CN1414643A - Packaged structure of display element and its packaging method - Google Patents
Packaged structure of display element and its packaging method Download PDFInfo
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- CN1414643A CN1414643A CN01136819A CN01136819A CN1414643A CN 1414643 A CN1414643 A CN 1414643A CN 01136819 A CN01136819 A CN 01136819A CN 01136819 A CN01136819 A CN 01136819A CN 1414643 A CN1414643 A CN 1414643A
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- display element
- glass
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- plate
- light
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Abstract
A package structure for display element includes one glass base plate with its upper surface to be used for setting a lightening element, one glass cover plate with its bottom surface rim being joined with the upper surface rim of glass base plate to construct an enclosed space and one sealing glue layer which is made of glass cement to be formed at the joint point of the glass base plate and the rim of glass cover plate. The packaging method is to place the display element on the supporting seat and to place a pressing plate above the display element, then to provide high power of laser beam to penetrate the glass cover plate and focus at sealing glue layer for the glass cement material sintering and meawhile a proper pressure can be applied to both the supporting seat and the pressing plate.
Description
Technical field
The invention belongs to electronics display element devices field, relate to a kind of encapsulating structure and method for packing thereof of display element.
Background technology
In new plane display element from generation to generation, organic light emitting diode (organic Light emittingdiode, OLED) or PLED (polymer light emitting diode, PLED), its principle of luminosity is that specific luminous organic material is applied electric current so that electric energy converts luminous energy to, has advantages such as face luminous slim, amount light feature and self luminous high-luminous-efficiency, low driving voltage.But along with increase service time, aqueous vapor in the environment and oxygen are easy to infiltrate in the display element, make peel off between metal electrode and the organic luminous layer, material cracking, anodizing, and then producing dim spot (darkspot), this can significantly reduce luminescent quality such as the luminous intensity of display element, the luminous uniformity.
Having the method for commonly using now is, finishes on the glass substrate of OLED/PLED display element after the evaporation processing procedure of metal electrode and organic light emission body thin film, can be with the element of cover plate packaged glass substrate surface.And in order to prolong the useful life of display element; now developed the technology that multiple reduction humidity; for example: on glass substrate directly the coating light-hardening resin, plate metal oxide, chloride, sulfide, covering waterproof protecting film, adopt methods such as closed cover plate encapsulation, but still find shortcomings such as leakage current, interference, oxide dissolution.As shown in Figure 1 to Figure 3, generalized section for the encapsulating structure of known OLED/PLED display element, as shown in Figure 1, one OLED/PLED display element 10 includes a glass substrate 12, one adhesive layer 14 is the frame place that coats glass substrate 12, and one cover plate 16 be by the tackness of adhesive layer 14 engaging with the surperficial frame place of glass substrate 12, and then Feng Chengyi confined space 18.Including a laminate 20 on glass substrate 12 surfaces, is via an anode conductive layer 22 1 luminous organic material layers 24 and 26 formation of a cathodic metal layer.Wherein adhesive layer 14 is ultraviolet ray (UV) sclerosis glue, and cover plate 16 is that employing metal or the glass material slightly littler than glass substrate 12 areas are made, can encapsulate laminate 20, only exposes the electrode of preparation in order to the electronic packaging drive circuit.
The encapsulating material of OLED/PLED display element 10 is to prolong with LCD to encapsulate employed UV sclerosis glue mostly, yet UV sclerosis glue is mainly epoxy resin (epoxy) material, the organic material that high sensitivity characteristic is arranged for oxygen, aqueous vapor and high temperature, the epoxy resin material can't be isolated oxygen, aqueous vapor fully, and can't provide splendid the engage performance of glass substrate, so do not apply the requirement of OLED/PLED display element 10 with cover plate.In order to improve encapsulating structure shown in Figure 1, wherein a kind of method as shown in Figure 2, lie in and fill up an involution glue 28 in the confined space 18, to wrap laminate 20, wherein another kind of method lies in as shown in Figure 3 fills up involution glue 28 to wrap laminate 20, the still making of omitting adhesive layer 14 in the confined space 18.Because the material of involution glue 28 mostly is the epoxy resin of UV sclerosis or thermmohardening greatly, it has gives vent to anger (out gassing) phenomenon so contain a large amount of aqueous vapor molecules, is easy to make produce between luminous organic material layer 24 and the cathodic metal layer 26 and peels off phenomenon.
In addition, can consider to adopt glass material as encapsulating material.Because glass material itself has excellent air-tightness, and has the close coefficient of expansion with glass substrate, therefore such as cathode ray tube (the cathode ray tube of traditional monitor, CRT), (Plasmadisplay panel, seal glue PDP) utilize glass cement as melted glass (frit) or glass for bonding (solder glass) to the electric slurry display panel of new display.Its encapsulation procedure is that workpiece is sent into sintering in the high temperature furnace, even if but the non-crystalline type PbO-B of high lead tolerance
2O
3Mixed stocker glass cement, the processing temperature of its involution also must reach more than 320 ℃, far surpass the Tg point (glass transition temperature, about about 90 ℃) of the luminous organic material of OLED/PLED display element.Therefore, with regard to considering of encapsulation procedure, if will adopt the encapsulating material of glass cement as the OLED/PLED display element, the sintering method that then need give up high temperature furnace, and change mode with localized heating, but the problem that still has the hard power of heat to produce, so the careful mode of heating of selecting for use of need.
Summary of the invention
In view of this, the objective of the invention is and to stop aqueous vapor, oxygen and the suitable effect of sticking together for reaching, a kind of encapsulating structure and method for packing thereof that adopts glass cement as the encapsulating material of OLED/PLED display element proposed, to solve the problem that prior art was produced.
The object of the present invention is achieved like this:
The encapsulating structure of display element of the present invention includes: its upper surface of a glass substrate is provided with a light-emitting component; One glass cover-plate, the frame place system of its lower surface engages with the upper surface frame place of glass substrate, to constitute a confined space; And an adhesive layer, be the frame joint that is formed at glass substrate and glass cover-plate, wherein sealing series of strata are made of the glass cement material; It is characterized in that:
The lower surface of this glass cover-plate includes a barrier wall structure, and this barrier wall structure is surrounded on the periphery of this light-emitting component, and this adhesive layer is surrounded on the periphery of this barrier rib;
The lower surface of this glass cover-plate is shaped on a groove, and the position of this groove is corresponding with the position of this light-emitting component;
Be mixed with particle filled composite (spacer) in the glass cement material of this adhesive layer.And
This barrier wall structure system is made of the glass cement material;
This barrier wall structure system is made of ceramic material;
This display element be an organic light emitting diode (organic light emitting diode, OLED);
This display element also can be a PLED (polymer light emittingdiode, PLED);
This light-emitting component is the laminate that is made of at least one anode conductive layer, a luminous organic material layer and a cathodic metal layer.
The method for packing of a kind of display element of the present invention includes the following step:
One display element with above-mentioned encapsulating structure is provided;
One bearing is provided, and this display element is positioned on this bearing;
One increased pressure board is provided, and it is positioned over the top of this display element;
One high-power laser beams is provided, and its penetrable glass cover-plate and focus on this adhesive layer is with this glass cement material of sintering; And
Apply a suitable pressure on this bearing and this increased pressure board.
This bearing material is the good metal material of heat conductivity.
This increased pressure board material is the good metal material of heat conductivity.
Because in the present invention, adopted lower surface to include a barrier wall structure at glass cover-plate, this barrier wall structure is surrounded on the periphery of this light-emitting component, and this adhesive layer is surrounded on the periphery of this barrier rib, can keep the homogeneity in the gap between glass cover-plate and the glass substrate; The second, the radiant heat that produces in the time of can completely cutting off because of sintered glass glue, and then avoid light-emitting component to be burnt; The 3rd, can prevent that glass cement from overflowing into confined space and touching light-emitting component, to guarantee the luminescent quality of display element; The 4th, the air tightness of Strengthenable glass cement is with the isolation capacity of nearly step lifting oxygen, aqueous vapor.Homogeneity in order to the gap of keeping glass cover-plate and glass substrate;
Glass cover-plate of the present invention is made becomes groove shapes, with increase by second kind of Improvement type cover plate and light-emitting component between airtight space, in order to the radiant heat that prevents from the to conduct to second kind of Improvement type cover plate light-emitting component of burning.
Because be mixed with particle filled composite in the glass cement, its function can make keeps the homogeneous gap between glass cover-plate and the glass substrate, and the function of glass cement can be reached the purpose of starvation, aqueous vapor, significantly to imitate operating environment condition and the useful life that promotes display element.
The present invention adopts high-power laser beam as sintered source, and the advantage of the powerful thermal source of very small region is provided, and can prevent that the material temperature around the focal zone is too high, and can exempt the problem that the hard power of heat produces.And the high temperature that sintered glass glue produced can the vertical diversion via the bearing of the increased pressure board of top and below.
Description of drawings
The generalized section of the known OLED/PLED display element of Fig. 1-3 encapsulating structure;
The generalized section of the OLED/PLED display element encapsulating structure of Fig. 4 embodiment of the invention 1;
The generalized section of the OLED/PLED display element method for packing of Fig. 5 embodiment of the invention 1;
The generalized section of the OLED/PLED display element encapsulating structure of Fig. 6 embodiment of the invention 2;
The top view of first kind of Improvement type cover plate of Fig. 7 embodiment of the invention 2;
The generalized section of the OLED/PLED display element encapsulating structure of Fig. 8 embodiment of the invention 3.The piece number explanation:
Known techniques
10 display elements, 12 glass substrates
14 adhesive layers, 16 cover plates
18 confined spaces, 20 laminates
22 anode conductive layers, 24 luminous organic material layers
26 cathodic metal layers, 28 involution glue
The technology of the present invention
30,60,70 display elements
32 glass substrates, 34 light-emitting components
36 anode conductive layers, 38 luminous organic material layers
40 cathodic metal layers, 42 adhesive layer
44 glass cover-plates, 46 increased pressure boards
48 bearings, 50 laser beams
62 first kinds of Improvement type cover plates of 52 suitable pressure
6 little barrier wall structure 66 glass cements
72 second kinds of Improvement type cover plates
Embodiment
Embodiment 1:
As Fig. 4, the generalized section of the encapsulating structure of the OLED/PLED display element 30 of its demonstration first embodiment of the invention.As shown in Figure 4, an OLED/PLED display element 30 includes a glass substrate 32, includes a light-emitting component 34 on its surface, is the laminate that is constituted via an anode conductive layer 36, a luminous organic material layer 38 and a cathodic metal layer 40.One adhesive layer 42 is the outermost frame place that is coated on glass substrate 32 with wire mark or some glue mode, be mainly used to provide the tackness of encapsulation, then the frame place of a glass cover-plate 44 can engage with the surperficial frame place of glass substrate 32, forms a confined space with encapsulation.
In the present invention, the main material of adhesive layer 42 is a glass cement, and in glass cement, be mixed with particle filled composite (spacer), wherein the function of particle filled composite can make between glass cover-plate 44 and the glass substrate 32 and keep the homogeneous gap, and the function of glass cement can be reached the purpose of starvation, aqueous vapor, significantly to imitate operating environment condition and the useful life that promotes OLED/PLED display element 30.
See Fig. 5, the generalized section of the method for packing of the OLED/PLED display element 30 of its demonstration first embodiment of the invention.The present invention is applied to the sintering method of adhesive layer 42, system adopts high-power laser beam as sintered source, utilize laser beam that the advantage of the powerful thermal source of very small region can be provided, can prevent that the material temperature around the focal zone is too high, and can exempt the problem that the hard power of heat produces.
In method for packing of the present invention, be that above-mentioned OLED/PLED display element 30 is positioned between an increased pressure board 46 and the bearing 48, and a high-power laser beam 50 and a suitable pressure 52 are provided.Wherein, increased pressure board 46 can be selected the good metal material of heat conductivity for use with the material of bearing 48, as: copper (Cu).It should be noted that, when using, OLED/PLED display element 30 plugs with molten metal tin-oxide (indium tinoxide, during IT0) as transparency conductive electrode, then need consider the laser beam selecting penetrable clear glass for use and do not absorbed by ITO, so employed laser beam wavelength is more than the 550nm, for example in preferred embodiment: high power diode laser (wavelength is 800nm), Nd-YAG laser (wavelength is 1064nm).
Laser beam 50 penetrable glass cover-plates 44 and focusing on the glass cement material of adhesive layer 42 thus are to reach the purpose of sintered glass glue.The suitable pressure 52 that applies on increased pressure board 46 and bearing 48 has the following advantages simultaneously: first, gap between glass cover-plate 44 and the glass substrate 42 can be depressed into the size of particle filled composite, to guarantee keeping the homogeneous gap between glass cover-plate 44 and the glass substrate 32; Second, by applying the high temperature that produces when this suitable pressure 52 can absorb sintered glass glue, avoiding near the glass cement glass cover-plate 44 to produce the excessive temperature difference and to be out of shape, to break, also can avoid near the light-emitting component 34 the glass cement to be subjected to high temperature injury with glass substrate 42.In addition, because the capacity of heat transmission of glass material is far below metal material, the glass cover-plate 44 of fOEED/ELED display element 30 only has about 0.7mm with the thickness of glass substrate 32,34 the distance much smaller than glass cement to light-emitting component, so the high temperature that sintered glass glue produced can the vertical diversion via the bearing 48 of the increased pressure board 46 of top, below.
Embodiment 2:
See Fig. 6 and Fig. 7, Fig. 6 shows the generalized section of encapsulating structure of the OLED/PLED display element 60 of the embodiment of the invention 2, and Fig. 7 shows the top view of first kind of Improvement type cover plate 62 of second embodiment of the invention.
The embodiment of the invention 2 is that one first kind of Improvement type cover plate 62 is provided, the frame place of its glass cover-plate 44 is manufactured with a barrier wall structure 64, and the outermost frame place of glass cover-plate 44 is coated with a glass cement 66, then the frame place of first kind of Improvement type cover plate 62 can engage with the surperficial frame place of glass substrate 32, forms a confined space with encapsulation.Wherein, the material of barrier wall structure 64 can be glass cement or ceramic material, system is made on the glass cover-plate 44 in advance with any sintering processing, has following function: first, can replace employed particle filled composite in the adhesive layer 42 of first embodiment, in order to keep the homogeneity in glass cover-plate 44 and the gap of glass substrate 32; The second, the radiant heat that produces in the time of can completely cutting off because of sintered glass glue 66, and then avoid light-emitting component 34 to be burnt; The 3rd, can prevent that glass cement 66 from overflowing into confined space and touching light-emitting component 34, to guarantee the luminescent quality of OLED/PLED display element 60; The 4th, the air tightness of Strengthenable glass cement 66 is with the isolation capacity of nearly step lifting oxygen, aqueous vapor.
The method for packing system of the OLED/PLED display element 60 of the embodiment of the invention 2 is described identical with embodiment 1.Different is owing to do not sneak into particle filled composite in glass cement 66, so laser beam can successfully focus on the glass cement 66, and dense glass glue 66 can prevent that laser beam from penetrating into glass substrate 32.
Embodiment 3:
See Fig. 8, the generalized section of the encapsulating structure of the OLED/PLED display element 70 of its demonstration third embodiment of the invention.The encapsulating structure of continuity embodiment 1, embodiments of the invention 3 are that one second kind of Improvement type cover plate 62 is provided, can utilize sandblast or etching mode that glass cover-plate making is originally become groove shapes, with increase by second kind of Improvement type cover plate 72 and light-emitting component 34 between airtight space, in order to prevent to conduct to the radiant heat burn light-emitting component 34 of second kind of Improvement type cover plate 72.In addition, in third embodiment of the invention, the material of adhesive layer 42 can be glass cement, or is mixed with the glass cement of particle filled composite.As for the method for packing system of the OLED/PLED display element 70 of the embodiment of the invention 3 with to execute example 1 described identical.
Claims (19)
1. the encapsulating structure of a display element includes:
One glass substrate, its upper surface is provided with a light-emitting component;
One glass cover-plate, the frame place system of its lower surface engages with the upper surface frame place of this glass substrate, to constitute a confined space;
One adhesive layer is the frame joint that is formed at this glass substrate and this glass cover-plate, and this adhesive layer is made of the glass cement material;
It is characterized in that:
The lower surface of this glass cover-plate includes a barrier wall structure, and this barrier wall structure is surrounded on the periphery of this light-emitting component, and this adhesive layer is surrounded on the periphery of this barrier rib;
The lower surface of this glass cover-plate is shaped on a groove, and the position of this groove is corresponding with the position of this light-emitting component.
2. the encapsulating structure of display element according to claim 1 is characterized in that, is mixed with particle filled composite (spacer) in the glass cement material of this adhesive layer.
3. the encapsulating structure of display element according to claim 1 is characterized in that, this barrier wall structure system is made of the glass cement material.
4. the encapsulating structure of display element as claimed in claim 1 is characterized in that, this barrier wall structure system is made of ceramic material.
5. the encapsulating structure of display element according to claim 1 is characterized in that, this display element be an organic light emitting diode (organic light emitting diode, OLED).
6. the encapsulating structure of display element according to claim 1 is characterized in that, this display element be a PLED (polymer light emitting diode, PLED).
7. the encapsulating structure of display element according to claim 1 is characterized in that this light-emitting component is the laminate that is made of at least one anode conductive layer, a luminous organic material layer and a cathodic metal layer
8. the method for packing of the described display element of claim 1 is characterized in that comprising the following steps: at least
One display element is provided, this display element includes a light-emitting component, this light-emitting component system is made in the upper surface of a glass substrate, one glass cover-plate system engages with the upper surface frame place of this glass substrate, and one the sealing series of strata be formed at the frame joint of this glass substrate and this glass cover-plate, wherein these sealing series of strata are made of a glass cement material;
One bearing is provided, and this display element is positioned on this bearing;
One increased pressure board is provided, and it is positioned over the top of this display element;
One high-power laser beams is provided, and its penetrable glass cover-plate and focus on this adhesive layer is with this glass cement material of sintering; And
Apply a suitable pressure on this bearing and this increased pressure board.
9. as the method for packing of display element as described in the claim 8, it is characterized in that this bearing material is the good metal material of heat conductivity.
10. as the method for packing of display element as described in the claim 8, it is characterized in that this increased pressure board material is the good metal material of heat conductivity.
11. the method for packing as display element as described in the claim 8 is characterized in that the wavelength of this high-power laser beams is greater than 550nm.
12. the method for packing as display element as described in the claim 8 is characterized in that, is mixed with particle filled composite in the glass cement material of this adhesive layer.
13. the method for packing as display element as described in the claim 8 is characterized in that the lower surface of this glass cover-plate includes a barrier wall structure, this barrier rib system is surrounded on the periphery of this light-emitting component, and these sealing series of strata are surrounded on the periphery of this barrier rib.
14. the method for packing as display element as described in the claim 13 is characterized in that, this barrier rib system is made of the glass cement material.
15. the method for packing as display element as described in the claim 13 is characterized in that, this barrier rib system is made of ceramic material.
16. the method for packing as display element as described in the claim 8 is characterized in that the lower surface of this glass cover-plate includes a groove, the position of this groove is corresponding with the position of this light-emitting component.
17. the method for packing as display element as described in the claim 8 is characterized in that, this display element be an organic light emitting diode (organic light emitting diode, OLED).
18. the method for packing as display element as described in the claim 8 is characterized in that, this display element be a PLED (Polymer light emitting diode, PLED).
19. the method for packing as display element as described in the claim 8 is characterized in that this light-emitting component is the laminate that is made of at least one anode conductive layer, a luminous organic material layer and a cathodic metal layer.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011368195A CN1200465C (en) | 2001-10-24 | 2001-10-24 | Packaged structure of display element and its packaging method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011368195A CN1200465C (en) | 2001-10-24 | 2001-10-24 | Packaged structure of display element and its packaging method |
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| CN1414643A true CN1414643A (en) | 2003-04-30 |
| CN1200465C CN1200465C (en) | 2005-05-04 |
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| CNB011368195A Expired - Fee Related CN1200465C (en) | 2001-10-24 | 2001-10-24 | Packaged structure of display element and its packaging method |
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