CN1311529C - Supersonic vibration device and wet type disposing device adopting same - Google Patents
Supersonic vibration device and wet type disposing device adopting same Download PDFInfo
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- CN1311529C CN1311529C CNB2004100598331A CN200410059833A CN1311529C CN 1311529 C CN1311529 C CN 1311529C CN B2004100598331 A CNB2004100598331 A CN B2004100598331A CN 200410059833 A CN200410059833 A CN 200410059833A CN 1311529 C CN1311529 C CN 1311529C
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- ultrasonic vibration
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/20—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of a vibrating fluid
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
Abstract
This ultrasonic vibration apparatus 1 has a vibration part 5 comprising a vibration plate 2 of a single layered or multilayered structure, and vibrators 3 fixed to the vibration plate 2 and generating ultrasonic vibration. A thickness of the vibration part 5 is set so that the sum of ratios of a thickness of the ultrasonic vibration at each layer of the vibration plate 2 and the vibrators 3 in the advancing direction to wavelength of the ultrasonic vibration (ratio of thickness/wavelength) is integral multiples of 1/2. The vibrator 3 is set to have a thickness with the ratio of thickness/wavelength to be other than integral multiples of 1/2. The wet treatment apparatus is provided with wet treatment nozzles having a wet treatment body part with an opposing face to a treating object, and the body part is provided with the ultrasonic vibration apparatus 1. To simplify manufacturing processes and to reduce cost.
Description
Technical field
The present invention relates to a kind ofly object being treateds such as glass substrate or semiconductor substrate are being supplied with wet processed liquid, implement to clean, peel off, during wet processed such as video picture, etching, plated film, grinding, can be used for wet processed liquid is bestowed the ultrasonic vibration apparatus of ultrasonic vibration and adopted the wet type processing device of this device.
Background technology
As cleaning device a kind of known the cleaning device that has ultrasonic vibration apparatus is arranged, the cleaning device of this mode is called ultrasonic cleaning equipment.
Figure 14 be represent ultrasonic cleaning equipment example in the past the summary pie graph (for example, with reference to patent documentation 1.)。
This ultrasonic cleaning equipment has the treatment fluids such as pure water or cleaning fluid 101 and can accommodate the treatment trough 103 of object being treated and be bonded at the oscillator 105 of these treatment trough 103 bottom surfaces of being fit to pack into.Above-mentioned treatment trough 103 double as oscillating plates.Oscillator 105 is by formations such as PZT (zirconium titanate) elements, utilizes oscillator to add the voltage of assigned frequency, exports the ultrasonic vibration of this frequency.The thickness of the base plate of this treatment trough 103 generally is set at the integral multiple (n doubly) of the half-wavelength (λ/2) of above-mentioned ultrasonic vibration, and the thickness of actual used base plate is decided to be λ/2.
In the ultrasonic cleaning equipment that so constitutes,, then, clean the thing that is cleaned that is immersed in the treatment fluid 101 by base plate, the treatment fluid 101 of ultrasonic vibration energized process groove 103 if produce ultrasonic vibration from oscillator 105.
Patent documentation 1: the spy opens flat 10-94756 communique (Figure 10, Fig. 1)
But, in the ultrasonic cleaning equipment of Figure 14, need make the thickness of the base plate of treatment trough 103 meet the integral multiple of half-wavelength of the resonance frequency of ultrasonic oscillator 105, perhaps be thinned to the degree that does not influence vibration.Therefore,, can not adopt general parts because the degree of freedom of article shape is little, so, the necessary individual design of a lot of situations, making, the result increases manufacturing cost.
In addition, in ultrasonic vibration apparatus in the past, because of certain reason, under the situation that the liquid level of treatment fluid 101 reduces greatly, owing to there is not processing water 101 as external load above oscillator 105, the amplitude of oscillator 105 increases thus, and caloric value increases, because of this heating, damage adhesive, and oscillator 105 can be peeled off from treatment trough 103.
In addition, Figure 10 is the oscillator applied voltage that is illustrated in the past ultrasonic cleaning equipment, the schematic diagram of the waveform example of the vibration section when oscillator produces ultrasonic vibration (part that is made of oscillator and oscillating plate).Each component parts of vibration section during for expression waveform shown in Figure 10 adopts the PZT plate of thick 2.0mm, adopts the SUS plate of thick 3.0mm as oscillating plate as oscillator.The resonance frequency of vibration section is approximately 950kHz.
Therefore, for improving so problem, ultrasonic cleaning equipment has as shown in figure 15 been proposed (for example, with reference to patent documentation 1.)。
This ultrasonic cleaning equipment has the ultrasonic vibration generating unit 106 that can be fit to pack into treatment fluid 101 and can accommodate the treatment trough 103 of object being treated and insert the peristome 103a that is formed on these treatment trough 103 bottom surfaces.Ultrasonic vibration generating unit 106 has oscillator 107 and the wave conductor 109 that is bonded on this oscillator 107, and this wave conductor 109 is configured in upside in the mode that contacts with treatment fluid 101, and oscillator 107 is configured in downside.Oscillator 107 adds the voltage of assigned frequency by oscillator 112, produces the ultrasonic vibration of this frequency.Wave conductor 109 will pass to treatment fluid 101 from the ultrasonic vibration of oscillator 107.In addition, in Figure 15,109a is provided in a side of the flange part on the wave conductor 109.
, in the ultrasonic cleaning equipment of Figure 15, the heating when descending in order to be suppressed at the liquid level of handling water 101, and be about 20 times of half-wavelength of ultrasonic vibration with the thickness setting of wave conductor 109, increased the weight of device.
In addition, the part that the thickness of wave conductor 109 is thick, hyperacoustic loss is big, because heating in this part generation, therefore need cooling produce the part of heating, can be owing to be provided with to the cooling body that is formed on the through hole 109c supply cooling fluid on the flange part 109a, so apparatus structure is complicated.
Summary of the invention
The present invention be directed to the problems referred to above and propose, one of purpose provides a kind of ultrasonic vibration apparatus that can simplify manufacturing process, reduce cost.
In addition, one of purpose of the present invention provides a kind of in light weight, ultrasonic vibration apparatus that can the stable supplying ultrasonic vibration.
In addition, one of purpose of the present invention provide a kind of can improve the peeling off of oscillator, can the stable supplying ultrasonic vibration ultrasonic vibration apparatus.
In addition, one of purpose of the present invention provides a kind of ultrasonic cleaning equipment and wet type processing device with the ultrasonic vibration apparatus that can simplify manufacturing process, reduce cost.
For achieving the above object, the present invention adopts following formation.
Ultrasonic vibration apparatus of the present invention has by the oscillating plate of 1 layer or sandwich construction and is fixed on this oscillating plate and produces the vibration section that the oscillator of ultrasonic vibration constitutes, and it is characterized in that:
By the ratio of the thickness of the direction of advance of each layer that makes above-mentioned oscillating plate and above-mentioned ultrasonic vibration above-mentioned oscillator, separately and the wavelength of separately above-mentioned ultrasonic vibration be thickness/wavelength ratio and be the thickness that 1/2 integral multiple is set above-mentioned vibration section;
Above-mentioned oscillator is that ratio beyond 1/2 the integral multiple is set its thickness by above-mentioned thickness/wavelength ratio.
In this ultrasonic vibration apparatus, because above-mentioned vibration section, by the ratio of the thickness of the direction of advance of the above-mentioned ultrasonic vibration separately of each layer that makes above-mentioned oscillating plate and above-mentioned oscillator and the wavelength of separately above-mentioned ultrasonic vibration (below, be called thickness/wavelength ratio) and be that 1/2 integral multiple is set thickness, in other words, make the thickness of the vibration section integral body that constitutes by oscillating plate and oscillator reach the integral multiple of the half-wavelength of the ultrasonic vibration that produces from oscillator, therefore, when it is made, as long as it is just passable that the thickness of the above-mentioned vibration section of combination satisfies the oscillating plate and the oscillator of above-mentioned condition, unlike ultrasonic vibration apparatus in the past, the thickness of oscillating plate is limited to the integral multiple of the half-wavelength of ultrasonic vibration.Thus, the degree of freedom selected, design of each parts increases, and does not need to cooperate the processing of other design size, so, can simplify manufacturing process, reduce cost.
In ultrasonic vibration apparatus of the present invention, above-mentioned vibration section, also can by the above-mentioned thickness/wavelength ratio separately of each layer that makes above-mentioned oscillating plate and above-mentioned oscillator and be 1/2 to set thickness.
If adopt the ultrasonic vibration apparatus of above-mentioned formation, because thickness that can the attenuate vibration section, thus, reduce the ultrasonic wave loss, the cooling device that the heating that is caused by the ultrasonic wave loss is cooled off also can be set, in addition, can also make whole device lightweight.
In addition, in ultrasonic vibration apparatus of the present invention, above-mentioned oscillating plate preferably is made of highly heat-conductive material.As above-mentioned highly heat-conductive material, can adopt in the materials such as pottery such as alloy, aluminium oxide, carborundum of copper, silver, gold, aluminium and these metals more than a kind or 2 kinds.
If adopt the ultrasonic vibration apparatus of above-mentioned formation, because even when the processing liquid measure minimizing of the cleaning device with this ultrasonic vibration apparatus etc., the amplitude of oscillator increases, and increases caloric value, also can distribute above-mentioned heating by oscillating plate, within a certain period of time, can keep oscillator and be bonded in state on the oscillating plate, so, compared with the past, oscillator is not easy to peel off, and can prolong the life-span of ultrasonic vibration apparatus in the certain hour drive vibrator.
In addition, in ultrasonic vibration apparatus of the present invention, also can: above-mentioned oscillating plate is a sandwich construction, and the layer of bonding above-mentioned oscillator is made of highly heat-conductive material, is formed by the material of anti-the fluidity with the outermost layer of the opposite side of a side of bonding above-mentioned oscillator.As the above-mentioned material of anti-the fluidity, when the ultrasonic cleaning equipment with this ultrasonic vibration apparatus or the employed treatment fluid of wet type processing device are water, can adopt stainless steel, surface treated stainless steel, when treatment fluid is acid or alkali, can adopt the metal material, pottery, quartz glass etc. of coating sapphire, high purity aluminium oxide or TFE (tetrafluoroethylene resin).
If adopt this ultrasonic vibration apparatus, because by form the layer of bonding above-mentioned oscillator by highly heat-conductive material, can improve the thermal conductivity of oscillating plate, so even the amplitude of oscillator increases, caloric value increases, also can distribute above-mentioned heating, within a certain period of time, keep oscillator and be bonded on state on the oscillating plate by oscillating plate.In addition, owing to, can improve the anti-fluidity of oscillating plate by form the outermost layer with the opposite side of a side of bonding above-mentioned oscillator by the material of anti-the fluidity, therefore, even the thickness of attenuate oscillating plate also is not easy deterioration in above-mentioned treatment fluid.
In addition, in ultrasonic vibration apparatus of the present invention, also can have the temperature measuring apparatus of the temperature of measuring above-mentioned oscillating plate and the electric power of oscillator and supply with shearing device.
If adopt the ultrasonic vibration apparatus of above-mentioned formation, even under situations such as above-mentioned processing liquid measure minimizing, the amplitude of oscillator increases, caloric value increases, and adopts at oscillating plate under the situation of highly heat-conductive material, and oscillator can not peeled off within a certain period of time yet, so, by before peeling off oscillator (through behind the certain hour), utilize electric power to supply with the shearing device cut-out and supply with to the electric power of oscillator, can prevent to destroy ultrasonic vibration apparatus.
Ultrasonic cleaning equipment of the present invention is characterized in that: the treatment trough of storing washing fluid has above-mentioned any one ultrasonic vibration apparatus of the present invention that constitutes.
If adopt the ultrasonic cleaning equipment of the present invention of above-mentioned formation, can provide a kind of easy manufacturing, ultrasonic cleaning equipment that cost is low.
Wet type processing device of the present invention, has the wet processed nozzle, this wet processed comprises the wet processed body that has with the opposed opposed faces of processed object with nozzle, the wet processed liquid that the gap of utilization between above-mentioned object being treated and above-mentioned opposed faces supplied with, above-mentioned object being treated is implemented wet processed, it is characterized in that:
Above-mentioned wet processed body has the ultrasonic vibration apparatus of claim 1 record, and the vibration section of this ultrasonic vibration apparatus has and the opposed opposed faces of above-mentioned object being treated.
If adopt the wet type processing device of above-mentioned formation, can provide a kind of easy manufacturing, wet type processing device that cost is low.
Description of drawings
Fig. 1 is the cutaway view that the summary of the ultrasonic vibration apparatus of expression the 1st execution mode of the present invention constitutes.
Fig. 2 is the cutaway view that the summary of the ultrasonic vibration apparatus of expression the 2nd execution mode of the present invention constitutes.
Fig. 3 is the cutaway view that the summary of the wet type processing device of expression the 3rd execution mode of the present invention constitutes.
Fig. 4 is a plane graph of seeing the wet processed usefulness nozzle that this wet type processing device has from object being treated one side.
Fig. 5 is the cutaway view that the summary of the wet type processing device of expression the 4th execution mode of the present invention constitutes.
Fig. 6 is the cutaway view that the summary of the wet type processing device of expression the 5th execution mode of the present invention constitutes.
Fig. 7 is the cutaway view that the summary of the ultrasonic cleaning equipment of expression the 6th execution mode of the present invention constitutes.
Fig. 8 is the schematic diagram of waveform example of the vibration section that ultrasonic vibration apparatus had of expression the 1st execution mode.
Fig. 9 is the schematic diagram of other waveform examples of the vibration section that has of ultrasonic vibration apparatus of expression the 1st execution mode.
Figure 10 is the schematic diagram of other waveform examples of the vibration section of representing that the ultrasonic vibration apparatus of formula in the past has.
Figure 11 is the frequency of vibration section of ultrasonic vibration apparatus of expression embodiment 1～2, comparative example 1 and the figure of average relationship of amplitude.
Figure 12 is the figure of relation of the displacement of the resonance frequency of vibration section of ultrasonic vibration apparatus of expression embodiment 1, comparative example 2～3 and vibration plane.
Figure 13 is the resonance frequency of vibration section of ultrasonic vibration apparatus of expression embodiment 3～4, comparative example 1 and the figure of average relationship of amplitude.
Figure 14 is a summary pie graph of representing ultrasonic cleaning equipment example in the past.
Figure 15 is other routine summary pie graphs of representing ultrasonic cleaning equipment in the past.
Among the figure: 1,11, the 21-ultrasonic vibration apparatus, 2, the 12-oscillating plate, 22-wave conductor (oscillating plate), 2a, the 22a-material layer of anti-the fluidity, 2b, 22b-highly heat-conductive material layer, the 3-oscillator, 5,15, the 25-vibration section, 41,41a, 41b-wet processed nozzle, 50-wet processed liquid, 53-wet processed body, the 53a-opposed faces, 51-treatment fluid introduction part, 51a-introducing port, 51b-the 1st peristome, the 51c-ingress pipe, 52-treatment fluid recoverer, 52a-outlet, 52b-the 2nd peristome, the 52c-discharge pipe, 55-wet processed zone, 81-washing fluid, 83-treatment trough.
Embodiment
Below, with reference to the accompanying drawings, ultrasonic vibration apparatus of the present invention is described and adopts the ultrasonic cleaning equipment of this device and the execution mode of wet type processing device.
The 1st execution mode
Fig. 1 is the cutaway view that the summary of the ultrasonic vibration apparatus of expression the 1st execution mode constitutes.
The ultrasonic vibration apparatus 1 of present embodiment, have by the oscillating plate 2 of sandwich construction and be fixed on the vibration section 5 that the oscillator 3 that produces ultrasonic vibration on 2 one faces of this oscillating plate constitutes, the electric power that is connected the oscillator (diagram slightly) on the oscillator 3, the temperature measuring apparatus (diagram slightly) of measuring the temperature of vibration section 5, oscillator is supplied with shearing device (diagram slightly).
Oscillating plate 2 has 2 layers of structure, is made of layer (being also referred to as the material layer of the anti-the fluidity sometimes) 2a that forms with the above-mentioned material of anti-fluidity the and layer (being also referred to as the highly heat-conductive material layer sometimes) 2b that the highly heat-conductive material that is formed on this material layer of anti-fluidity 2a constitutes.In addition, when the material layer of anti-fluidity 2a and highly heat-conductive material layer 2b are made of metal, there is not the composition surface in oscillating plate 2 from metal interlevel, can have the angle of propagating on ultrasonic wave loss ground and considers, preferably is made of the hot rolled steel plate that utilizes the hot rolling manufacturing.In addition, constitute under the situation of oscillating plate 2 can't help hot rolled steel plate, utilize the bonding material layer of anti-fluidity 2a of adhesive and highly heat-conductive material layer 2b.
On above-mentioned highly heat-conductive material layer 2b, utilize adhesive oscillator 3.
In this vibration section 5,, then encourage highly heat-conductive material layer 2b, highly heat-conductive material layer 2a if produce ultrasonic vibration by the oscillator 3 of above-mentioned oscillator applied voltage.
The thickness t of vibration section 5, press each layer of oscillating plate 2 and oscillator 3 above-mentioned ultrasonic vibration separately direction of advance thickness and the wavelength of separately above-mentioned ultrasonic vibration ratio (below, be called thickness/wavelength ratio) and the thickness that is 1/2 integral multiple set, that is, set by the thickness of the condition that satisfies following formula (1).
(t
1/ λ
1)+(t
2/ λ
2)+(t
3/ λ
3)=n/2 ... formula (1)
(in the formula, t
1Be the thickness of the direction of advance of the ultrasonic vibration of oscillator 3, λ
1Be the wavelength of the ultrasonic vibration that produces from oscillator 3, t
2Be the thickness of the direction of advance of the ultrasonic vibration of highly heat-conductive material layer 2b, λ
2Be the wavelength in highly heat-conductive material layer 2b of the ultrasonic vibration that produces from oscillator 3, t
3Be the thickness of the direction of advance of the ultrasonic vibration of the material layer of anti-fluidity 2a, λ
3Be the wavelength in the material layer of anti-fluidity 2a of the ultrasonic vibration that produces from oscillator 3, n is an integer)
But it is thickness beyond 1/2 the integral multiple that oscillator 3 is set above-mentioned thickness/wavelength ratio for, that is, and and the thickness of the condition of discontented foot formula (2).
(t
1/ λ
1)=n/2 ... formula (2)
Above-mentioned vibration section 5, also can by the thickness/wavelength ratio separately of each layer of oscillating plate 2 and oscillator 3 and be that 1/2 thickness is set, that is, for the foregoing reasons, preferably set by the thickness of the condition that satisfies following formula (3).
(t
1/ λ
1)+(t
2/ λ
2)+(t
3/ λ
3)=1/2 ... formula (3)
Above-mentioned electric power is supplied with shearing device, by before peeling off oscillator 3 (through behind the certain hour), cuts off the electric power of oscillator 3 and supplies with, and can prevent to destroy ultrasonic vibration apparatus.For example, the 6th execution mode as described later, when in ultrasonic cleaning equipment, having the ultrasonic vibration apparatus of present embodiment, even the amplitude of the oscillators such as processing liquid measure in the treatment trough increases, caloric value increases because of minimizing is packed into, also owing to when oscillating plate adopts highly heat-conductive material, can not peel off at the certain hour oscillator, so, by with before peeling off oscillator 3 (through behind the certain hour), can cut off the mode that the electric power of oscillator 3 is supplied with and set, can prevent that oscillator from peeling off.
In addition, above-mentioned electric power is supplied with shearing device, is connected with the said temperature determinator, and based on the temperature of the vibration section of temperature measuring apparatus mensuration, electric power that can the sever supply oscillator.By measuring the temperature of vibration section with above-mentioned temperature measuring apparatus, with can be before reaching the temperature of peeling off oscillator (through behind the certain hour), cut off the mode that the electric power of oscillator is supplied with and set, can prevent that oscillator from peeling off.
The ultrasonic vibration apparatus 1 of above-mentioned formation, the the 3rd～the 5th execution mode is such as described later, in the time of in the wet type processing device of packing into, be configured in the side that the material layer of anti-fluidity 2a of oscillating plate 2 contacts with wet processed liquid, as the 6th execution mode, in the time of in the ultrasonic cleaning equipment of packing into, be configured in a side that contacts with treatment fluid.
Fig. 8 is oscillator 3 applied voltages that are illustrated in the ultrasonic vibration apparatus 1 of present embodiment, the schematic diagram of the example of the waveform (size distribution of the amplitude that expression is inner) of the vibration section 5 during from oscillator 3 generation ultrasonic vibrations.Each component parts of vibration section 5 during as expression waveform shown in Figure 8, adopt the PZT plate of thick 2.5mm as oscillator, adopt hot rolled steel plate by SUS layer (material layer of the anti-fluidity 2a) formation of the Cu layer (highly heat-conductive material layer 2b) of thick 1.0mm and thick 1.0mm as oscillating plate 2.The resonance frequency of vibration section 5 is approximately 966kHz.
Fig. 9 is oscillator 3 applied voltages that are illustrated in the ultrasonic vibration apparatus 1 of present embodiment, the schematic diagram of other examples of the waveform of the vibration section 5 during from oscillator 3 generation ultrasonic vibrations.Each component parts of vibration section 5 during as expression waveform shown in Figure 9, adopt the PZT plate of thick 2.0mm as oscillator 3, adopt oscillating plate by sapphire plate (material layer of the anti-fluidity 2a) formation of the Cu plate (highly heat-conductive material layer 2b) of thick 1.0mm and thick 4.0mm as oscillating plate 2.The resonance frequency of vibration section 5 is approximately 927kHz.
If adopt the ultrasonic vibration apparatus 1 of present embodiment, because the thickness t of vibration section 5 is set at the thickness of the condition that satisfies formula (1), in other words, the thickness t of the vibration section integral body that constitutes by oscillating plate and oscillator, be set at the integral multiple (n doubly) of the half-wavelength (λ/2) of the ultrasonic vibration that produces from oscillator, therefore, when it is made, because as long as the thickness of the above-mentioned vibration section of combination satisfies the highly heat-conductive material layer 2b of above-mentioned condition, the material layer of anti-fluidity 2a and oscillator 3 just can, so, unlike ultrasonic vibration apparatus in the past, the thickness of oscillating plate need not to meet the integral multiple of the half-wavelength of ultrasonic vibration, can increase the degree of freedom of processing, simplify manufacturing process, reduce cost.
In addition, oscillating plate 2, because by form the layer that oscillator 3 sides are set by highly heat-conductive material layer 2b, can improve the thermal conductivity of oscillating plate 2, even so the amplitude of oscillator increases, caloric value increases, and also can distribute above-mentioned heat by oscillating plate 2, within a certain period of time, can keep oscillator 3 and be bonded in state on the oscillating plate 2.In addition, oscillating plate 2 since by forms by the material of anti-fluidity 2a with the opposite side of a side that oscillator is set layer, can improve the anti-fluidity of oscillating plate, therefore, even the thickness of attenuate oscillating plate also is difficult to by above-mentioned treatment fluid deterioration.
The 2nd execution mode
Fig. 2 is the cutaway view that the summary of the ultrasonic vibration apparatus of expression the 2nd execution mode constitutes.
The ultrasonic vibration apparatus 11 of the 2nd execution mode is with ultrasonic vibration apparatus 1 difference of the 1st execution mode shown in Figure 1, oscillating plate 12 is single layer structures, in addition, by oscillating plate 12 be bonded in the thickness t of the vibration section 15 that an oscillator 3 on the face constitutes, set with the thickness above-mentioned thickness/wavelength ratio separately of oscillating plate 12 and oscillator 3 and that be 1/2 integral multiple, that is, set by the thickness of the condition that satisfies following formula (4).
(t
1/ λ
1)+(t
4/ λ
4)=n/2 ... formula (4)
(in the formula, t
1Be the thickness of the direction of advance of the ultrasonic vibration of oscillator 3, λ
1Be the wavelength of the ultrasonic vibration that produces from oscillator 3, t
4Be the thickness of the direction of advance of the ultrasonic vibration of oscillating plate 12, λ
4Be the wavelength of the ultrasonic vibration of oscillating plate 12, n is an integer)
As the material of oscillating plate 12, can adopt plate that constitutes by the above-mentioned material of anti-fluidity the or the plate that constitutes by above-mentioned highly heat-conductive material, perhaps also can adopt high purity glass shape carbon, titanium, magnesium etc.
In the ultrasonic vibration apparatus of above-mentioned the 1st～the 2nd execution mode, situation when oscillating plate is tabular has been described, as long as but can be on a face bonding oscillator 3, also can be other shapes, for example, also can be " コ " word shape cross section, " L " word shape cross section, " U " word shape.
The 3rd execution mode
Fig. 3 is the cutaway view that the summary of the wet type processing device of expression the 3rd execution mode of the present invention constitutes.Fig. 4 is a plane graph of seeing the wet processed usefulness nozzle that this wet type processing device has from object being treated one side.
The wet type processing device 31 of present embodiment, have up and down a pair of wet processed and roll (inclination connecting gear) 25 with 41,41 a plurality of transmission of nozzle with heeling condition (tiltangle) transmission object being treated 23 with nozzle (a pair of push-pull type nozzle) 41,41 with to above-mentioned a pair of wet processed.In addition, symbol S is the direction of transfer (moving direction) of object being treated 23 among the figure.Above-mentioned tiltangle can suit to select in the scope of 0≤θ＜arctan (a/b).Even under the situation of horizontal transmission (θ=0), can obtain effect of the present invention equally.
Each wet processed nozzle 41, formation comprises: wet processed body 53, it has and object being treated 23 opposed opposed faces 53a (being also referred to as the object being treated opposed faces sometimes); Treatment fluid introduction part 51 is adjacent to be provided with a side of this body 53, and the gap between above-mentioned object being treated 23 and above-mentioned opposed faces 53a imports wet processed liquid 50; Treatment fluid recoverer 52 is located at the opposing party of body 53, reclaims wet processed liquid 50 from above-mentioned gap.
Wet processed body 53 is by having ultrasonic vibration apparatus 1 as shown in Figure 3 and constituting from the side wall portion 67 that the periphery of the vibration section 2 of this ultrasonic vibration apparatus 1 erects.Side wall portion 67 forms one with vibration section 2, the side plate 67a that is erected by the end face from the material layer of anti-fluidity 2a and constitute from the side plate 67b that the end face of highly heat-conductive material layer 2b erects.Side plate 67a is made of the above-mentioned material of anti-the fluidity, and side plate 67b is made of highly heat-conductive material.The oscillator 3 of ultrasonic vibration apparatus 1 in the inboard of side wall portion 67, is configured on the highly heat-conductive material layer 2b of oscillating plate 2, and face vibration section 5 and the opposite side of a side that oscillator 3 is set forms and the opposed opposed faces 53a of object being treated.
Treatment fluid introduction part 51 has the ingress pipe 51c that at one end is provided with towards the 1st peristome 51b of object being treated 23 openings, in addition, is provided with introducing port 51a at the other end of this ingress pipe 51c, imports wet processed liquid 50.
Be provided with the object being treated opposed faces 53a of wet processed body 53 between above-mentioned the 1st peristome 51b and the 2nd peristome 52b, above-mentioned peristome 51b, 52b and object being treated opposed faces 53a be aligned configuration roughly.
In object being treated opposed faces 53a that handles body 53 and the space between the object being treated 23, form the zone 55 of carrying out wet processed.
In addition, at treatment fluid recoverer 52, pressure control part (diagram slightly) is set.This pressure control part; constitute by the drawdown pump that is located at outlet 52a side; control the equilibrium of the pressure (also comprising the surface tension of wet processed liquid and processed surface tension of object being treated) and the atmospheric pressure (the wet processed outer protection atmosphere of nozzle) of the wet processed liquid of the 1st peristome 51b, so that the wet processed liquid 50 that contacts with object being treated 23 flows into discharge pipe 52c after wet processed.
Therefore, pressure control part in outlet 52a side uses drawdown pump, control is with the power of the wet processed liquid 50 of this drawdown pump attraction processing body 53, so that pressure of the wet processed liquid 50 of the 1st peristome 51b (also comprising the surface tension of wet processed liquid and processed surface tension of object being treated) and atmospheric pressure are kept in balance.Promptly.By pressure P with the wet processed liquid 50 of the 1st peristome 51b
W(also comprising the surface tension of wet processed liquid and processed surface tension of object being treated) and atmospheric pressure P
aRelation be set at P
W P
aAnd supply with treatment fluid object being treated 23, contacted with object being treated 23 through the 1st peristome 51b, with not with object being treated 23 on supply the modes that contact of the other parts beyond the part of wet processed liquid, remove from object being treated 23, be discharged into discharge pipe 52c.
So the wet processed that constitutes is set wet processed body 53,53 with nozzle 41,41 in the opposed mode of phase septal space.In so a pair of wet processed gap with 53,53 of the wet processed bodies of nozzle 41,41, utilize to transmit and roll 25 with heeling condition transmission object being treated 23, in object being treated 23 and wet processed wet processed zone 55,55 with 41,41 at nozzle, carry out wet processed, can implement wet processed the two sides of object being treated 23.
Each wet processed is with the liquid level that touches of nozzle 41, fluororesin the such as never angle of stripping impurity is considered in wet processed liquid, preferred PFA and its have the stainless steel of the hybrid films of aluminium oxide and chromated oxide according to the stainless steel of applicable the most surperficial the passive state face that is made of chromated oxide of used wet processed liquid or on the surface, further it is with respect to the suitable titanium with electrolytic polishing surface of Ozone Water etc.If constitute by quartz and to touch liquid level, be suitable for all the wet processed liquid except that fluoric acid.
As above-mentioned wet processed liquid 50, can select according to the processing that object being treated 23 is implemented, for example, when clean, adopt cleaning fluid or pure water, when etching, adopt etching solution, when video picture, adopt imaging liquid, when peeling off, adopt stripper.
Above-mentioned a plurality of transmission rolls 25, and the mode that can be between a pair of wet processed is with the opposed faces of nozzle 41,41 transmits object being treated 23 with the angle that rises on moving direction is configured.
Below, adopt Fig. 3 and wet type processing device shown in Figure 4, object being treated 23 is implemented wet processed.
Utilize to transmit and roll 25, transmit object being treated 23, one side from a pair of wet processed each the 1st peristome 51b in a pair of wet processed with inclination between the opposed faces of nozzle 41,41 on one side with nozzle 41,41, supply with wet processed liquid 50 to wet processed zone 55, under this state, produce ultrasonic vibration from oscillator 3, excited vibration plate 2, wet processed liquid 50 successively, make object being treated 23 these wet processed liquid 50 that are energized of contact, after wet processed, discharge and wet processed liquid 50 after object being treated 23 contacts to discharge pipe 52c from the 2nd peristome 52b.In the wet processed at this moment, be not whole two sides of 1 wet processed object being treated 23, and at object being treated 23 by between opposed faces 53a, the 53a of nozzle 41,41 time, wet processed is by the part between this opposed faces successively.
If adopt the wet type processing device of present embodiment, by having a pair of wet processed nozzle 41,41 of above-mentioned formation, by controlling with respect to the pressure (supplying with the pressure of the wet processed liquid in the gap between above-mentioned object being treated and above-mentioned opposed faces) of the wet processed liquid of supplying with from above-mentioned ingress pipe 51c 50 from the pressure (attraction of treatment fluid recoverer) of the wet processed liquid of discharge pipe 52c discharge, and can be not be that wet processed liquid is discharged on external leakage ground to wet processed, thus can enough few treatment fluids, carry out wet processed expeditiously.In addition, the ultrasonic vibration apparatus 1 by having present embodiment at each wet processed body 53 can form wet type processing device easy to manufacture, that cost is low.
In addition, in the wet type processing device of present embodiment, the situation when each wet processed body 53 has the ultrasonic vibration apparatus 1 of the 1st execution mode has been described, but also can have had the ultrasonic vibration apparatus 11 of the 2nd execution mode.
In addition, up and down a pair of wet processed 41,41 o'clock the situation of nozzle of one group of setting has been described, but many groups can be set also, implement different types of wet processed by each group, in addition, only the one side of object being treated 23 is being implemented under the situation of wet processed, also can the wet processed nozzle be set an one side side at object being treated 23.
The 4th execution mode
Fig. 5 is the cutaway view that the summary of the wet type processing device of expression the 4th execution mode of the present invention constitutes.
The wet type processing device of the 4th execution mode, be with the difference of the wet type processing device of the 3rd execution mode: except that the opposing party of wet processed body 53 not the set handling liquid recoverer 52, have with the same up and down a pair of wet processed of above-mentioned the 3rd execution mode with nozzle 41a, 41a.
Adopt the wet type processing device of Fig. 5, object being treated 23 is implemented wet processed, undertaken by following.
Utilize to transmit and roll 25, one side tilts to transmit object being treated 23 between a pair of wet processed is with the opposed faces of nozzle 41a, 41a, each the 1st peristome 51b from a pair of wet processed nozzle 41a, 41a supplies with wet processed liquid 50 to wet processed zone 55 on one side, under this state, produce ultrasonic vibration from oscillator 3, excited vibration plate 2, wet processed liquid 50 successively, make object being treated 23 these wet processed liquid 50 that are energized of contact, carry out wet processed.Roll 25 with the angle that rises at the moving direction transmission object being treated 23 that tilts owing to utilize to transmit, so, wander the opposite side of moving direction with object being treated 23 with the wet processed liquid 50 after the contact above the object being treated 23, with the wet processed liquid 50 after following contact of object being treated 23, wander from the opposite side (with an opposite side of treatment fluid introduction part side) of wet processed body 53.
The 5th execution mode
Fig. 6 is the cutaway view that the summary of the wet type processing device of expression the 5th execution mode of the present invention constitutes.
The wet type processing device of the 5th execution mode, be with the difference of the wet type processing device of the 4th execution mode: except that near a side's of wet processed body 53 a side, be provided as the treatment fluid introduction part, treatment fluid supplies with the nozzle 71, adopt and the same wet processed nozzle 41b of above-mentioned the 3rd execution mode, and this wet processed only is arranged on the upper face side of object being treated 23 with nozzle 41b.Wet processed is supplied with wet processed liquid 50 with nozzle 71 to wet processed zone 55.
Adopt the wet type processing device of Fig. 6, object being treated 23 is implemented wet processed, undertaken by following.
Utilize to transmit and roll 25, one edge wet processed tilts to transmit object being treated 23, supplies with wet processed liquid 50 with nozzle 71 to wet processed zone 55 from the treatment fluid supply on one side with the downside of the opposed faces of nozzle 41b, under this state, produce ultrasonic vibration from oscillator 3, excited vibration plate 2, wet processed liquid 50 successively, make this wet processed liquid 50 that is energized of top contact of object being treated 23, carry out wet processed.
The 6th execution mode
Fig. 7 is the cutaway view that the summary of the ultrasonic cleaning equipment of expression the 6th execution mode of the present invention constitutes.
The ultrasonic cleaning equipment of present embodiment has the washing fluid 81 that is fit to pack into and can accommodate treatment trough 83 that is cleaned thing (diagram slightly) and the ultrasonic vibration apparatus 21 that connects the peristome 83a that inserts the bottom that is formed on this treatment trough 83 simultaneously.
Ultrasonic vibration apparatus 21, have by the wave conductor (oscillating plate) 22 of sandwich construction and be bonded in the vibration section 25 that oscillator 3 that these wave conductor 22 one sides went up and produced ultrasonic vibration constitutes, the electric power that is connected the oscillator 26 on the oscillator 3, the temperature measuring apparatus (diagram slightly) of measuring the temperature of vibration section 25, oscillator 3 is supplied with shearing device (diagram slightly).
Wave conductor 22 is a double-decker, is made of highly heat-conductive material layer 22b and the material layer of anti-fluidity 22a that is formed on this highly heat-conductive material layer 22b.The material layer of anti-fluidity 22a of this wave conductor 22, the mode to contact with washing fluid 81 is configured in upside, and highly heat-conductive material layer 22b is configured in downside.The material layer of anti-fluidity 22a forms than wide ground of highly heat-conductive material layer 22b form, and this is wide to go out portion and have function as flange part 22c.
Below highly heat-conductive material layer 22b, utilize the bonding oscillator 3 of adhesive.
In this vibration section 25, if produce ultrasonic vibration by the oscillator 3 of above-mentioned oscillator 26 applied voltages, field wave conductor 22 by this wave conductor 22, will pass to washing fluid 81 from the ultrasonic vibration of oscillator 3.
The thickness t of vibration section 25, press each layer of wave conductor 22 and oscillator 3 above-mentioned ultrasonic vibration separately direction of advance thickness and the wavelength of separately above-mentioned ultrasonic vibration ratio (below, be called thickness/wavelength ratio) and the thickness that is 1/2 integral multiple set, that is, set by the thickness of the condition that satisfies following formula (5).
(t
1/ λ
1)+(t
2/ λ
2)+(t
3/ λ
3)=n/2 ... formula (5)
(in the formula, t
1Be the thickness of the direction of advance of the ultrasonic vibration of oscillator 3, λ
1Be the wavelength of the ultrasonic vibration that produces from oscillator 3, t
2Be the thickness of the direction of advance of the ultrasonic vibration of highly heat-conductive material layer 22b, λ
2Be the wavelength in highly heat-conductive material layer 22b of the ultrasonic vibration that produces from oscillator 3, t
3Be the thickness of the direction of advance of the ultrasonic vibration of the material layer of anti-fluidity 22a, λ
3Be the wavelength in the material layer of anti-fluidity 22a of the ultrasonic vibration that produces from oscillator 3, n is an integer)
In the ultrasonic cleaning equipment that so constitutes, if produce ultrasonic vibration from oscillator 3, field wave conductor 22 is by this wave conductor 22, to pass to washing fluid 81 from the ultrasonic vibration of oscillator 3, and clean to be immersed in and be cleaned thing (object being treated) in the washing fluid 81.
If adopt the ultrasonic cleaning equipment of present embodiment, can form a kind of easy manufacturing, ultrasonic cleaning equipment that cost is low.
In addition, since ultrasonic vibration apparatus 21 can attenuate vibration section 25 thickness, therefore, no ultrasonic wave loss, because the cooling device that the heating that is produced by the ultrasonic wave loss is cooled off also can be set, therefore can make whole equipment miniaturization, lightweight, and can constitute by simplification device.
Embodiment
Below, by embodiment, be described more specifically.
Following making ultrasonic vibration apparatus constitutes the ultrasonic vibration apparatus of embodiment 1, this ultrasonic vibration apparatus except that adopt on the oscillating plate 2 that the hot rolled steel plate by thick 3.0mm constitutes by adhesive the vibration section 5 of the bonding oscillator 3 that constitutes by the PZT element of thick 2.0mm, all identical with Fig. 1.
Constitute the hot rolled steel plate of oscillating plate 2, by constituting as the SUS316L plate (corrosion resistant plate) of the thick 2.0mm of the material layer of anti-fluidity 2a with as the Cu layer of the thick 1.0mm of highly heat-conductive material layer 2b.In addition, the thermal conductivity under the ambient temperature 300K of Cu is 398Wm
-1K
-1, the thermal conductivity under the ambient temperature 300K of SUS is 14～17Wm
-1K
-1
Make wet type processing device, this wet type processing device except that have the wet processed of ultrasonic vibration apparatus that the wet processed body is equipped with embodiment 1 with nozzle, all identical with Fig. 6.
Adopt the wet type processing device of making, by oscillator to oscillator 3 applied voltages, vibrate from oscillator 3 output ultrasonic waves on one side, when processed substrate being implemented wet processed on one side, at the bubble that deliberately forms between opposed of the substrate wet processed body and processed (material layer of anti-fluidity of oscillating plate 2a's and processed substrate opposed face) and the processed substrate about diameter 5mm, the mode that flows through 0.1 liter of wet processed liquid by the length at every 1cm of 1 minute internal vibration plate 2 is carried out 1 hour continuous processing again, does not observe 2 of oscillator 3 and oscillating plates and peels off.
The resonance frequency of above-mentioned vibration section 5 is 918kHz (a 150Vp-p sin ripple).In addition, the amplitude shift of the material layer of anti-fluidity 2a side (liquid contact side) of vibration section 5 is approximately 2.5 μ m.
In addition, owing between opposed of the substrate wet processed body and processed (material layer of anti-fluidity of oscillating plate 2a's and processed substrate opposed face) and processed substrate, do not supplying with wet processed liquid, even, do not produce peeling off of oscillator 3 so drive 1 minute oscillator 3 yet.
Make the ultrasonic vibration apparatus that ultrasonic vibration apparatus constitutes embodiment 2, this ultrasonic vibration apparatus remove employing on the oscillating plate 2 of thick 5.0mm with adhesive the vibration section 5 of the bonding oscillator 3 that constitutes by the PZT element of thick 2.0mm, identical with Fig. 1.
As oscillating plate 2, adopt on sapphire plate, with the oscillating plate of the Cu plate of the bonding thick 1.0mm as highly heat-conductive material layer 2b of adhesive as the thick 4.0mm of the material layer of anti-fluidity 2a.
Make wet type processing device, this wet type processing device remove have the wet processed of ultrasonic vibration apparatus that the wet processed body is equipped with embodiment 2 with nozzle, with scheme identical.
Adopt the wet type processing device of making, by oscillator to oscillator 3 applied voltages, vibrate from oscillator 3 output ultrasonic waves on one side, when processed substrate being implemented wet processed on one side, between opposed of the substrate wet processed body and processed (material layer of anti-fluidity of oscillating plate 2a's and processed substrate opposed face) and the processed substrate with the same bubble that deliberately forms about diameter 5mm of the foregoing description, carry out 1 hour continuous processing, but do not observe oscillator 3 and 2 of oscillating plates are peeled off.
The resonance frequency of above-mentioned vibration section 5 is 926kHz.In addition, the amplitude shift of the material layer of anti-fluidity 2a side of vibration section 5 (contact liquid side) is approximately 2.4 μ m.
In addition, owing between opposed of the substrate wet processed body and processed (material layer of anti-fluidity of oscillating plate 2a's and processed substrate opposed face) and processed substrate, do not supply with wet processed liquid, even, do not produce peeling off of oscillator 3 so oscillator 3 is driven 1 minute yet.
Comparative example 1
Make the ultrasonic vibration apparatus that ultrasonic vibration apparatus constitutes comparative example 1, this ultrasonic vibration apparatus except that adopt on the oscillating plate that the duralumin, hard alumin ium alloy by thick 52.0mm constitutes with adhesive the vibration section of the bonding oscillator that constitutes by the PZT element of thick 2.0mm, identical with embodiment 1.
The thickness of above-mentioned oscillating plate is set by 20 times thickness of the half-wavelength that becomes ultrasonic vibration.In addition, the thermal conductivity under the ambient temperature 300K of duralumin, hard alumin ium alloy is 16Wm
-1K
-1
Make wet type processing device, this wet type processing device except that have the wet processed of ultrasonic vibration apparatus that the wet processed body is equipped with comparative example 1 with nozzle, identical with Fig. 6.
Adopt this wet type processing device, to the oscillator applied voltage,, processed substrate is implemented wet processed on one side on one side from the vibration of oscillator output ultrasonic wave by oscillator.
It is more than the 900kHz that there are 2, resonance frequency in above-mentioned vibration section, under the situation that all is resonance frequency, and the also about 0.6 μ m of the amplitude shift that touches the liquid side of vibration section.
The ultrasonic vibration apparatus of comparative example 1, because the thickness of vibration section surpasses 54.0mm, it is big that thickness becomes, weight increases the weight of.
The resonance frequency of the vibration section when Figure 11 is expression to the oscillator applied voltage of the ultrasonic vibration apparatus of embodiment 1～2, comparative example 1 and the relation of mean amplitude of tide (amplitude shift).
Find out that from the result of Figure 11 the ultrasonic vibration apparatus of embodiment 1～2 is with comparing of comparative example 1, because mean amplitude of tide is big, so can obtain being better than the cleaning force of comparative example 1.
In addition, the ultrasonic vibration apparatus of comparative example 1 owing to have a plurality of means amplitude of tide, is therefore thought the controlled variation that drives.
Comparative example 2
Make the ultrasonic vibration apparatus that ultrasonic vibration apparatus constitutes comparative example 2.This ultrasonic vibration apparatus except that adopt on the oscillating plate that the SUS by thick 3.0mm constitutes with adhesive the vibration section of the bonding oscillator that constitutes by the PZT element of thick 2.0mm, identical with embodiment 1.
The thickness of above-mentioned oscillating plate is set by 1 times thickness of the half-wavelength that reaches ultrasonic vibration.
Make wet type processing device, this wet type processing device except that have the wet processed of ultrasonic vibration apparatus that the wet processed body is equipped with comparative example 2 with nozzle, identical with Fig. 6.
Adopt this wet type processing device, to the oscillator applied voltage,, processed substrate is implemented wet processed on one side on one side from the vibration of oscillator output ultrasonic wave by oscillator.
Comparative example 3
Make the ultrasonic vibration apparatus that ultrasonic vibration apparatus constitutes comparative example 3, this ultrasonic vibration apparatus except that adopt on the oscillating plate that the duralumin, hard alumin ium alloy plate by the SUS plate of thick 3.0mm and thick 13mm constitutes with adhesive the vibration section of the bonding oscillator that constitutes by the PZT element of thick 2.0mm, identical with embodiment 1.
In addition, the thickness of above-mentioned SUS plate is set by 1 times thickness of the half-wavelength that becomes ultrasonic vibration.
In addition, the thickness of above-mentioned duralumin, hard alumin ium alloy plate is set by 5 times thickness of the half-wavelength that becomes ultrasonic vibration.
Make wet type processing device, this wet type processing device except that have the wet processed of ultrasonic vibration apparatus that the wet processed body is equipped with comparative example 3 with nozzle, identical with Fig. 6.
Adopt this wet type processing device, to the oscillator applied voltage,, processed substrate is implemented wet processed on one side on one side from the vibration of oscillator output ultrasonic wave by oscillator.
The relation of the resonance frequency of the vibration section when Figure 12 is expression to the oscillator applied voltage of the ultrasonic vibration apparatus of embodiment 1, comparative example 2～3 and the displacement (amplitude shift) of vibration plane.
Find out that from the result of Figure 12 therefore the ultrasonic vibration apparatus of embodiment 1 owing to obtain and comparative example 2～3 displacement of above vibration plane on an equal basis, thinks that embodiment 1 can obtain and comparative example 2～3 equal above cleaning forces.But,, therefore need to increase manufacturing process because comparative example 2～3 need make the component parts of oscillating plate reach 5 times processing of the half-wavelength of ultrasonic vibration.
Make the ultrasonic vibration apparatus that ultrasonic vibration apparatus constitutes embodiment 3, this ultrasonic vibration apparatus except that adopt on the oscillating plate 2 that the hot rolled steel plate by thick 2.6mm constitutes with adhesive the vibration section 5 of the bonding oscillator 3 that constitutes by the PZT element of thick 2.0mm, identical with Fig. 1.
Constitute the hot rolled steel plate of oscillating plate 2, by constituting as the SUS316L plate (corrosion resistant plate) of the thick 1.0mm of the material layer of anti-fluidity 2a with as the Cu layer of the thick 1.6mm of highly heat-conductive material layer 2b.
Make wet type processing device, this wet type processing device except that have the wet processed of ultrasonic vibration apparatus that the wet processed body is equipped with embodiment 3 with nozzle, identical with Fig. 6.
Adopt the wet type processing device of making, by oscillator to oscillator 3 applied voltages, vibrate from oscillator 3 output ultrasonic waves on one side, when processed substrate being implemented wet processed on one side, intentional formation bubble same as the previously described embodiments between opposed of the substrate wet processed body and processed (material layer of anti-fluidity of oscillating plate 2a's and processed substrate opposed face) and processed substrate, carry out 8 hours continuous processing, but do not observe oscillator 3 and 2 of oscillating plates are peeled off.
The resonance frequency of vibration section 5 is 958kHz.In addition, the about 3 μ m of amplitude shift of the material layer of anti-fluidity 2a side (touching the liquid side) of vibration section 5.
In addition, because not between opposed of the substrate wet processed body and processed (material layer of anti-fluidity of oscillating plate 2a's and processed substrate opposed face) and processed substrate, supply with wet processed liquid, so, also do not produce peeling off of oscillator even oscillator 3 is driven 1 minute.
Embodiment 4
Make the ultrasonic vibration apparatus that ultrasonic vibration apparatus constitutes embodiment 4, this ultrasonic vibration apparatus except that adopt on the oscillating plate 2 that the hot rolled steel plate by thick 3.2mm constitutes with adhesive the vibration section 5 of the bonding oscillator 3 that constitutes by the PZT element of thick 2.0mm, identical with Fig. 1.
Constitute the hot rolled steel plate of oscillating plate 2, by constituting as the SUS316L plate (corrosion resistant plate) of the thick 1.0mm of the material layer of anti-fluidity 2a with as the Al layer of the thick 2.2mm of highly heat-conductive material layer 2b.In addition, the thermal conductivity under ambient temperature 300K of Al is 237Wm
-1K
-1
Make wet type processing device, this wet type processing device except that have the wet processed of ultrasonic vibration apparatus that the wet processed body is equipped with embodiment 4 with nozzle, identical with Fig. 6.
Adopt the wet type processing device of making, by oscillator to oscillator 3 applied voltages, on one side from the vibration of oscillator 3 output ultrasonic waves, when processed substrate being implemented wet processed on one side, between opposed of the substrate wet processed body and processed (material layer of anti-fluidity of oscillating plate 2a's and processed substrate opposed face) and processed substrate with the same bubble that deliberately forms of the foregoing description, carry out 8 hours continuous processing, but do not observe oscillator 3 and 2 of oscillating plates are peeled off.
The resonance frequency of vibration section 5 is 925kHz.In addition, the amplitude shift of the material layer of anti-fluidity 2a side (touching the liquid side) of vibration section 5 is approximately 2.5 μ m.
In addition, owing between opposed of the substrate wet processed body and processed (material layer of anti-fluidity of oscillating plate 2a's and processed substrate opposed face) and processed substrate, do not supply with wet processed liquid, even, do not produce peeling off of oscillator so drive 1 minute oscillator 3 yet.
The resonance frequency of the vibration section when Figure 13 is expression to the oscillator applied voltage of the ultrasonic vibration apparatus of embodiment 3～4, comparative example 1 and the relation of mean amplitude of tide (amplitude shift).
Find out that from the result of Figure 13 the ultrasonic vibration apparatus of embodiment 3～4 with comparing of comparative example 1, because mean amplitude of tide is big, is therefore thought the cleaning force that can obtain being better than comparative example 1.
In addition, the ultrasonic vibration apparatus of comparative example 1 owing to have a plurality of means amplitude of tide peak, is therefore thought the controlled variation that drives.
As previously discussed, if adopt ultrasonic vibration apparatus of the present invention, can provide a kind of ultrasonic vibration apparatus of simplifying manufacturing process, reducing cost.
In addition, if adopt ultrasonic cleaning equipment of the present invention,, can provide a kind of easy manufacturing, ultrasonic cleaning equipment that cost is low by having ultrasonic vibration apparatus of the present invention.
In addition, if adopt wet type processing device of the present invention,, can provide a kind of easy manufacturing, ultrasonic cleaning equipment cheaply by having ultrasonic vibration apparatus of the present invention.
Claims (6)
1. ultrasonic vibration apparatus has by the oscillating plate of 1 layer or sandwich construction and is fixed on this oscillating plate and produces the vibration section that the oscillator of ultrasonic vibration constitutes, and it is characterized in that:
By the ratio of the thickness of the direction of advance of each layer that makes above-mentioned oscillating plate and above-mentioned ultrasonic vibration above-mentioned oscillator, separately and the wavelength of separately above-mentioned ultrasonic vibration be thickness/wavelength ratio and be the thickness that 1/2 integral multiple is set above-mentioned vibration section;
Above-mentioned oscillator, by above-mentioned thickness/wavelength ratio be beyond 1/2 the integral multiple ratio set its thickness.
2. ultrasonic vibration apparatus as claimed in claim 1 is characterized in that: by each layer that makes above-mentioned oscillating plate and above-mentioned thickness/wavelength ratio above-mentioned oscillator, separately and be 1/2 to set the thickness of above-mentioned vibration section.
3. ultrasonic vibration apparatus as claimed in claim 1, it is characterized in that: above-mentioned oscillating plate is formed by highly heat-conductive material, as above-mentioned highly heat-conductive material, adopt in the alloy, aluminium oxide, silicon carbide ceramics of copper, silver, gold, aluminium and these metals more than a kind or 2 kinds.
4. ultrasonic vibration apparatus as claimed in claim 1, it is characterized in that: above-mentioned oscillating plate is a sandwich construction, the layer of fixing above-mentioned oscillator is formed by highly heat-conductive material, form by the material of anti-the fluidity with the outermost layer of the opposite side of a side of fixing above-mentioned oscillator, as above-mentioned highly heat-conductive material, adopt in the alloy, aluminium oxide, silicon carbide ceramics of copper, silver, gold, aluminium and these metals more than a kind or 2 kinds.
5. ultrasonic cleaning equipment is characterized in that: the treatment trough of storing washing fluid has the ultrasonic vibration apparatus of claim 1 record.
6. wet type processing device, has the wet processed nozzle, this wet processed comprises the wet processed body that has with the opposed opposed faces of processed object with nozzle, the wet processed liquid that the gap of utilization between above-mentioned object being treated and above-mentioned opposed faces supplied with, above-mentioned object being treated is implemented wet processed, it is characterized in that:
Above-mentioned wet processed body has the ultrasonic vibration apparatus of claim 1 record, and the vibration section of this ultrasonic vibration apparatus constitutes the part with the opposed above-mentioned opposed faces of above-mentioned object being treated.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003179676 | 2003-06-24 | ||
| JP2003179676A JP3984196B2 (en) | 2003-06-24 | 2003-06-24 | Ultrasonic vibration device and wet processing device using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1574239A CN1574239A (en) | 2005-02-02 |
| CN1311529C true CN1311529C (en) | 2007-04-18 |
Family
ID=34180944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100598331A Expired - Fee Related CN1311529C (en) | 2003-06-24 | 2004-06-22 | Supersonic vibration device and wet type disposing device adopting same |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP3984196B2 (en) |
| KR (1) | KR100546425B1 (en) |
| CN (1) | CN1311529C (en) |
| TW (1) | TWI289333B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007288289A (en) * | 2006-04-13 | 2007-11-01 | Honda Electronic Co Ltd | Ultrasonic transducer and ultrasonic cleaner |
| JP2010029815A (en) * | 2008-07-30 | 2010-02-12 | Hitachi Kokusai Denki Engineering:Kk | Ultrasonic washing device |
| KR100947558B1 (en) * | 2009-10-16 | 2010-03-12 | 우시 브라이트스카이 이렉트로닉 컴퍼니 리미티드 | Water treatment system for ballast water |
| KR100986585B1 (en) * | 2010-03-23 | 2010-10-08 | (주) 경일메가소닉 | The ultrasonic oscillator and cleaning apparatus having the same |
| JP6763843B2 (en) | 2017-10-25 | 2020-09-30 | 株式会社カイジョー | Ultrasonic cleaning equipment and ultrasonic cleaning system |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5119840A (en) * | 1986-04-07 | 1992-06-09 | Kaijo Kenki Co., Ltd. | Ultrasonic oscillating device and ultrasonic washing apparatus using the same |
| JPH1094756A (en) * | 1996-07-31 | 1998-04-14 | Kaijo Corp | Ultrasonic excitation device and ultrasonic cleaning device provided with the same |
| JPH10229067A (en) * | 1997-02-14 | 1998-08-25 | Kaijo Corp | Substrate processing equipment |
| JPH11207258A (en) * | 1998-01-22 | 1999-08-03 | Tadahiro Omi | Ultrasonic oscillation generating device and ultrasonic cleaning device |
| JP2000296374A (en) * | 1999-04-14 | 2000-10-24 | Kaijo Corp | Ultrasonic excitation device and ultrasonic cleaning device having the same |
| CN1404107A (en) * | 2001-09-04 | 2003-03-19 | 阿尔卑斯电气株式会社 | Spraying nozzle for wet processing, wet processing apparatus and method |
-
2003
- 2003-06-24 JP JP2003179676A patent/JP3984196B2/en not_active Expired - Fee Related
-
2004
- 2004-06-17 TW TW093117498A patent/TWI289333B/en not_active IP Right Cessation
- 2004-06-22 CN CNB2004100598331A patent/CN1311529C/en not_active Expired - Fee Related
- 2004-06-22 KR KR1020040046576A patent/KR100546425B1/en not_active IP Right Cessation
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5119840A (en) * | 1986-04-07 | 1992-06-09 | Kaijo Kenki Co., Ltd. | Ultrasonic oscillating device and ultrasonic washing apparatus using the same |
| JPH1094756A (en) * | 1996-07-31 | 1998-04-14 | Kaijo Corp | Ultrasonic excitation device and ultrasonic cleaning device provided with the same |
| JPH10229067A (en) * | 1997-02-14 | 1998-08-25 | Kaijo Corp | Substrate processing equipment |
| JPH11207258A (en) * | 1998-01-22 | 1999-08-03 | Tadahiro Omi | Ultrasonic oscillation generating device and ultrasonic cleaning device |
| JP2000296374A (en) * | 1999-04-14 | 2000-10-24 | Kaijo Corp | Ultrasonic excitation device and ultrasonic cleaning device having the same |
| CN1404107A (en) * | 2001-09-04 | 2003-03-19 | 阿尔卑斯电气株式会社 | Spraying nozzle for wet processing, wet processing apparatus and method |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200509238A (en) | 2005-03-01 |
| CN1574239A (en) | 2005-02-02 |
| KR20050001351A (en) | 2005-01-06 |
| TWI289333B (en) | 2007-11-01 |
| KR100546425B1 (en) | 2006-01-26 |
| JP3984196B2 (en) | 2007-10-03 |
| JP2005013809A (en) | 2005-01-20 |
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