CN1669363A - Sealing plate for electroluminescent device, method for manufacturing same, and mother glass substrate for multi-production of sealing plate - Google Patents
Sealing plate for electroluminescent device, method for manufacturing same, and mother glass substrate for multi-production of sealing plate Download PDFInfo
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- CN1669363A CN1669363A CNA038165600A CN03816560A CN1669363A CN 1669363 A CN1669363 A CN 1669363A CN A038165600 A CNA038165600 A CN A038165600A CN 03816560 A CN03816560 A CN 03816560A CN 1669363 A CN1669363 A CN 1669363A
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- Prior art keywords
- sealing plate
- glass
- projection portion
- peripheral projection
- electroluminescent device
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- 238000007789 sealing Methods 0.000 title claims abstract description 184
- 239000000758 substrate Substances 0.000 title claims abstract description 78
- 238000000034 method Methods 0.000 title claims abstract description 64
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 36
- 230000002093 peripheral effect Effects 0.000 claims abstract description 121
- 238000005530 etching Methods 0.000 claims description 47
- 238000012545 processing Methods 0.000 claims description 23
- 238000001039 wet etching Methods 0.000 claims description 23
- 239000007767 bonding agent Substances 0.000 claims description 20
- 239000003230 hygroscopic agent Substances 0.000 claims description 20
- 239000002808 molecular sieve Substances 0.000 claims description 18
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical group [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 claims description 18
- 238000002844 melting Methods 0.000 claims description 6
- 230000003628 erosive effect Effects 0.000 claims description 4
- 238000005401 electroluminescence Methods 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 12
- 229910052760 oxygen Inorganic materials 0.000 abstract description 12
- 239000001301 oxygen Substances 0.000 abstract description 12
- 230000006866 deterioration Effects 0.000 abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 9
- 239000010410 layer Substances 0.000 description 44
- 239000000853 adhesive Substances 0.000 description 23
- 230000001070 adhesive effect Effects 0.000 description 23
- 239000010408 film Substances 0.000 description 23
- 230000000052 comparative effect Effects 0.000 description 16
- 239000011248 coating agent Substances 0.000 description 12
- 238000000576 coating method Methods 0.000 description 12
- 238000002474 experimental method Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 238000001312 dry etching Methods 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 238000005266 casting Methods 0.000 description 6
- 238000007373 indentation Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000003672 processing method Methods 0.000 description 5
- 239000005361 soda-lime glass Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 150000007522 mineralic acids Chemical class 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 150000001413 amino acids Chemical class 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 150000001735 carboxylic acids Chemical class 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- 150000007524 organic acids Chemical class 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 238000010023 transfer printing Methods 0.000 description 3
- 238000010923 batch production Methods 0.000 description 2
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- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- WCPAKWJPBJAGKN-UHFFFAOYSA-N oxadiazole Chemical compound C1=CON=N1 WCPAKWJPBJAGKN-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 150000003852 triazoles Chemical class 0.000 description 2
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- 229910019015 Mg-Ag Inorganic materials 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 235000012241 calcium silicate Nutrition 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 210000002858 crystal cell Anatomy 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- DCZNSJVFOQPSRV-UHFFFAOYSA-N n,n-diphenyl-4-[4-(n-phenylanilino)phenyl]aniline Chemical compound C1=CC=CC=C1N(C=1C=CC(=CC=1)C=1C=CC(=CC=1)N(C=1C=CC=CC=1)C=1C=CC=CC=1)C1=CC=CC=C1 DCZNSJVFOQPSRV-UHFFFAOYSA-N 0.000 description 1
- 229960003540 oxyquinoline Drugs 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- MCJGNVYPOGVAJF-UHFFFAOYSA-N quinolin-8-ol Chemical compound C1=CN=C2C(O)=CC=CC2=C1 MCJGNVYPOGVAJF-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
A sealing plate for an EL device, which effectively prevents water or oxygen from entering the EL device, thereby prolonging the life of the EL device; a sealing plate for a top emission EL device, which can suppress deterioration of a mother glass substrate for a multi-production of the sealing plate and that of an EL multilayer film while sufficiently taking out the light from a light-emitting layer; a method for manufacturing such a sealing plate; and a mother glass substrate for a multi-production of the sealing plate are provided. The EL device (100) comprises a transparent substrate having a planar shape, an organic EL stacked body and a sealing plate (30). The sealing plate (30) has a recess in the central portion, thereby providing a peripheral projection part (31) on the periphery, and the height of the roughness of the top surface of the peripheral projection part (31) is less than 10mum at the maximum.
Description
Technical field
The present invention relates to sealing plate for electroluminescent device and manufacture method thereof and the mother glass substrate that is used to produce a plurality of sealing plates.
Background technology
Electroluminescence (hereinafter referred to as EL) element generally is made of with sealing plate institute substrate that forms on the surface and EL element, wherein said EL element with sealing plate middle body be processed to concavity, so that limit peripheral projection portion at peripheral part, the end face of this peripheral projection portion is to be bonded on the substrate by bonding agent, and the EL stacked film that is used for forming on this substrate covers.Substrate and sealing plate bond together by the adhesive linkage that the bonding agent that is configured on the sealed portion between substrate and the peripheral projection portion forms.
As the material of sealing plate, can adopt metal, glass or resin etc.Wherein, when sealing plate constitutes by metal, electrical insulating property with the extraction electrode part that keeps forming on the substrate is a purpose, must on the bonding agent that closure disposed between substrate and the peripheral projection portion, add the liner of insulating properties, thereby the gap between substrate and the peripheral projection portion resembles the liner greatly, and the possibility that outside moisture is invaded from this part increases.In addition, it is transparent that the luminous structure that obtains the top of the light that comes from luminescent layer from sealing plate one side requires sealing plate, so can not use the sealing plate that is made of metallic plate.
Therefore, when EL element adopted the top light emitting structure, sealing plate can adopt the plastics or the glass of the insulating properties and the transparency.But, plastics because of water absorption that himself had seldom as sealing plate material, in contrast, glass because of its excellent insulating properties, the transparency and resistance to water be commonly used for sealing plate material.
As the glass sealing plate processing method, have pair glass blanket itself to carry out the pressure application (Fig. 3) of bending machining and remove the sandblast processing method (Fig. 4) that the middle body of glass blanket divides.
As shown in Figure 3, sealing plate 30 with pressure application processing makes it to have small concavo-convex casting mold for preventing that sintering from adopting, so this concavo-convex transfer printing is at the end face of peripheral projection portion 31, cause flatness low, moisture or oxygen are invaded from the adhesive linkage that closure disposed 40 between substrate 10 and peripheral projection portion 31 easily.In addition, as shown in Figure 4, sealing plate 30 with sand-blast processing, because produce the distinctive fine crack 60 of many sand-blasts on the surface of central indentation, so for sealing plate 30 is bonded on the substrate 10, when when the adhesive linkage that closure disposed 40 between substrate 10 and peripheral projection portion 31 is exerted pressure, sealing plate 30 usually destroys.
As the processing method of sealing plate 30, except that above-mentioned pressure application and sand-blast, also has etching method.According to this method, the flatness height of the end face of peripheral projection portion 31, and also can not produce small crackle on the surface of central indentation, even thereby exert pressure for adhesive base plate 10 and sealing plate 30, also can partly carry out bonding equably in sealing-in.
In addition, even under the situation that sealing plate 30 is made of the glass of resistance to water excellence, when the bonding agent coating weight that is coated on the closure between substrate 10 and the peripheral projection portion 31 hour, outside moisture or oxygen also can be invaded and destruction EL stacked film self from enclosure portion, and the life-span of EL element becomes extremely short.For this reason, the amount at the bonding agent of enclosure portion coating is subjected to strict control.
But, when the end face of peripheral projection portion 31 concavo-convex inhomogeneous, then be detained bonding agent easily at its concave portion, in addition when the area of the end face of peripheral projection portion 31 be the area of coating adhesive when big, the adhesive linkage 40 that then the forms uniform thickness difficulty that becomes.
Therefore, even just strict control is coated on the bonding agent coating weight of the enclosure portion between substrate 10 and the peripheral projection portion 31, also be difficult to form certain thickness adhesive linkage 40 in enclosure portion, the 1st problem of Chan Shenging is that outside moisture or oxygen is lower than certain thickness part intrusion from adhesive linkage 40 like this, makes the lifetime of EL element.
On the other hand, known already that EL element had 2 kinds, thus promptly on the electrode of the configuration in opposite directions that separates by luminescent layer and backplate selectively applied voltage, can make that this luminescent layer is luminous selectively to be suitable for the passive that matrix shows thus; Thereby switching shows the active type that is suitable for the animation demonstration with utilizing the speed-sensitive switch function to carry out at a high speed.
Above-mentioned passive EL element adopts simple matrix structure, comprise substrate, be configured in electrode and luminescent layer on this substrate, and by being layered in this EL duplexer above electrode, being layered in this backplate above EL duplexer and the sealing plate institute of glass constitutes, wherein said sealing plate middle body be processed to concavity, so that limit peripheral projection portion at peripheral part, the end face of this peripheral projection portion is bonded on the substrate that is laminated with this EL duplexer.
In addition, above-mentioned active type EL element adopts active matrix structure, the same with the structure of TFT liquid crystal cell, comprise substrate, each pixel all is formed on thin-film transistor circuit or diode and the luminescent layer on this substrate, and by be layered in this thin-film transistor circuit or this above diode the EL duplexer and the sealing plate institute of glass constitute, wherein said sealing plate middle body be processed to concavity, so that limit peripheral projection portion at peripheral part, the end face of this peripheral projection portion is bonded in and is laminated with on this EL duplexer substrate, and the sealed portion of the end face by peripheral projection portion is bonded on the substrate.
The structure of described sealed portion is with the inner sealed portion of isolating with moisture or oxygen of EL element.
In described passive EL element and described active type EL element, the top emission type EL element constitutes with transparent material to described sealing plate one side from described luminescent layer, obtains the light that comes from luminescent layer from sealing plate one side thus.
In this top emission type EL element, in order to isolate with moisture or oxygen EL element is inner, by sealing plate sealed portion seal, but because through using for a long time, the sealing of sealed portion reduces, and moisture etc. are sneaked into EL element inside, often cause the deterioration of EL stacked film thus.For suppressing the deterioration of this EL stacked film, set hygroscopic agent in the EL element inside of sealing, thereby improve sneaking into the resistance to water of moisture.This hygroscopic agent generally be provided in the whole sealing plate relative with the EL duplexer recess the inside.
Yet, if hygroscopic agent be provided in the whole sealing plate relative with the EL duplexer recess the inside, then the 2nd problem that produces like this is: the top light emitting structure that obtains the light that comes from luminescent layer from sealing plate one side just can not obtain sufficient aperture opening ratio, thereby can not fully obtain the light that comes from luminescent layer.
Summary of the invention
The 1st purpose of the present invention is: provide a kind of can prevent effectively moisture or oxygen invade EL element inside and seek EL element long lifetime EL element with sealing plate, and basic pattern glass (mother glass) substrate that is used to produce a plurality of sealing plates.
In addition, the 2nd purpose of the present invention is: provide a kind of top emission type EL element that can suppress EL stacked film deterioration and can fully obtain the light that comes from luminescent layer with sealing plate and manufacture method be used to produce the mother glass substrate of a plurality of sealing plates.
For realizing the 1st above-mentioned purpose, the EL element of the 1st scheme of the present invention is the EL element sealing plate of glass with sealing plate, the middle body of sealing plate is processed to concavity, so that limit peripheral projection portion at peripheral part, the end face of this peripheral projection portion is to be bonded on the substrate by bonding agent, thereby the EL duplexer that will be layered on this substrate covers, and it is characterized in that: the concavo-convex maximum of the end face of described peripheral projection portion is lower than 10 μ m.
In the EL element of the 1st scheme was used sealing plate, described middle body preferably was processed into concavity with etching method.
And then described etching method is preferably wet etching.
For reaching the above-mentioned the 1st purpose, the 1st scheme of the present invention can produce a plurality of sealing plates mother glass substrate, it is characterized in that: above-mentioned EL element roughly is processed into rectangular with sealing plate.
For reaching the above-mentioned the 2nd purpose, the EL element of the 2nd scheme of the present invention is the EL element sealing plate of glass with sealing plate, the middle body of sealing plate is processed to concavity, so that limit peripheral projection portion at peripheral part, the end face of this peripheral projection portion is bonded on the substrate that is laminated with the EL duplexer, it is characterized in that: the medial surface in described peripheral projection portion is equipped with hygroscopic agent.
In the EL element of the 2nd scheme was used sealing plate, described hygroscopic agent was preferably molecular sieve.
With in the sealing plate, the end face in described peripheral projection portion when preferably having peristome in the central, also has the maintaining part that keeps described hygroscopic agent in the EL element of the 2nd scheme.
And then the opening edge of described maintaining part preferably highlights to the inside from the medial surface of described peripheral projection portion.
And then described maintaining part is more preferably used the alkali-free glass manufacturing of thickness 0.05～1.1mm.
For reaching the above-mentioned the 2nd purpose, the EL element of the 2nd scheme of the present invention is used be used to produce a plurality of sealing plates mother glass substrate, it is characterized in that: above-mentioned EL element forms roughly rectangular with sealing plate.
For reaching the above-mentioned the 2nd purpose, the EL element of the 2nd scheme of the present invention with sealing plate manufacture method, it is characterized in that: prepare glass blanket and etching speed than the slow sheets of glass of described glass blanket, described sheets of glass is bonded on the described glass blanket, the described glass blanket that is bonded with described sheets of glass carved from described sheets of glass one lateral erosion at middle body be processed into concavity, so that limit peripheral projection portion at peripheral part, the medial surface in described peripheral projection portion sets hygroscopic agent then.
The method of the described bonding preferred employing heat welded of the 2nd scheme is carried out.
And then described heat welded is preferably undertaken by low-melting glass between described glass blanket and described sheets of glass.
For reaching the above-mentioned the 2nd purpose, the EL element of the 3rd scheme of the present invention with sealing plate manufacture method, it is characterized in that: prepare glass blanket and sheets of glass; At middle body described glass blanket etching and processing is become concavity, so that limit peripheral projection portion at peripheral part; Described sheets of glass is carried out etching and processing, so that make it to have the little peristome of aperture area of the recess of the described glass blanket of crossing than etching and processing in central authorities; The described sheets of glass that described glass blanket of again etching and processing being crossed and etching and processing are crossed is bonded together, so that the opening edge that makes described peristome highlights to the inside from the medial surface of described peripheral projection portion; Medial surface in described peripheral projection portion sets hygroscopic agent.
The EL element of the 3rd scheme with sealing plate in the manufacture method, the method for described bonding preferred employing heat welded is carried out.
And then described heat welded is preferably undertaken by low-melting glass between described glass blanket and described sheets of glass.
And then, the EL element of described the 2nd scheme and the 3rd scheme with sealing plate in the manufacture method, the described bonding bonding agent that more preferably adopts carries out.
Description of drawings
Fig. 1 be EL element with the 1st embodiment of the present invention with sealing plate the sectional view of EL element.
Fig. 2 for the EL element 100 employed sealing plates 30 of Fig. 1 be formed roughly rectangular being used to produce a plurality of sealing plates the plane graph of mother glass substrate.
Fig. 3 be have the EL element that adopts pressure application processing with sealing plate the sectional view of EL element.
Fig. 4 be have the EL element that adopts sand-blast processing with sealing plate the sectional view of EL element.
Fig. 5 be EL element with the 2nd embodiment of the present invention with sealing plate the sectional view of EL element.
Fig. 6 is the flow chart of the manufacture method of sealing plate 30a in the presentation graphs 5.
Fig. 7 is the flow chart of other manufacture method of sealing plate 30a in the presentation graphs 5.
Fig. 8 is the sectional view of Change Example of the organic EL 100a of Fig. 5.
Embodiment
The present inventor reaches the above-mentioned the 1st purpose to have carried out research with great concentration, found that: for the EL element sealing plate made from glass, the middle body of sealing plate is processed to concavity, so that limit peripheral projection portion at peripheral part, the end face of this peripheral projection portion is to be bonded on the substrate by bonding agent, thereby the EL duplexer that will be layered on this substrate covers, in such EL element is used sealing plate, if the concavo-convex maximum of the end face of described peripheral projection portion is lower than 10 μ m, just can make sealing plate the thickness of the adhesive linkage between sealing-in part and the substrate become evenly, thereby can prevent moisture or oxygen intrusion EL element inside effectively, and seek the long lifetime of EL element.
In addition, the present inventor reaches the above-mentioned the 2nd purpose to have carried out research with great concentration, found that: for the EL element sealing plate of glass, its middle body is processed to concavity, so that limit peripheral projection portion at peripheral part, the end face of this peripheral projection portion is bonded on the substrate that is laminated with the EL duplexer, in such EL element is used sealing plate, if the medial surface in peripheral projection portion is equipped with hygroscopic agent, then because on the medial surface of peripheral projection portion, set hygroscopic agent, so can suppress EL stacked film deterioration, and can fully obtain the light that comes from luminescent layer.
The present invention finishes based on the result of above-mentioned research.
Describe with sealing plate below with reference to the EL element of drawing with regard to the 1st embodiment of the present invention.
Fig. 1 be EL element with the 1st embodiment of the present invention with sealing plate the sectional view of EL element.
In Fig. 1, EL element 100 adopts the bottom-emission structure, by the tabular transparent alkali-free glass system substrate 10 of square, the thickness 1.0mm of big or small 7.0cm, be formed with the folded body 20 of organic EL layer and fold the sealing plate 30 that body 20 forms and constituted by covering this organic EL layer on substrate 10.
On the lower surface 33 of the recess 32 of sealing plate 30, be coated with molecular sieve 50 (manufacturing of ユ ニ オ Application カ one バ イ De company) for absorbing moisture.In addition, during the coating of molecular sieve 50 and sealing plate 30 and substrate 10 when bonding, be the influence of eliminating moisture or oxygen, preferably in dry atmosphere or under reduced pressure carry out.
In addition, the present embodiment is used as hygroscopic agent with only molecular sieve 50, but the present invention is not limited to this, for example silica gel (SiO
2), デ シ カ イ ト (desiccant, clay class drier), calcium chloride, calcium oxide, calcium silicates etc. also be fine.
The folded body 20 of organic EL layer forms on substrate 10, the nesa coating 21 that constitutes by the ITO film of thickness 300nm, luminescent layer described later and by the folded film 22 of the organic EL layer on the surface that is layered in this nesa coating 21, organic EL layer fold that the surface of film 22 forms by the backplate 23 of the Mg-Ag alloy composition of thickness 300nm and be connected the extraction electrode of forming by the ITO film of thickness 300nm on this backplate 23 24 and constituted.
The folded film 22 of organic EL layer is to be according to the hole transporting layer of the earlier stacked thickness 70nm that is made up of triphenyldiamine, the such sequential cascade of luminescent layer of the stacked thickness 70nm that is made up of the oxyquinoline aluminium complex forms again from nesa coating 21 1 sides.And then overleaf between electrode 23 and the luminescent layer, also can dispose the transparent electron supplying layer of forming by triazole or oxadiazole.
The employed etching solution of described wet etching contains in right amount the group of the inorganic acid of forming from sulfuric acid, hydrochloric acid, nitric acid and phosphoric acid and selects at least a kind acid preferably in the hydrofluoric acid of 5～50 quality %.Can increase etch capabilities thus.In addition, the strong acid of selecting from the group of these inorganic acids can be a kind of, also can be 2 kinds or above mixture.
In addition, described etching solution preferably contains a kind, 2 kinds or above organic acid or the alkaline species material of selecting in right amount from the group that carboxylic acids, omega-dicarboxylic acids, amine and amino acid are formed.In addition, in described etching solution, also surfactant can be suitably added, also the surfactant that is added can be suitably changed.
The composition of above-mentioned etching solution and concentration thereof can be according to the different of the composition of etching solution temperature and etched glass and kind in addition suitably change.In addition, when implementing etch processes, it also is effective shaking etched glass or applying low power ultrasonic wave.Can make etching solution become the solution of homogeneous thus.Moreover, when implementing etch processes, it also is effective taking out from etching solution and selecting to flood slightly at least a kind acid or a kind, 2 kinds of selecting from the group that carboxylic acids, omega-dicarboxylic acids, amine and amino acid are formed or above organic acid or the alkaline species material the group of water or the inorganic acid formed from sulfuric acid, hydrochloric acid, nitric acid and phosphoric acid.Can implement etch processes equably thus.
In described embodiment, as the method that forms recess 32 on the glass blanket, though use wet etching, the dry-etching method also is fine, and also is fine with dry-etching method and wet etching.
Wet etching can carry out batch process by the selection of liquid etching composition and etch temperature, thereby can improve the production efficiency of sealing plate 30.In contrast,, can not carry out batch process, have no alternative but to carry out individual and handle, thereby the production efficiency of sealing plate 30 be lower though the dry-etching method can accurately be carried out etch processes.
In addition, sealing plate 30 adopts the glass blanket of alkali-free glasss, but according to the formation of EL element 100, can adopt glass with lower alkali content, also can adopt soda lime glass or quartz glass etc.
The thickness of recess 32 bottoms of sealing plate 30 is preferably 0.3～1.1mm.When thickness was lower than 0.3mm, the intensity of recess 32 bottoms of sealing plate 30 was too small, and during greater than 1.1mm, and the intensity of sealing plate 30 is very big and can not seek the slimming of EL element 100.
According to the present embodiment, because the concavo-convex maximum of the end face of peripheral projection portion 31 is lower than 10 μ m, in the sealing-in part between substrate 10 and peripheral projection portion 31, it is even that the thickness of adhesive linkage 40 will become, can prevent the inside of moisture or oxygen intrusion EL element 100 effectively, and seek the long lifetime of EL element 100.
In the present embodiment, the folded film 22 of organic EL layer adopts passive configuration, has source structure also to be fine but adopt.In addition, in the present embodiment,, also can adopt the top light emitting structure though organic EL 100 adopts the bottom-emission structure.
In addition, the folded film 22 of organic EL layer has adopted the structure of being made up of hole transporting layer and luminescent layer, but also can adopt by hole transporting layer, luminescent layer and the structure be made up of the electron supplying layer that triazole or oxadiazole are formed.
Moreover the EL stacked film also can replace the folded film 22 of organic EL layer with inorganic EL stacked film.At this moment, can adopt the structure of forming according to the order of insulating barrier, luminescent layer, insulating barrier from nesa coating one side, also can adopt the structure of forming according to the order of electronic barrier layer, luminescent layer, current-limiting layer from nesa coating one side.
The EL element 100 employed sealing plates 30 of Fig. 1, except that being narrated above resembling by individual handle make, can also be from Fig. 2 down be used to produce cutting on the mother glass substrate of a plurality of sealing plates.
Fig. 2 is formed the plane graph that the mother glass substrate of a plurality of sealing plates is produced in roughly rectangular being used to for the EL element 100 employed sealing plates 30 of Fig. 1.
In Fig. 2, being used to of long 30cm, wide 40cm the mother glass substrate 200 of producing a plurality of sealing plates have processing and be arranged in 5 * 6 rectangular sealing plate 30.
As the rectangular method that on the glass blanket, sealing plate 30 is formed 5 * 6, have by comprising wet etching and the predetermined portions of glass blanket is removed the method that becomes concavity at interior etching method.Employed glass blanket is considered from the operability aspect, its thickness be preferably in 0.5mm or more than, consider that from the slimming aspect of EL element 100 its thickness is preferably in 1.1mm or following.
This method can be described below: at first; on the glass blanket that alkali-free glass (for example NA-35 etc.) is made; cover processing so that make the rectangular of exposed portions serve formation 5 * 6 by the wide banded protective layer of 2.5mm; the glass blanket that then this was carried out covering processing flooded in above-mentioned etching solution about about 10～180 minutes; so just, by the residual lower convexity of glass blanket portion 101; predetermined portions is removed and become concavity, just formed recess 102.This glass blanket is peeled off protective layer after fully cleaning with pure water.
Because be to adopt wet etching that the predetermined portions of glass blanket is removed in this wise and become concavity, thus can make the lower surface of sealing plate 30 recesses 32 become smooth really, and the intensity of sealing plate 30 is increased to resist external pressure.
Then will be as above-mentioned, recess 102 is processed to the mother glass substrate 200 that a plurality of sealing plates are produced in 5 * 6 rectangular being used to, and cuts off along the position of the lug boss 101 that limits recess 102.Can obtain for example individual sealing plate 30 in EL element 100 employed 30 (5 * 6) of aftermentioned Fig. 2 like this.
In described embodiment, as the method that on the glass blanket, forms recess 102,, also can be the dry-etching method, perhaps also with dry-etching method and wet etching though adopt wet etching.
Being used to produce the mother glass substrate 200 of a plurality of sealing plates, sealing plate 30 being arranged in rectangular, but so long as be suitable for a plurality of obtaining, also can be the arrangement beyond rectangular.
In addition, the width of protective layer is not limited to 2.5mm, so long as the width of the peripheral projection portion 31 of the sealing plate of obtaining 30 for guaranteeing the allowance of sealing plate 30, also can be about 1cm more than or equal to the thickness of this peripheral projection portion 31 just.
The mother glass substrate 200 that is used to produce a plurality of sealing plates according to Fig. 2, can obtain each sealing plate 30 by cutting off separation, thereby the external pressure when the intensity increase is cut off to resist, and avoided carrying out individual and handled, the production efficiency of sealing plate 30 is improved.
EL element with regard to the 2nd embodiment of the present invention describes with sealing plate with reference to the accompanying drawings.
The EL element of the present embodiment has the formation same with the EL element of the 1st embodiment basically.Therefore, put on same symbol, and explanation is saved for same formation.
Fig. 5 be EL element with the 2nd embodiment of the present invention with sealing plate the sectional view of EL element.
In Fig. 5, top emission type organic EL 100a adopts passive configuration, is constituted by tabular transparent soda lime glass substrate 10a, the folded body 20a of organic EL layer that forms on substrate 10a of square, the thickness 1.0mm of big or small 7.0cm and by covering the sealing plate 30a that the folded body 20a of this organic EL layer forms.
Moreover sealing plate 30a has the sheets of glass 311 that the alkali-free glass of square, the thickness 0.1mm of big or small 5.0cm is made on the end face of the 31a of peripheral projection portion.This sheets of glass 311 meanwhile, is also keeping aforesaid molecular sieve 50 at the square peristome that central authorities have the etched 4.5cm that processes.
The opening edge 312 of this sheets of glass 311 highlights to the inside from the medial surface 313 of the 31a of peripheral projection portion.The molecular sieve 50 that keeps by this opening edge 312 is configured on the medial surface 313 of the 31a of peripheral projection portion.
The formation of the recess 32a of sealing plate 30a is undertaken by adopting wet etching described later that the glass blanket is processed into concavity.To the result that the etch depth that adopts the etched glass blanket of this wet etching is measured, show that this etch depth is 300 μ m.In addition, in the corner, bottom surface of recess 32a crooked position is arranged, its radius of curvature is about 300 μ m.The bottom thickness of the recess 32a of sealing plate 30a is preferably 0.3～1.1mm.When thickness was lower than 0.3mm, the intensity of sealing plate 30a was insufficient, and during greater than 1.1mm, the intensity of sealing plate 30a can obtain fully, but can not seek the slimming of EL element 100.
Fig. 6 is the flow chart of the manufacture method of sealing plate 30a in the presentation graphs 5.
In Fig. 6, at first prepare glass blanket and sheets of glass 311 (step S21).Here, for forming above-mentioned opening edge 312, the material of sheets of glass 311 is preferably the etching speed material slower than glass blanket.
Secondly, sheets of glass 311 is bonded in (step S22) on the glass blanket.This glass blanket and sheets of glass 311 bonding is to adopt sheets of glass 311 to be heated near the softening temperature of glass blanket and the method that is welded together is mutually carried out.
Moreover, adopt wet etching, the middle body that is bonded with the glass blanket of sheets of glass 311 carved from sheets of glass 311 1 lateral erosion be processed into concavity (step S23), so that limit the 31a of peripheral projection portion at peripheral part, the medial surface 313 at the 31a of peripheral projection portion sets molecular sieve 50 (step S24) then.
The wet etching of described step S23; exactly for the square middle body of the 4.5cm that exposes the glass blanket that is bonded with sheets of glass 311; with the acid resistance adhesive tape is after protective layer covers processing, with this glass blanket that covers for example be immersed in form by the mixed liquor of the neopelex of the hydrofluoric acid of 20 quality % and 1 quality %, remain in 25 ℃ the etching solution.
In addition, the etching solution that described wet etching adopted is not limited to described etching solution, also can adopt the etching solution the same with the 1st embodiment.The composition and the concentration thereof that resemble etching solution as described above can be according to temperature and the composition of etched glass and the different and suitable in addition changes of kind of etching solution.In addition, when implementing etch processes, it also is effective shaking etched glass or applying low power ultrasonic wave.Can make etching solution become the solution of homogeneous thus.Moreover, when implementing etch processes, it also is effective taking out from etching solution and selecting to flood slightly at least a kind acid or a kind, 2 kinds of selecting from the group that carboxylic acids, omega-dicarboxylic acids, amine and amino acid are formed or above organic acid or the alkaline species material the group of water or the inorganic acid formed from sulfuric acid, hydrochloric acid, nitric acid and phosphoric acid.Can implement etch processes equably thus.
Fig. 7 is the flow chart of other manufacture method of sealing plate 30a in the presentation graphs 5.
In Fig. 7, at first prepare glass blanket and sheets of glass 311 (step S31).
Secondly, adopt described wet etching, the middle body etching and processing of glass blanket is become concavity, so that limit the 31a of peripheral projection portion (step S32) at peripheral part; Adopt described wet etching again, the recess 32a of the glass blanket of crossing from etching and processing carries out etching and processing to sheets of glass 311, has the little peristome of aperture area (step S33) so that make it in central authorities.
Moreover, glass blanket and sheets of glass 311 that described etching and processing is crossed are bonded together, so that the opening edge 312 that makes sheets of glass 311 highlights (step S34) to the inside from the medial surface 313 of the 31a of peripheral projection portion, on the medial surface 313 of the 31a of peripheral projection portion, set molecular sieve 50 (step S35) then.
According to the present embodiment, because on the medial surface 313 of the 31a of peripheral projection portion, set molecular sieve 50, thus can suppress the deterioration of the folded film 22a of organic EL layer, and can fully obtain the light that comes from luminescent layer.
In the present embodiment, organic EL 100a adopts the passive structure.But the present embodiment is not limited thereto, and also can adopt the active type structure
According to the present embodiment, sealing plate 30a remains on molecular sieve 50 on the medial surface 313 of the 31a of peripheral projection portion by the sheets of glass on the end face that is arranged on the 31a of peripheral projection portion 311, but the present embodiment is not limited thereto, for example as shown in Figure 8, also can sheets of glass be set and with adhesive linkage 40 as the maintenance means.
The present embodiment is used as sealing plate 30a glass blanket with soda lime glass, but can adopt glass with lower alkali content, alkali-free glass, quartz glass etc. according to the structure of organic EL 100a.
In the present embodiment, as sheets of glass 311, but the present embodiment is not limited thereto, and for example can be the alkali-free glass of thickness 0.05～1.1mm with the alkali-free glass of thickness 0.1mm.
In the present embodiment, as sheets of glass 311, but the present embodiment is not limited thereto, and for example can be glass with lower alkali content, soda lime glass, quartz glass etc. with alkali-free glass.
In the present embodiment, as hygroscopic agent, but the same with the 1st embodiment, the present embodiment is not limited thereto with only molecular sieve 50.
In the present embodiment, glass blanket and sheets of glass 311 bonding is to adopt sheets of glass 311 to be heated near the softening temperature of glass blanket and the method that is welded together is mutually carried out, but the present embodiment is not limited thereto, bonding between glass blanket and the sheets of glass 311 also can be undertaken by low-melting glass, and it is bonding to adopt bonding agent to carry out.
In the present embodiment, as the method that forms recess 32a on the glass blanket, though use wet etching, the same with the 1st embodiment, the dry-etching method also is fine, and also is fine with dry-etching method and wet etching.
As the EL stacked film, but the same with the 1st embodiment, the present embodiment is not limited thereto the present embodiment with the folded film 22 of organic EL layer.
The sealing plate 30a that the organic EL 100a of Fig. 8 is adopted, except that being narrated above resembling by individual handle make, can also be the same with the 1st embodiment, cut from the mother glass substrate 200 that is used to produce a plurality of sealing plates.
In addition, the shape after the mother glass substrate 200 that is used to produce a plurality of sealing plates cuts off preferably with the same shape of described sealing plate 30a.
In addition, processing method as the mother glass substrate 200 that is used to produce a plurality of sealing plates, both can be with the rectangular method that on described glass blanket, sealing plate 30a is processed into 5 * 6, be applicable to the sheets of glass 311 that do not form peristome bonding glass blanket, also peristome can be processed to the recess 32a that rectangular sheets of glass is bonded in as shown in Figure 5 and be processed on the rectangular glass blanket.
The mother glass substrate 200 that is used to produce a plurality of sealing plates according to Fig. 5, can obtain each sealing plate 30a by cutting off separation, external pressure when the intensity increase is cut off to resist, and avoided carrying out individual and handled, thereby the production efficiency of sealing plate 30a is improved.
The following describes the embodiment of the present invention's the 1st embodiment.
The present inventor adopts wet etching (embodiment 1), pressure application (comparative example 1), sand-blast (comparative example 2) respectively, has made according to the following steps to recess being limited to middle body to make peripheral part have the sealing plate experiment slice (embodiment 1 and comparative example 1～2) (seeing Table 1) of peripheral projection portion.
Table 1
| The recess processing method | Concavo-convex maximum | Brightness partly subtract the life-span | The situation that driving voltage rises | |
| Embodiment 1 | Wet etching | Be lower than 10 μ m | 5000 hours | Little (12V) |
| Comparative example 1 | | 10 μ m or more than | 2000 hours | (25V) greatly |
| Comparative example 2 | Sand-blast | - | 2500 hours | (25V) greatly |
At first, the etching solution that preparation is made up of the mixed liquor of the neopelex of the hydrofluoric acid of 20 quality % and 1 quality %, cover square by big or small 5.0cm with acidproof adhesive tape then, the outer surface of the glass blanket that the alkali-free glass of thickness 0.70mm (NA-35) constitutes, processing is covered in periphery surface and peripheral projection portion, again with this glass blanket dipping 60 minutes in remaining on 25 ℃ described etching solution, from etching solution, take out, after fully cleaning with pure water, by peeling off the acid resistance adhesive tape, so that on the glass blanket, be processed to form the recess of the degree of depth 300 μ m and the peripheral projection portion of width 2.5mm, thus obtained sealing plate experiment slice.
According to these sealing plates of obtaining the result of experiment slice test, the concavo-convex maximum of the end face of peripheral projection portion is lower than 10 μ m, with it as embodiment 1.
Secondly, the glass blanket of the NA-35 of thickness 0.50mm is heated near the operating temperature on one side, push with carbon system casting mold on one side, just the recess of the degree of depth 300 μ m and the peripheral projection portion of width 2.0mm on the glass blanket of this NA-35, have been processed to form, thereby obtained sealing plate experiment slice, with its as a comparative example 1.As carbon system casting mold, make it to have small concavo-convex casting mold for preventing that sintering from adopting, so the sealing plate of comparative example 1 in the experiment slice, be not limited to central indentation even the end face of peripheral projection portion also transfer printing carbon system casting mold small concavo-convex, the concavo-convex maximum of the end face of peripheral projection portion has surpassed 10 μ m.
Moreover, on the glass blanket of the NA-35 of thickness 0.70mm, implement blasting treatment, just on the glass blanket of this NA-35, be processed to form the recess of the degree of depth 300 μ m and the peripheral projection portion of width 2.0mm, thus obtained sealing plate experiment slice, with its as a comparative example 2.The sealing plate of comparative example 2 in the experiment slice, produce the distinctive fine crack of many sand-blasts in central indentation, but the concavo-convex maximum of the end face of peripheral projection portion is being kept the concavo-convex of NA-35 glass blanket, not necessarily be lower than 10 μ m.
Follow peripheral projection portion at the sealing plate experiment slice of embodiment 1 and comparative example 1～2, be coated with an amount of ultraviolet hardening epoxy resin system bonding agent respectively, the sealed portion branch that forms between glass substrate and peripheral projection portion from two side direction of glass substrate and sealing plate experiment slice applies 980N/m then
2(100kg/m
2) about power, simultaneously with ultraviolet irradiation on bonding agent, just the sealed portion between glass substrate and peripheral projection portion is divided and have been formed adhesive linkage thus, thereby has produced organic EL.
With the organic EL made like this at 10mA/cm
2Drive current under carry out Continuous Drive, and measure brightness partly subtract the life-span.Its measurement result is as shown in table 1.
As can be seen from Table 1:
Embodiment 1
The whole zone of the sealing-in part of embodiment 1 between substrate and peripheral projection portion, the thickness of adhesive linkage is homogeneous, the life-span that partly subtracts of brightness reaches 5000 hours, shows the very high life-span.
In addition, the driving voltage at initial stage is 8V, and when increasing along with driving time, brightness descends, and just needs the rising driving voltage for keeping brightness, but just can keep brightness as long as the driving voltage at initial stage is elevated to 12V.
Comparative example 1
In comparative example 1 because in the end face transfer printing of peripheral projection portion carbon system casting mold small concavo-convex, so the part of the sealing-in between substrate and peripheral projection portion can not form the adhesive linkage of homogeneous, partly subtracting the lost of life is 2000 hours.In addition, though the driving voltage at initial stage the same with embodiment be 8V, for keep brightness just the driving voltage at initial stage need be elevated to 25V or more than.
Comparative example 2
In comparative example 2,,, can not make organic EL so adhesive linkage was squeezed when forming and experiment slice is broken owing to there is the fine cracks that produces because of sandblast.
So, when forming adhesive linkage, apply 490N/m
2(50kg/m
2) about power make organic EL.But under this condition, represented as the adhesive linkage 40 of Fig. 3, can not form the adhesive linkage of homogeneous in sealing-in part, the lost of life that partly subtracts of brightness is 2500 hours.In addition, though the driving voltage at initial stage the same with embodiment be 8V, in order to keep brightness, the driving voltage at initial stage need be elevated to 25V or more than.
According to present embodiment as can be known, if the concavo-convex maximum of the end face of peripheral projection portion is lower than 10 μ m, the thickness of the adhesive linkage of the sealing-in part between substrate and the peripheral projection portion is become evenly, can prevent moisture or oxygen intrusion EL element inside effectively and seek the long lifetime of EL element.
The following describes the embodiment of the 2nd embodiment of the present invention.
The present inventor has made at the medial surface 313 of the 31a of peripheral projection portion and has set the organic EL 100a (embodiment 2 (Fig. 5) and embodiment 3 (Fig. 8)) of molecular sieve 50 and be not equipped with the organic EL 100a (comparative example 3) of molecular sieve 50 on the medial surface 313 of the 31a of peripheral projection portion.Here, the organic EL 100a of embodiment 2 has the sheets of glass 311 for keeping molecular sieve 50 to be provided with on the end face of the 31a of peripheral projection portion.
Go up irradiation ultraviolet radiation to the organic EL 100a that makes like this, at 10mA/cm
2Drive current under carry out Continuous Drive, and measured situation about rising and brightness for the driving voltage of keeping initial stage brightness partly subtract the life-span, its measurement result is as shown in table 2.
Table 2
| Molecular sieve | Sheets of glass | Brightness partly subtract the life-span | The situation that driving voltage rises | |
| Embodiment 2 | Have | Have | 6000 hours | Little (4V) |
| Embodiment 3 | Have | Do not have | 4000 hours | Little (7V) |
| Comparative example 3 | Do not have | Do not have | 500 hours | (12V) greatly |
As can be seen from Table 2:, just can suppress the deterioration of the folded film 22a of organic EL layer, and can obtain the light that comes from luminescent layer fully if on the medial surface 313 of the 31a of peripheral projection portion, set molecular sieve 50.
It can also be seen that in addition: if use sealing plate to obtain using with the sheets of glass 311 that on the end face of the 31a of peripheral projection portion, maintains molecular sieve 50, then can suppress the deterioration of the folded film 22a of organic EL layer really, and can obtain the light that comes from luminescent layer fully.
As top describe in detail, the EL element sealing plate of the 1st scheme according to the present invention, because the concavo-convex maximum of the end face of peripheral projection portion is lower than 10 μ m, so can make the thickness of the adhesive linkage of the sealing-in part between substrate and the peripheral projection portion become even, can prevent moisture or oxygen intrusion EL element inside effectively, and seek the long lifetime of EL element.
According to the EL element sealing plate of the 1st scheme, because middle body adopts etching method to be processed to concavity, so can the bottom surface of central indentation be processed smoothly.
According to the EL element sealing plate of the 1st scheme, because etching method is a wet etching, so can the bottom surface of central indentation be processed more smoothly.
According to the mother glass substrate that is used to produce a plurality of sealing plates of the 1st scheme rectangular because described glass EL element roughly is processed to sealing plate, thereby make EL element with sealing plate production efficiency be improved.
In addition, as top describe in detail, the EL element sealing plate of the 2nd scheme according to the present invention because the medial surface of peripheral projection portion is equipped with hygroscopic agent, so can suppress the deterioration of EL stacked film, and can fully obtain the light that comes from luminescent layer.
According to the EL element sealing plate of the 2nd scheme,, when its central authorities have peristome, also has the maintaining part that keeps hygroscopic agent, so can suppress the deterioration of EL stacked film really because on the end face of peripheral projection portion.
According to the EL element sealing plate of the 2nd scheme, because the opening edge of maintaining part highlights to the inside from the medial surface of peripheral projection portion, so can keep hygroscopic agent really.
Be used to produce the mother glass substrate of a plurality of sealing plates according to the EL element of the 2nd scheme, roughly rectangular because described sealing plate is formed, so can give play to the effect same with described effect.
According to the EL element of the 2nd scheme with sealing plate manufacture method, at first prepare glass blanket and the etching speed sheets of glass slower than glass blanket, sheets of glass is bonded on the glass blanket, the glass blanket that will be bonded with sheets of glass is then carved from sheets of glass one lateral erosion at middle body and is processed into concavity, so that limit peripheral projection portion at peripheral part, so the etching of glass blanket and sheets of glass is carried out simultaneously, can be made the EL element sealing plate at an easy rate.
According to the EL element of the 2nd scheme with sealing plate manufacture method because the bonding of glass blanket and sheets of glass is to adopt the method for heat welded to carry out, so glass blanket and sheets of glass can be bonded together reliably.
According to the EL element of the 2nd scheme with sealing plate manufacture method because heat welded undertaken by low-melting glass between glass blanket and sheets of glass, so glass blanket and sheets of glass can be bonded together more reliably.
According to the EL element of the 2nd scheme with sealing plate manufacture method because bonding employing bonding agent carries out, just can glass blanket and sheets of glass is bonding so need not heat.
Claims (17)
1. glass sealing plate for electroluminescent device, the middle body of sealing plate is processed to concavity, so that limit peripheral projection portion at peripheral part, the end face of this peripheral projection portion is to be bonded on the substrate by bonding agent, thereby the stacked body of electroluminescence that will be layered on this substrate covers, and it is characterized in that: the concavo-convex maximum of the end face of described peripheral projection portion is lower than 10 μ m.
2. sealing plate for electroluminescent device as claimed in claim 1 is characterized in that: described middle body is to adopt etching method to be processed into concavity.
3. sealing plate for electroluminescent device as claimed in claim 2 is characterized in that: described etching method is a wet etching.
4. mother glass substrate that is used to produce a plurality of sealing plates, it is characterized in that: sealing plate for electroluminescent device as claimed in claim 1 is formed roughly rectangular.
5. glass sealing plate for electroluminescent device, its middle body is processed to concavity, so that limit peripheral projection portion at peripheral part, the end face of this peripheral projection portion is bonded on the substrate that is laminated with the stacked body of electroluminescence, it is characterized in that: the medial surface in described peripheral projection portion is equipped with hygroscopic agent.
6. sealing plate for electroluminescent device as claimed in claim 5 is characterized in that: described hygroscopic agent is a molecular sieve.
7. sealing plate for electroluminescent device as claimed in claim 5 is characterized in that: the end face in described peripheral projection portion has peristome in the central, and has the maintaining part that keeps described hygroscopic agent.
8. sealing plate for electroluminescent device as claimed in claim 7 is characterized in that: the opening edge of described maintaining part highlights to the inside from the medial surface of described peripheral projection portion.
9. sealing plate for electroluminescent device as claimed in claim 7 is characterized in that: described maintaining part is that the alkali-free glass by thickness 0.05～1.1mm makes.
10. mother glass substrate that is used to produce a plurality of sealing plates, it is characterized in that: sealing plate for electroluminescent device as claimed in claim 5 is formed roughly rectangular.
11. the manufacture method of a sealing plate for electroluminescent device is characterized in that: prepare glass blanket and etching speed than the slow sheets of glass of described glass blanket; Described sheets of glass is bonded on the described glass blanket; The described glass blanket that is bonded with described sheets of glass is processed into concavity at middle body from described sheets of glass one lateral erosion quarter, so that limit peripheral projection portion at peripheral part; Medial surface in described peripheral projection portion sets hygroscopic agent.
12. the manufacture method of sealing plate for electroluminescent device as claimed in claim 11 is characterized in that: described bonding be to adopt the method for heat welded to carry out.
13. the manufacture method of sealing plate for electroluminescent device as claimed in claim 12 is characterized in that: described heat welded is undertaken by low-melting glass between described glass blanket and described sheets of glass.
14. the manufacture method of a sealing plate for electroluminescent device is characterized in that: prepare glass blanket and sheets of glass; Described glass blanket is become concavity in the middle body etching and processing, so that limit peripheral projection portion at peripheral part; Described sheets of glass is carried out etching and processing, so that make it to have the little peristome of aperture area of the recess of the described glass blanket of crossing than etching and processing in central authorities; The described sheets of glass that described glass blanket of again etching and processing being crossed and etching and processing are crossed is bonded together, so that the opening edge that makes described peristome highlights to the inside from the medial surface of described peripheral projection portion; Medial surface in described peripheral projection portion sets hygroscopic agent.
15. the manufacture method of sealing plate for electroluminescent device as claimed in claim 14 is characterized in that: described bonding be to adopt the method for heat welded to carry out.
16. the manufacture method of sealing plate for electroluminescent device as claimed in claim 15 is characterized in that: described heat welded is undertaken by low-melting glass between described glass blanket and described sheets of glass.
17. the manufacture method of sealing plate for electroluminescent device as claimed in claim 11 is characterized in that: described bonding employing bonding agent carries out.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP203924/2002 | 2002-07-12 | ||
| JP2002203924A JP2004047309A (en) | 2002-07-12 | 2002-07-12 | Sealing plate for electroluminescence element, and mother glass substrate for multi-chamferming of the sealing plate |
| JP2002248573A JP2004087369A (en) | 2002-08-28 | 2002-08-28 | Sealing plate for el element and its manufacturing method, as well as mother glass substrate for multiple arrangement of seal plate |
| JP248573/2002 | 2002-08-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1669363A true CN1669363A (en) | 2005-09-14 |
Family
ID=30117439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA038165600A Pending CN1669363A (en) | 2002-07-12 | 2003-07-11 | Sealing plate for electroluminescent device, method for manufacturing same, and mother glass substrate for multi-production of sealing plate |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR20050011009A (en) |
| CN (1) | CN1669363A (en) |
| TW (1) | TWI276365B (en) |
| WO (1) | WO2004008810A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8125146B2 (en) | 2006-01-27 | 2012-02-28 | Samsung Mobile Display Co., Ltd. | Organic light emitting display having a second frit portion configured to melt more easily than a frit portion |
| CN102448906A (en) * | 2009-07-03 | 2012-05-09 | 日本电气硝子株式会社 | Element sealing body and method for producing the same |
| US9004972B2 (en) | 2006-01-20 | 2015-04-14 | Samsung Display Co., Ltd. | Organic light-emitting display device with frit seal and reinforcing structure |
| CN106797684A (en) * | 2014-10-17 | 2017-05-31 | 株式会社半导体能源研究所 | The manufacture method of light-emitting device, module, electronic equipment and light-emitting device |
| CN109301084A (en) * | 2018-09-28 | 2019-02-01 | 京东方科技集团股份有限公司 | Encapsulating structure, electronic device and packaging method |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100729653B1 (en) * | 2006-03-03 | 2007-06-19 | (주)나노닉스 | Method for preparing cover glass for encapsulating organic electroluminescent diode |
| KR101015848B1 (en) | 2009-02-09 | 2011-02-23 | 삼성모바일디스플레이주식회사 | Organic light emitting diode display |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61177395U (en) * | 1985-04-22 | 1986-11-05 | ||
| JPS6276187A (en) * | 1985-09-28 | 1987-04-08 | 富士通株式会社 | Manufacturing thin film el panel |
| JP2002160932A (en) * | 2000-11-17 | 2002-06-04 | Sony Corp | Method of producing glass substrate, glass substrate, and electronic device having the glass plate |
| JP2002260849A (en) * | 2001-03-06 | 2002-09-13 | Tohoku Pioneer Corp | Sealing cover for organic el device |
| JP2003007452A (en) * | 2001-06-20 | 2003-01-10 | Nippon Seiki Co Ltd | Organic el panel |
| JP2003173868A (en) * | 2001-09-28 | 2003-06-20 | Sanyo Electric Co Ltd | Manufacturing method of electroluminescent panel |
| JP3865056B2 (en) * | 2002-01-22 | 2007-01-10 | セイコーエプソン株式会社 | Manufacturing method of sealing substrate |
| JP2003243162A (en) * | 2002-02-12 | 2003-08-29 | Seiko Epson Corp | Manufacturing method and device of electro-optic device, electro-optic device and electronic apparatus |
| JP3975779B2 (en) * | 2002-03-01 | 2007-09-12 | 株式会社日立製作所 | Organic electroluminescence device and manufacturing method thereof |
-
2003
- 2003-07-11 KR KR10-2005-7000609A patent/KR20050011009A/en not_active Application Discontinuation
- 2003-07-11 WO PCT/JP2003/008818 patent/WO2004008810A1/en active Application Filing
- 2003-07-11 CN CNA038165600A patent/CN1669363A/en active Pending
- 2003-07-11 TW TW092119031A patent/TWI276365B/en not_active IP Right Cessation
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9004972B2 (en) | 2006-01-20 | 2015-04-14 | Samsung Display Co., Ltd. | Organic light-emitting display device with frit seal and reinforcing structure |
| US8125146B2 (en) | 2006-01-27 | 2012-02-28 | Samsung Mobile Display Co., Ltd. | Organic light emitting display having a second frit portion configured to melt more easily than a frit portion |
| CN102448906A (en) * | 2009-07-03 | 2012-05-09 | 日本电气硝子株式会社 | Element sealing body and method for producing the same |
| CN102448906B (en) * | 2009-07-03 | 2015-04-01 | 日本电气硝子株式会社 | Element sealing body and method for producing the same |
| CN106797684A (en) * | 2014-10-17 | 2017-05-31 | 株式会社半导体能源研究所 | The manufacture method of light-emitting device, module, electronic equipment and light-emitting device |
| US10270057B2 (en) | 2014-10-17 | 2019-04-23 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, module, electronic device, and method for manufacturing light-emitting device |
| US10629843B2 (en) | 2014-10-17 | 2020-04-21 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, module, electronic device, and method for manufacturing light-emitting device |
| US11189817B2 (en) | 2014-10-17 | 2021-11-30 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, module, electronic device, and method for manufacturing light-emitting device |
| US11778850B2 (en) | 2014-10-17 | 2023-10-03 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, module, electronic device, and method for manufacturing light-emitting device |
| CN109301084A (en) * | 2018-09-28 | 2019-02-01 | 京东方科技集团股份有限公司 | Encapsulating structure, electronic device and packaging method |
| CN109301084B (en) * | 2018-09-28 | 2020-06-16 | 京东方科技集团股份有限公司 | Packaging structure, electronic device and packaging method |
| US11805667B2 (en) | 2018-09-28 | 2023-10-31 | Boe Technology Group Co., Ltd. | Encapsulation structure, electronic apparatus and encapsulation method |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI276365B (en) | 2007-03-11 |
| KR20050011009A (en) | 2005-01-28 |
| WO2004008810A1 (en) | 2004-01-22 |
| TW200410588A (en) | 2004-06-16 |
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