CN1300659C - Radiator for power element on main board of computer - Google Patents
Radiator for power element on main board of computer Download PDFInfo
- Publication number
- CN1300659C CN1300659C CNB031551696A CN03155169A CN1300659C CN 1300659 C CN1300659 C CN 1300659C CN B031551696 A CNB031551696 A CN B031551696A CN 03155169 A CN03155169 A CN 03155169A CN 1300659 C CN1300659 C CN 1300659C
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- plate
- wind
- motherboard
- processing unit
- central processing
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- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The present invention relates to an air guide device for a mainboard. The mainboard comprises a CPU fan and a power element. The air guide device comprises an air receiving part and a flow guide part, wherein the air receiving part receives air flow coming from the CPU fan; the flow guide part is connected with the air receiving part; the air flow of the CPU fan is guided to the power element by the flow guide part.
Description
(1) technical field
The present invention is relevant with a kind of heat abstractor that is installed on the computer motherboard, particularly a kind of airflow direction device that can change cooling fan on the motherboard, with the temperature of effective reduction central processing unit side power component, and then promote motherboard serviceable life and usefulness.
(2) background technology
Along with the continuous progress and development of electronic technology, the multimedia computer that combines high image quality, high tone quality is subjected to general the liking and use of consumer, and has quickened the degree of computer universalness.And the consumption of computer Related product increases, and the development of also ordering about related industry is rapidly flourishing more.As well known, the performance of the usefulness of computer system depends primarily on employed motherboard, and installs on this motherboard such as central processing unit, storer, chipset etc.. the performance of various element.
With the central processing unit and the main chip group (for example north bridge chips and South Bridge chip) of a new generation, owing to possessed the more core texture of elaborate, therefore can provide frequency quite high execution clock pulse, and more powerful calculation function.Yet along with the significantly increase of operation usefulness, the temperature that central processing unit and chipset are produced in the running is also more and more high.In order effectively to reduce the operating temperature of each element on the motherboard, cause host board fault or damage to prevent that temperature is too high, how effectively to cool off the central processing unit element peripheral with it, become current motherboard design dealer urgently in an important topic of breakthrough.
With the type of cooling of motherboard now, employed heat abstractor has comprised and is installed in the fan on central processing unit (CPU) heat radiator and is installed in fan on the computer chassis.Wherein, the fan that is positioned on the CPU can be constructed distinguished and admirable guiding main chip group to reduce the surface temperature of chipset by the fin of heat radiator, and on the casing that fan produced was distinguished and admirable, then can increase distinguished and admirable circulation in the airtight casing, and then make CPU and the increase of main chip group radiating efficiency.
Please refer to Fig. 1, this figure has shown the configuration mode and the wind direction of present motherboard top element and cpu fan.Generally speaking, after CPU2 being assembled on the motherboard 1, can attaching a CPU radiating fin 11 at the CPU2 upper surface, and cpu fan 12 is assembled on the CPU radiating fin 11.At the periphery of CPU2 and the motherboard element miscellaneous that distributed, these elements have comprised the memory assembly 13 that is arranged in the CPU left side, capacitor 14 and power component 15 and the north bridge chipset 3 (figure has shown the heat radiator 16 that is installed in north bridge chips 3 upper surfaces) and PCI function expansion board 17 at rear side that is positioned at the right side.Wherein, by the fin of CPU radiating fin 11 structure, can be with distinguished and admirable guiding north bridge chipset heat radiator 16 (shown in arrow among the figure), and reduce the surface temperature of north bridge chipset 3.
It should be noted that except CPU2 and north bridge chipset 3, be positioned at the power component (for example the power transistor element is made of the MOSFET element usually) 15 that the CPU2 right side is used for supplying cpu power, in operating process, also can produce quite high temperature.Especially under specified output, the surface temperature of this class power component 15 can surpass 100 especially.Although the operating temperature range of these power components 15 is originally just than CPU or main chip group height,, power component 15 may cause its solder side that contacts with motherboard 1 thawing if work for a long time under the high temperature more than the 100.If this moment, motherboard 1 was loaded in the computer chassis for orthogonal sets, then power component 15 just may be because solder side melts displacement or drop, and the function of motherboard 1 is affected.
(3) summary of the invention
In order to address the above problem, fundamental purpose of the present invention provides a kind of heat abstractor that can effectively reduce the power component working temperature.
Another object of the present invention provide a kind of can be the air ducting of the distinguished and admirable guiding power component of processor fan heat radiation guide plate.
The present invention discloses a kind of motherboard with heat radiation guide plate, can promote the radiating effect of a central processing unit, a chipset and a power component on this motherboard, this motherboard comprises following elements at least: a fan, be installed in this central processing unit top, can produce distinguished and admirable to reduce the temperature of this central processing unit; One processor heat radiator is installed between this central processing unit and this fan, and in order to promote the radiating efficiency of this central processing unit, this processor heat radiator has fin structure, can be with this chipset of distinguished and admirable guiding that this fan produced; One chipset heat radiator is installed in this chipset upper surface, in order to promote the radiating efficiency of this chipset; And a heat radiation guide plate, be installed in this chipset heat radiator top, in order to will flow to this power component of distinguished and admirable guiding of this chipset by this central processing unit.
Above-mentioned heat radiation guide plate comprises wind-engaging portion connected to one another and diversion division, and this heat radiation guide plate also comprises a shield, is connected in this wind-engaging portion and this diversion division upper edge.Wind-engaging portion and diversion division can constitute an arc structure, a tabular or a L shaped structure.Generally speaking, can make the angle of wind-engaging portion and diversion division between about 90 to 120 degree.
(4) description of drawings
Preferred embodiment of the present invention will be aided with following accompanying drawing and set forth in more detail in comment backward:
Fig. 1 has shown in the known techniques configuration mode of cpu fan and wind direction on the motherboard;
Fig. 2 has shown heat radiation guide plate and the wind direction that is installed among the present invention on the motherboard;
Fig. 3 shows and adopts the present invention's temperature change situation of each element on the motherboard of dispelling the heat before and after the guide plate; And
Fig. 4 A, 4B are the vertical view of motherboard, show that respectively the guide plate that will dispel the heat is assembled in the situation of diverse location on the chipset heat radiator.
(5) embodiment
The invention provides a kind of heat radiation guide plate that is applied on the motherboard, be used for promoting the radiating efficiency of power component.This piece heat radiation guide plate is to be installed in the central processing unit next door, can with the processor fan towards the main chip group blow out distinguished and admirable, this power component that leads, and reach the purpose that reduces main chip group and power component temperature simultaneously.Relevant of the present invention be described in detail as follows described.
Please refer to Fig. 2, this figure is the synoptic diagram of a motherboard 20.What specify is, understands for convenience, is to be designed to example with typical motherboard in the market describe herein.But,, be not limited thereto the layout type of motherboard among the figure when understanding characteristics of the present invention and spirit for person skilled in the art person.As shown in FIG., behind the processor slot that the central processing unit (not shown) is inserted on the motherboard 20, can attach a processor heat radiator (heatsink) 21 at central processing unit (CPU) 20a upper surface, and processor fan 22 is assembled on the CPU radiating fin 21.Similarly, assemble or made motherboard element miscellaneous around CPU20a, these elements mainly comprise the memory assembly 23 that is arranged in the CPU20a left side, capacitor 24 and power component 25 and the north bridge chips 26a (figure only shows the chipset heat radiator 26 that is installed on the north bridge chips 26a) and PCI function expansion board 27 at rear side that is positioned at the right side.
As above-mentioned, according to the design of the fin of present CPU radiating fin 21, by cpu fan derive distinguished and admirable, can flow towards the position of north bridge chips 26a, and the radiating efficiency of speed-up chip group heat radiator 26, and then reduce the operating temperature of north bridge chips.In order to make the distinguished and admirable power component 25 that can lead that blows to north bridge chips, the invention provides a heat radiation guide plate 28, be installed on the chipset heat radiator 26.The primary structure of this heat radiation guide plate 28 has comprised a 28a of wind-engaging portion, diversion division 28b and a shield 28c.
As shown in FIG., the 28a of wind-engaging portion can be a plate, vertical type shelf is located at the upper surface of north bridge chips 26a heat radiator 26, or extend by the upper surface of north bridge chips 26a heat radiator 26, and the wind direction of object oriented processor fan 22 just in time, that is the 28a of this wind-engaging portion is not parallel with wind direction, in order to stop by this processor fan blow distinguished and admirable.Then be connected in the side of the 28a of wind-engaging portion as for diversion division 28b, and and the 28a of wind-engaging portion between angle less than 180 degree.This piece diversion division 28b also extends towards the direction of power component 25, in order to will flow to the distinguished and admirable guiding power component 25 of the 28a of wind-engaging portion.Distinguished and admirable in process of flowing in order to prevent, towards the top loss,, and can install a shield 28c along the plate of 28a of wind-engaging portion or diversion division 28b in the upper edge of 28a of wind-engaging portion and diversion division 28b.As shown in FIG., this shield 28c is the flat board that has " L " type for, and by the upper edge of the 28a of wind-engaging portion, along the upper edge that extends diversion division 28b.
In preferred embodiment, angle between may command diversion division 28b and the 28a of wind-engaging portion and allows the front end of diversion division 28b between 90 ~ 120 degree, just in time along the outside that extends power component 25, change the distinguished and admirable of direction just in time irritated to power component 25, quickened its radiating efficiency.And, in order to take into account radiating effect to north bridge chips 26a, the above-mentioned wind-engaging 28a of portion can be installed in the position (counting from the side near processor fan 22) of chipset heat radiator 26 upper surfaces 1/2 ~ 2/3, make to blow to the distinguished and admirable of north bridge chips 26a, also can promote the radiating efficiency of chipset heat radiator 26.
Like this, by cpu fan 22 produce distinguished and admirable, can be by design of the fin on the CPU radiating fin 21 and heat radiation guide plate 28 provided by the present invention, blow to chipset heat radiator 26 earlier, power component 25 again leads, also be about to distinguished and admirablely roughly be directed to a U-shaped, and promote the radiating efficiency of these two elements simultaneously.
Although what particularly point out is in the above-described embodiments, to be to utilize the 28a of wind-engaging portion to combine the plate structure of formation " L " type with diversion division 28b with a predetermined angle, and to produce required water conservancy diversion effectiveness.But,, also can be used to produce similar guide effect when the plate that can understand other Any shape, structure easily to person skilled in the art person.For example, also can use single crooked plate to replace above-mentioned 28a of wind-engaging portion and diversion division 28b, crooked plate of this piece also vertical type shelf is located at the upper surface of chipset heat radiator 26, and by direction towards central processing unit, position bending towards power component 25 is extended, make cpu fan 22 blow to the distinguished and admirable guiding power component 25 of crooked plate, to reduce its working temperature.Similarly, in order to prevent to blow to the distinguished and admirable of crooked plate, also can install the flat board of a lunate shape at the upper limb of crooked plate towards the top loss.
Please refer to Fig. 3, this figure has shown and has adopted the present invention's temperature change situation of element on the motherboard of dispelling the heat before and after the guide plate.Environment with 33 degree Celsius is an example, is not installing under the situation of heat radiation guide plate, and the temperature of start back power component can rise to 40 by 33 degree at once and spend.And the program of carrying out maximum consumption of power at this computer is after one hour, and the temperature in the whole casing rises to 47 degree by 33 degree; North bridge chips then rises to 60 degree by 34 degree; Temperature as for power component then can rise to 81 degree from 40 degree.As above-mentioned, under the situation of not using the heat radiation guide plate, the temperature of power component 41 degree that risen, and may cause pin scolding tin to produce softening effect.
Still please refer to Fig. 3, compared to the situation of not using the heat radiation guide plate, behind installing heat radiation guide plate, owing to blow to the distinguished and admirable of north bridge chips, can be directed to and flow to power component, therefore even if the program of carrying out maximum consumption of power at computer is after one hour, the temperature of power component 26 degree that only can rise, Celsius temperature 39 degree after start increase to 65 degree, and have effectively promoted the radiating efficiency of power component.It should be noted that because the heat radiation guide plate is the position that is installed in chipset heatsink upper surface 1/2 to 2/3, is that radiating efficiency with north bridge chips can be affected really and reduces.But by experimental result, under the situation of using the heat radiation guide plate, the temperature of north bridge chips only can rise to 64 degree from 34 degree after the start, and still in the operating temperature range of safety.In other words, use heat radiation guide plate of the present invention after, although the ascending temperature of north bridge chips has increased by 4 degree on the contrary, arrive 64 degree, can't influence the normal running of north bridge chips, and can effectively reduce the operating temperature of power component simultaneously.
Therefore be understandable that, use design of the present invention, have considerable advantage.At first, owing to effectively promote the radiating efficiency of power component, and reduce its surface temperature, therefore except effectively prolonging the serviceable life of power component, the operational stability of total system also significantly promotes.In other words, even using very high-speed CPU, power component to provide under the very a large amount of situation of power to CPU, power component still can remain under the operating temperature of safety, and is unlikely the function that makes melts soldering tin and influence motherboard.Secondly,, therefore behind installing heat radiation guide plate, even the power component that uses rated power lower can be selected, that is the littler power component of use capacity, and the cost of manufacture of motherboard can be further reduced because the radiating efficiency of power component effectively improves.
Please refer to Fig. 4 A, 4B, this partly figure be the vertical view of motherboard, be used for showing that the guide plate 28 that will dispel the heat is assembled in the situation of diverse location on the chipset heat radiator 26.In Fig. 4 A, be that the 28a of wind-engaging portion with heat radiation guide plate 28 is installed in chipset heat radiator 26 and counts about 1/2 position near cpu fan 22 1 sides.As in Fig. 4 B, then be that the 28a of wind-engaging portion with heat radiation guide plate 28 is installed in chipset heat radiator 26 near on the end faces of cpu fan 22, so that with cpu fan 22 blow out distinguished and admirable, under the situation of minimum loss, the guiding power component of concentrating 25, and then make power component 25 produce best radiating effect.
The present invention with preferred embodiment explanation as above, and those of ordinary skill in the art, in not breaking away from spiritual scope of the present invention, when can making all changes and replacement, its scope of patent protection should on accompanying Claim and etc. same domain decide.
Claims (14)
1. air ducting that is used on the motherboard, this motherboard comprises a central processing unit fan and a power component, this air ducting comprises:
One wind-engaging plate stands on the plate face of this motherboard, and towards this central processing unit fan, its acceptance is distinguished and admirable from this central processing unit fan; And
One water conservancy diversion plate, it is connected in the side of this wind-engaging plate, this water conservancy diversion plate extends to this power component, make this central processing unit fan distinguished and admirable be by this water conservancy diversion plate this power component that leads.
2. air ducting as claimed in claim 1 is characterized in that, also comprises:
One shield, it is connected in this wind-engaging plate and this water conservancy diversion plate upper edge, and the plate face of this shield extends towards this central processing unit fan.
3. air ducting as claimed in claim 1 is characterized in that, this wind-engaging plate and this water conservancy diversion plate constitute a crooked plate.
4. air ducting as claimed in claim 1 is characterized in that, this wind-engaging plate and this water conservancy diversion plate constitute a L shaped plate block structure.
5. air ducting as claimed in claim 1 is characterized in that, the angle of this wind-engaging plate and this water conservancy diversion plate is between 90 to 120 degree.
6. air ducting as claimed in claim 1 is characterized in that this motherboard also comprises a north bridge chips, and this wind-engaging plate is the upper surface that is arranged at this its heat radiator of north bridge chips.
7. air ducting as claimed in claim 1 is characterized in that, this water conservancy diversion plate is to extend to the direction of this power component from this wind-engaging plate.
One kind have the heat radiation guide plate motherboard, can promote the radiating effect of a central processing unit, a chipset and a power component on this motherboard, wherein this power component is positioned at the right side of this central processing unit, and this chipset is positioned at the rear side of this central processing unit, and this motherboard at least also comprises:
One fan is installed in this central processing unit top, can produce distinguished and admirable to reduce the temperature of this central processing unit;
One processor heat radiator is installed between this central processing unit and this fan, and to promote the radiating efficiency of this central processing unit, this processor heat radiator also has fin structure, with this chipset of distinguished and admirable guiding with this fan was produced;
One chipset heat radiator is installed in this chipset upper surface, to promote the radiating efficiency of this chipset; And
One heat radiation guide plate is installed in this chipset heatsink upper surface, and the plate face of this heat radiation guide plate is towards the wind direction of this fan, and extends towards the direction of this power component, will be flowed to this power component of distinguished and admirable guiding of this chipset by this central processing unit.
9. motherboard as claimed in claim 8 is characterized in that, described heat radiation guide plate comprises wind-engaging plate connected to one another and water conservancy diversion plate, and this water conservancy diversion plate is connected in the side of this wind-engaging plate and extends to this power component.
10. motherboard as claimed in claim 9 is characterized in that, described heat radiation guide plate also comprises:
One shield, it is connected in this wind-engaging plate and this water conservancy diversion plate upper edge, and the plate face of this shield extends towards this central processing unit fan.
11. the described motherboard of claim 9 is characterized in that, this wind-engaging plate and this water conservancy diversion plate constitute a crooked plate.
12. motherboard as claimed in claim 9 is characterized in that, this wind-engaging plate and this water conservancy diversion plate are to constitute a L shaped plate block structure.
13. motherboard as claimed in claim 9 is characterized in that, the angle of this wind-engaging plate and this water conservancy diversion plate is between 90 to 120 degree.
14. motherboard as claimed in claim 9 is characterized in that, this water conservancy diversion plate is to extend to the direction of this power component from this wind-engaging plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031551696A CN1300659C (en) | 2003-08-22 | 2003-08-22 | Radiator for power element on main board of computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031551696A CN1300659C (en) | 2003-08-22 | 2003-08-22 | Radiator for power element on main board of computer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1584779A CN1584779A (en) | 2005-02-23 |
| CN1300659C true CN1300659C (en) | 2007-02-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031551696A Expired - Lifetime CN1300659C (en) | 2003-08-22 | 2003-08-22 | Radiator for power element on main board of computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1300659C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101742888B (en) * | 2008-11-14 | 2013-02-20 | 富准精密工业(深圳)有限公司 | Radiation device and electronic equipment using same |
| CN107920216B (en) * | 2017-12-05 | 2020-05-05 | 北海华源电子有限公司 | Flat-panel television with set-top box protective cover with heat dissipation device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2336457Y (en) * | 1998-05-06 | 1999-09-01 | 英业达股份有限公司 | Air guide type heat sink |
| US6442024B1 (en) * | 2000-12-11 | 2002-08-27 | Shoei-Yuan Shih | Fan flow guide |
| US6477044B2 (en) * | 2000-11-06 | 2002-11-05 | 3Com Corporation | Flow guide |
| CN2531435Y (en) * | 2001-08-24 | 2003-01-15 | 联想(北京)有限公司 | Air guide channel and desk computer using said air guide channel |
-
2003
- 2003-08-22 CN CNB031551696A patent/CN1300659C/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2336457Y (en) * | 1998-05-06 | 1999-09-01 | 英业达股份有限公司 | Air guide type heat sink |
| US6477044B2 (en) * | 2000-11-06 | 2002-11-05 | 3Com Corporation | Flow guide |
| US6442024B1 (en) * | 2000-12-11 | 2002-08-27 | Shoei-Yuan Shih | Fan flow guide |
| CN2531435Y (en) * | 2001-08-24 | 2003-01-15 | 联想(北京)有限公司 | Air guide channel and desk computer using said air guide channel |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1584779A (en) | 2005-02-23 |
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