CN1294503C - Embedded intelligent platform - Google Patents
Embedded intelligent platform Download PDFInfo
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- CN1294503C CN1294503C CNB031403158A CN03140315A CN1294503C CN 1294503 C CN1294503 C CN 1294503C CN B031403158 A CNB031403158 A CN B031403158A CN 03140315 A CN03140315 A CN 03140315A CN 1294503 C CN1294503 C CN 1294503C
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- 230000001360 synchronised effect Effects 0.000 claims abstract description 8
- 230000006870 function Effects 0.000 claims description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011438 cord wood Substances 0.000 description 1
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Abstract
The present invention relates to an embedded intelligent platform. The embedded intelligent platform comprises a hardware part and a software part, wherein the hardware part of the embedded intelligent platform comprises a system main module and a system expansion module connected with the system main module; the system main module comprises a configurable system level chip, a flash memory, a synchronous dynamic random access memory and an expansion port, wherein the flash memory and the synchronous dynamic random access memory are connected with the configurable system level chip; the expansion port comprises a system bus and an expansion bus, and is connected with the configurable system level chip; the system expansion module comprises an expansion interface and an expansion functional module; the expansion interface comprises a system bus and an expansion bus, and is used for connecting the expansion port of the system main module; the expansion functional module is connected with the expansion port; the software part of the embedded intelligent platform comprises a configuration program and a corresponding operating system of the configurable system level chip. The embedded intelligent platform of the present invention fast realizes an embedded application system in low cost mode s o as to adapt to the fast changed embedded application market.
Description
[technical field]
The present invention relates to built-in field, relate in particular to a kind of embedded intelligence platform.
[background technology]
Traditional built-in applied system design generally all is to adopt pure hardware, hardware+software, firmware (Firm Ware) or system level chip (SoC, System on Chip) method for designing just adopts the method for designing of " device that the user selects chip manufacturer to provide according to system requirements carries out system design " to realize.But,, more and more at the specific (special) requirements of different application along with constantly widening of modern electronic technology application.Particularly pay attention to personalized product design concept, make the renewal speed of applying electronic product be exceedingly fast, thus also more and more to the demand of the many kinds of short run.Adopt the method for designing of traditional built-in applied system to make the produce market sluggish, the system design cost is high.So short run and cost, many kinds and cost, integrated and a series of problems such as cost, lead time and cost have been carried, and are perplexing everybody always.
[summary of the invention]
In order to overcome traditional high shortcoming of built-in applied system method for designing, the invention provides the method for designing that a kind of user of employing carries out system design according to the device of system requirements situ configuration oneself, be the user a kind of embedded intelligence platform is provided, adopt embedded intelligence platform of the present invention to make built-in applied system low-costly to realize fast, to adapt to nowadays fast changing Embedded Application market.
For realizing purpose of the present invention, the technical solution adopted in the present invention is: a kind of embedded intelligence platform is provided, this platform comprises system's primary module and the system extension module that links to each other with this system's primary module, the flash memory that this system's primary module comprises a configurable system level chip, link to each other by the configurable system level chip of system bus and this and synchronous DRAM and the expansion mouth that comprises system bus and expansion bus that links to each other with this configurable system level chip; This system extension module comprises and is used for expansion interface that comprises system bus and expansion bus that links to each other with the expansion mouth of this system's primary module and the extended function module that links to each other with this expansion interface.
The invention has the beneficial effects as follows, the method for designing that embedded intelligence platform of the present invention carries out system design owing to the device that adopts the user according to system requirements situ configuration oneself, therefore make built-in applied system can adopt the low-cost realization fast of the present invention, to adapt to nowadays fast changing Embedded Application market.
[description of drawings]
Fig. 1 is that system of the present invention main module circuit connects block diagram.
Fig. 2 is that system extension modular circuit of the present invention connects block diagram.
Fig. 3 is a system software workflow diagram of the present invention.
Fig. 4 is that the circuit of the primary module embodiment of system of the present invention connects block diagram.
Fig. 5 is that the circuit of system extension module embodiment of the present invention connects block diagram.
Fig. 6 is the workflow diagram of system software embodiment of the present invention.
[embodiment]
The present invention specifically implements to have adopted configurable system level chip (CSoC, ConfigurableSystem on Chip) technology and cordwood modular architecture, and according to the technical scheme of the different supporting corresponding system softwares of system requirements.
See also Fig. 1 and Fig. 2, the hardware components of embedded intelligence platform of the present invention comprises system's primary module (Fig. 1) and the system extension module (Fig. 2) that links to each other with the system primary module.
System's primary module of embedded intelligence platform of the present invention comprise a configurable system level chip 1 with by system bus 2 (comprising: address bus+data bus+control bus) flash memory 3 (FLASH) that links to each other with configurable system level chip 1 and synchronous DRAM 4 (SDRAM), and link to each other with configurable system level chip 1 comprise system bus 2 (comprising: address bus+data bus+control bus) and expansion bus 5 (comprising: input/output port able to programme+core power interface+input/output port power interface) 176 pins expansion mouthfuls 6.
The system extension module of embedded intelligence platform of the present invention comprise be used for linking to each other with system primary module 176 pins expansion mouthfuls 6 comprise system bus (comprising: address bus+data bus+control bus) and expansion bus (comprising: 176 pin expansion interfaces 7 input/output port able to programme+core power interface+input/output port power interface), and the flash memory of expanding 8 that links to each other with 176 pin expansion interfaces 7, synchronous DRAM 9, ethernet controller 10, USB Host controller 11, serial ports level translator 12 etc.
The configurable system level chip 1 of system's primary module of embedded intelligence platform of the present invention is integrated with a configurable functionality module and input/output port able to programme, can by to the configurable functionality block configuration to realize different function (for example: can realize functions such as lcd controller, universal serial port and encryption and decryption).The system extension module can be according to the corresponding module of different requirements extend (for example: need USB interface and Ethernet interface, then can carry out the expansion of USB interface and Ethernet interface on the system extension module).Be configured by configurable functionality module and input/output port able to programme, and design corresponding expansion board, to reach the omnipotent of embedded intelligence platform of the present invention according to real needs to configurable system level chip 1.
See also Fig. 3, the software section of embedded intelligence platform of the present invention comprises the configurator and the corresponding operating system of configurable system level chip.The system software workflow of embedded intelligence platform of the present invention may further comprise the steps:
(a) system power-up 13;
(b) the configurable system level chip 14 of configuration;
(c) the basic initialization 15 of system;
(d) operating system initialization 16;
(e) user application 17.
See also Fig. 4 and Fig. 5, system primary module embodiment (as Fig. 4) of the hardware components of embedded intelligence platform of the present invention mainly comprises: the auspicious imperial I of configurable system level chip number (Hero-I) 18, plate carries by system bus 19 kindly imperial I numbers 18 4 megabyte (4MB) flash memories 20 that link to each other (adopting SST39VF320) and 8 megabyte (8MB) synchronous DRAM 21 (adopting HY57V281620BT), and kindly imperial I number 18 176 pins (4 * 44pin) the system extension mouths 22 that link to each other.
The system extension module embodiment (as Fig. 5) of the hardware components of embedded intelligence platform of the present invention mainly comprises: 176 pins (4 * 44pin) the system extension interface 23 that links to each other with the system primary module, with 176 pins (16 megabyte (16MB) flash memory 24 that 4 * 44pin) system extension interface 23 links to each other (adopting two SST39VF320 to realize), 32 megabyte (32MB) synchronous DRAM 25 (adopting HY57V561620BT), and an ethernet controller 26 that links to each other with system extension interface 23 (adopting DM9000), a USB Host controller 27 (adopting PDIUSBD12), a serial ports level translator 28 (adopting MAX232).
See also Fig. 6, the software section embodiment of embedded intelligence platform of the present invention comprises: to auspicious imperial I number 18 configuration softwares that are configured, mainly finish configurable part to auspicious imperial I numbers 18 and be configured and realize a figure lcd controller and the input/output port able to programme of auspicious imperial I numbers 18 is configured.The system software embodiment workflow of embedded intelligence platform of the present invention may further comprise the steps:
(a) system power-up 29;
(b) the auspicious imperial I of configuration number (Hero-I) 30;
(c) the basic initialization 31 of system;
(d) Linux loading/initialization 32;
(e) user application 33.
Wherein, auspicious imperial I numbers 18 is a high-performance towards information terminal and sector application, low-power consumption, high integration system level chip, it is integrated popular high performance 32 bit CPU core A RM7TDMI of industry, and the core work frequency reaches 66MHz.
Auspicious imperial I number not only integrated clock synthesizer; Energy supply control module; The electrification reset module; And, the director data buffer memory of 8KB and memory protect unit, 16KB scratch-pad scratchpad SRAM; Hardware Breakpoint unit and jtag interface (support hardware debug function); 4 passage dma controllers; 2 counting/timers, 2 UART, 16 passage interruptable controllers, dog timer opens the door; In addition, also integrated can be configured to: UART (global function or non-global function), SPI (master/slave), I2C (master/slave), CAN, PS2, I2S (master/slave), counter, multiplier, data register, shift register, dual port RAM, asynchronous receiving-transmitting FIFOs, R/A receives and dispatches FIFOs, 7 segmentation charactron drivers, the characters/graphics lcd controller, rgb interface, the VGA interface, status register, pulse-width modulator, single-direction and dual-direction I/O mouth, ternary delivery outlet, MailBox (Storage Mapping mailbox) interface, Triple DES, Single DES ECB, the configurable module of SingleDES CBC etc.
Claims (4)
1. embedded intelligence platform, it is characterized in that: this platform comprises system's primary module and the system extension module that links to each other with this system's primary module, the flash memory that this system's primary module comprises a configurable system level chip, link to each other by the configurable system level chip of system bus and this and synchronous DRAM and the expansion mouth that comprises system bus and expansion bus that links to each other with this configurable system level chip; This system extension module comprises and is used for expansion interface that comprises system bus and expansion bus that links to each other with the expansion mouth of this system's primary module and the extended function module that links to each other with this expansion interface.
2. embedded intelligence platform as claimed in claim 1 is characterized in that this system bus comprises address bus, data bus and the control bus of this configurable system level chip.
3. embedded intelligence platform as claimed in claim 1 is characterized in that this expansion bus comprises input/output port, core power interface and the input/output port power interface of the programmable configuration of this configurable system level chip.
4. embedded intelligence platform as claimed in claim 1 is characterized in that this configurable system level chip is integrated with a configurable functionality module and input/output port able to programme, its can by to this configurable functionality block configuration to realize different functions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031403158A CN1294503C (en) | 2003-08-26 | 2003-08-26 | Embedded intelligent platform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031403158A CN1294503C (en) | 2003-08-26 | 2003-08-26 | Embedded intelligent platform |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1591375A CN1591375A (en) | 2005-03-09 |
| CN1294503C true CN1294503C (en) | 2007-01-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031403158A Expired - Lifetime CN1294503C (en) | 2003-08-26 | 2003-08-26 | Embedded intelligent platform |
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| Country | Link |
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| CN (1) | CN1294503C (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6029239A (en) * | 1997-12-01 | 2000-02-22 | Advanced Micro Devices, Inc. | Configuring a communications system with a configurable data transfer architecture |
| CN1379302A (en) * | 2001-03-30 | 2002-11-13 | 株式会社东芝 | Computer system and expansion plate and connector used in said system |
| CN2526908Y (en) * | 2001-06-14 | 2002-12-18 | 武汉大学 | Universal system board of single board computer based on PSD |
| CN2549537Y (en) * | 2002-06-04 | 2003-05-07 | 武汉大学 | High speed monochip system platform based on programmable logic elements |
-
2003
- 2003-08-26 CN CNB031403158A patent/CN1294503C/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6029239A (en) * | 1997-12-01 | 2000-02-22 | Advanced Micro Devices, Inc. | Configuring a communications system with a configurable data transfer architecture |
| CN1379302A (en) * | 2001-03-30 | 2002-11-13 | 株式会社东芝 | Computer system and expansion plate and connector used in said system |
| CN2526908Y (en) * | 2001-06-14 | 2002-12-18 | 武汉大学 | Universal system board of single board computer based on PSD |
| CN2549537Y (en) * | 2002-06-04 | 2003-05-07 | 武汉大学 | High speed monochip system platform based on programmable logic elements |
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| Publication number | Publication date |
|---|---|
| CN1591375A (en) | 2005-03-09 |
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Address after: Guangdong province Shenzhen city Nanshan District high in the four EVOC Technology Building No. 31 Patentee after: EVOC INTELLIGENT TECHNOLOGY Co.,Ltd. Address before: Guangdong city in Shenzhen Province, Che Kung Temple Tian An Digital City Tienhsiang building 10B Patentee before: SHENZHEN EVOC INTELLIGENT TECHNOLOGY Co.,Ltd. |
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Assignee: Xi'an EVOC Intelligent Technology Co.,Ltd. Assignor: EVOC INTELLIGENT TECHNOLOGY Co.,Ltd. Contract fulfillment period: 2008.5.8 to 2013.5.7 Contract record no.: 2009610000096 Denomination of invention: Embedded intelligent platform Granted publication date: 20070110 License type: Exclusive license Record date: 20091201 |
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Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.5.8 TO 2013.5.7; CHANGE OF CONTRACT Name of requester: XI'AN EVOC INTELLIGENT TECHNOLOGY CO., LTD. Effective date: 20091201 |
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Assignee: Xi'an EVOC Intelligent Technology Co.,Ltd. Assignor: EVOC INTELLIGENT TECHNOLOGY Co.,Ltd. Contract record no.: 2009610000009 Denomination of invention: Embedded intelligent platform Granted publication date: 20070110 License type: Exclusive License Open date: 20050309 Record date: 20091109 |
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