CN1215545C - 半导体测试装置 - Google Patents
半导体测试装置 Download PDFInfo
- Publication number
- CN1215545C CN1215545C CN03108392.7A CN03108392A CN1215545C CN 1215545 C CN1215545 C CN 1215545C CN 03108392 A CN03108392 A CN 03108392A CN 1215545 C CN1215545 C CN 1215545C
- Authority
- CN
- China
- Prior art keywords
- contact substrate
- substrate
- semiconductor
- electronic parts
- test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
Abstract
Description
Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP093673/2002 | 2002-03-29 | ||
JP2002093673 | 2002-03-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1449010A CN1449010A (zh) | 2003-10-15 |
CN1215545C true CN1215545C (zh) | 2005-08-17 |
Family
ID=28786171
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN03108392.7A Expired - Fee Related CN1215545C (zh) | 2002-03-29 | 2003-03-28 | 半导体测试装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7312621B2 (zh) |
CN (1) | CN1215545C (zh) |
TW (1) | TWI234218B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101320075B (zh) * | 2007-06-06 | 2011-11-23 | 日商日本工程技术股份有限公司 | 连接器 |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI278950B (en) * | 2003-07-10 | 2007-04-11 | Toshiba Corp | Contact sheet for testing of electronic parts, testing device for electronic parts, testing method for electronic parts, manufacturing method for electronic parts, and the electronic parts |
CN100362351C (zh) * | 2004-08-27 | 2008-01-16 | 京元电子股份有限公司 | 无吸头式取放待测电子元件的装置 |
CN100357743C (zh) * | 2004-08-27 | 2007-12-26 | 京元电子股份有限公司 | 取放待测电子元件的方法与装置 |
JP4882644B2 (ja) | 2006-08-10 | 2012-02-22 | パナソニック電工株式会社 | 光電気変換装置 |
CN101523264A (zh) * | 2006-08-10 | 2009-09-02 | 松下电工株式会社 | 光电变换装置 |
WO2010050132A1 (ja) * | 2008-10-28 | 2010-05-06 | 株式会社アドバンテスト | 試験装置および回路モジュール |
CN102540049B (zh) * | 2010-12-17 | 2015-01-14 | 富葵精密组件(深圳)有限公司 | 电路板测试装置及电路板测试方法 |
JP2013168400A (ja) * | 2012-02-14 | 2013-08-29 | Tokyo Electron Ltd | 半導体デバイス検査装置用配線基板及びその製造方法 |
KR101204941B1 (ko) * | 2012-04-27 | 2012-11-27 | 주식회사 아이에스시 | 전극지지부를 가지는 테스트용 소켓 및 그 테스트용 소켓의 제조방법 |
CN103575938B (zh) * | 2012-08-01 | 2016-08-10 | 鸿劲科技股份有限公司 | 吸附式测试装置及其应用测试设备 |
US9121884B2 (en) * | 2013-06-07 | 2015-09-01 | Infineon Technologies Ag | Capacitive test method, apparatus and system for semiconductor packages |
JP6259590B2 (ja) * | 2013-06-12 | 2018-01-10 | 株式会社日本マイクロニクス | プローブカード及びその製造方法 |
CN104730445B (zh) * | 2013-12-19 | 2017-12-08 | 致伸科技股份有限公司 | 电路板的测试系统 |
US9693469B2 (en) * | 2013-12-19 | 2017-06-27 | The Charles Stark Draper Laboratory, Inc. | Electronic module subassemblies |
KR101585182B1 (ko) * | 2014-04-28 | 2016-01-14 | 황동원 | 반도체 소자 테스트용 소켓장치 |
JPWO2016024534A1 (ja) * | 2014-08-11 | 2017-05-25 | 株式会社村田製作所 | プローブカードおよびこのプローブカードが備える積層配線基板 |
US10107856B2 (en) | 2014-10-21 | 2018-10-23 | Stmicroelectronics S.R.L. | Apparatus for the thermal testing of electronic devices and corresponding method |
CN106249133A (zh) * | 2016-09-07 | 2016-12-21 | 广州视源电子科技股份有限公司 | 接线装置 |
US10777458B2 (en) * | 2016-12-27 | 2020-09-15 | Semes Co., Ltd. | Method of filling a via hole and apparatus for performing the same |
CN110941156B (zh) * | 2018-09-25 | 2023-08-25 | 富士胶片商业创新有限公司 | 图像形成装置及基板 |
USD927429S1 (en) * | 2019-03-15 | 2021-08-10 | Modus Test, Llc | Plurality of contact fields for a printed circuit board |
USD933016S1 (en) * | 2019-03-15 | 2021-10-12 | Modus Test, Llc | Contact field for a printed circuit board |
CN112285514A (zh) * | 2019-07-09 | 2021-01-29 | 致茂电子(苏州)有限公司 | 晶圆测试装置 |
TWI775566B (zh) * | 2021-08-13 | 2022-08-21 | 美商第一檢測有限公司 | 晶片檢測設備 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55161306A (en) | 1979-06-05 | 1980-12-15 | Asahi Chemical Ind | Partly plated porous sheet |
US4496903A (en) * | 1981-05-11 | 1985-01-29 | Burroughs Corporation | Circuit board test fixture |
US5498467A (en) * | 1994-07-26 | 1996-03-12 | W. L. Gore & Associates, Inc. | Process for preparing selectively conductive materials by electroless metal deposition and product made therefrom |
US5602491A (en) * | 1995-03-16 | 1997-02-11 | Motorola, Inc. | Integrated circuit testing board having constrained thermal expansion characteristics |
US5830565A (en) * | 1996-11-08 | 1998-11-03 | W. L. Gore & Associates, Inc. | High planarity and low thermal coefficient of expansion base for semi-conductor reliability screening |
US5766979A (en) | 1996-11-08 | 1998-06-16 | W. L. Gore & Associates, Inc. | Wafer level contact sheet and method of assembly |
JPH10260223A (ja) * | 1997-03-19 | 1998-09-29 | Fujitsu Ltd | 半導体検査装置及びこれを用いた検査方法 |
JP3980801B2 (ja) | 1999-09-16 | 2007-09-26 | 株式会社東芝 | 三次元構造体およびその製造方法 |
-
2003
- 2003-03-28 CN CN03108392.7A patent/CN1215545C/zh not_active Expired - Fee Related
- 2003-03-28 TW TW092107152A patent/TWI234218B/zh not_active IP Right Cessation
- 2003-03-31 US US10/401,871 patent/US7312621B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101320075B (zh) * | 2007-06-06 | 2011-11-23 | 日商日本工程技术股份有限公司 | 连接器 |
Also Published As
Publication number | Publication date |
---|---|
US7312621B2 (en) | 2007-12-25 |
TW200306637A (en) | 2003-11-16 |
US20040205402A1 (en) | 2004-10-14 |
TWI234218B (en) | 2005-06-11 |
CN1449010A (zh) | 2003-10-15 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CI01 | Publication of corrected invention patent application |
Correction item: Inventor Correct: Zhen Zhumao False: Qing Zhumao Number: 33 Page: 788 Volume: 21 |
|
CI03 | Correction of invention patent |
Correction item: Inventor Correct: Zhen Zhumao False: Qing Zhumao Number: 33 Page: The title page Volume: 21 |
|
COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: QINGZHU MAO TO: ZHEN ZHUMAO |
|
ERR | Gazette correction |
Free format text: CORRECT: INVENTOR; FROM: QINGZHU MAO TO: ZHEN ZHUMAO |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050817 Termination date: 20110328 |