CN1655405B - 大密度电连接器 - Google Patents
大密度电连接器 Download PDFInfo
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Abstract
本发明提供了一种大密度电连接器,适于装配到具有导电元件的基板表面上,它包括:由绝缘材料形成的底板,所述底板具有内侧面和外侧面,该外侧面限定出多个外凹部;多个接头,每个接头包括:长的内段、置入底板的长中段、和伸入所述多个外凹部之一的末端;以及多个焊球,设在所述末端上,所述多个焊球与每个限定出外表面,其特征在于所述多个焊球的所述外表面部分地包容在所述多个同外凹部中,所述多个焊球的所述外表面形成平的安装界面。
Description
本申请是申请号为97120414.4,申请日为1997年10月9日,发明名称为“大密度电连接器及其制造方法”专利申请的分案申请。
技术领域
本发明涉及电连接器,尤其涉及类似阵列连接器等容有大密度输入与输出线路的连接器。
背景技术
由于减小电子设备尤其是个人便携式电子设备的尺寸并增大其使用功能的驱动,致使实现所有部件尤其是电连接器微型化的努力至今不衰。电连接器微型化方面的工作包括缩小单、双列直线型连接器的接点之间的间距,以便使那些适于安置在规定用于安装电连接器的电路基板极为有限面积上的连接器,能够连接较大数量的输入和输出线路或其他线路。由于这种微型化的驱动,致使在电路板上装配部件的工艺方法也随之可趋转向表面装贴工艺法(SMT)。表面装贴工艺法的大量应用与直线型连接器接点之间间距的高精度要求相结合,已使表面装贴工艺法的大范围、低成本的应用接近了极限。缩小接点之间的间距势必增大焊锡膏软熔时相邻焊层或接点出现短路的危险。为了满足增大输入和输出线路密度的需求,有人建议使用阵列连接器。这种连接器是在一块绝缘的基板上装配接线点的二维阵列,从而可以增大连线的密度。然而,这种连接器却给通过表面装贴工艺法将连接器固定于电路基板上带来一定难度,因为大多数(如果不是全部)接点的表面装贴尾端必须位于连接器本体之下方,如是,所采用的装配方法必须十分可靠,否则,一旦出现故障,很难进行目视检查或维修。当前,在一块塑料或陶瓷基板上装配集成电路,已普遍采用球栅阵列(BGA)或其他类似的装配方式。在这种方式中,附在集成电路上的各圆焊球要落达到电路基板的各电接头上,而且,各电接头上通常还要用密封膜或掩膜涂一层焊锡膏,然后对整个设备加热至一定温度,使焊锡膏和焊球的局部或全部熔化,并熔合在电路基板上形成的一个下伏的导电层上,这样,就可以不需外加导线而将集成电路连接到基板上。
采用球栅阵列或其他类似的装配方式将集成电路连接到基板上虽然有许多优点,但是,至今还没有研究出可将电连接器或类似的部件装配到印制线路板(PWB)或其他基板上的相应方法。在绝大多数情况下,重要的是各焊球的基板接触面要保持良好的共面性,从而构成平滑的装配接面,焊球和焊锡膏才能最后均匀地软熔在印刷电路板基板平面上。相对给定的基板来说,焊剂共面性的任何明显差异,都会导致在将连接器软熔到印刷电路板上时焊接效果的下降。为了实现高度可靠的焊接,客户往往提出异常苛刻的共面性要求,通常是0.004英寸左右。影响焊球共面性的因素是焊球的尺寸大小和它在连接器上的定位,而焊球的尺寸大小取决于焊球和焊锡膏二者最初所含有的总焊剂体积,在将焊球置于连接器接头上时,这一点尤其重要,因为焊接体内接受的连接器接头体积的变化,会影响焊接体体积发生变化,进而使各焊球相对连接器装配接面的共面性也发生变化。
将连接器焊接到基板上的另一个问题是连接器上往往配合各种不同形状的绝缘外壳,诸如有多个空腔的绝缘外壳,这些热塑料绝缘外壳中的残余应力可以是模压工艺造成的后果,也可以是由于插入接头而形成的或者是二者共同作用的结果。这些绝缘外壳自一开始或在表面装贴工艺过程中需要加热到一定温度时(诸如达到可使焊球软熔的温度时)会发生变形或扭曲。绝缘外壳的变形或扭曲会导致连接器组件和印刷线路板之间在形状尺寸大小上的不匹配,从而由于诸如焊球等表面装贴元件在焊接前不能与焊锡膏充分接触或不能接近印制线路板等,造成焊接效果的不可靠。
因此,采用表面装贴工艺将大密度连接器可靠而又高效地装配到基板上,仍然是当前的迫切需要。
发明内容
本发明的目的是提供一种电连接器,既提供了大密度的输入与输出能力,又可以通过表面装贴工艺法将它连接到电路基板上,而且还显示出了相对装配接面的良好共面性。
在本发明所述的电连接器上,一个或多个接点可通过一种易熔的导电材料连接到一个基板上。这种易熔的导电材料就是焊接体,最好是用焊球组成焊接体,它可以软熔,从而形成接点和电路基板之间的主要电流通道。
根据本发明,提供了一种大密度电连接器,适于装配到具有导电元件的基板表面上,它包括:由绝缘聚合材料模压成形的底板,所述底板具有内底面和外底面,该外底面限定出多个外凹部;多个信号线接头,每个信号线接头包括:内段、置入所述底板的中段、和伸入所述多个外凹部之一的末端;以及多个焊球,熔合在每个所述末端上,其特征在于所述多个焊球均熔合到多个外凹部中的末端上,所述多个焊球相对所述底板的外底面的平面的高度是一致的。
附图说明
下面将参照以下附图进一步介绍本发明所述电连接器及其制备方法。
图1是本发明所述连接器最佳实施例中一种插座式连接器的顶视图。
图2是图1所示插座式连接器的局部剖面图。
图3是本发明最佳实施例中一种插头连接器的顶视图。
图4是图3所示插销式连接器的局部剖面图。
图5是图1~4所示插座式和插销式连接器的剖面端视图(二者未连)。
图6是图5所示插座式和插销式连接器的端视图(二者已连接)。
图7a、7b、7c分别是图5所示插座式与插销式连接器相互连接的第一、二、三步骤的剖面端视图。
图8是图1所示插座式连接器在置入焊球之前的底视图。
图9是图8所示插座式连接器在置入焊球之后的底视图。
图10是图1所示XII部分的剖面详图。
图11是图4所示剖面部分的放大图。
图12是图10所示剖面部分的放大图。
图13是图10所示13-13部分的放大剖面图。
图14是本发明所述一种插座式连接器第二个最佳实施例的顶视图。
图15是图14所述插座式连接器的端视图。
图16是本发明所述一种插销式连接器第二个最佳实施例的顶视图。
图17是图16所示插销式连接器的端视图。
图18是图14~17所示插座与插销相连的端视图。
图19是本发明所述插座式连接器第三个最佳实施例中所用插座的顶视图。
图20是图14所示插座式连接器的端视图。
图21是本发明所述插销式连接器第三个最佳实施例中所用插销的顶视图。
图22是图21所示插销式连接器的端视图。
图23是图19~22所示插座式和插销式连接器相互连接的端视图。
图24是本发明所述连接器的另一个实施例局部侧剖面图。
图24a是图24所示结构部分的凹部加深后的局部图。
图25是图24所示连接器的局部前剖面图(插座与插销已连接)。
图26a和图26b是本发明所述方法第1、2示例中在焊剂软熔期间温度相对时间、距离关系的曲线图。
图27a~27f是本发明所述方法第3示例效果的激光图像。
图28a和图28b是本发明所述方法第4示例效果的X光图像。
图28c和图28d是本发明所述方法第4示例效果的电子显微镜图像。
图29与图10相同,只是略去了地线和电源线接头。
图30是图13所示XXXI局部的剖面图。
图31是本发明最佳实施例中所示绝缘外壳应力预测的计算机显示图。
图32是图29所示绝缘外壳内的凸肋变形(压缩)量与接头保持力的函数关系。
图33是本发明所述连接器最佳实施例使用的插座式信号线接头的正视图。
图34是本发明所述连接器最佳实施例使用的插销式信号线接头的正视图。
图35是本发明所述连接器最佳实施例使用的带有支撑板的插座式地线与电源线接头的正视图。
图36是本发明所述连接器最佳实施例使用的带有支撑板的插销式地线或电源线接头的正视图。
具体实施方式
从图1~2和图12~13可以得知,本发明所述大密度连接器第一个实施例中的一套相互连接的电连接器包括一个以标号10指示的插座式连接器,标号12指示的则是该插座式连接器的底座。底座(12)最好用诸如液晶聚合物(LCP)等适当绝缘聚合材料模压成形,以承受住表面装贴工艺时的软熔温度。首先介绍底座部分。这部分包括一块底板(14),它有外底面(16)和内底面(18),外底面(16)上有诸如图12所示的多个外凹部(20、22、24、26、28),内底面(18)上有接受插头的内凹部(30、32、34、36、38),内、外凹部之间由中间狭槽(40、42、44、46、48)相连。每个外凹部有图12所示的底边(50)和周边(52),每个接受信号线接头的内凹部有图12所示的底边(54)和周边(56、58),每个接受地线或电源线接头的内凹部也有如图12所示的底边(60)和合围的周边(62、64)。上述内、外凹部和中间狭槽用于接受地线或电源线和信号线接头。
地线或电源线接头最好有标号66所示的上段,由两条相交的叉棒(68、70)组成,每条叉棒有收敛段(72)、相交点(74)和外扩展段或引入段(76)。中段(78)穿过插座式连接器的下板,而下段(80)则伸入外凹部。焊球(82)经加热熔合在下段(80)上,详见下文。
每个信号线接头(见图12~13)包括标号84指示的上段,最好有一个接头突出部(86)、一个引入弯头(88)和一个加强肋(90)。信号线接头的中段(92)穿过插座式连接器的下板,下段(图13中的98)则伸入外凹部(图12~13中的22),焊球(100)经加热熔合在下段(98)上(详见下文)。
从图1~2中尤其可以看到,插座式连接器的底座上有卡锁机构(102),该卡锁机构(102)包括一个向上的凸起(104),此凸起叠落在一条竖槽(106)上并有一个外向突块(108)。插座式连接器的底座上还有几个同样的卡锁机构(110、112、114)。插座式连接器的上部(116)叠落在底座上,由顶板(118)和周边(120)组成,上部(116)由卡锁机构(122)固定在底座上。每个这样的卡锁机构都有一个侧壁开口(124)和一个U形卡锁(126),后者(126)自顶板向下延伸并与前者(124)保持一定间隔。向上的凸起(104)夹在U形卡锁(126)和侧壁开口(124)之间,可使U形卡锁(126)卡住底座上的卡锁机构(102)的外向突块(108)。插座式连接器的上部还有几个同样的卡锁机构(128、130、132)分别与底座上的卡锁机构(110、112、114)相啮合。插座式连接器的上部(116)和底座(102)还可以附以安装架(134、136),其上分别设有固定器插孔(138、140)。插座式连接器上部(116)的顶板(118)上还有一些信号线接头的通孔(142、144),这些通孔相对底座上的信号线接头呈多行排列,在这些多行排列的信号线接头通孔之间夹有若干细长形的地线或电源线接头凹部槽(146,148)。插座式连接器的上部(116)构成了整个插座式连接器(10)和下述配套的插销式连接器之间的衔接面。
从图3~4和图11可以看到,插销式连接器如标号150所示。插销式连接器包括底板(152)和周边(154),周边四周留有一定的间隔(156、158),与底板(152)相对的顶部(160)是敞开的。从插销式连接器横向伸出的是安装架(162、164),安装架(162、164)上分别设有固定器插孔(166、168),这两个固定器插孔(166、168)分别与插座式连接器安装架上的两个固定器插孔(138、140)对齐。
参照图11可以看到,在底板(152)内侧上有一些诸如凹部(170)那样的接受信号线接头的内凹部,在底板(152)内侧上还有一些诸如凹部(172)那样的接受地线或电源线接头的内凹部。在底板(152)外侧上则有与这些内凹部相对齐的接受信号线接头的外凹部(174)和接受地线或电源线接头的外凹部(176)。将接受信号线接头的内、外凹部和将接受地线或电源线接头的内外凹部相连通的分别是中间狭槽(178、180)。通过中间狭槽(180)而安装到接受地线或电源线接头切口的是地线或电源线接头(182)。每个地线或电源线接头(182)有一个细长的内段(184),一个置入底板(152)的细长中段(186)和一个伸入凹部(176)的外段(188),焊球(190)则熔合在外段(188)上。外段(188)和焊球(190)的各一部分都包容在外凹部(176)之中。插销式连接器上也包括有多个信号线接头(192),每个信号线接头(192)都有一个内段(194),一个置入底板的中段(196)和一个伸入凹部(174)的末端(198),焊球(200)熔合在末端(198)上。这里同样看到末端(198)和焊球(200)的各一部分都包容在外凹部(170)之中。
从图5~7c中可以看到,以上所述插销式连接器装配在一块诸如硬式印制线路板(202)的电路基板上,而插座式连接器则装配在一块相同的印制线路板(204)上,因此,正如图6所示,插销式和插座式连接器二者构成了一个中介连接板堆。插销式连接器上有二维排列的诸如标号192所指示的信号线接头,在这些接头上熔合有焊球(200),还有多个诸如标号182所指示的地线或电源线接头,在这些接头上也熔合有焊球(190)。使用表面装贴工艺法,这些焊球还可熔合在印制线路板(202)上,从而将整个插销式连接器固定于印制线路板上,使插销式连接器和印刷线路板上的信号线接头和地线或电源线接头之间通电。最好是将二者上面的所有接头与焊球熔合,再将这些焊球熔合到印制线路板上(图5所示并非全部接头)。同样,可以先将焊球(100)熔合到插座式连接器的信号线接头(84)上,然后再将这些焊球(100)熔合到印制线路板(204)上。插座式连接器上的地线或电源线接头(66)也可先被置入中间狭槽(134)的并与焊球(82)熔合,然后再将这些焊球(82)熔合到印制线路板(204)上。
插销式连接器要和插座式连接器对齐,插销式连接器的周边(154)才能重叠在插座式连接器上部(118)的周边(120)上。
图7a~7c详尽地显示了插销式连接器和插座式连接器的啮合情况。图7a显示的是:在二者对齐的前提下,插销式连接器的地线或电源线接头开始进入插座式连接器的接受地线或电源线接头的中间狭槽,并与插座式连接器中的相应地线或电源线接头衔接,与此同时,信号线接头已进入插座式连接器的信号线接头中间狭槽。图7b显示的是:插销式连接器上的信号线接头开始衔接插座式连接器上相应的信号线接头,插销式连接器上的地线或电源线接头则进一步插入插座式连接器的地线或电源线接头的两条叉棒之间。图7c显示的是:插销式连接器上的信号线接头与插座式连接器上的信号线接头已完全啮合衔接,而插销式连接器上的地线或电源线接头已完全到位,即到达插座式连接器上的地线或电源线接头的两条叉棒底部。
图8显示的是在使用焊球之前插座式连接器底座(12)的外底板(16),在使用焊球之前,信号线接头的末端(82)和地线或电源线接头的末端(48)在接头插入至底座(12)的内底板(18)时位于相应的外凹部(20、22、24、26、28)中。先用一定数量的含有适当成分的焊锡膏充满各外凹部,然后再将焊球置于外凹部或底座装配面上。外凹部的直径最好小于焊球的直径,这样,凹部边缘可以托住焊球,使焊球更加接近接头的末端。为保持位于凹部上的焊球的最大稳定性,凹部的剖面最好呈圆形或规则的多边形。如图9所示,焊锡膏也有助于固定各暴露于凹部上的焊球。图中焊球(82)在凹部(20)上,而焊球(100)则在切(22)上,其他的焊球(230、232、234)则在凹部(24、26、28)上,但在插座式连接器的所有外凹部上只放一个焊球。如图8和图11所示,在放置焊球之前开口以后,插销式连接器的外底板与插座式连接器的外底板是全然相同的。将多个焊球置入多个外凹部以后,插销式连接器就会在软熔过程的作用下将焊球熔合到接头末端上。插销式连接器的外底板连同焊球,尤其是焊球的外表面,便形成一个十分平滑的装配接面,连接器将通过这个装配接面被装配到诸如印制线路板等电路基板上。
图10和图13显示的是图1所示实施例的变型,图中的插座式连接器的接头(66)不是叉棒式接头,而是以相对的一对扇叶(66a、66b)夹住地线或电源线末端(182)。
图14~18显示的是本发明的一组配套连接器的第二种最佳实施例。从图14~15可以看出,这组连接器包括标号236指示的插座式连接器,该连接器有一个绝缘外壳(238),此外壳有内底(240),侧壁(242)和外底(244),此外壳还有两个相对的调准突块(246、248)。外壳的内底上有接头(250、251、252),每个接头部分为叉棒分离段、向接触点的收敛段和扩展段。接头(251)装配在底座(231)上,装配方法与图1~13所示实施例相同。诸如标号254指示的焊球装在接头(251)的侧壁上,装配方法与上述实施例相同。从图16~17可知,本组连接器还包括一个插销式连接器(258),该连接器包括一个绝缘外壳(260),此外壳由内底(262)、周边(264)和外底(266)组成,在外壳的一端有一对呈垂直的端壁(268、270),此对端壁(268、270)上还有一个中界端开口(272)。在外壳的另一端也有一对呈垂直的端壁(274、276),此对端壁(274、276)上也有一个中界端开口(278)。从绝缘外壳的内底伸出多个接头(280),这些接头自凹部(282)中伸出。每个凹部都熔合一个焊球(284)。从图中还可以看出,这些接头的位置交错排列,例如,接头(286)相对接头(280)偏移一定角度,如此,接头行列间隔更紧凑,接头密度也相应增大。从图18可知,插销式连接器上的每个接头(280)与插座式连接器的一对收敛的接头叉棒(250、252)要垂直对正,并在后二者中间穿过。从图中还可以看到,调准突块(246、248)与插销式连接器上的中界端开口(272、278)相啮合。在本实施例中,没有图1~13所述实施例中专用的地线或电源线接头,必要时,其功能可使用成对的接头实施。
图19~23显示的是一组配套衔接的连接器的第三种最佳实施例。标号290指示的是插销式连接器,它包括一个外壳(292),此外壳(292)上有一块底板(294),一圈周边(296)和相对的两个调准突块(298、300)。外壳的底板(294)又分为内底(302)和外底(304),信号线接头(306)从内底(302)伸出。从图中可知,信号线接头按行交错排列,目的是增大接头的密度。插销式连接器上设有地线或电源线接头(310、312、314、316),这些地线或电源线接头排列在插销式连接器的四边并分别与邻近的周边平行走向。在底板的外底上置有信号线接头的焊球(318)和地线或电源线接头的焊球(320),这些焊球以上述第一种实施例中的同样方式熔合在各自的接头上。标号302指示的是插座式连接器,它有一个绝缘外壳(324),此外壳(324)上有一块底板(326),一圈周边(326)和接受调准突块的开口(330、332)。底板(326)又分为外底(324)和内底(332),信号线接头(338、340)从内底伸出。相邻横排的接头也呈偏心布局,也是为了增大接头的密度。地线或电源线接头(342、344、346、348)则与四个周边平行排列。在底座外底上的每一个信号线接头上都有一个焊球(352),而在地线或电源线接头上则也附有一个焊球(354)。从图23上可以看到插销式连接器(290)与插座式连接器(322)啮合的情况。
如上所述,采用表面装贴工艺法将电连接器等部件装配到电路基板上时,这些部件必须要满足十分严格的共面性要求,如果达不到一般为0.003~0.004英寸的共面性要求允许值,则整个连接器就往往因焊接不当而失效。接头表面装贴部分相对电路基板的距离不同,是由于插入的接头在绝缘外壳中的位置不同和绝缘外壳的变形造成的,这两个因素导致连接器本体装配面的隆起和扭曲。本发明所述工艺方法,采用了定位准确和大小适当的熔接体将连接器与基板相连接的措施,和接头固定排列以防止因应力积聚而导致连接器外壳变形的措施,因而达到了严格的共面性要求。
图1~23所述的实施例中,金属接头固定于绝缘外壳的方法可以避免外壳承受应力,这种方法就是将接头的固定部分插入呈一定形状的狭槽或开口之中。对小型信号线接头尤其适用的方法是使狭槽的形状与尺寸尽量与接头一个接面以外的所有接面一致,而面对此不一致接面的狭槽壁有一个整体磨压成形的指向狭槽的横向突起,突起远端和狭槽壁之间的距离要小于接头的厚度。因此,当接头插入时,突起的远端将与接头相接触并发生变形,这样,变形的突起作用于接头的法向力便固定住了接头。由于突起远端可以随意变形,所以可以避免在绝缘外壳上产生应力。在以上所述最佳实施例中,横向突起由在狭槽一个侧壁上整体成形的一个角锥形的凸肋组成。
这里介绍的这种凸肋的具体结构相信会与它所配用的绝缘外壳完好匹配,而形状和尺寸稍作变化的同样结构的凸肋或许可以完好匹配地应用于其他类型的绝缘外壳。图29~30具体显示了一个信号线接头(494)固定在狭槽(496)之中并紧紧抵在凸肋(498)上的情况,凸肋有一个与接头(494)相衔接的平面(500)和两个与此平面(500)相对的斜面(502、504)。插头(494)通过与狭槽(496)的后缘、侧缘和凸肋(498)相衔接而被牢牢固定,凸肋靠近平面(500)的部分在将接头用力插入狭槽(496)时可以任意变形,因而可以避免因为接头的插入而产生的应力。
同样,一个地线或电源线接头也可固定在狭槽(508)中并紧紧抵住可变形的凸肋(510),此凸肋(510)有一个可与接头紧紧相抵的远端(512)和两个与此远端(512)相对的斜面(514、516)。在这种结构中还有一个相对的凸肋(518),此相对的绝缘凸肋(518)也有一个远端(520)和两个斜面(522、524),它可用来固定较大的接头并使接头在狭槽中处于居中位置。熟练的技术人员都会理解:凸肋的不同形状、尺寸、数量和位置适于不同类型的绝缘外壳,只要对这些因素进行筛选,就可以使绝缘外壳的应力最大限度地消失在可变形的凸肋之中。图31是使用宾夕法尼亚洲休斯敦市Ausys公司现有的Ansys应力分析软件而得到的图形,该图显示了使用图29~30所述的接头固定方法,大量应力主要消失在凸肋中,而且不会实际扩展到接头装配狭槽之外,因此可以大大降低由于插入大量接头而导致绝缘外壳变形和扭曲的危险。图31中表示不同应力大小的单位是牛顿/mm2,其中的mm是表示位移量的单位。图32表示:对标准接头(494)来说,可变形凸肋远端的压缩变形增大到0.0004英寸左右时,由于凸肋施于接头的法向力的缘故,将导致接头和绝缘外壳之间的保持力增大,压缩变形超过0.0004英寸之后,则保持力增大不明显。
如上文所述,使用球栅阵列装配法时,影响连接器的基板装配面共面性的另一个因素是焊球尺寸和它相对连接器外壳底板装配面的位置的一致性。在上述最佳实施例中,在接头的末端被置入凹部内,各外凹部的尺寸和形状是一致的,这些凹部对本发明具有多方面的重要意义。使用简单的覆盖或涂层方法可以将数量极为相同的焊锡膏附加在这些凹部上,因此,将各焊球固定于各接头上所用的焊剂数量是完全一致的。在焊球熔合在接头上之前,这些凹部可将各焊球沿X-Y轴方向定位,还可以将各焊球沿相对绝缘外壳的底板的Z轴方向定位,并可确定各焊球相对接头末端的距离。接头末端深入凹部的程度是受限的,在最大允许程度时,接头末端不会触及焊球,因而不会影响焊球在Z轴方向上的定位。然而,只有切口内的焊锡膏含有数量相对一致并足够的焊剂时,才能确保焊球与接头末端熔合。接头末端与焊球之间的距离变化可以通过变化置入凹部的焊锡膏的数量来调节。
为将焊球附加在接头上而采用软熔工艺时,必须确保在焊球附近具备足够数量的焊剂,还要防止焊剂被接头衔接面吸收,为此,对接头要进行一番处理使其不能吸收焊剂。图33中,接头(526、528)连接在一个支撑板(530)上,这些接头的衔接面(532)通常镀有一层诸如金或钯或钯合金的非氧化金属。这些接头还有一个中段(534),此中段构成了保持接头位于绝缘外壳内的部位,其上附有防焊剂吸收或非焊剂浸湿材料,为此目的,最佳材料之一是镀镍。虽然这里无意涉及任何专门的理论,但是,可以相信,镀镍层的抗焊剂性能是由于镀镍层氧化的结果或因此而得以增强。镀镍层氧化的方法可以是在自然空气中暴露数日等,令人始料未及的是这一镀镍层或氧化镍层竟能够防止或降低接头吸收焊剂。为使镍镀层或氧化镍镀层具备如此钝化功能,镀层的厚度最好在10~100微英寸之间,以50微英寸为最佳。可用于此目的的其他防焊剂吸收材料还有含防焊剂吸收涂层的flourine等。当整个接头镀有黄金等焊剂易吸收金属材料外层时,使用这种flourine尤其有效。接头的突出部(536)最好镀一层黄金或锡或锡合金等焊剂吸收材料,整个接头镀一层镍更好。在接头的上部,在镀镍层之外再有选择地镀一层稀有金属,此稀有金属层厚度最好在10~100微英寸之间,以30微英寸为最佳。在接头的下部,应再有选择地镀一层焊剂易吸收金属,也可用铬电镀层取代镀锦层。
图34显示的是连接在支撑板(542)上的插销式连接器的信号线接头(538、540),每个接头都有一个镀金的突出部(544),一个镀镍的、防焊剂吸收的中间保持段(546)和一个镀有稀有金属层的衔接段(548)。同样,在图35中显示的是连接在支撑板(552)上的地线或电源线接头(550),此接头的上段为镀金的突出部(554),还有一个镀镍的、防焊剂吸收的中段(556)和一个镀金的衔接段(558)。这种也具有防焊剂吸收能力的地线或电源线接头(550)的另一个特点,是它的突出部(554)上有一系列缺口(560、562、564),这种包含在上述实施例中的地线或电源线接头(550)的再一个特点,是它还有一个竖直的切槽(568)。图37显示的是插销式连接器上的地线或电源线接头(568),它的上段为镀金的突出部(570),中段为镀镍的防焊剂吸收段(572),下段为镀金的衔接段(574)。从图中可以看到,地线或电源线接头(568)虽然没有支撑板,但却有一个可使接头自身具有支撑作用的圆孔(576)。通过对各种接头的上述介绍可以得知,接头下段使用的镀金可换用锡或其他焊剂吸收材料。对图33~37所示的所有接头来说,上段镀金突出部的宽度,如图37中W1所示,最好在大约0.1~0.25mm之间,而镀镍中段的宽度,如图37中W2所示,最好在大约0.1~1mm之间。
图24~25显示的是本发明一种实施例中固定焊球的另一种方式。标号324指示的是插座式连接器,其底座(326)有外底(328)和内底(330),外底(328)上有凹部(图25中的332、334、336、338、340和图24中的342、344),每个凹部最好有一个含有一段圆面(362)的斜底面(360)。内底(330)上有凹部(图25中的346、348、350、352、354和图24中的356、358)。在内、外底凹部之间中间狭槽(图25中的364、366、368、370、372和图24中的374、376),每个狭槽有一个可夹住接头的凸起(图中未显示),凸起的式样与图29~30所述的连接器的凸肋完全相同。内底的结构与图1~2所述插座式连接器的内底结构完全相同,它包括一个固定在底座(326)的上段(436),固定方式最好是图1~2所示的卡锁机构(图中未显示)。上段或上盖(436)上有多个开口(452、460),用来接受来自配套插销或狭槽(454、456、458)的单个接头,而这些狭槽(454、456)是用来接受来自配套插销式连接器的地线或电源线接头的。诸如接头(408)的信号线接头和地线或电源线接头的形式与上述实施例中的任何类似接头完全相同,例如,地线接头(图25中的382)有一个下段(384),此下段上有一个凸起(386)。此接头还有一个上段(388),该上段(388)由两个叉棒(390、392)构成,每个叉棒都有一个收敛段(394)和一个向外扩张的引入段(396)。凸起(386)位于凹部(336)之中。每个信号线接头(408)的上段(410)有一个前突部(412)和一个后弯部(414)。各信号线接头(408)还有一个与绝缘外壳相接的中段(416)和一个位于凹部(334)中的下凸起(418)。
地线接头(382)的凸起(386)和信号线接头(408)的下凸起(418),是在将各接头插入底座后使各接头末端围绕圆面(326)折弯而形成的,各圆面(326)用作各有关接头末端的折弯轴。接头末端折弯后转向斜面(360),但又可以反向后弹,所以此凸起(386、418)横切接头的纵轴线并与外底板(328)平行,这就确保了多个凸起具备了良好的共面性。继形成凸起之后,将焊锡膏涂在各凸起的外表面,然后将焊球(图25中的398、400、402、404、406和图24中的426、428)置于各凸起上,再对整套组合设备进行加热,使焊锡膏熔化将焊球熔合到凸起上。图24a则显示了另外一种结构,凹部(334a)加深,因而斜底面(360a)和圆面(362a)相对底座外底(328a)更加靠里。这样,焊球(398a)的一部分位在凹部(334a)之内,凹部(334a)边缘将保持焊球的平稳固定,如此情况与图12~13所述情况完全相同。因此,只要焊球的尺寸大小完全一致,这样结构就可以形成完整的连接器,使装配接面上的接头具有良好的共面性。
插销式连接器(430)的结构与上述插销式连接器的结构基本相同。它包括一个底座(432),底座(432)上又分为内底(434)和外底(436),外底(436)上有多个凹部(438、440、442、444、446)。每个凹部有一个斜底面(448)和一个圆面(450),各凹部与各接头中间狭槽(452、454、456、458、460)相连。插销式连接器还有数个地线或电源线接头(462),每个接头的衔接段(464)与插座式连接器上的地线或电源线接头的叉棒相衔接。这些接头还各有一个与绝缘外壳相连的中段(466)和一个用来接受焊球(470)的焊球凸起(468)。插座式连接器上还有一些信号线接头(476),每个信号线接头包括一个与插座式连接器上的信号线接头相衔接的衔接段(478),一个与绝缘体外壳相连的中段(480)和一个用来接受焊球的焊球凸起(482)。其他信号线接头(486、488)则分别与其他焊球(490、492)相连。焊球凸起的形成和将焊球熔合在插销式连接器上的方式与上述插座式连接器所采用的方法完全相同。
在本发明所述的方法中,导电元件最好是焊球。然而,熟练的技术人员知道,还可以使用熔点低于绝缘外壳的可熔材料取代焊球,这种可熔体也可以呈圆形以外的形状。焊球或其他导电元件的直径最好是凹部宽度的50~200%,并且最好是凹部深度的50~200%,焊球的体积最好是凹部体积的75~150%,与凹部体积相同则最佳。接头凸起深入凹部应达到一定程度,以形成足够使焊球熔合的表面面积,深入的程度通常为凹部深度的25~75%,如上所述,以50%为最佳。凹部一般为圆形、方形或剖面呈规则多边形的任何其他形状。如果导电元件为焊剂体,最好是合金,其比例为从约90%Sn和10%Pb到约55%Sn和45%Pb的范围,最理想的共熔合金比例是63%Sn和37%Pb,其共熔点为183℃。连接陶瓷等材料通常使用含铅量高的“硬”焊剂合金,这种“硬”焊球在标准表面装贴工艺条件下不会变软,因而会产生轻微的扩展或变形,但不会熔化。因此,常使用一种“软”的易熔焊球将连接器连接到印刷电路板上,这种易熔焊球在标准表面装贴工艺条件下能软熔和重新组合自身。其他已知适于导电的焊剂估计也适于在本方法中使用,诸如导电的锡锑合金、锡银合金和铅银合金以及铟等,当然还不止这些。在将焊球或其他导电元件放入凹部之前,应在凹部内放入焊锡膏。
另一种方法是采用一种在表面装贴工艺温度中不致熔化的材料形体取代上述焊球,并使用凹部内的焊锡膏将它软熔连接到接头上,从而使连接器装配接面上出现许多呈共面阵列排列的非熔小球。这种连接器可以采用普通的表面装贴工艺方法固定到基板上。
虽然可以认为含有任何普通有机或无机助熔剂的焊锡膏或焊油也同样适用于这种方法,但最好是一种非净化的焊锡膏或焊油,这种焊锡膏或焊油包括一种以细粉末状浮在适当助熔材料中的焊剂合金,这种细粉末通常是一种合金而不是多种成分的混合物。在助熔剂中,焊剂的所占比例可高达重量的80~95%或体积的80%左右。当焊剂材料浮在松香助熔剂中时就可以形成焊油。这里的松香助熔剂最好是白色松香或活性较低的松香助熔剂,但由于用途不同,活性较高的甚至超活性的松香也是可以使用的。当细粉末状的合金浮在一种有机酸焊熔剂或无机酸焊熔剂中时就会形成焊锡膏。这种有机酸可从乳酸、油酸、硬脂酸、酞酸、柠檬酸或类似酸中选择,而这种无机酸可从盐酸、氢氟酸和磷酸中选择。焊锡膏或焊油可有毛刷涂或掩膜或模压方式封在凹部面上,凹部面最好能预先逐渐加温以确保良好的浸湿效果,虽然现已发现,使用焊锡膏或焊油可以大大降低接头吸收的焊剂,但是可以相信,在使用适当的钝化剂情况下,单独使用油膏状的焊熔剂也是可行的。这样适当的钝化剂包括诸如三M公司生产的FLOURAD等含有抗焊涂层的氟化物。
加热最好是在板式红外焊剂软熔传输炉中进行,焊剂体通常要加热到183℃-195℃的温度,但是,视绝缘外壳制作材料的不同,也可以加热到焊剂熔点的温度。传送带的移动速度最好为10~14英寸/秒,并能在总时间大约5~10分钟内移动穿过多个连续的加热阶段。在装进传输炉前,可将绝缘外壳、接头和焊剂体以不断升高的温度预先加热一小时。基于适当的峰值温度、最大梯度和高于软熔温度的时间,可以绘出传输炉中的温度曲线图。峰值温度是绝缘外壳所能承受的最高温度,对熔点为183℃的焊剂体来说,峰值温度通常在185℃-195℃之间,最大梯度以℃/秒为单位计量,它决定了连接器绝缘外壳温度变化的允许速度,为的是防止外壳出现变形和扭曲。就大多数使用情况说,开始时的最大正梯度最好在2℃/秒-15℃/秒之间,在到达焊剂的液化点之后,负梯度最好在-2℃/秒--15℃/秒之间。本发明中的方法的一个重要特点是高于软熔温度的时间被缩短至最低限度,这个时间就是计量焊剂体保持液体状态的时间长短。现已发现,焊剂体处于液体状态的时间越短,则接头吸收凹部中焊剂的现象就大为减少甚至不会出现。从印刷电路板上测得的温度从180℃上升至200℃的时间和温度从200℃下降至180℃的时间都在大约10~100秒之间。
虽然无意涉及任何具体的理论,但是可以认为,在如此短暂的时间阶段,液态焊剂体的表面张力将会阻止液态焊剂流动到位于凹部底部的接受接头的狭槽里。可是,在这一时间阶段之后,液态焊剂体将开始向接受接头的狭槽流动并浸湿接头。也可以采用这样的方法:在使焊剂体的温度上升至熔点温度前,一开始以较高的梯度增温,但接近熔点温度时则降低增温或降温的速度,然后再以较高梯度增温直到达到熔点温度。选取适当的绝缘外壳制作材料也会取得良好结果。外壳的制作材料最好是令芳香族液晶聚醌(LCP),其特点是应具备玻璃的高转变温度,低的热膨胀系数,良好的防潮性,高的断裂韧度,良好的塑变性能,低的粘度,高的熔点和燃点。
下面,将参照以下示例进一步介绍本发明中的方法。
例一
结合图1~18的描述实际制备出了插销式和插座式连接器的绝缘外壳,根据以上描述将接头实际置入该绝缘外壳,这些接头系铜铍合金制品,其整体表面镀金厚度为30微米。绝缘外壳的制作材料是DupontH6130液晶聚酯。插销式连接器的长度和宽度分别为52.5mm(含安装架)和42.36mm。插销式和插座式连接器绝缘外壳外底板上的凹部的剖面呈长方形,边长分别为0.62mm和0.4mm,接头进入凹部的深度约为2mm,其他尺寸则可根据图1~18与上述尺寸呈比例确定。插销式和插座式连接器外底板上的凹部内充填着新泽西市Alphametals公司现已投放市场的Cleanline LR725非净化焊锡膏。将插销式和插座式连接器二者翻转,使各自的外底板对向多个圆形焊球,便可使各焊球卡在一个凹部上。焊球是Alphametal公司的无助熔剂63SN/37PB(锡、铅的成份分别为63%和37%)圆形焊球,直径0.030英寸±0.001英寸,重量约为0.00195g。然后用3M公司的Flourad防焊剂吸收材料处理插销式和插座式连接器。经过如此处理后,将二者送入对流干燥箱内在105℃的恒温中干燥2小时,此后,再将二者固定到专用电路板上,这种电路板是用普通的增强环氧树脂印刷电路板材料制作的,厚度为0.061英寸。如图9所示,在插销式连接器外底板的T点放置一个热电偶,再将另一个热电偶居中放在邻近插销式连接器的电路板的支撑面上,然后将插销式和插座式连接器放入板式红外传输焊剂软熔炉中进行处理,与这种传输炉的正常运转一样,插销式和插座式连接器在软熔中要移动通过六个区段,传送带的运动速度为13英寸/分,各区段的温度如表一所示。表二显示的是对插销式连接器及电路板加热的最高温度和最低温度,表三显示的是最大正、负温度梯度,表四显示的则是在电路板上测得的180℃-200℃之间的增温时间和降温时间。插销式连接器在不同时间和移动距离上的温度如图26a中的曲线所示,图中的粗线是电路板上的热电偶的温度,细线是插销式连接器外底板上的热电偶的温度。在焊剂软熔之后,通过对插销式和插座式连接器的目视检查,发现几乎所有的焊球均已熔合到各空腔的接头引入点上,焊球相对插销式和插座式连接器二者外底板的高度也是基本一致的,绝缘外壳也未见明显变形或扭曲。
例二
以示例一所述基本相同的方法制备了另一套插销式和插座式连接器,并且焊球已被置入外底板的凹部内。在结束示例一所述的于焊剂软熔炉内的处理几小时之后,由于自然环境条件发生变化,另一套与示例一中所述基本相同的插销式和插座式连接器即将进行示例一中所述同样的软熔加热工序。软熔炉的条件如表一所示。插销式连接器和邻近的电路板的最高和最低温度如表二所示,最大正、负温度梯度如表三所示,在电路板上测得的180℃-200℃之间的增温和降温时间如表四所示,在不同时间与移动距离上的温度如图26b所示。从图26b的曲线可以看出与图26a的曲线的差别,这种差别是由于不同的自然环境条件所致。对最终得到的连接器的目视检查表明其结果与示例一取得的结果完全相同。
表1
温度(℃)
示例 | 区段 | #1 | #2 | #3 | #4 | #5 | #6 |
1 | 上部 | 350 | 未加热 | 275 | 230 | 310 | 未加热 |
1 | 下部 | 未加热 | 未加热 | 275 | 230 | 310 | 未加热 |
2 | 上部 | 350 | 未加热 | 275 | 230 | 310 | 未加热 |
2 | 下部 | 未加热 | 未加热 | 275 | 230 | 710 | 未加热 |
表2
表3
最大正、负温度梯度(℃/秒)
表4
180℃-200℃的增温时间与降温时间
(电路板处测量结果)
示例 | 增温时间(分·秒) | 降温时间(分·秒) |
1 | 0:28.8 | 0:15.2 |
2 | 1:31.6 | 0:40.6 |
例三
使用例一、二基本相同的条件制备出另一套连接器,只是由于自然环境条件不同,与图26a和图26b所显示的具体曲线相比有所差别。此连接器制作完成后,使用明尼苏达州明尼阿波利斯市Cyber光学公司现有的点距离激光传感器对插销式连接器外底板上6个位置的焊球进行了检测。图9中分别显示了这6个位置,即来自L1方向的激光照射的27a和27b,来自L2方向的激光照射的27c和27d,来自L3方向的激光照射的27e和27f。在每个位置上,一束激光可同时照射5个焊球,图27a~27f显示了这些激光照射的图形。表三则显示了各焊球最高点相对插销式连接器外底板平面的高度。表五中对各组焊球位置的排序是以最靠近插销式连接器正面的焊球为第一焊球位置,图27a~27f中最左侧图形即为第一焊球的图形。对这些结果的检查表明,在每个由5个焊球组成的一组中,就焊球的高度而言,可以说都达到了可以接受的一致性。(表五)
表5
焊球的位置高度(0.001英寸)
焊球组 | 焊球1 | 焊球2 | 焊球3 | 焊球4 | 焊球5 |
27a | 18.1 | 18.9 | 19.5 | 19.6 | 19.1 |
27b | 19.2 | 18.5 | 17.6 | 18.5 | 18.0 |
27c | 20.4 | 21.1 | 21.6 | 21.1 | 21.4 |
27c | 19.9 | 20.1 | 20.1 | 21.2 | 20.5 |
27e | 18.2 | 18.9 | 19.3 | 18.2 | 18.7 |
27f | 19.1 | 18.2 | 19.0 | 18.2 | 18.9 |
例四
根据例一和例二所述的条件制备了另一套连接器,只是由于自然环境条件的不同,与图26a和图26b所显示的曲线相比有所差别。在绝大多数情况下,焊球都能令人满意地熔合在接头引入点上,而且焊球相对插销式和插座式连接器外底板平面的高度,从目视检查看来均达到了可以接受的一致性。使用了一种与插销式和插座式连接器上的焊球形状相似的模型向各厚度为0.061英寸的两块不同电路板上的导电焊接点涂抹焊锡膏。插销式连接器固定在一块电路板上,而插座式连接器固定在另一块电路板上,然后将二者再次分别置入传输炉进行处理,传输炉内的条件与将焊球熔合到接头上时的条件相同,只是传送带速度降低到11英寸/秒。经过冷却后发现,插销式和插座式连接器都已令人满意地熔合到各自的电路板上。图28a和图28b的照片表明被选定的焊球的X射线已相互衔接。用剖面电子显微镜拍摄的照片也显示出了焊球熔合到信号线接头引入点和焊球熔合到印刷电路板的情况。这两种情况的电子显微镜照片已分别显示在图28c和图28d中。虽然这只是两个相邻信号线接头的特写镜头,但已可看出接头与焊球之间和焊球与电路板之间在所有其他各点的完好衔接。
从以上所述的电连接器和它的制备方法可以得知,这种连接器可以使用球栅阵列工艺装配到印刷线路板上。令人始料不及的是,我们还发现其中的焊球具有很好的一致性,重量和体积的一致性尤其突出。
虽然本发明是结合不同的附图所示的最佳实施例而介绍的,但是,只要不违背本发明的基本原则,又能确保具备同样的功能,也可使用其他类似的实施例,也允许对上述实施例作些变更或增补。再则,所述具体方法也可以应用于连接器以外的部件,即那些配有绝级材料制作的外壳,且外壳上装配的元件要熔合到印制线路板或其他基板上的部件。
因此,对本发明的理解不应仅局限于任何单个的实施例,而应根据后附列举的权利要求作更广泛、更深入的认识。
Claims (2)
1.一种大密度电连接器,适于装配到具有导电元件的基板表面上,它包括:
由绝缘聚合材料模压成形的底板,所述底板具有内底面和外底面,该外底面限定出多个外凹部;
多个信号线接头,每个信号线接头包括:内段、置入所述底板的中段、和伸入所述多个外凹部之一的末端;以及
多个焊球,熔合在每个所述末端上,
其特征在于:
所述多个焊球均熔合到多个外凹部中的末端上,所述多个焊球相对所述底板的外底面的平面的高度是一致的。
2.根据权利要求1所述的电连接器,其中所述中段其上附有防焊剂吸收材料。
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CN2003101026354A Expired - Lifetime CN1510788B (zh) | 1996-10-10 | 1997-10-09 | 电连接器 |
CN2005100563746A Expired - Lifetime CN1655405B (zh) | 1996-10-10 | 1997-10-09 | 大密度电连接器 |
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CN2003101026354A Expired - Lifetime CN1510788B (zh) | 1996-10-10 | 1997-10-09 | 电连接器 |
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2001
- 2001-09-14 US US09/953,631 patent/US7186123B2/en not_active Expired - Fee Related
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2003
- 2003-10-23 KR KR1020030074088A patent/KR100450547B1/ko not_active IP Right Cessation
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2005
- 2005-11-10 US US11/272,212 patent/US7168964B2/en not_active Expired - Lifetime
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2007
- 2007-01-29 US US11/668,435 patent/US7476110B2/en not_active Expired - Fee Related
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2009
- 2009-01-12 US US12/352,227 patent/US7802999B2/en not_active Expired - Fee Related
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2010
- 2010-09-27 US US12/891,469 patent/US8167630B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN2381069Y (zh) * | 1999-07-16 | 2000-05-31 | 深圳市华为技术有限公司 | 具有信号指示的光接口板 |
WO2002004999A2 (en) * | 2000-07-10 | 2002-01-17 | Massachusetts Institute Of Technology | Graded index waveguide |
Non-Patent Citations (2)
Title |
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JP特开2002-250846A 2002.09.06 |
JP特开2002-277657A 2002.09.25 |
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