CN1393942A - 发光器件及其制造方法 - Google Patents
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Abstract
发光器件具有基片,安装在基片上的LED。第一透明层密封LED,而第二透明层则配备在第一透明层周围。荧光材料的微粒包括在第二透明层之中。反光器层形成在除上侧以外的外壁上。
Description
技术领域
本发明涉及使用发光二极管(LED)的发光器件以及制造该器件的方法。
背景技术
LED通过在含诸如GaP、GaAs等一类III-V族化合物的半导体晶片上形成pn结加以制作。
业已进行实验以获得发射所期望色彩的发光器件。发光器件具有诸如环氧树脂和硅树脂一类密封树脂。为了产生所期望的色彩,在密封树脂中混合荧光材料。
然而,由于荧光材料比密封树脂重,故荧光材料的微粒在树脂固化之前就沉积在树脂中。所沉积的微粒不规则地弥散在LED和基片上。因此,由发光器件发射出的光在色彩和照度分布上是不规则的。
在另一方面,提供了通过使用小片制造多个发光器件的方法。然而,由于许多工艺步骤而使小片法复杂化。
发明内容
本发明的目的在于提供具有均匀色彩和照度分布的发光器件。
本发明的另一目的在于提供能以很少步骤制造发光器件的方法。
按照本发明,提供一种发光器件,它包含基片,安装在基片上的LED,密封LED的第一透明层,围绕第一透明层提供的第二透明层,第一透明层和第二透明层这两者的任何一层中包括的荧光材料,和在除了上侧之外的外壁上形成的反射器层。
第一和第二透明层的任何一层之中包括有着色剂。
第一和第二透明层的任何一层之中包括有荧光材料和着色剂。
第二透明层具有倒置的梯形断面。
制造发光器件的方法包含以下步骤:制备具有多个基片分割部的基片集,将LED安装在基片分割部上,在基片集上形成第一透明层,在围绕基片分割部的分割线上切割第一透明层以形成单个第一透明层,在单个第一透明层上形成第二透明层,在围绕基片分割部的分割线上切割第二透明层以形成单个第二透明层,在单个第二透明层的外壁上形成反射器膜,以及在分割部的分割线上分离基片分割部。
还方法进一步包含在相邻分割部之间提供基片连接,并以倒置的V-形断面切割基片连接和第二透明层。
本发明的这些以及其他目的和特点将从以下详细叙述结合有关附图而变得更为明晰。
附图说明
图1是本发明第一实施例的发光器件的透视图。
图2a至2j表示制造发光器件用的方法。
图3是本发明第二实施例的发光器件的断面图。
图4示出第三实施例的透视图。
图5a至5j示出制造发光器件用的另一种方法。
具体实施方式
参见图1,它表示按本发明第一实施例的发光器件的透视图,发光器件10包含:由诸如环氧树脂一类绝缘材料制作的基片1,一对对应的电极2,其每一个作为端子延伸至基片的下侧,安装在基片上并借助引丝焊接至电极2的LED3。
LED3被设计成发射蓝光。LED3由诸如环氧树脂一类透明树脂所制的第一密封立方透明层4加以密封。第一透明层4又由诸如环氧树脂一类透明树脂所制的第二平行管透明层5加以覆盖。在第二透明层5之中包括诸如钇铝石榴石(YAG)之类的荧光材料微粒以及着色剂微料。第二透明层5除了上侧的外壁上均通过银或铝的金属镀层覆盖以反射器层6。
由LED3发射出的蓝光通过第一透明层4进入第二透明层5。当蓝光捕捉到荧光材料的微粒时,蓝色就变成黄色。当未捕捉到荧光材料微粒的蓝光同黄光混合时,光就变成白色。根据着色剂的颜色白色变成所期望的色彩。假若希望的颜色为粉红,则在第二层5中混合以红的着色剂。这样,粉红色光就从发光器件10发射出来。着色剂也可在第一透明层中加以混合。
此后将描述制造发光器件10的方法。
参见图2a,基片集11包含有多个基片分割部,后者将在最后步骤中被分成单个基片1,在相邻分割部的每个边界处对基片集11钻孔以形成穿孔12。基片集11中每一基片分割部上侧和下侧的铜箔膜通过无电铜沉积形成的导电层14加以电气连接。将一干的膜13粘附在导电层14的上表面上,以封闭穿孔12的开口。另外,借助Ni和Au的电解沉积在导电层14上形成电极。
参见图2b,借助小片焊接将LED15安装在基片集11的每一基片分割部上。所安装的LED15通过Au或Al丝16的引丝焊接连接至各电极,各图2c所示。基片集11的上表面通过图2d所示环氧树脂的第一树脂层17加以密封。如图2e所示,第一树脂层17通过在每一分割部切割一半被分割成单个的第一树脂层18。
参见图2f,第一树脂层18用包括有荧光剂和着色剂的硅树脂的第二树脂层20进行包覆。如图2g所示,第二树脂层20通过在每一分割部切割一半被分割成单个的第二树脂层21。在第二树脂层21上和基片集的下侧印刷上抗镀层22,如图2h所示。参见图2i,在第二树脂层21的外侧通过对每一分割部的电镀而形成反射器膜23。如图2j所示,去除抗镀层22,并通过全切割将每一分割部分离。这样,就完成了图1所示的发光器件。
参见图3,它示出本发明第二实施例的发光器件的断面图,如图1中相同的部件均以与图1相同的标号加以识别,并省略对这些部件的说明。
在第1透明层4的表面形成会聚透镜部分4a。会聚透镜部分4a集聚来自LED3的光,以此增加所发射光的照度。
将参照图4来描述本发明发光器件的第三实施例。
发光器件30包括由环氧树脂制成的基片31,在基片31两侧形成的一对电极32,安装在基片上的LED33,以及第一透明层34。这些构件均和图1所示第一实施例的那些相同。
基片31和第一透明层34均由硅树脂制成的且具有倒置梯形断面的第二透明层35加以覆盖。第二层35中包括荧光材料和着色剂。在第二透明层35的外壁上形成反射器膜36。这样,发光器件30就具有光扩展的作用。
此后将参照图5a至5j来描述发光器件30的制造方法。
参见图5a,基片集41包含多个基片分割部42,后者将在最后步骤中被分割成单个基片31;以及在相邻基片分割部42之间提供的基片连接43。在基片分割部42的两侧对基片集41钻孔,以形成穿孔44。在基片集41分割部两侧上的铜箔膜通过无电铜沉积所形成的导电层45加以电气连接。将一干膜46粘附在导电层45的上表面,以封闭穿孔44的开口。另外,在导电层45上借助Ni和Au的电解沉积形成电极。
参见图5b,将LED47通过小片焊接安装在基片集41的每一基片分割部42上。通过Au或Al丝48的引丝焊接将所安装的LED47连接至导电层45上的电极,如图5c所示。基片集41的上表面通过环氧树脂的第一树脂层50加以密封,如图5d所示。如图5e所示,通过在每一分割部切割一半将第一树脂层50分成单个的第一树脂层51。
参见图5f,第一树脂层50用包括荧光材料和着色剂的硅树脂的第二树脂层52加以包覆。于是倒置该组件如图5g所示。用V-形切割器对基片连接43和第二树脂层52进行切割。基片分割42的另一侧(未示出)相似地进行切割。再次将组件倒置成为如图5h所示。将抗镀层53印刷在第二树脂层52上和基片集的下侧,如图5h所示。参见图5i,通过电镀在第二树脂层52和基片连接43的外侧形成反射器膜54。如图5j所示,去除抗镀层53,并通过全切割使每一分割部分离。这样,就完成了图4所示的发光器件30。
在本发明的发光器件中,第二透明层在第一透明层上形成。所以,荧光材料的微粒均匀地散布在第一透明层的表面而不沉积在LED上。因此,光均匀地从发光器件发射出来。
在本发明的方法中,并未使用小片。所以,能用简单的步骤来制造多个发光器件。
虽然结合较佳的特定实施例对发明进行了描述,但将会明白,这种描述旨在说明而非限止本发明的范畴,后者由下面的诸权利要求加以限定。
Claims (9)
1.一种发光器件,其特征在于,它包含:
基片;
安装基片上的LED;
密封LED的第一透明层;
围绕第一透明层提供的第二透明层;
第一透明层和第二透明层中任何一个包括的荧光材料;和
在除了上侧以外的外壁上形成的反射器层。
2.如权利要求1所述的发光器件,其特征在于,在第一和第二透明层的任何一层之中包括有着色剂。
3.如权利要求1所述的发光器件,其特征在于,在第一和第二透明层的任何一层之中包括有荧光材料和着色剂。
4.如权利要求1所述的发光器件,其特征在于,第二透明层具有倒置的梯形断面。
5.一种制造发光器件的方法,其特征在于,它包含以下步骤:
制备具有多个基片分割部的基片集;
在基片分割部上安装LED;
在基片集上形成第一透明层;
在围绕基片分割部的分割线上切割第一透明层,以形成单个的第一透明层;
在单个的第一透明层上形成第二透明层;
在围绕基片分割部的分割线上切割第二透明层,以形成单个的第二透明层;
在单个的第二透明层的外侧上形成反射器膜;以及
在分割部的分割线上分离基片分割部。
6.如权利要求5所述的方法,其特征在于,进一步包含在相邻基片分割部之间提供基片连接,并以倒置的V-形断面切割基片连接和第二透明层。
7.如权利要求5所述的方法,其特征在于,进一步包含在第一和第二透明层的任何一层中混合荧光材料。
8.如权利要求5所述的方法,其特征在于,还包含在第一和第二透明层的任何一层中混合着色剂。
9.如权利要求5所述的方法,其特征在于,还包含在第一和第二透明层的任何一层中混合荧光材料和着色剂。
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Also Published As
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US20020185966A1 (en) | 2002-12-12 |
JP4789350B2 (ja) | 2011-10-12 |
US6707247B2 (en) | 2004-03-16 |
US7026661B2 (en) | 2006-04-11 |
JP2002368286A (ja) | 2002-12-20 |
CN1201411C (zh) | 2005-05-11 |
US20040069993A1 (en) | 2004-04-15 |
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