CN1306580C - Mechanism and method for inspecting batch nos. and etched nos. on wafers in casing - Google Patents
Mechanism and method for inspecting batch nos. and etched nos. on wafers in casing Download PDFInfo
- Publication number
- CN1306580C CN1306580C CNB031548628A CN03154862A CN1306580C CN 1306580 C CN1306580 C CN 1306580C CN B031548628 A CNB031548628 A CN B031548628A CN 03154862 A CN03154862 A CN 03154862A CN 1306580 C CN1306580 C CN 1306580C
- Authority
- CN
- China
- Prior art keywords
- crystal
- wafers
- stigmatometer
- platform
- boat box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The present invention relates to an inspection mechanism which comprises a platform and an inspection device, wherein the inspection device is positioned on the platform, the inspection device having an inclined plane which can be abutted on the periphery of wafers, in order to slightly push out the wafers in a wafer vessel box, and thus, marks on the wafers can be orderly exposed. The inspection mechanism and an inspection method thereof of the present invention can be used for inspecting the lot numbers and the marking numbers of all wafers in the wafer vessel box at one time with time saving without the trouble of breaking the wafers.
Description
(1) technical field
The mechanism and the inspection method thereof that the invention relates to a kind of lot number of inspecting wafer in the crystal-boat box and carve number, and particularly relevant for a kind of can be rapidly and inspect the mechanism and the method at the lot number of wafer and quarter number safely.
(2) background technology
In manufacture of semiconductor, integrated circuit (IC) wafer (IC wafer) is to be loaded in the crystal-boat box (pod), and needs according to loading in regular turn at lot number on the wafer (lot number) and quarter number (wafer number).For instance, after FEOL was finished, wafer can be placed in the crystal-boat box, waited for the beginning of next processing procedure.Whether at waiting time, the production operation personnel can extract the some of wafer one by one with vacuum WAND out, to inspect its lot number or to carve number correct.Lot number and carve position number on wafer, as shown in Figure 1.
Among Fig. 1, there is a label zone 102 in the corner on the wafer 100, is indicating the lot number of this wafer and carves number, as 123456-01; The former is a lot number, and the latter is for carving number.The wafer of same crystal-boat box has identical lot number, and n group groove is arranged in the crystal-boat box, can load the n wafer.Generally, the wafer in the crystal-boat box be according to quarter order in turn be placed; For example, carve number 01 wafer and be placed on first group of groove, carve number 02 wafer and then be placed on second group of groove ... quarter, the wafer of n then was placed on n group groove.Through the wafer after the ordering, can enter the processing procedure in next stage.And well-regulated placement wafer also helps seeking a certain wafer in crystal-boat box.
Yet, extract wafer out inspection in the mode of artificial use vacuum WAND, not only expend time in, and the anxiety of fragmentation is arranged easily.This kind conventional procedures is as follows: earlier vacuum WAND is inserted the space between two wafer, hold the surface of a wafer then gently and haul out sub-fraction, to check lot number and to carve number.After checking out,, and then descend inspecting of a slice again with the wafer pushed home and put down.At present, finish inspecting of a wafer and need about 30 seconds.If fill 25 wafer in the crystal-boat box, check whole wafers, need expend about 12.5 minutes, very time-consuming.In addition, draw and put down wafer and need each 25 times.Go wrong if operating personnel shake the vacuum section of hand or suction pen carelessly, all make wafer break away from vacuum WAND easily, and cause fragmentation.
(3) summary of the invention
In view of this, the purpose of this invention is to provide a kind of mechanism and inspection method thereof inspected, with the lot number of inspecting all wafers in the crystal-boat box rapidly with carve number, save time and do not have the anxiety of fragmentation.
According to purpose of the present invention, a kind of mechanism of inspecting is proposed, in order to inspecting the mark on each wafer in the interior multi-disc wafer of crystal-boat box (pod), as lot number with carve number etc.Inspecting mechanism comprises: a platform and a stigmatometer.Crystal-boat box is to be placed in the platform place.And stigmatometer is positioned at the end on the platform, and has an inclined plane.Relative motion can be carried out with this crystal-boat box in this inclined plane, so that the wafer in the crystal-boat box is ejected slightly, thereby exposes those marks on the wafer in order.
According to purpose of the present invention, other proposes a kind of inspection method, and in order to inspect the mark on each wafer in the multi-disc wafer, wherein these wafers are to deposit in the crystal-boat box, and it is as follows that the method comprising the steps of: (a) earlier crystal-boat box is positioned on the platform; (b) make a stigmatometer and crystal-boat box generation on the platform relatively move, the inclined plane of stigmatometer and the periphery of wafer are offseted, and wafer is ejected slightly, these wafers that wherein are ejected expose the described mark on these wafers in order; (c) inspect described mark on all wafers.Not according to the sequence arrangement of carving number, then adjust its position if find the part wafer with manual type.
(4) description of drawings
Fig. 1 is the schematic diagram in wafer and its label zone;
Fig. 2 is the schematic diagram of inspecting of inspecting mechanism according to a preferred embodiment of the present invention;
Fig. 3 is the schematic diagram according to the another kind of inspection method of inspecting mechanism of preferred embodiment of the present invention; And
Fig. 4 is the end view of another kind of stigmatometer of the present invention.
(5) embodiment
Please refer to Fig. 2, it is the schematic diagram of inspecting of inspecting mechanism according to a preferred embodiment of the present invention.Inspect mechanism and comprise platform 202 and stigmatometer 204.The crystal-boat box 208 that carries full integrated circuit (IC) wafer 206 can be positioned on the platform 202, and stigmatometer 204 is ends that are positioned at platform 202.Major technique of the present invention is characterised in that the inclined plane 204a of stigmatometer 204.Utilize this inclined plane 204a, wafer 206 can be ejected slightly outside crystal-boat box 208, in order to inspect its lot number and to carve number.And second wafer can how than first wafer outstanding so that inspect the lot number of second wafer and carve number.And that the 3rd wafer can be howed than second wafer is outstanding, so that inspect the lot number of the 3rd wafer and carve number, and a slice to the last by that analogy.And platform 202 materials of the present invention can be used plastic-steel, to support heavy crystal-boat box 208, can use the Teflon with softness as for stigmatometer 204 materials, it are caused damage when avoiding contacting with wafer 206.
And the mechanism of inspecting among Fig. 2 also comprises a baffle plate 210, is positioned at the other end of platform 202, drops out outside platform 202 in order to the wafer 206 that prevents to be ejected.And also can form track groups on the platform 202,, avoid crystal-boat box 208 when operation, to produce and slide, and cause injury wafer 206 with fixing crystal-boat box 208.Wherein, the position of track groups and length are to decide on the crystal-boat box shape of actual use, and also can comprise many group track groups on the platform 202, to match with the crystal-boat box of different sizes.Can match with the crystal-boat box that loads 6 o'clock wafers as the track groups among the figure 212, and track groups 214 can match with the crystal-boat box that loads 8 o'clock wafers.Yet the present invention does not limit the existence that baffle plate 210 and track groups must be arranged.Both consider visual practical application situation.
To inspect the step that mechanism inspects wafer as follows with of the present invention: at first, crystal-boat box 208 is positioned on the platform 202; Then, make stigmatometer 204 produce and relatively move, the inclined plane 204a of stigmatometer 204 and the periphery of wafer 206 are offseted, and wafer 206 is ejected slightly, to expose lot number on the wafer 206 and quarter number with crystal-boat box 208; Then, all lot numbers on the wafer 206 and carve number have once been inspected.Inspect the back and not according to the sequence arrangement of carving number, then adjust the position of these wafers with manual type if find wafer 206.
In addition, the method that stigmatometer 204 and crystal-boat box 208 generations are relatively moved has a variety of, is not specially limited in the present invention.For example, fix the position of crystal-boat box 208 after, stigmatometer 204 is slided, on platform 202 outside the release crystal-boat box 208 that wafer 206 is slight.Or stigmatometer 204 can be fixed on the platform 202, and makes crystal-boat box 208 202 slide towards the inclined plane of stigmatometer 204 204a on platform, so that wafer 206 is released outside the crystal-boat box 208 slightly.Or be that stigmatometer 204 is to be fixed on the platform 202, but directly crystal-boat box 208 is positioned on the inclined plane 204a of stigmatometer 204, also outside the release crystal-boat box 208 that can wafer 206 is slight, as shown in Figure 3.
Fig. 3 is the schematic diagram according to the another kind of inspection method of inspecting mechanism of preferred embodiment of the present invention.Fig. 3 and Fig. 2 to inspect mechanism identical, except the disposing way of crystal-boat box 208 becomes upright placement by horizontal placement.As long as the inclined plane 204a of stigmatometer 204 can offset with the periphery of wafer 206, these two kinds of disposing ways can both make wafer 206 be pushed out slightly outside the crystal-boat box 208, and reach very clear, the effect of once inspecting.
In above-mentioned Fig. 2 and Fig. 3, its stigmatometer 204 is that a cross section is leg-of-mutton tetrahedron, that is, and and triangular prism, and inclined plane 204a is a flat surfaces, however the present invention is not limited to this.Please refer to Fig. 4, it is the end view of another kind of stigmatometer of the present invention.Among Fig. 4, the stigmatometer 404 on the platform 402 is a prismatoid, and its inclined plane 404a is a stepped surface, and this surface comprises a plurality of ladders, and the position of these ladders is corresponding with wafer 406 with number.Therefore, when the inclined plane 404a that is positioned over stigmatometer 404 when crystal-boat box 408 goes up, these ladders can with the periphery of wafer 406 offseting one by one, and wafer 406 is pushed out outside the crystal-boat box 408 slightly.Hence one can see that, no matter the inclined plane of stigmatometer is a smooth flat, or is made up of ladder layer by layer, even form by projection layer by layer, as long as have an angle of inclination in fact, all wafer can be released outside the crystal-boat box slightly, once inspect the purpose that all are carved number and reach.
Compare with traditional artificial use vacuum WAND mode, use mechanism and the inspection method inspected of the present invention, not only can once inspect in the crystal-boat box quarter on all wafers number, time saving and energy saving, and can significantly reduce the probability of fragmentation, reduce production costs.
In sum; though the present invention discloses as above with preferred embodiment; yet it is not in order to limit the present invention; any person skilled in the art person without departing from the spirit and scope of the present invention; change with equivalence and replace when doing various equivalence, so protection scope of the present invention is when looking being as the criterion that accompanying Claim defines.
Claims (18)
1. inspect mechanism for one kind, in order to inspect the mark on each wafer in the multi-disc wafer, those wafers are to deposit in the crystal-boat box, and this mechanism comprises:
One platform is in order to put this crystal-boat box; With
One stigmatometer has an inclined plane, and is positioned at the end on this platform, and this inclined plane can carry out relative motion with this crystal-boat box, so that those wafers in this crystal-boat box are ejected slightly, thereby exposes those marks on those wafers in order.
2. the mechanism of inspecting as claimed in claim 1 is characterized in that, this mark comprises a lot number and a moment number.
3. the mechanism of inspecting as claimed in claim 1 is characterized in that this stigmatometer is a triangular prism, and this inclined plane is a flat surfaces.
4. the mechanism of inspecting as claimed in claim 1 is characterized in that this stigmatometer is a prismatoid, and this inclined plane is a stepped surface, and this stair-stepping surface comprises a plurality of ladders, and the position of those ladders is one by one corresponding to the position of those wafers.
5. the mechanism of inspecting as claimed in claim 1 is characterized in that the other end of this platform has a baffle plate at least, drops out outside this platform in order to those wafers that prevent to be ejected.
6. the mechanism of inspecting as claimed in claim 1 is characterized in that, also is provided with at least one group of track on this platform, to put this crystal-boat box.
7. the mechanism of inspecting as claimed in claim 1 is characterized in that this stigmatometer is to be fixed on this platform, and this crystal-boat box can slide towards this inclined plane of this stigmatometer on this platform, so that those wafers are released outside this crystal-boat box slightly.
8. the mechanism of inspecting as claimed in claim 1 is characterized in that, stigmatometer is to be fixed on this platform, and this crystal-boat box then directly is positioned on this inclined plane of this stigmatometer, outside this crystal-boat box of the release that those wafers are slight.
9. the mechanism of inspecting as claimed in claim 1 is characterized in that this stigmatometer can slide on this platform, so that those wafers are released outside this crystal-boat box slightly.
10. inspection method, in order to inspect the mark on each wafer in the multi-disc wafer, wherein these wafers are to deposit in the crystal-boat box, it is as follows that the method comprising the steps of:
(a) this crystal-boat box is positioned on the platform;
(b) make a stigmatometer and the generation of this crystal-boat box on this platform relatively move, one inclined plane of this stigmatometer and the periphery of these wafers are offseted, and these wafers are ejected slightly, these wafers that wherein are ejected expose the described mark on each wafer in order;
(c) inspect described mark on all these wafers.
11. inspection method as claimed in claim 10 is characterized in that, also comprises in the step (a) this crystal-boat box is placed in a track groups on this platform, skids off this platform to avoid this crystal-boat box.
12. inspection method as claimed in claim 10 is characterized in that, this stigmatometer is a triangular prism, and this inclined plane is a flat surfaces.
13. inspection method as claimed in claim 10, it is characterized in that this stigmatometer is a prismatoid, and this inclined plane is a stepped surface, this stair-stepping surface comprises a plurality of ladders, and the position of these ladders is corresponding with the position and the number of these wafers with number.
14. inspection method as claimed in claim 10, it is characterized in that in the step (b), this stigmatometer is to be fixed on this platform, and this crystal-boat box is to slide towards this inclined plane of this stigmatometer on this platform, so that these wafers are released outside this crystal-boat box slightly.
15. inspection method as claimed in claim 10 is characterized in that, in the step (b), this stigmatometer is to be fixed on this platform, and this crystal-boat box then directly is positioned on this inclined plane of this stigmatometer, so that these wafers are released outside this crystal-boat box slightly.
16. the mechanism of inspecting as claimed in claim 10 is characterized in that, this stigmatometer can be at this platform top offset, outside this crystal-boat box of the release that these wafers are slight.
17. inspection method as claimed in claim 10 is characterized in that, this mark comprises a lot number and a moment number.
18. inspection method as claimed in claim 17 is characterized in that, in step (c), inspects the back if these wafers not according to the sequence arrangement at this quarter number, are then adjusted the position of these wafers with manual type.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031548628A CN1306580C (en) | 2003-08-20 | 2003-08-20 | Mechanism and method for inspecting batch nos. and etched nos. on wafers in casing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031548628A CN1306580C (en) | 2003-08-20 | 2003-08-20 | Mechanism and method for inspecting batch nos. and etched nos. on wafers in casing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1585105A CN1585105A (en) | 2005-02-23 |
| CN1306580C true CN1306580C (en) | 2007-03-21 |
Family
ID=34598014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031548628A Expired - Fee Related CN1306580C (en) | 2003-08-20 | 2003-08-20 | Mechanism and method for inspecting batch nos. and etched nos. on wafers in casing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1306580C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111554599B (en) * | 2020-04-27 | 2022-07-26 | 厦门通富微电子有限公司 | Tool for bearing wafer material box, wafer material box device and method for loading wafer |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4618938A (en) * | 1984-02-22 | 1986-10-21 | Kla Instruments Corporation | Method and apparatus for automatic wafer inspection |
| JPH08148546A (en) * | 1994-11-22 | 1996-06-07 | Sumitomo Metal Ind Ltd | Wafer arrangement detection device |
| CN1242872A (en) * | 1997-10-17 | 2000-01-26 | 奥林巴斯光学工业株式会社 | Wafer transfer device |
| CN1368474A (en) * | 2001-02-08 | 2002-09-11 | 奇美电子股份有限公司 | Delivery system for stored materials |
-
2003
- 2003-08-20 CN CNB031548628A patent/CN1306580C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4618938A (en) * | 1984-02-22 | 1986-10-21 | Kla Instruments Corporation | Method and apparatus for automatic wafer inspection |
| JPH08148546A (en) * | 1994-11-22 | 1996-06-07 | Sumitomo Metal Ind Ltd | Wafer arrangement detection device |
| CN1242872A (en) * | 1997-10-17 | 2000-01-26 | 奥林巴斯光学工业株式会社 | Wafer transfer device |
| CN1368474A (en) * | 2001-02-08 | 2002-09-11 | 奇美电子股份有限公司 | Delivery system for stored materials |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1585105A (en) | 2005-02-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1112550B1 (en) | An automated wafer defect inspection system and a process of performing such inspection | |
| CN101802978B (en) | Substrate processing method and substrate processing system | |
| JP2003209154A (en) | Substrate treatment device and substrate treatment method | |
| CN110227655A (en) | A kind of chip-detecting apparatus based on image recognition | |
| TW386160B (en) | Socket type module test apparatus and socket for the same | |
| CN1306580C (en) | Mechanism and method for inspecting batch nos. and etched nos. on wafers in casing | |
| WO2010134890A1 (en) | System and method for testing and managing camera modules | |
| TW201140266A (en) | Optical inspection during a PCB manufacturing process | |
| CN107931154A (en) | Electronic unit test sorting machine and its taught point method of adjustment | |
| TWI326771B (en) | Static dissipative layer system and method | |
| JP2008020251A (en) | Defect inspection method, defect inspection device and pattern extraction method | |
| KR100724150B1 (en) | The Method of Inspecting an External Appearance of Module IC and the Device Thereof | |
| JP3635835B2 (en) | Component mounting apparatus and defective component collection method | |
| JP2014089215A (en) | Inspection device | |
| US20180263152A1 (en) | Control device | |
| JP6152034B2 (en) | Labeling method, labeling device and defect inspection device | |
| JP2004251641A (en) | Apparatus and method for inspecting semiconductor wafer | |
| US20050238350A1 (en) | Apparatus for removing developing solution | |
| US7610574B2 (en) | Method and apparatus for designing fine pattern | |
| JP2010165725A (en) | Substrate mounting device | |
| CN114822601B (en) | Automatic copying machine | |
| JPH07221499A (en) | Board backup device | |
| CN217484212U (en) | Object stage with sheet picking plate for wafer defect detection | |
| JP2006066747A (en) | Positioning apparatus and method of substrate | |
| US20220221370A1 (en) | Device and method for measuring thickness of dielectric layer in circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070321 Termination date: 20190820 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |