CN1222684A - Liquid crystal display device with chip on glass - Google Patents
Liquid crystal display device with chip on glass Download PDFInfo
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- CN1222684A CN1222684A CN98121534A CN98121534A CN1222684A CN 1222684 A CN1222684 A CN 1222684A CN 98121534 A CN98121534 A CN 98121534A CN 98121534 A CN98121534 A CN 98121534A CN 1222684 A CN1222684 A CN 1222684A
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- Prior art keywords
- liquid crystal
- lsi
- glass
- chip
- crystal display
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
Abstract
To provide a chip-on glass liquid crystal display device capable of improving the yield of bonding and positioning which accompany LSI mounting for driving and to improve the reliability. This device is provided with arbitrary dummy terminals disposed at four corners of an LSI for driving, a transparent conductive film formed on a glass substrate and a frame-shaped metallic film forming markers for positioning. The dummy terminals are bonded face down to the transparent conductive film via conductor particles. The visual checking of the state of the shape deformation by bonding of the conductive particles 16 and the positions of the dummy terminals by the metallic film is made possible.
Description
The present invention relates to the LSI chip that is used for liquid crystal drive be disposed at integratedly the liquid crystal cell periphery at the liquid crystal display device that has chip on glass, contact condition that particularly can Visual Confirmation LSI chip terminals (flange) at the liquid crystal display device that has chip on glass.
In recent years, be extensive use of liquid crystal display device, as the display of home appliance such as AV machine, washing machine, electric cookers such as stereo set, video equipment and tester etc.
In addition, on the glass substrate that loads liquid crystal cell, also provide and load the driving LSI chip that drives liquid crystal cell integratedly, realize the cost degradation of liquid crystal display device, the device of miniaturization.
Fig. 9 be represent in the past in the basic block diagram that has the liquid crystal display device of chip on glass.
Among Fig. 9, at the liquid crystal display device 50 that has chip on glass, between two sheet glass substrates 51,51, enclose liquid crystal 54, with 55 sealings of sealing gaskets such as resin around it, on the surface with respect to liquid crystal 54 of two sheet glass substrates 51, form nesa coating 52,53.On the surface of the glass substrate 51 of enclosing liquid crystal 54, be provided with light polarizing film 57.The 56th, with so that the liquid crystal molecule alignment films of direction orientation in accordance with regulations.
On the surface of the glass substrate 51 of enclosing liquid crystal 54, prolong nesa coating 53, the driving that form to drive liquid crystal 54 is with LSI58 or be formed on the connection figure of the electronic unit, connector etc. of loading on the glass substrate 51, connect on the surface of figure at this, generate the metal film 59 of implementing gold-plated grade, form conductor fig.
The metal film 59 of conductor fig makes between driving with LSI58 and liquid crystal 54 or is driving to descend with the resistance value between LSI58 and electronic unit and the connector etc., keeps well conducting.
Figure 10 is the glass substrate of LSI is used in a Stowage Plane from expression to the driving of Fig. 9.
Among Figure 10, drive the splicing ear (flange) 61 of using LSI58 by the crimping of upside-down mounting mode by the conducting particle 62 that in anisotropic conductive film, comprises, with on the nesa coatings 53 that form on glass substrate 51 surface with the gold-plated metal film 59 that generates that waits, carry out to the loading that drives the glass substrate 51 of using LSI58.
Figure 11 be expression observe from glass substrate the inside in the past at the driving of the liquid crystal display device that has a chip on glass connection layout with LSI and conductor fig.
Among Figure 11, the splicing ear (flange) 61 (dotted line is represented) that drives with LSI58 is crimped on the conductor fig that generates metal film 69 by the upside-down mounting mode.In addition, on four jiaos that drive with LSI58, be provided with the virtual terminal 63 (virtual flange) that is not connected with external electric, on the conductor fig that constitutes by the bilayer that is formed at nesa coating 53 on the glass substrate 51 and metal film 59 shown in Figure 9, by conducting particle 62 (with reference to Figure 10) by these virtual flanges 63 of upside-down mounting mode crimping.
In the past at the liquid crystal display device that has chip on glass, owing to have on driving by the crimping of conducting particle and generate the structure that the conductor fig of metal film also is connected with the surface of the splicing ear of LSI and virtual terminal, even thereby by conquassation situation from observation conducting particle in glass substrate the inside shown in Figure 11, the Visual Confirmation conducting state, but because the metal film of conductor fig is opaque, so still exist conquassation situation according to the conducting particle to cause can not Visual Confirmation driving problem with the contact condition of LSI and conductor fig.
Much less, drive being electrically connected with special LSI tester with LSI and conductor fig, even but conduct, if because of crimping causes the conquassation of conducting particle in bad order, touch the conducting that causes the initial stage of producing because of virtual connection so, but loose contact in time can take place, have to cause descending in the manufacturing yields that has the liquid crystal display device of chip on glass, loose contact in time takes place, and makes the problem of reliability decrease.
Therefore, drive the selective examination of the conducting particle conquassation situation that is electrically connected with conductor fig with LSI by Visual Confirmation, owing to carry out the condition enactment of crimping, the inspection of crimped status etc., thereby in manufacturing process, become extremely effectively confirmation method.
If on conductor fig, generate opaque metal film, so by transparent nesa coating, can visual driving with splicing ear and the virtual terminal of LSI, simultaneously can also be by the conquassation situation of Visual Confirmation conducting particle.
The object of the present invention is to provide a kind of at the liquid crystal display device that has chip on glass, confirm by driving by the conquassation situation of the conducting particle on the virtual terminal of Visual Confirmation (virtual flange), thereby can judge to drive and use splicing ear and the normal of conductor fig of LSI to be connected with LSI and being connected that the crimping of conductor fig produces.
Of the present inventionly on the liquid crystal display device that has a chip on glass is driving with LSI, be provided with a plurality of virtual terminals, can have an X-rayed this a plurality of virtual terminals from the non-crimping face of glass substrate.Therefore, by the conquassation situation of the conducting particle on the virtual terminal, can drive being connected by Visual Confirmation with LSI and conductor fig.
Above-mentioned a plurality of virtual terminal drives with on two angles of LSI if can be arranged at least, so preferably by the conquassation situation of the conducting particle on the virtual terminal at two angles, can drive the connection status of using LSI and conductor fig by Visual Confirmation.
Determine the mark of usefulness if form above-mentioned driving with the position of LSI, so just can whether be positioned at the normal position by the " loaded " position that Visual Confirmation drives with LSI with the figure that metal film or ELD are arranged.As this mark, if the frame shape that is provided with the distance of equalization around the virtual terminal for example so preferably according to the position relation of virtual terminal and mark, can drive the " loaded " position that use LSI by Visual Confirmation.The inboard of this framework and the distance of virtual terminal also depend on the installation accuracy that drives with LSI, if for example about 0～20 μ m except location confirmation easily, side within it can also be confirmed the conquassation situation of conducting particle.And, as other routine mark, can list the rectilinear figure of the cross shape that passes the virtual terminal subcenter.In this case, from the zone of the virtual terminal that exceeds cross shape, can confirm the conquassation situation of conducting particle.Certainly other example that serves as a mark can form and drive four jiaos of graphs of a correspondence with LSI.
Below, the several preferred embodiments that present invention will be described in detail with reference to the accompanying, among the figure:
Fig. 1 is the synoptic diagram of the driving of liquid crystal display device of the present invention with the crimped status of LSI and conductor fig, the state that expression is observed from the inside of glass substrate;
Fig. 2 represents the section of the II-amplification that the II line dissects from Fig. 1;
Fig. 3 is illustrated in driving shown in Figure 1 with one enlarged drawing in four jiaos of virtual terminals that are provided with of LSI;
Fig. 4 represents to eliminate the definite virtual terminal that drives the metal film of the mark of using with the LSI position of formation;
Fig. 5 represents that the metal film by rectangular-shaped corresponding with each limit of virtual terminal shown in Figure 4 forms allocation mark really;
Fig. 6 represents to determine position another embodiment with mark;
Fig. 7 represents to determine the another embodiment of position with mark;
Fig. 8 is the process flow diagram of the manufacturing process of expression liquid crystal display device of the present invention;
Fig. 9 represent in the past in the basic block diagram that has the liquid crystal display device of chip on glass;
Figure 10 represents the driving of Fig. 9 is used the Stowage Plane of the glass substrate of LSI;
Figure 11 represent to observe in the glass substrate in the past at the driving of the liquid crystal display device that has a chip on glass connection layout with LSI and conductor fig.
The present invention is such liquid crystal display device, can drive the crimping with conductor fig by Visual Confirmation according to the conquassation situation of conductive particle, can utilize metal film simultaneously or have the mark that the figure of ELD forms to drive the " loaded " position of using LSI by Visual Confirmation with LSI.
To be expression observe the crimped status figure that drives with LSI9 and conductor fig 1～4 from the inside of the glass substrate that forms the liquid crystal display device that has a chip on glass to Fig. 1, and Fig. 2 represents the amplification profile of virtual terminal subdivision.
In Fig. 1 and Fig. 2, on nesa coating, form metal film with electroplate and evaporation etc., and corresponding to the number that drives with the splicing ear (flange) 14 of LSI9, by with outside terminal at interval identical distance be formed on the conductor fig 1～4 that forms on the glass substrate G surface, be connected with not shown liquid crystal.For example use gold (Au) to form metal film.
In addition, driving with the corresponding position of the virtual terminal (virtual flange) 10～13 of four jiaos of LSI9 with being arranged at, remove metal film 5～8 by frame shape, form the shortcoming zone 17 (with reference to Fig. 2) that constitutes by opening portion, form the conductor fig of residual nesa coating 15.
In the position corresponding with virtual terminal (virtual flange) 10～13, also can remove nesa coating 15, glass substrate G is only arranged.For example the figure by required big width forms metal film 8 on driving power etc., shared and splicing ear connection and with the figure of the corresponding frame shape of virtual terminal.
If drive splicing ear (flange) 14 and the virtual terminal (virtual flange) 10～13 of using LSI9 by the crimping of upside-down mounting mode by for example silver particles conductive particles such as (fillers) 16, and the conductor fig of the nesa coating 15 that on conductor fig 1～4 and four jiaos, is provided with, so from the non-crimping face of glass substrate G, just can not pass through the state of the splicing ear (flange) 14 of Visual Confirmation conductor fig 1～4 and crimping with the metal film 5～8 of opaque conductor fig, if but on metal film 5 as shown in Figure 2, form shortcoming zone 17, the crimped status of the conductor fig of four jiaos virtual terminal (virtual flange) 10～13 and nesa coating 15 becomes and can have an X-rayed so, just can carry out Visual Confirmation by the conquassation situation of conductive particle 16.
Like this, of the present invention at the liquid crystal display device that has chip on glass, owing on driving, be provided with a plurality of virtual terminals 10～13 with LSI9, can have an X-rayed these virtual terminals 10～13 from the non-crimping face of glass substrate G, so, can drive being connected by Visual Confirmation with LSI and conductor fig according to the conquassation situation of the conducting particle on the virtual terminal 10～13.
Fig. 3 represent four jiaos any virtual terminal shown in Figure 1 and nesa coating conductor fig crimping and form the relation of metal film in the shortcoming zone of frame shape.
Among Fig. 3, owing to be crimped on driving shown in Figure 1 any virtual terminal (virtual flange) 10 by conductive particle 16 by the upside-down mounting mode on the nesa coating 15 that on glass substrate, forms, so can be by shortcoming zone 17 by the state of Visual Confirmation by the change of shape (conquassation situation) of the crimping generation of conductive particle 16 from the inside of glass substrate with at least two angles (among the figure being four jiaos) setting of LSI9.
If among Fig. 1 by the state of the conquassation situation that produces of the crimping of the conductive particle 16 on the quadrangular virtual terminal 10～13 identical with Fig. 3, so owing to can infer on whole that drives with LSI9 and carry out crimping equably, though, can judge that it also carries out equably so can not drive splicing ear (flange) 14 of usefulness LSI9 and the crimping that conductor fig 1～4 passes through conductive particle 16 by Visual Confirmation.
On the other hand, in Fig. 1 by state and Fig. 3 of the conquassation situation that produces of the crimping of quadrangular virtual terminal 10～13 upper conductor particles 16 inequality, exist under the situation about dispersing, can judge that crimping do not carry out equably, in crimping process, feed back, carry out the adjustment of press-connection machine.
Like this, of the present invention at a plurality of virtual terminal that has the liquid crystal display device of chip on glass, drive with on two angles of LSI9 owing to be arranged at least, so, can drive the connection status of using LSI9 and conductor fig by Visual Confirmation by the conquassation situation of the conducting particle on the virtual terminal at two angles.
In addition, in Fig. 3, after virtual terminal 10 and nesa coating 15 crimping, determine distance D (suitable) by Visual Confirmation from four limits of virtual terminal 10 to forming relative respectively position with shortcoming zone 17 with the metal film 5 of the frame shape of mark, confirm that driving determines whether correctly with the position of the " loaded " position of LSI9, feed back to the chip loading attachment (shovel loader) that drives with LSI9, can adjust " loaded " position.
Under the situation that distance D four limits of the metal film 5 of Visual Confirmation from virtual terminal 10 to the frame shape that forms relative mark all equate, it is correct just to judge that driving uses the position of the chip loading attachment (shovel loader) of LSI9 to determine.On the other hand, incorrect if the judgement position is determined when distance D dissimilates on four limits, so just adjust or change the position control of chip loading attachment (shovel loader).
Like this, have the liquid crystal display device of chip owing to use the figure formation driving that metal film 5 or ELD 15 are arranged to determine to use mark on glass, so can use the " loaded " position of LSI9 whether in the normal position by the Visual Confirmation driving with the position of LSI9.
Determine the mark of usefulness as the position, the shortcoming of the metal film 5～8 of dual-purpose zone 17 is owing to be the frame shape that is provided with the distance of equalization around the nesa coating, so, can drive the " loaded " position of using LSI9 by Visual Confirmation according to the position relation of virtual terminal 10～13 with mark 5～8.
Have again, can not Visual Confirmation driving with LSI9 really under the situation of allocation, determine to constitute also passable on the nesa coating 15 with the metal film 5 of mark removing formation position as shown in Figure 4 by the structure of the virtual terminal 10 of conductive particle 16 crimping.
In addition, form the position and determine that the metal film 5 with mark is not a frame shape, and the metal film 5a～5d of the formation rectangular shape corresponding with shown in Figure 5 and each limit of virtual terminal 10 is also passable.
Fig. 6 is the expression structural drawing of determining in the position that has the liquid crystal display device of chip on glass with other embodiment of mark of the present invention.
Among Fig. 6, the rectilinear figure of pressing the cross shape of metal film 21 and metal film 22 forms the position and determines to use mark, drives with under the state of LSI9 in crimping on the glass substrate, and the center of virtual terminal 10 and the center of cross shape are constituted crossingly.
Because the metal film 21,22 of cross shape is opaque, so the time by the virtual terminal 10 of Visual Confirmation, determine correctly that if drive by metal film 21,22 quarterns shortcoming zone 23 with cross shape, virtual terminal 10 is become can be visual so with the position of LSI9.Virtual terminal 10 when the shape of cutting apart with the metal film 21,22 of cross shape is not the quartern, is determined incorrectly with regard to judging to drive with the position of LSI9, carry out the adjustment of chip loading attachment (shovel loader).
Like this, because of the present invention is the rectilinear figure 21,22 that passes the cross shape at virtual terminal 10 centers at the mark that has the liquid crystal display device of chip on glass, so, can drive the " loaded " position of using LSI9 by Visual Confirmation according to the position relation of virtual terminal 10 with mark.
Have, among Fig. 6, the rectilinear figure that forms the cross shape of mark also can for the shape of rotation 45 degree again.
Fig. 7 is the structural drawing of determining in the position that has the liquid crystal display device of chip on glass with other embodiment of mark of the present invention.
Among Fig. 7, drive the metal film 24～27 that mark is determined to use in the position of using LSI9 by forming with four jiaos of LSI9 corresponding L word shapes formations with driving.
Under situation about driving being loaded in LSI9 on the glass substrate,, can determine correctly by the Visual Confirmation position by on the line of metal film 24～27 inboards, making four jiaos of unanimities that drive with LSI9.When driving was inconsistent with four jiaos of inside cords with metal film 24～27 of LSI9, the judgement position was determined incorrect, adjust chip loading attachment (shovel loader).
Like this, because present embodiment is corresponding to the figure 24～27 that drives with four jiaos of LSI9 at the mark that has the liquid crystal display device of chip on glass, so can drive " loaded " position by Visual Confirmation with LSI9.
Have, though form mark with the figure of metal film, form with nesa coating, remove nesa coating in the part of the virtual terminal of crimping, only surplus glass substrate also can.
Below, with reference to flowchart text shown in Figure 8 in the manufacturing process that has the liquid crystal display device of chip on glass.
At first, in step S1, on glass substrate, form the viewing area with tin indium oxide and to the nesa coating of the pattern I TO film of the wiring of display part and outer electrode by corrosion.
In step S2, shelter mask graph as the nickel coating of metal-plated lower floor (end plating) with photoresists.Cover the part (liquid crystal display area and flange portion) that (coating) needn't coating metal with photoresists.
In step S3, make nickel plating as metal-plated lower floor (end plating) not from outside inflow current, the reduction of solution metal ion is separated out, on by the surface of plating body, implement nickel plating with the no electrolytic process that coating is separated out.Separate out nickel coating in the part that does not have photoresists.By adopting selectable plating, only on the ITO film that does not have the photoresists part, separate out nickel coating to the ITO film.As mask, can not glue and pay coating, also passable with transparent inorganic insulating membrane.
In step S4, use washing agent and remover etc. to peel off to remove the photoresists of the mask graph that the electroless nickel plating that forms uses in step S2.
In step S5, utilize heating further to remove the remains of the photoresists in step S4, eliminate the stress of glass substrate etc. simultaneously, for the bond degree that makes nickel coating is firm, for example under 250 ℃ temperature, carry out clock aging in 30 fens.
In step S6, it is gold-plated to utilize the electroless plating method of applying to implement on the nickel coating of substrate once more, with the integral body formation coat of metal of nickel plating and Gold plated Layer.
In step S7, make the position consistency of two plate bases of the glass substrate of the ELD that the ELD that shows to the part side as the liquid crystal display of glass substrate of step S6 and the formation public side corresponding with it show, between two sheet glass substrates, be provided with the gap, seal (still, on the inlet that injects liquid crystal, not sealing) with sealing gaskets such as resins around.With injection equipment etc., glass substrate is placed in the container, carry out exhaust with vacuum pump, after the exhaust, proofing glass substrate in the liquid crystal vessel of the special use that liquid crystal is housed injects liquid crystal in box.If in the box of glass substrate, injected liquid crystal, so just with sealing inlets such as resins.In addition, paste polarization of incident light light direction qualification polarizing coating in one direction (according to liquid crystal display method on the top of box, because of reflection-type is different with infiltration type, in addition, the warping method because of liquid crystal itself for the polarization direction of light is different for light).
In step S8,, use the resin that disperses by the conductive particle of upside-down mounting mode crimping by the good silver particles of electric conductivity (filler) formation at the flange portion of the liquid crystal display cells of finishing.At this moment, driving as the pairing chip is not produced with LSI under the situation with respect to LSI crimping part location dislocation, apply evenly certain pressure from LSI top with plane tabular press-connection machine (for example connector), make a certain amount of conquassation of conducting particle (filler).By crimp force and resin etc., can constantly change cold weld, thermo-compressed (for example, 150 ℃ of room temperatures) and pressurization (for example, 0.1～1kg) and pressing time (for example, 0.1～60 second) etc. bonding.In addition, between glass substrate and LSI, use resin bonding simultaneously.
Claims (6)
1. one kind at the liquid crystal display device that has chip on glass, between two sheet glass substrates (G), enclose liquid crystal, simultaneously the driving that drives this liquid crystal is loaded on the described glass substrate with LSI (9), go up on the conductor fig (1,2,3,4) that forms metal film (5) at the nesa coating that is provided with on the described glass substrate (15), by conducting particle (16), the described driving of crimping makes described liquid crystal be electrically connected with LSI with described driving with the splicing ear (14) of LSI, it is characterized in that
Be provided with a plurality of virtual terminals (10,11,12,13) in described driving on LSI (9), at least go up formation shortcoming zone (17) at described metal film (5), can have an X-rayed described a plurality of virtual terminal from the non-crimping face of described glass substrate by described shortcoming zone with respect to described virtual terminal subdivision.
2. as claimed in claim 1ly it is characterized in that, on two angles of described driving, be provided with described a plurality of virtual terminal at least with LSI at the liquid crystal display device that has chip on glass.
3. as claimed in claim 1ly it is characterized in that, form described driving with the figure that described metal film or described ELD are arranged and determine to use mark with the position of LSI at the liquid crystal display device that has chip on glass.
4. as claimed in claim 3ly it is characterized in that described being labeled as around the described virtual terminal by equal frame shapes of equidistant setting at the liquid crystal display device that has chip on glass.
5. as claimed in claim 3ly it is characterized in that the described rectilinear figure that is labeled as the cross shape at the center by described virtual terminal at the liquid crystal display device that has chip on glass.
6. as claimed in claim 3ly it is characterized in that at the liquid crystal display device that has chip on glass, described be labeled as and described driving with four jiaos of graphs of a correspondence of LSI.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9289937A JPH11125837A (en) | 1997-10-22 | 1997-10-22 | Chip-on glass liquid crystal display device |
| JP289937/1997 | 1997-10-22 | ||
| JP289937/97 | 1997-10-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1222684A true CN1222684A (en) | 1999-07-14 |
| CN1108535C CN1108535C (en) | 2003-05-14 |
Family
ID=17749681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN98121534A Expired - Fee Related CN1108535C (en) | 1997-10-22 | 1998-10-22 | Liquid crystal display device with chip on glass |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPH11125837A (en) |
| KR (1) | KR100504220B1 (en) |
| CN (1) | CN1108535C (en) |
| TW (1) | TW533329B (en) |
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| US7411211B1 (en) | 1999-07-22 | 2008-08-12 | Semiconductor Energy Laboratory Co., Ltd. | Contact structure and semiconductor device |
| CN100417994C (en) * | 2001-09-26 | 2008-09-10 | 株式会社日立制作所 | Display |
| CN103913911A (en) * | 2013-12-13 | 2014-07-09 | 句容骏成电子有限公司 | Liquid crystal display and method for manufacturing same |
| CN104200767A (en) * | 2014-09-18 | 2014-12-10 | 南京中电熊猫液晶显示科技有限公司 | Array substrate, display device and detection method of display device |
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| US7361027B2 (en) | 2002-12-25 | 2008-04-22 | Semiconductor Energy Laboratory Co., Ltd. | Contact structure, display device and electronic device |
| KR100724479B1 (en) * | 2003-11-07 | 2007-06-04 | 엘지.필립스 엘시디 주식회사 | Liquid crystal display device and meothd for inspecting a bonding state with driving circuit |
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| JP2007322591A (en) * | 2006-05-31 | 2007-12-13 | Rohm Co Ltd | Image display |
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| KR102340938B1 (en) * | 2015-09-17 | 2021-12-20 | 엘지디스플레이 주식회사 | Display device and method of measuring contact resistance thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0629296A (en) * | 1992-07-09 | 1994-02-04 | Toshiba Corp | Bump pad-equipped semiconductor device |
| JP2661540B2 (en) * | 1994-03-24 | 1997-10-08 | 日本電気株式会社 | Semiconductor chip, TAB tape, inner lead bonder, and method of manufacturing semiconductor device |
| JPH08304462A (en) * | 1995-03-07 | 1996-11-22 | Nitto Denko Corp | Probe structure for burn in test |
| JP3657696B2 (en) * | 1996-06-13 | 2005-06-08 | 東芝電子エンジニアリング株式会社 | Mounting method of semiconductor device |
| JP3482826B2 (en) * | 1997-08-01 | 2004-01-06 | セイコーエプソン株式会社 | IC mounting method, liquid crystal display device, electronic equipment, and liquid crystal display device manufacturing apparatus |
-
1997
- 1997-10-22 JP JP9289937A patent/JPH11125837A/en active Pending
-
1998
- 1998-10-08 TW TW087116705A patent/TW533329B/en not_active IP Right Cessation
- 1998-10-20 KR KR10-1998-0043800A patent/KR100504220B1/en not_active IP Right Cessation
- 1998-10-22 CN CN98121534A patent/CN1108535C/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7411211B1 (en) | 1999-07-22 | 2008-08-12 | Semiconductor Energy Laboratory Co., Ltd. | Contact structure and semiconductor device |
| US7626202B2 (en) | 1999-07-22 | 2009-12-01 | Semiconductor Energy Laboratory Co., Ltd. | Contact structure and semiconductor device |
| US7956359B2 (en) | 1999-07-22 | 2011-06-07 | Semiconductor Energy Laboratory Co., Ltd. | Contact structure and semiconductor device |
| CN1282106B (en) * | 1999-07-22 | 2011-10-05 | 株式会社半导体能源研究所 | Contact structure and semiconductor device |
| US8258515B2 (en) | 1999-07-22 | 2012-09-04 | Semiconductor Energy Laboratory Co., Ltd. | Contact structure and semiconductor device |
| US8368076B2 (en) | 1999-07-22 | 2013-02-05 | Semiconductor Energy Laboratory Co., Ltd. | Contact structure and semiconductor device |
| US8624253B2 (en) | 1999-07-22 | 2014-01-07 | Semiconductor Energy Laboratory Co., Ltd. | Contact structure and semiconductor device |
| CN100417994C (en) * | 2001-09-26 | 2008-09-10 | 株式会社日立制作所 | Display |
| CN100403140C (en) * | 2002-06-06 | 2008-07-16 | 阿尔卑斯电气株式会社 | Liquid crystal display device and method for manufacturing liquid crystal display device |
| CN103913911A (en) * | 2013-12-13 | 2014-07-09 | 句容骏成电子有限公司 | Liquid crystal display and method for manufacturing same |
| CN104200767A (en) * | 2014-09-18 | 2014-12-10 | 南京中电熊猫液晶显示科技有限公司 | Array substrate, display device and detection method of display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1108535C (en) | 2003-05-14 |
| TW533329B (en) | 2003-05-21 |
| JPH11125837A (en) | 1999-05-11 |
| KR19990037217A (en) | 1999-05-25 |
| KR100504220B1 (en) | 2005-11-16 |
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