CN1130304A - 半导体器件、其制造方法和电光器件 - Google Patents

半导体器件、其制造方法和电光器件 Download PDF

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CN1130304A
CN1130304A CN95119479A CN95119479A CN1130304A CN 1130304 A CN1130304 A CN 1130304A CN 95119479 A CN95119479 A CN 95119479A CN 95119479 A CN95119479 A CN 95119479A CN 1130304 A CN1130304 A CN 1130304A
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CN1083617C (zh
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山崎舜平
荒井康行
寺本聪
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Semiconductor Energy Laboratory Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133305Flexible substrates, e.g. plastics, organic film
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    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136227Through-hole connection of the pixel electrode to the active element through an insulation layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78606Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
    • H01L29/78636Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device with supplementary region or layer for improving the flatness of the device

Abstract

一对形成有源矩阵液晶显示器的衬底,它们由具有柔韧性和透明性的树脂构成。一薄膜晶体管有一半导体层,该层形成于已形成在树脂衬底上的树脂薄膜上。形成该树脂层以阻止在薄膜的形成和使树脂衬底表面平面化过程中,在树脂衬底表面上产生齐聚物。

Description

半导体器件、其制造方法和电光器件
本发明一般涉及薄膜晶体管的结构,这种薄膜晶体管在如由工程塑料制成的树脂的柔韧(即有机械弹性)衬底上形成。本发明还涉及制造这种薄膜晶体管的方法。此外,本发明还涉及应用了这些薄膜晶体管所制造的有源矩阵液晶显示器。
大家知道,薄膜晶体管一般在玻璃衬底或石英衬底上形成。以玻璃为衬底的薄膜晶体管主要用于有源矩阵液晶显示器。由于有源矩阵液晶显示器能够以高灵度、高信息量显示图像,所以期望有源矩阵液晶显示器可以取代简单矩阵液晶显示器。
在有源矩阵液晶显示器中,每个象素都设置有作为开关单元的一个或多个薄膜晶体管。电荷进入和流出象素电极是由薄膜晶体管控制的。因为需要可见光穿过液晶显示器,所以采用玻璃或石英作衬底。
液晶显示器是一种应用前途预计十分广泛的显示装置。例如:用作卡式计算机、便携式计算机和作为各种远距离通信设备的便携式电子装置等的显示装置。在要处理采用更先进技术的信息时,这些信息需要在用作便推式电子装置的显示装置上显示出来。如需要有显示较大信息量和移动图象以及数码和符号的功能。
这里,由于要求液晶显示器具有显示大信息量和移动图象的功能,所以很有必要采用有源矩阵液晶显示器。然而,由于衬底是玻璃或石英的,各种问题就产生了:(1)液晶显示器自身的减薄受到了限制;(2)重量增加;(3)如果试图在减少重量时减小厚度,则衬底会损坏;(4)衬底没有柔韧性。
尤其是对于卡式电子器件,为了在加工中有轻微的压力作用于器件时,器件不致于受损伤,需要有柔韧性。因此,与这些电子器件结合使用的液晶显示器,同样需要具有柔韧性。
本发明在此提供一种具有柔韧性的有源矩阵液晶显示器。
一种使液晶显示器具有柔韧性的适当方法,是用透光的塑料或树脂的衬底。然而由于树脂衬底耐热性很差,要在其上形成薄膜晶体管在技术上是困难的。
因此,这里所披露的发明,是通过采用下述结构来解决上述问题。
这里所披露的一个发明包括:一薄膜树脂衬底;一在所说树脂衬底的表面上形成的树脂层;和在所说树脂层上形成的薄膜晶体管。
图1表示了上述结构的一个具体例子。在图1所示的结构中,树脂层102与厚度为100μm的PET膜101接触,PET膜为一薄膜树脂衬底。在树脂层上形成颠倒交错排列的薄膜晶体管。
薄膜树脂衬底的材料可以从PET(聚对苯二甲酸乙二醇酯)、PEN(聚乙烯萘甲酸酯)、PES(聚乙烯亚硫酸酯)和聚酰亚胺中选择。必要的是要具备柔韧性和透明性。材料所能承受的温度应尽可能的高。如果加热温度升高约200℃,齐聚物(直径约1μm的聚合物)一般会沉积在表面,或会有气体产生。因此,要在树脂衬底上形成半导体层是很困难的。因而,所选材料应有最高的可能的处理温度。
在上述结构中,树脂层的作用是使树脂衬底表面平面化。平面化可以在如形成半导体层这样的加热步骤过程中防止齐聚物在树脂衬底表面上析出。
此树脂层材料可以从丙烯酸甲酯、丙烯酸乙酯、丙烯酸2-乙氧基乙酯中选择。这样,即使采用树脂衬底,这种树脂层也可以在上述薄膜晶体管制造过程中消除这些缺陷。
另一种发明的结构包括以下步骤:在薄膜树脂衬底上形成一树脂层;通过等离子辅助CVD,在所说树脂基底上形成一半导体层;和用所说半导体层形成薄膜晶体管。
再一种发明的结构,包括以下步骤:为使所说树脂衬底脱气,在给定温度对薄膜树脂层进行热处理;在薄膜树脂衬底上形成一树脂层;通过等离子辅助CVD,在所说树脂衬底上形成一半导体层;和使用半导体层形成薄膜晶体管。
在上述结构中,为了防止在包括加热工艺在内的后续工艺过程中,气体从树脂衬底中析出,对该衬底进行热处理使树脂衬底脱气。例如,当在树脂衬底上形成半导体薄膜时,如果有气体从该衬底放出,那么将会在半导体薄膜里形成大针孔。这会很严重地损害其电性能。因此,应在高于后续工艺中的加热温度,对衬底进行热处理,使树脂衬底脱气。以这种方法,将会抑制后续步骤中气体从树脂衬底放出。
又一种发明的结构,包括如下步骤:在给定温度对薄膜树脂衬底进行热处理;在所说薄膜树脂衬底上形成一树脂层;把衬底加热至低于所说给定温度时,运用等离子辅助CVD,在所说树脂衬底上形成半导体层;和用所说半导体层形成薄膜晶体管。
又一种发明的结构包括以下步骤:在高于其它步骤中所用的任何热处理温度的给定温度下,对薄膜树脂衬底进行热处理;在所说薄膜树脂衬底上形成一树脂层;通过等离子辅助CVD,在所说树脂衬底上形成一半导体层;用所说半导体层形成薄膜晶体管。
另有一种发明的结构,包括:一对薄膜树脂衬底;在所说树脂衬底之间设置液晶材料;在至少一个所说树脂衬底的表面上,形成象素电极;薄膜晶体管与所说的象素电极连接并形成在所说一树脂衬底上;和树脂层形成在所说的薄膜树脂衬底的表面上以便表面变平。
图3表示的是上述结构的一个具体实例。如图3所示,该结构包括:一对树脂衬底301,302,一置于这些树脂衬底之间的液晶材料309,象素电极306,薄膜晶体管(TFTS)305,它们与象素电极306相连,和一为使树脂衬底301的表面平面化而设置的树脂层303。
图1(A)至1(E)表示的是本发明制造薄膜晶体管的一种工艺步骤。
图2(A)至2(C)表示的是本发明制造薄膜晶体管的另一种工艺的步骤。
图3是液晶屏板的示意性截面图。
实例1:
本例示出颠倒交错排列TETS,形成在有机树脂的PET(聚对苯二甲酸乙二醇酯)衬底上的一实例。
如图1(A)所示,首先制备厚度为100μm的PET膜101,并且对它进行热处理使之脱气。热处理的温度须高于在后续工艺中所用的最高温度。在本实例工艺中,由等离子辅助CVD工艺形成非晶硅膜期间所用的温度为160℃,是最高加热温度。因此,为PET膜脱气的热处理温度定在180℃。
在PET膜101上形成丙烯树脂层102,如丙烯树脂可采用丙稀酸甲酯。这层丙稀树脂层102可以防止后续工艺中齐聚物在PET膜101的表面上析出。丙稀树脂层102还可以使PET膜102的不平整的表面平面化。PET膜表面一般具有几百埃至1μm的不平整度。这样的不平整度会严重影响几百埃厚的半导体层的电性能。因此,使在其上形成半导体层的基片平面化是很重要的。
然后形成铝栅极103。通过用溅射法形成厚2000-5000(在下例中为3000)的铝膜并进行公知的使用光刻法的图形化步骤,形成栅极103。刻蚀栅电极103,使侧面渐渐变窄。
之后,由溅射形成厚为1000的SiO2膜用来作栅绝缘膜104。栅绝缘膜104也可以用氮化硅代替氧化硅。
接着,500厚的实质上是本征(I型)的非晶硅膜105由等离子辅助CVD形成,其工艺条件如下:
形成膜的温度(加热衬底的温度):160℃
反应压力:                    0.5torr
射频(RF)功率(13.56MHz):      20mw/cm2
反应气体:                    SiH4
在这个例子中,采用平行板式等离子CVD设备形成薄膜。由设置在树脂衬底置于其中的衬底承载台内的加热器对衬底加热。以此方法可得到如图1(B)所示的状态。
然后,由溅射形成在后续步骤中用作刻蚀阻挡层的氧化硅膜,再通过图形化以形蚀刻阻挡层106。
其后,膜厚为300的n型非晶硅膜107由平行板等离子辅助CVD形成,工艺条件如下:
形成膜的温度(加热衬底的温度):160℃
反应压力:                    0.5torr
射频(RF)功率(13.56MHz):      20mW/cm2
反应气体:                   B2H6/SiH4=1/100
由此可获得图1(C)所示状态。然后,通过于法腐蚀工艺在n型非晶硅膜107和真正的本征(I型)非晶硅膜105上形成图形。由溅射形成-厚3000的铝膜。随后腐蚀该铝膜和下面的n型非晶硅膜107就形成了源极108和漏极109。在腐蚀过程中,由于腐蚀阻挡层106的存在,保证了源区和漏区之间的相互绝缘(如图1(D)所示。)
用除树脂外的材料形成-厚为6000的层间介质层110,例如可用氧化硅或聚酰亚胺。这里形成的氧化硅膜可以使用形成氧化硅膜所用的液体。最后,形成接触孔并由270制造象素电极。这样,采用了透明树脂衬底(图1E),就可以制造设置于有源矩阵液晶显示器的象素电极处的薄膜晶体管。
实施例2
该实例是利用例1中所述的薄膜晶体管,来制造一有源矩阵液晶显示器。图3是本例的液晶电光器件的截面图。
如图3所示,厚度为100μm的PET膜301和302构成了一对衬底,一丙稀树脂层303充当平面化层,306为象素电极。在图3中仅示出与两个象素电极相对应的结构。
304为一反电极。定向膜307和308朝向液晶309,液晶309可以是扭转向列型(TN)液晶、超扭转向列型(STN)液晶或铁电液晶,一般采用TN液晶。液晶层的厚度大约为几微米到10微米。
薄膜晶体管(TFTs)305与象素电极306相连。由TFTs305控制电荷流入或流出象素电极306。在本例中,只取象素电极306中一个作为典型,但也形成了相似结构的所需的一些其它构型。
在图3所示的结构中,为了使整个液晶屏板具有柔韧性,衬底301和302应是柔韧的。
实例3:
本例是制造共平面的,用于有源矩阵液晶显示器的薄膜晶体管的方法。本例制造薄膜晶体管的工艺步骤如图2所示。首先,准备一PET膜201作为有机树脂薄膜衬底,其厚度为100μm。然后,在180℃对衬底进行热处理以促进PET膜201脱气。在该膜表面上形成一层丙烯树脂202。在本例中,丙烯树脂采用丙烯酸甲酯。
接着用等离子辅助CVD工艺生长实质上是本征的半导体层203,沟道区将在该层里形成,生长的条件如下:
形成薄膜的温度(加热衬底的温度):160℃
反应压力:                      0.5torr
射频(RF)功率(13.56MHz):        20mW/cm2
反应气体:                      SiH4本例采用平行板型等离子CVD设备。
然后用平行板型等离子CVD设备生长一厚为300的n型非晶硅膜,生长条件如下:
形成膜的温度(加热衬底的温度):160℃
反应压力:                    0.5torr
射频(RF)功率(13.56MHz)        20mW/cm2
反应气体:                    B2H6/SiH4=1/100在n型非晶Si膜上形成源区205和漏区204图形。(图2(A)所示)。
采用溅射法形成用作栅绝膜的氧化硅膜或氮化硅膜,并构图以在其上形成栅绝缘膜206。然后由铝形成栅极207(图2(B)所示)。
形成一厚度为5000的聚酰亚胺层208,用来充当层间介质膜。形成接触孔。用溅射法形成ITO电极209,该电极为象素电极,这样就完成了TETs的制造(图2(c))。
实例4:
除了半导体层是由微晶半导体膜构成之外,本例的结构与例1或例2类似。首先,生长一实质上是本征的半导体层作为微晶半导体层,生长条件如下:
形成膜的温度(加热衬底的温度):160℃
反应压力                      0.5torr
射频(RF)功率(13.56MHz)        150mW/cm2
反应气体:                    SiH4/H2=1/30在本例中,采用平行板型等离子(VI)设备生长膜。
同样采用平行板型等离子CVD设备,在下述条件下生长-n型微晶硅膜。
形成膜的温度(加热衬底的温度):160℃
反应压力:                    0.5torr
射频(RF)功率(13.56MHz):      150mW/cm2
反应气体:                    B2H6/SiH4=1/100
微晶硅膜一般加100-200mW/cm2的功率便可获得。对本征半导体层,通过用氢气将硅烷稀释到1/10至1/50,并增加功率可获得所要求的结果。然而,如果进行氢气稀释,膜的生长速度会降低。
实例5:
本例涉及一种方法,包括用激光照射硅膜,该激光的功率不足以加热薄膜基片或衬底,所说的硅膜是用上述其它实例中所说的等离子辅助CVD说形成的。
通过用激光(如:krF准分子激光器所发光)照射非晶硅膜,使生长在玻璃衬底上的非晶硅膜转变为晶体硅膜的方法已然公知。在另一种公知的方法中,将能产生一种导电类型的杂质离子注入到硅膜中,然后用激光照射该硅膜,以激活该硅膜和杂质离子。杂质离子的注入使硅膜非晶化。
对本例所述的结构采用上述激光照射工艺,其特征在于,使用微弱的激光照射图1所示的非晶硅膜105或图2所示的非晶硅膜203、204,使它们晶体化。如果先前形成的膜是微晶硅膜,则能改善其晶性。
可用krF或XeCl准分子激光器发射激光,所发射的激光能量为10-50mJ/cm2。重要的是,树脂衬底101或102不能被热损伤。
利用本发明所公开的思想,有源矩阵液晶显示器的厚度是可以减小的,而且其重量也可以减轻。如果施加一个外力,衬底也不会破碎,因显示器具有柔韧性。
这种液晶显示器能有广泛的用途,是非常有用的。

Claims (8)

1.一种半导体器件,包括:
一薄膜树脂衬底;
一形成于所说的树脂衬底表面上的树脂层;和
形成于所说树脂层上的薄膜晶体管。
2.根据权利要求1所说的半导体器件,其特征是所说的树脂层使得所说的树脂衬底平面化。
3.根据权利要求1所说的半导体器件,其特征是所说树脂层由丙烯树脂构成。
4.一种制造半导体器件的方法,包括以下步骤:
在一薄膜树脂衬底上形成一树脂层;
在所说的树脂衬底上,通过等离子辅助CVD形成一半导体层;和
用所说半导体层形成薄膜晶体管。
5.一种制造半导体器件的方法,包括以下步骤:
在给定温度热处理薄膜树脂衬底,使所说树脂衬底脱气;
在所说薄膜树脂衬底上形成一树脂层;
在所说树脂层上通过等离子辅助CVD形成半导体层;
用所说半导体层形成薄膜晶体管。
6.一种制造半导体器件的方法,包括以下步骤:
在给定温度热处理薄膜树脂衬底;
在所说薄膜树脂衬底上形成一树脂层;
把衬底加热至低于所说给定温度时,通过等离子辅助CVD,在所说树脂衬底上形成一半导体层;和
用所说半导体层形成薄膜晶体管。
7.一种制造半导体器件的方法,包括如下步骤:
在高于其它步骤中所用的任何热处理温度的给定温度,热处理薄膜树脂衬底;
在所说薄膜树脂衬底上形成一树脂层;
通过等离子辅助CVD,在所说树脂层上形成一半导体层;和
用所说半导体层形成薄膜晶体管。
8.一种电光器件,包括:
一对薄膜树脂衬底;
置于所说树脂衬底之间的液晶材料;
在至少一个所说树脂衬底的表面上形成的象素电极;
于所说树脂衬底上形成并与所说象素电极连接的薄膜晶体管;和
形成在所说薄膜树脂衬底平面上以使该表面平面化的树脂层。
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