution of 105 Ω cm.

Figure 10 A, 10B and 10C are the spray regime schematic diagram when utilizing the electrostatic force sprayed solution.

In Figure 10 A, 10B and 10C, numbering 121,124,126 expression spray orifices, the coated object of 122 expressions, 123 to 127 expression solution spray regimes.

When utilizing the electrostatic force sprayed solution, but its spray regime rough classification becomes the state shown in Figure 10 A, 10B and 10C.

Promptly, as typical three class spray regimes, Figure 10 A is that solution becomes independent drop 123 to be dissolved in the state on the coated object 122 from spray orifice 121 ejections, deposition, Figure 10 B is wire when being the solution injection, pull out one with the numbering 125 thread lines of representing from spray orifice 124 seemingly, be deposited on the state on the coated object 122; Figure 10 C is that solution is the spray form ejection shown in the numbering 127 from nozzle 126, is deposited on the state on the coated object 122.

For forming good film, require solution to be Figure 10 B and form ejection under the wire drawing shape.According to present inventor's experiment, find that the spray regime of solution is relevant with the ratio resistance of solution.Promptly as this than resistance less than 10 ⁵Ω cm, then electrostatic force is not enough to this solution is worked, thereby can not get good wire drawing shape.So the ratio resistance of this solution preferably is not less than 10 ⁵Ω cm.

Below, describe this experiment content in detail.

Figure 11 shows that and use the electrostatic force sprayed solution, and the floor plan of the basic facilities of coating.

Shown in Figure 11,128 is supply opening, and 129 is mouth spray, and 130 is solution, and 131 for can be by the film forming coated object of solution of deposition on it, and 132 for being arranged at the backplate at coated object 131 back sides, and 133 is spray orifice, and 134 is high voltage source.

In above-mentioned configuration, apply voltage by high voltage source 134 between electrode 132 and the spray orifice 133 overleaf, produce electric field.Solution is under this electric field action, by coated object 131 between spray orifice 133 sprays.

Figure 12 uses the relation than resistance and institute's making alive to show with configuration shown in Figure 11 solution spray regime when utilizing the electrostatic force sprayed solution.

In Figure 12, transverse axis is represented the ratio resistance of solution, and the longitudinal axis is represented the electric-field intensity that electrostatic force produces.Again, state when a region representation solution does not spray, state (state of Figure 10 A) when b region representation solution is the ejection of independent drop, state (state of Figure 10 B) when the state (state of Figure 10 c) when c region representation solution is the spray form ejection, d region representation solution are the injection of wire drawing shape.

State as preceding,, be necessary to make solution can control the wire drawing shape ejection of sprayed solution for forming the film of good pattern.

Therefore, be to obtain as the state in the d zone among Figure 12, its primary prerequisite be selection solution than resistance 10 ⁵More than the Ω cm.Moreover, regulate energy (electric-field intensity) size, make it can make solution be the wire drawing shape, then can obtain forming the spray regime of good film.

For example, in recent years, capacitor of using as DRAM just under development and permanent memory be with MOD (metal organic deposit) solution of material and sol solution etc., generally all the hydrocarbon system organic solvent of ethanol, methyl alcohol etc. added as solvent, the ratio resistance of these solution is usually 10 ⁷More than the Ω cm.

If take to use the gunite of commonly using of piezoelectric element to spray these solution, then produce cavitation, can not carry out good hydrojet.Yet, as device sprayed solution, as shown in Figure 12, because solution has 10 with present embodiment ⁵The high specific resistance that Ω cm is above, wire drawing shape sprayed solution that just can be stable.Thereby, can save exposure and etching work procedure, directly form piezoelectric membrane and thin dielectric film at any part of substrate.

Without the configuration of Figure 11, with configuration shown in Figure 13, then the situation of solution injection is the same.

Being configured on the principle with the electrostatic force sprayed solution of the configuration of Figure 13 and Figure 11 is similar, but its difference is that the metal film 135a that the former forms on coating articles 135 tops is used as an electrode that produces electric field.Can select above-mentioned any configuration for use by the purposes difference.

Secondly, doing one with regard to the film forming device of the above-mentioned film of practical application formation method describes in detail.

Figure 14 shows that the film forming device of a fourth embodiment in accordance with the invention.

In Figure 14,137 is the hydrojet parts of sprayed solution, 138 is to spray film forming in the above coated object by solution, 139 heating plates for the coated object 138 of heating, 140 for moving the X-Y framework of coated object, this framework have the motor 140x that moves coated object 138 on the x direction and perpendicular to x to the y direction on move the motor 140y of coated object, this framework 140 can form film in any part sprayed solution on this object 138.141 heat-insulating shields for preventing to dispose from the heat transmission that heating plate 139 produces, 142 for disposing the framework of motor 142z, this Z framework 142 can make hydrojet parts 137 move along the Z direction perpendicular to X and Y direction, and can make hydrojet parts 137 be positioned vertical direction.143 are the storage sprayed solution, and feed flow is to the solution supply part of hydrojet parts 137.

Have, control assembly 144 is used for the emitted dose control to solution injecting-unit 131, the control of the displacement of X-Y framework 140 and Z framework 142 is controlled, reached to the temperature of heating plate 139 again.

In apparatus structure as above, behind the position with Z framework 142 location solution injecting-units 137, solution promptly sprays to coated parts 138 by aforementioned ejector principle from solution injecting-unit 137.At this moment, on demand, make the X-Y framework in the hydrojet process or the hydrojet back that finishes move.

And, because of being provided with the heater-heating plate 139 of the coated object 138 of heating, solution can sprayed after on the coated object 138, by heating coating articles 138, evaporating solvent forms film rapidly, so can shorten the formation required time of film.

In addition, adopt lamp as the method for heater etc., also can obtain same effect.

Certainly, at room temperature dry if any time enough, then can heat.

Again, substrate is not limited to tabular, and formation films such as also can making curved substrate uses the same method.

Have, to apparatus structure shown in Figure 14, replenish the function of inert gas again, this inert gas can be used as film forming surrounding environment gas.Thus, can not be subjected to the influence of atmosphere more can not occur making the solution of injection and the moisture content in the atmosphere etc. to react, make the phenomenon of himself deterioration in characteristics, thereby can make solution keep its characteristic.

Charge into the inert gas method as film forming surrounding environment gas, for example, used vessel gets up the diaphragm seal that forms, and inert gas is imported wherein being higher than under the atmospheric pressure; Perhaps, vacuum available pump etc. produces pressure reduction between film forming zone and atmosphere, thereby inert gas is charged into film forming zone.

Again, the shower nozzle of the solution injecting-unit 137 of sprayed solution also has many spray orifices shower nozzle of a plurality of nozzles, and these just can be simultaneously with various different solutions formation films, or can make a plurality of loop figure lines with certain intervals simultaneously, thereby have improved production efficiency.

Embodiment 5

Below, do an explanation with regard to the 5th embodiment of the present invention.

Among the embodiment 4, just than resistance higher (10 ⁵More than the Ω cm) solution done elaboration, in the present embodiment, just lower solution (10 than resistance ⁵Ω cm is following) spray and do an explanation.

In the commercially available sol solution of a part, for example, be the SrTiO of main solvent with acetic acid ₃Sol solutions etc., it is lower by according to appointment 4 * 10 than resistance ³Therefore Ω cm, can not produce the lines phenomenon by electrostatic force, so can't realize stable solution spraying according to the principle spray of embodiment 4.

Can think that the reason of above-mentioned phenomenon is that acetate becomes the ion of disassociation in solvent, reduce and compared resistance.

Therefore,, hydrophobic organic solvent isobutyl-benzene as second solvent, is mixed in this mixed liquid with 1: 1 ratio, is comprised, rise to 10 than resistance as the d zone of Figure 12 for improving than resistance ⁷Ω cm is so can carry out good solution spraying.

As above as seen, except first solvent of abundant dissolve medium, re-using to regulate than resistance is second solvent of purpose, can make the solution that can well be sprayed by electrostatic force thus.

The common preferably polarity of above-mentioned second solution is lower than the organic solvent of first solution, and, can mix with first solution is good molten, for example, aliphatic hydrocarbon, cycloalkane, and-alkyl or dialkyl group naphthalene, the organic solvent of the aromatic hydrocarbon of isopropylbenzene etc. etc.

Then, can form film by as the operation after the injection of embodiment 4.

Embodiment 6

Below, do an explanation with regard to the sixth embodiment of the present invention.

In the present embodiment, do an explanation with regard to the injection of the higher solution of viscosity (more than 10～20cp), particularly resin solution.

The solution that has dissolved resin is sprayed on the coated object, and dry thereafter this solution obtains the film formation method of resin film, can consider to be used for various uses.Shielding material when for example, can be used for making the electronic component circuit.

And, because the general viscosity of these solution is higher, be 10～20cp or higher on, with before piezoelectricity spraying process the time, can't spray, or ejection is unstable.

Yet, find that as using the gunite of electrostatic force, promptly using viscosity is the resin solution of 20～30cp, also can be made into high-quality pattern.

The ratio resistance that it should be noted that some resin solution is lower than 10 ⁵Ω cm.

Referring to Figure 12, can think that the resin solution of these low resistivities can't spray, but according to the research of present inventor to resin solution, find exceptionally:, also can produce the wire drawing state even when lower than resistance.

For example, the ratio resistance that has added the PVA aqueous solution of PVA (polyvinyl alcohol) 5% is about 500 Ω cm.It sprays with the liquid discharging method of electrostatic force, the solution that can carry out the wire drawing shape.

Can think, as the key element that produces the physical property value of wire drawing phenomenon by electrostatic force, not only can consider than resistance value, and can consider the size of solute self molecular weight in some cases.

Although the reason of the easier generation wire drawing of relevant resin solution phenomenon not clear and definite, can be thought, since the easy wire drawing of hmw protein, the also easier generation wire drawing of macromolecule resin phenomenon.

Then, can form film by as the operation after the injection of embodiment 4.

By said method, when the sprayed solution, can fill perhaps and in the scope that quite enlarges, form film than resistance at resin.When making with common electronics system, multiple working procedures such as the formation of mask need application of resin, exposure, etching are compared, in hydrojet principle according to fourth embodiment of the invention, when forming film by resin solution, only can form mask with a procedure, so, obtained very big effect at the aspects such as price of operation that reduces making electronic component circuit and reduction electronic component circuit.

Embodiment 7

In the present embodiment, a kind of method that forms metallic film has been described.

If, the solution that contains lemel can be sprayed directly on on the coated object and form film, then can be formed directly in meticulous connecting line, thereby, can reach on the low price and obtain very big effect in the miniaturization of circuit.

Adopt dispersant, the lemel end is suspended, can make the solution of containing metal fine powder stably.

Example as dispersant has surfactant, and this surfactant is adsorbable in the solid-liquid interface place, reduces and stablized interface energy.

That is, because of surfactant can form absorption protection coverlay at microparticle surfaces, in the suspension that makes the surfactant stable dispersion, directly contact and collision can not take place between each particulate, therefore, can be used as conductance low, promptly than resistance 10 ⁵The solution that Ω cm is above.

In addition, the absorption diaphragm also can only form with surfactant, but also has the material that strengthens the surface coverage film.

Described material is often referred to protecting colloid or emulsion stabilizer, adds those materials and can avoid fully running foul of each other between micro mist, makes the suspension of electric performance stablity.

As protecting colloid, the known ether (ether with fiber) that natural plant gum, starch, alginate, protein, lecithin, (containing) fiber arranged, polyvinyl alcohol, polyvinylpyrrolidine, polyacrylic acid ester derivant, cabosil etc.

Usually, the dispersant of particulate, its particle diameter are called colloid, its particle diameter and are called latex when several μ m to 0.1 μ m when 0.1 μ m is following.

Above-mentioned microparticulate agent is on sale on market, in the present embodiment, has used the ultrafine dust solution of the silver-colored microparticulate of Vacuum Metallurgical Co., Ltd.'s system any dispersion in toluene solution, argentiferous 30% (weight).

This disperse particles is generated in gaseous environment by evaporation, and particle diameter is below 0.1 μ m, and aggegation ground does not take place each particle of doing the dispersion of colloid shape, disperse arbitrarily, therefore, the ratio resistance higher about 10 of solution ⁷Ω cm.

This microparticulate agent is sprayed on the coated object with electrostatic force, can produces hydrojet with good wire drawing phenomenon.

, will be sprayed on dispersant on the coated object 300 ℃ of heating thereafter, dispersion liquid have a silver-colored film of electric conductivity.

Can think, this be because, covered silver-colored surface activity of particles agent or protecting colloid melted by heat and evaporation, contact with each other between the silver granuel cohesion form.

Certainly, and as aforementioned, this heating process also can be omitted because of the occasion difference.

As mentioned above, even particulate itself has the characteristic of lower resistance, but by the little material that makes coated with insulating materials, form the words of sprayed solution, then can carry out good hydrojet, form film, and can be formed directly in trickle circuit by electrostatic force, this can obtain very big effect reducing on circuit price and the coated parts distribution to the band curved surface.

Embodiment 8

Below, the eighth embodiment of the present invention is described.

In the 4th to the 7th embodiment of the present invention, illustrated and only utilized the method for electrostatic force as ejection solution, and on the other hand, in eighth embodiment of the invention, except electrostatic force, situation is done an explanation when again solution being aided with the vibration that applies by generations such as piezoelectric elements.

Figure 15 shows that to be used in combination electrostatic force and pressure wave, make the configuration of spray orifice 190 sprayed solution.

As shown in Figure 15,147 is spout, and 148 for being used for taking place the piezoelectric element of pressure wave on solution, and 149 is the balancing gate pit, and 150 is supply opening, and 151 is backplate, and 152 is high voltage source, and 153 is coated object.

In said structure, piezoelectric element 148 is added voltage, make its distortion, thereby pressure adds voltage to piezoelectric element 148 in said structure, make its distortion, thereby the volume of balancing gate pit 149 changes.

The volume-variation of balancing gate pit 149 produces the solution in the spout 149 to flow, when this flows greater than certain value, solution drop spray to coated object.

Again, exist effect of electric field between masking liquid in balancing gate pit 149 and the back electrode, its active force inhales masking liquid to coated object.

When solution was applied electrostatic force, the ejection of solution took place when perhaps the pressure wave that produces at existing piezoelectric element has electrostatic force again.Can be to the solution application of force, solution remains in spout 147 places because of surface tension.

Use said apparatus, research has been done in the solution injection that produces when just only using the occasion of electrostatic force and being used in combination the two occasion of electrostatic force and pressure wave, and it the results are shown in Figure 16.

Curve shown in Figure 16 has connect solution and has begun blow-off point.

When the pressure wave that does not have piezo-electric effect to produce acted on solution, the C point needs electrostatic force, and (electric-field intensity that is equivalent to Figure 12 2KV/mm), but was exerted pressure ripple to the D point to solution, then can show, increases with pressure wave, can correspondingly reduce electrostatic force.

At this moment, magnitude of voltage different, common, that impose on the piezoelectric element is 50V to 500V to the pressure wave size that imposes on solution with the material of piezoelectric element and the structure of size, fluid storage compartment, the aperture of spray orifice, the physical characteristic value of ejection liquid etc.

This experimental result shows that the liquid ejecting method compared with solution only being done in order to electrostatic force is aided with the ripple of exerting pressure again in the electrostatic force part, can reduce the hydrojet starting voltage shown in Figure 12 of embodiment 4, thereby can produce the wire drawing phenomenon at broader area.

With reference to Figure 17, the above-mentioned fact is described again.

Figure 17 has represented to apply the relation between the voltage when ratio resistance value of solution and hydrojet begin when solution being added as the electrostatic force of the point of the E among Figure 16 expression and pressure wave.

In Figure 17, dotted line F is the hydrojet starting voltage (being equivalent to the curve A among Figure 12) when only using electrostatic force, and curve G is the hydrojet starting voltage when having electrostatic force and pressure wave.

Exert pressure again on the electrostatic force liquid discharging method of ripple descends the hydrojet starting voltage of solution, solution produce the zone of wire drawing phenomenon can the d zone when only electrostatic force being arranged on, add the e zone, therefore, can use the solution lower than resistance value, the result can enlarge the range of choice of hydrojet.

Then, adopt as the process forming film after embodiment 4 hydrojets.

As above as seen, hydrojet is not only applied electrostatic force, the ripple of also exerting pressure is then compared with the liquid ejecting method with electrostatic force only, has enlarged selected hydrojet kind, so can film forming type increase, can the manufacturing of component or microcomputer be produced a very large impact.

In embodiment 4 to embodiment 8 described methods, make solutions employed be sprayed into the wire drawing shape.Yet the present invention is not limited to this, and the ratio resistance of solution can be regulated, thereby can make the droplet-like of solution formation shown in Figure 10 A by the requirement of coating, or the spray form shown in Figure 16 c.

Said apparatus of the present invention does not have substantial restriction to the solution kind that can be used for spraying.

Further, when the solution of ejection can stably form the wire drawing shape, just can form meticulous film.

As mentioned above,, use solution shape material to form material as film according to the present invention, and only with electrostatic force; Or except electrostatic force, add the method for piezo-electric effect as ejection film formation material, the solution that described film is formed material is sprayed on the film former spare.Remove solvent in the solution by heating evaporation then, or make this solution at room temperature leave standstill a special time.Like this, compare with the film formation method of commonly using, the former essentially no restriction of solution kind to can be used for spraying, and when making spray coating liquor form the wire drawing shape, can form high-quality thin-film, its result can provide very big facility to making various circuit and device.

In addition, the structure of set masking liquid shower nozzle may be able to make pressure reduction outwards impose on the meniscus that forms in the hydrojet aperture from the feed flow source.In this embodiment, steam vent also can face the spray hole setting, and like this, air stream can blow out via the hole between spray hole and steam vent.Wherein, be bordering on the air pressure of the spray hole of steam vent one side,, go up outwards ejection thereby make this liquid can be stated from air stream less than the air pressure that imposes on by feed flow source one side on the meniscus that the spray hole place forms.Embodiment 9

Below, the ninth embodiment of the present invention is described.

Figure 18 is used for forming and the structural representation of the spinning applying device of installation method according to the film of the ninth embodiment of the present invention.

Among Figure 18,10 is coated substrates, and 161 is the masking liquid shower nozzle, and 162 is spray orifice.

Here, masking liquid shower nozzle 161 makes liquid from small spray orifice (usually below 0.1mm) ejection, and application is deposited on the record body.

Again, spray orifice 162 has a plurality of spray orifices, and the coated substrates 10 that is arranged at rotation at certain intervals radially.

Below, with this structure, the operation that film forms is described.

At first, for example, adopt similar driving control device among Fig. 5, control by micro computer among Fig. 5 53, make coated substrates 10 keep slowly running simultaneously, make coating liquid 163 spray to coated substrates 10 from the spray orifice 162 on the masking liquid shower nozzle 161, coating fluid 163 begins to be deposited on the coated substrates 10.

Then, coating liquid constantly sprays to coated substrates 10 from the spray orifice 162 on the masking liquid shower nozzle 161.Simultaneously coated substrates 10 continues slowly running, till making coating liquid 163 roughly be deposited on the whole surface of coated substrates 10.As long as this low speed rotation makes its rotating speed be enough to make coating liquid to be deposited on the surface of coated substrates 10.

At this moment, excessive as the spacing between the spray orifice of a plurality of configurations, the lines non-overlapping copies of the coating liquid that is formed by adjacent spray orifice is closed, and when separating each other, then by the microcomputerized control 53 among Fig. 5, when moving radially of coated substrates 10 applied shower nozzle 161, the coated substrates that slowly runs more than 10 time seamlessly was deposited on the whole surface of coated substrates 10 coating liquid.

Then, by the microcomputerized control among Fig. 5, after confirming that coating liquid has been deposited on the whole surface of coated substrates 10 basically, to be higher than the previous coated substrates 10 that slowly runs, the coating liquid of too much coating is splashed away, simultaneously, further improved the uniformity of coated film, on coated substrates 10, formed film by said method.

The masking liquid spray orifice of the spinning applying device of commonly using, its internal diameter is 6.5-1mm, is difficult to carry out the accurate control of micro-spouting liquid, uses the masking liquid shower nozzle 161 of present embodiment, can paint and make high-quality pattern, and form uniformly, film as thin as a wafer.

Have, according to the 9th embodiment, coating liquid is coated on the whole surface of coated substrates 10 by masking liquid shower nozzle 161 in advance again, and what disperse during high speed rotary is coated with liquid measure and can reduces to very lowly, so can reduce production costs, and shortens the operating time significantly.

Embodiment 10

Below, do an explanation with regard to the tenth embodiment of the present invention.

Figure 19 shows that the critical piece sectional view of spinning applying device, shown concrete structure among the figure according to the employed coating shower nozzle of film formation method in the tenth embodiment of the invention.

Generally, the coating jet recording system has polytype.Comprise, produce bubble, and the bubble jet system of the pressure ejection liquid that produces with bubble by heat energy, and, by piezoelectric element compression fluid storage compartment, and connect requirement and be ejected liquid piezo type system etc. with its pressure.Above-mentioned these systems are a lot of to the liquid restriction that can be used for hydrojet, and for example relevant viscosity can only be the interior very among a small circle liquid of 1-5cp with viscosity.

Use masking liquid shower nozzle as shown in figure 19, that be called the electrostatic attraction system and device, but the liquid of spray viscosity higher (about 100cp or following) then.

In Figure 19,170 is coated substrates, and 171 are the masking liquid shower nozzle of electrostatic attraction system, and 172 is nozzle, and 183 is substrate holder, and it has the conductive materials of metal and so on to constitute, and also plays the electrode effect.

Again, 174 is high-voltage generator, and 175 is fluid storage compartment.

The below operating process of the spinning applying device of explanation said structure, the operating process itself that the present embodiment film forms is substantially similar to the 9th embodiment.

At first, the coated substrates 170 that slowly runs simultaneously by high-voltage generator 174, applies high voltage pulse between inherent substrate holder 173 of setting-up time and fluid storage compartment 175.

During applying high voltage pulse, the meniscus that is formed at spray orifice 172 places is attracted to substrate holder 173, ejection, and be deposited on the coated substrates 170.

Usually, be decided to be 2-3mm as distance with spray orifice 172 and substrate holder 173, then can be by the ejection of the voltage about 2-4KV liquid.

In electrostatic attraction system masking liquid shower nozzle as above, be suitable for the solution of the high-insulativity organic solvent of viscosity below about 100cp, therefore can spray polyamide liquid and protection liquid etc.

Then, after confirming that coating liquid 177 has been deposited on the whole surface of coated substrates basically, to be higher than the previous coated substrates 170 that slowly runs, the coating liquid of too much coating is splashed away, simultaneously, further improved the uniformity of coated film, on coated substrates 170, formed film by said method.

In the present embodiment, paint and do than the higher pattern of commonly using of spinning applying device quality, and formation uniformly, film as thin as a wafer.

Have, because of coating liquid 177 is sprayed on the whole surface of coated substrates 170 by the masking liquid head 171 that has used electrostatic force in advance, what disperse during high speed rotary is coated with liquid measure and can reduces to very lowly, so can reduce production costs, and shortens the operating time significantly again.As above-mentioned masking liquid shower nozzle, also can use the masking liquid shower nozzle of first embodiment shown in Fig. 2-4.

In addition, controlled with the magnetic valve 41 of Fig. 4 as the described masking liquid shower nozzle of the 9th and the tenth embodiment, then as the present invention's explanation, although the high speed adaptability of this masking liquid shower nozzle is relatively poor, still can not need paint and make fine pattern, be useful for without a doubt on the object of desire formation homogeneous film.

Further, the system of the 9th and the tenth embodiment is a kind of system of simple pressure control type, the seldom influence of liquid body physical property value, for example, and viscosity, surface tension, than resistance, thus, but the free degree of using liquid is very big, is another advantage.

Again, in the 9th and the tenth embodiment, coated substrates is horizontally disposed with, and vertical pivot is as turning cylinder, and liquid is from last ejection.But, the present invention is not limited to said structure, as long as the result can form the film of desired properties.

As above as seen, according to the present invention, have the masking liquid shower nozzle of a plurality of small spray orifices and substrate to relatively rotate each other than low velocity, in this simultaneously, after coating liquid was deposited on the whole surface of substrate substantially, then this substrate relatively rotated at a relatively high speed, the film that is evenly applied thus.Like this, because the waste that causes of splashing of liquid can reduce to minimum, thereby make the present invention that the film that a kind of running cost is low and process velocity is high formation method can be provided.

Further,, can paint and make first-rate quality pattern, and form more even, extremely thin film by the use of masking liquid shower nozzle.

At this moment, if use the masking liquid shower nozzle of an electrostatic attraction system, can adopt viscosity less than about 100cp, have the organic solvent solution of high-insulativity, therefore can spray polyamide liquid, protection liquid, and other liquid etc.

Again, littler if use the masking liquid shower nozzle utilize air stream by the influence of this system's liquid body physical property value, for example, and viscosity, surface tension, and piezoelectricity value, like this, it will be very big can using the free degree of liquid, and this can be used as another advantage.

Embodiment 11

Figure 22 is the perspective view according to the film forming device 301 of the 11st embodiment of the present invention.

In Figure 22, this film forming device 301 comprises: segmentation support rotating light substrate (below abbreviate substrate as) 302 supported parts 303, towards the jet head 304, by the substrate 302 spraying coating liquid of supported parts 303 supportings be used for to this shower nozzle 304 supply liquid liquid supply part 305, make shower nozzle 304 move radially from the centre of substrate and be used to control supported parts 303 liquid supply parts 305, the control assembly 307 of jet head moving-member 306 to the jet head moving-member 306 of outer circumferential side.

Supported parts 303 have supported chassis 301, and this chassis 310 is a disc, and are rotatable, and play sticking substrate 302, and substrate rotation motor 311 is used to rotate supported chassis 310.Be provided with the cover cap 312 of covering substrate 302 outer circumferential sides, to surround supported parts 303.

As shown in figure 23, jet head 304 has, the spray orifice 315a-315g of 7 masking liquid head-type that its diameter is cumulative.Decide according to the surface covered that increases in outer peripheral sidewall in the spray orifice aperture of these 315a-315g.Spray orifice 315a-315g is arranged in delegation in one direction, and both can be along the arranged radially of spray orifice, also can with the angled arrangement of this radial intersection.In addition, because at the surface covered of the outer circumferential side of substrate 302 surface covered greater than basic centre, the spray orifice 315a of minimum-value aperture places the centre of this substrate 302, and the spray orifice 315g of maximum diameter of hole places outer circumferential side.

Liquid supply part 305 by, for example, can regulate the measuring pump of discharge capacity or a pressurization storage tank and constitute.Liquid supply part 305 is according to surface covered, operating time and film thickness fixed constant lifting rate, to jet head 304 supply liquid.

Spray moving-member 306, the original position of work that solid line is painted and between backspacing a position, move radially injector head 304 in as Figure 22 along substrate 302 by two works that dotted line is painted.This shower nozzle moving-member 306 comprises: the top has the armed lever 320 of jet head 304, mobile framework 321, and a pair of lower guide rod 322 of going up, fixed frame 323, screw rod 324 moves with motor 325.The intermediate configurations of armed lever 320 has pivot pin 324a, is used to regulate the installation site of shower nozzle 304 around vertical shaft.Mobile framework 321 makes it be attached to the basal plane end of armed lever 320.The a pair of mobile framework of lower guide rod 322 guiding of going up moves in the horizontal direction.Two ends of fixed frame 323 fixings two guide rods 322, and swivel bearing screw rod 324, screw rod 324 be arranged in parallel between two guide rods 322 and guide rod 322, and wherein an end is connected with mobile motor 325.The guide bearing (not shown) of being made sliding bearing by guide rod 322 is installed in the mobile framework 321.

As shown in figure 24, control assembly 307 comprises: the micro computer that contains CPU, ROM, RAM etc.Feed flow part 305, substrate rotation motor 311, mobile motor 325, and other input-output unit etc. is connected on the control assembly 307.What be connected in control assembly 307 also has: comprise start-up function initiate key enter key 330 and comprise the position of rotation that is used for detection screw rod 324 and the various sensors 331 of the used sensor of rotating speed of substrate driver part 311.

Secondly, by flow chart shown in Figure 25, the operation of previous embodiment is described.

As the step S among Figure 25 ₁, do initial setting.By this initial setting, jet head moving-member 306 moves to the position of moving backward as two works that pecked line is painted with jet head 304.At step S ₂In, prepare substrate 302 is installed on the substrate fixed underpan 310.When substrate 302 is installed on the substrate fixed underpan 310, flow process proceeds to step S ₃, at step S ₃, jet head 304 is brought to the original position of work that solid line is painted among Figure 22 by jet head moving-member 306.At step S ₄In, substrate rotation motor 311 starts, and substrate 302 rotates with constant rotational speed.At step S ₅Liquid supply part 305 startings, liquid sprays to substrate 302 from jet head 304.Then, step S ₆, jet head 304 moves as constant speed towards the outer circumferential side of substrate 302.At step S ₇, preparation moves jet head 304 and reaches coating end position.When jet head 304 arrived this coating end position, flow process entered S ₈At step S ₈In, substrate rotation motor 311, mobile motor 325, and liquid supply part 305 is out of service.At step S ₉, substrate rotation motor 311 is with rotation at a high speed, so unnecessary liquid is dispersed away.At step S ₁₀, the basal plate transmitting system of configuration is separately sent the instruction of sending substrate, flow process is back to step S thus again ₂

In above-mentioned situation, the aperture design of nozzle bore 315a to 315g is to increase by its increase with surface covered.Therefore, the simple control by mobile shower nozzle 304 under simple control rotary substrate 302 under constant speed and the constant speed can form the well-proportioned film with thickness.

According to the 11 embodiment, the masking liquid injector head has a plurality of spraying parts, and these spraying parts are made of spray orifice, and makes spouting liquid cumulative toward the direction like this towards a direction arrangement, and wherein, the hydrojet parts of spouting liquid minimum place the near zone of substrate.Therefore, the liquid measure from this hydrojet parts ejection increases gradually along with separated region (periphery) side of shifting to this substrate from the near zone side (central side) of this substrate.Like this, at the outer circumferential side of the big substrate of surface covered, quantity for spray is bigger, so can be obtained very uniformly, be had certain thickness film by simple control.And, when the masking liquid injector head moves with respect to substrate, even if substrate also can form film greater than in one direction hydrojet section length.Cumulative by nozzle bore further, carrying out towards the substrate periphery when mobile, as long as can be easy to increase spouting liquid.Other embodiment

(a) as shown in figure 26, in jet head 404, for example, 9 set spray orifice 435a to 435I with same diameter are along with the increase of surface covered.Its spacing reduces gradually.

In this embodiment, carrying out towards the periphery of substrate when mobile,, can easily increase quantity for spray as long as by reducing the spacing of nozzle bore gradually.Group can the same intervals setting, and the spray orifice number of spray orifice group 504a to 504f can increase with the increase of surface covered.In this embodiment, the orientation of spray orifice is to make spray orifice form the direction of cross arrangement, and perhaps, those spray orifices can be arranged by circumferential.

In last example, carrying out towards the periphery of substrate when mobile, as long as by increasing the spray orifice number of each spray orifice group gradually, can be easy to increase quantity for spray.

(c) as shown in figure 28, in jet head 604, spray orifice 615a to 615e can the equidistant from distance setting, and again, one group of featheredge aperture 636 being controlled flow velocity by the fluid pressure that reduces to impose on shower nozzle 615a to 655e gradually can be arranged in this jet head 604.

In this embodiment,, controlled the spouting liquid of spray orifice, this spouting liquid is increased gradually towards the outer circumferential side of substrate as the featheredge aperture 636 of flow velocity control element.Thus, can increase quantity for spray towards the substrate outer circumferential side with simple control.

(d) removable substrate fixed part is to replace moving of jet head.

As mentioned above, according to the present invention, from the liquid measure of spray spraying parts ejection along with shower nozzle from the central side of substrate towards substrate moving of outer circumferential side and increase gradually.Like this, increase, and surface covered also increases, so, can make uniform as far as possible thickness with simple control method in the spraying liquid measure of outer circumferential side.

More than, with reference to accompanying drawing,, the present invention has been done to prove absolutely, but for a person skilled in the art, variations and modifications all are obvious in conjunction with preferred embodiment.These variations and modification are understood to include within the defined scope of the present invention of appending claims, unless run counter to scope of the present invention.

Claims

1. film forming device, described device comprises:

Masking liquid shower nozzle (11,70,121,124,126,133,137,161,171,190) with spray orifice that a plurality of atomizing of liquids use;

Make and deposited the whirligig (50) that rotates around deciding rotating shaft from the coated substrate (10) of the liquid of above-mentioned masking liquid shower nozzle ejection;

Make above-mentioned masking liquid shower nozzle and above-mentioned coated substrate be adjacent to the near zone of above-mentioned rotating shaft and the relative movement device (51,54) that work relatively moves each other between the zone of leaving that above-mentioned coated substrate leaves above-mentioned rotating shaft at above-mentioned coated substrate;

Control the control device (52 that relatively moves of above-mentioned relative movement device, 53), make corresponding to the relative position of above-mentioned masking liquid shower nozzle and above-mentioned coated substrate near zone when leaving the zone and relatively move, the corresponding relative moving speed that reduces by the relative movement device generation

It is characterized in that: wherein, described device comprises that further being arranged on described masking liquid shower nozzle (70) air contiguous, that have to coated substrate blow out air stream function flows out head (71), wherein, in case liquid is sprayed onto on the coated substrate, immediately this air stream is blown out to this substrate.

2. film forming device as claimed in claim 1 is characterized in that, wherein, described device further comprises the charged charging device (90) of liquid that makes from the ejection of masking liquid shower nozzle.

3. film forming device as claimed in claim 1, it is characterized in that, wherein, described masking liquid shower nozzle has the mouth spray of facing (27,91) exhaust outlet of She Zhiing (25,92), and by this exhaust outlet discharge air, to cause fluid pressure in the mouth spray and to change, spray liquid thus by the balance of air-flow between near the air pressure that produces the mouth spray.

4. film forming device as claimed in claim 1, it is characterized in that, wherein, described device further comprises the electrode member (93) that is arranged at the exhaust outlet periphery, and be used for the potential difference feeding mechanism (90) of potential difference is provided between the liquid in described electrode member and the mouth spray, thus, make from the liquid of masking liquid shower nozzle ejection charged.

5. film forming device as claimed in claim 1 is characterized in that, wherein, the liquid of described desire ejection is to contain film to form material and dissolve the molten liquid material that this film forms the solvent of material, and described device further comprises:

Supply the source of supply (143) of this liquid to spray orifice;

Be equipped with framework (140) coated substrate, that rotate with whirligig on it; And

Be used to heat coated heating of substrate device (139).

6. film forming device as claimed in claim 1 is characterized in that, wherein, described device further comprises:

Moving up in first party, (142,142Z), this first direction is defined as described masking liquid shower nozzle and coated substrate is connected with each other for first mobile device of masking liquid shower nozzle; And

Be arranged at second mobile device on this framework (140,140x, 140y), this mobile device becomes the mobile framework on two vertical each other directions in the plane perpendicular to first direction.

7. film forming device as claimed in claim 1, it is characterized in that, wherein, described device further comprises: one makes the control device (53) of coated substrate with the rotation of first relative velocity, this first relative velocity is enough to make liquid deposition on the surface of this liquid coated substrates, so that liquid can little by little be conducted on the coated substrate surface of this coated substrate equably, finish first coating state thus;

Then, this control device moves coated substrate with second relative velocity greater than first relative velocity, so that too much the coating liquid of coating disperses, on coated substrate, form film thus than more uniform second coating state of first coating state from first coating state.

8. film forming device as claimed in claim 1 is characterized in that, wherein, described masking liquid shower nozzle is an electrostatic attraction type masking liquid shower nozzle, and this shower nozzle attracts liquid outwards from spray orifice with electrostatic force, makes the liquid ejection.

9. film forming device as claimed in claim 1 is characterized in that, wherein, described masking liquid shower nozzle is an electrostatic attraction type masking liquid shower nozzle, and this shower nozzle attracts liquid outwards from spray orifice with electrostatic force, makes the liquid ejection.

10. film forming device as claimed in claim 4 is characterized in that, wherein, described liquid has and is not less than 10 ⁵The ratio resistance of Ω cm.

11. film forming device as claimed in claim 3 is characterized in that, wherein, described liquid sprays with the wire drawing shape.

12. film forming device as claimed in claim 1 is characterized in that, wherein, described liquid is by the pressure wave effect ejection that is applied to it.

13. film forming device as claimed in claim 1, it is characterized in that, wherein, described masking liquid shower nozzle has a plurality of hydrojet parts, these parts are made of spray orifice, and arrange by this way in a direction: promptly spouting liquid increases in the same direction as gradually, and the hydrojet parts of minimum spouting liquid place near zone one side of described substrate.

14. film forming device as claimed in claim 13 is characterized in that, wherein, described relative movement device makes the masking liquid shower nozzle deposit minimum spray volume state partly from this substrate near zone one side, shifts to described substrate and leaves a regional side.

15. film forming device as claimed in claim 13 is characterized in that, wherein, described a plurality of hydrojet parts are a plurality of spray orifices, and this spray orifice is arranged by equidistant from distance, and its aperture increases gradually towards leaving a regional side.

16. film forming device as claimed in claim 13 is characterized in that, wherein, described a plurality of hydrojet parts are a plurality of spray orifices, and this spray orifice has same diameter, and its arrangement pitches diminishes gradually towards leaving a regional side.

17. film forming device as claimed in claim 13 is characterized in that, wherein, described a plurality of hydrojet parts are a plurality of spray orifice groups, and described spray orifice group is arranged with equidistant from distance, and its spray orifice footpath increases gradually towards leaving a regional side.

18. film forming device as claimed in claim 13, it is characterized in that, wherein, described a plurality of hydrojet parts comprise a plurality of spray orifices of arranging, having same diameter with equidistant from distance, and be used to control the liquidity ratio control element of described spray orifice spouting liquid, by this control element, make spouting liquid towards leaving a regional side, increase gradually.