CN1706042A - 表面安装的电气元件和用于安装并保持该电气元件的方法 - Google Patents

表面安装的电气元件和用于安装并保持该电气元件的方法 Download PDF

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CN1706042A
CN1706042A CNA038208369A CN03820836A CN1706042A CN 1706042 A CN1706042 A CN 1706042A CN A038208369 A CNA038208369 A CN A038208369A CN 03820836 A CN03820836 A CN 03820836A CN 1706042 A CN1706042 A CN 1706042A
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solder
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雅科夫·别洛波尔斯基
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Abstract

用于将电气元件(10，20)安装在基板(40)上并且牢固地保持这些元件(10，20)的方法。该方法包括在回流过程中改变置于元件保持销(25)和保持通孔(46)之间的钎焊膏组分。还披露了包括电路板(40)和安装在其上的电气元件(10)的电子组件。在其中一个电子组件的实施方案(10，20)中，在最初与所安装的电气元件(10，20)相连的材料转移到将这些电气元件(10，20)连接在电路板(40)上的钎焊膏中。

Description

表面安装的电气元件 和用于安装并保持该电气元件的方法
技术领域
本发明涉及其保持特性得到改善的表面安装的电气元件以及用于将电气元件安装和保持在基板上的方法。
背景技术
本领域已知有各种用于使元件例如连接器和集成电路器件与印刷电路板电连接的方法。表面安装技术作为节约成本的方法而日益被采用。表面安装技术的示例包括针栅阵列(PGA’s)、球栅阵列(BGA’s)、柱栅阵列(CGA’s)和基板栅格阵列(LGA’s)。通常在这些方法中，将钎焊膏引入到所要连接的表面之间，使钎焊膏回流然后冷却以形成一机械和导电连接。
如名称所暗示的一样，球栅阵列(BGA’s)采用了布置在电气元件的一侧上的焊料凸起或焊球的格栅或阵列来实现与印刷电路板的机械和电连接。焊球附着位置通常被称为焊盘或焊垫。利用通过屏蔽或遮蔽技术将钎焊膏设置在焊盘(和/或在焊球)上，然后将电气元件设置在电路板上，从而使焊球和焊盘对准。然后在足以使得焊料和至少一部分或所有焊球能够流动并且熔融的高温下处理该电路板，从而使在下面的焊盘/焊垫形成电气连接。例如参见受让给本专利的受让人的美国专利No.6325644和在那份专利内的所有专利，这些都结合到本专利作为参考。
可以采用从电气元件延伸出的定位销便于电气元件的初始对准。在沿着焊盘/焊垫的阵列周边的位置处将这些定位销插入到位于电路板的通孔中。销直径可以稍微大于相应的通孔直径，从而实现干涉配合。或者，销直径可以小于通孔直径。在该情况下，可以将粘接剂或钎焊膏施加在通孔中和其周围以使电气元件保持在基板上。
通过选择具有相对较小直径的定位销并且在通孔内施加焊料，从而使得BGA焊球能够在回流过程中漂浮(也就是说，没有受到严格限制)，从而导致自动对准和最终的低应力焊接头。但是当在回流热基本上消散之前操作该电路板时或者在使该电路板转动以便能够通过随后的回流步骤将其它电气元件安装在其它可用表面区域上时，该结构会损害元件保持力。
因此，需要这样一种将电气元件安装在基板上的方法，它提供了低应力焊接头同时在随后的双面操作期间和/或在第二回流步骤期间的处理中有效地保持着所安装的元件。
发明内容
本发明提供了用于将电气元件安装在基板上的方法。根据本发明的第一优选实施方案，提供了一种用于将电气元件安装并且保持在至少经过两个热循环的基板上的方法。该方法包括以下步骤：将第一焊料组分的钎焊膏设置到基板的保持通孔中；将从电气元件处延伸并且具有相对较小直径的保持销插入到保持通孔中；使该基板进行第一热循环，从而与保持通孔和保持销中的至少一个相连的材料转移到钎焊膏中以形成具有其熔点比第一焊料组分的熔点更高的混合焊料组分；然后使该基板进行其峰值温度小于所述混合焊料组分的熔点的第二热循环。
根据本发明的另一个优选实施方案，提供一种制作电子组件的方法。该方法包括以下步骤：提供包括具有壁的保持通孔的电路板；提供具有从中延伸出的保持销的电连接器，其中所述保持销其直径小于保持通孔并且由包含贵金属的材料制成；将第一焊料组分的钎焊膏设置到保持通孔中；将保持销插入到保持通孔中；并且使钎焊膏回流，从而在最初与保持销相连的至少一些贵金属转移到钎焊膏中以形成混合焊料组分。
根据本发明的再一个优选实施方案，提供一种用于将电气元件安装在基板的两个相对侧面上的方法。该方法包括以下步骤：提供包括第一和第二侧面以及第一和第二保持通孔的基板；提供包括从中延伸的第一保持销的第一电气元件，其中所述第一保持销其直径小于所述第一保持通孔的直径，并且在其上具有镀层材料；将具有第一焊料组分的钎焊膏设置到所述第一保持通孔中；将所述第一电气元件并置在基板的第一侧面上，并且将所述第一保持销插入到所述第一保持通孔中；加热该基板，从而至少一部分镀层材料从第一保持销转移到钎焊膏中，形成其熔点高于所述第一焊料组分的混合焊料组分；将第一焊料组分的钎焊膏设置到所述第二保持通孔中；提供包括从中延伸出的第二保持销的第二电气元件，其中所述第二保持销的直径小于所述第二保持通孔的直径；将所述第二电气元件并置在所述基板的第二侧面上，并且将所述第二保持销插入到所述第二保持通孔中；并且将所述基板加热至足以使得所述第一焊料组分回流并且低于所述混合焊料组分的熔点的温度。
本发明还提供了电子组件。根据本发明的一个优选实施方案，提供一种电子组件，它包括：一电路板，该电路板包括具有壁的保持通孔；安装在电路板上的一电气元件，它包括一外壳和从中延伸出的保持销，其中所述保持销设置在所述保持通孔中并且其直径小于所述保持通孔；以及回流焊料，它设置在所述保持通孔中并且包围着至少一部分所述保持销，其中回流焊料包括与保持销和保持通孔壁中的至少一个在最初相连的材料，并且其中回流焊料的熔点高于纯焊料的熔点。
根据本发明的另一个优选实施方案，提供一种电子组件，它包括：具有保持通孔的电路板；安装在该电路板上的电气元件，它具有一外壳和从中延伸出的保持销，其中所述保持销设置在所述保持通孔内并且其直径小于所述保持通孔；以及回流焊料，它设置在所述保持通孔中并且包围着所述保持销，其中所述回流焊料重量的至少大约0.5％为包括贵金属的添加剂。
根据本发明的再一个优选实施方案，提供一种电子组件，它包括：具有保持通孔的电路板；安装在该电路板上的电气元件，它具有一外壳和从中延伸出的保持销，其中所述保持销设置在所述保持通孔内，其直径小于所述保持通孔并且在其上具有镀层材料；以及回流焊料，它设置在所述保持通孔中并且包围着所述保持销，其中所述回流焊料包括从保持销转移的镀层材料重量的至少大约0.5％。
在附属的并且构成本申请的一部分的权利要求书中具体给出了具有新颖性的这些和各个其它特征及其相应的优点。但是，为了便于理解本发明的各个方面，应该参照构成其另一部分的附图，并且参照其中描述了优选实施方案的随后的说明内容。
附图说明
图1为设计并且构成用来表面安装在基板上的电子元件的立体图。
图2为包括表面安装焊盘的电路板的平面图。
图3为由本发明提供的电子组件实施方案的局部侧视图，显示出安装在电路板上的包括球栅阵列互连的电子连接器。
图4为由本发明提供的电子组件实施方案的局部立体图，显示出安装在电路板上的包括球栅阵列互连和设置在填充有焊料的通孔中的保持销的电子连接器。
图5为通过包围着保持销的焊料设置在基板保持通孔中的电子元件保持销的局部剖视图。
图6为由本发明提供的电子组件实施方案的局部立体图，它包括表面安装在电路板的两侧上的电子元件。
具体实施方式
本发明的优选实施方案涉及具有改善的保持特性的表面安装的电气元件及其制造方法。现在参照这些附图，其中相同的附图标记在全部视图中表示相应的结构，并且具体参照图1，该图显示出连接器形式的电气元件10，它包括一外壳20、从外壳下表面22延伸出的焊球21的一个阵列以及从外壳下表面22延伸出并且与焊球21间隔开的保持销25。每个焊球21与存在于外壳20内的多个传统端子(未示出)的一个的端部连接。这些端子的相对端部可以由电气元件例如集成芯片或相配的电连接器接合。
电连接器10适用于表面安装在基板例如在图2中所示的印刷电路板40上。印刷电路板40包括第一侧42、与焊球21的阵列对应地设置在该侧42上的焊盘或焊垫41的一个阵列以及其设计和构成用来容纳保持销25的保持通孔45。
参照图3和4，为了将电连接器10安装在电路板40上，首先将钎焊膏50施加在焊盘或焊垫41上，并且施加在保持通孔45中和/或其周围。可以采用许多本领域普通技术人员容易理解的技术例如丝网印刷术、屏蔽或遮蔽来施加钎焊膏。优选地，钎焊膏50为其熔点大约为183℃的锡铅共晶合金。电连接器10与电路板40并置，并且通过将保持销25插入到焊料容纳保持通孔45中而使各个焊球21与相应焊盘或焊垫41大体上对准。然后，优选在采用对流或辐射热源的固定或带式炉中使电路板/元件组件回流(进行热循环)。可以在选自包括干的氮气、合成气体或氢气组的环境中进行焊料回流。回流过程通常包括使电路板-元件组件受到峰值温度(或等于或高于钎焊膏熔点的温度)在15-150秒之间的时间内的热循环。回流过程是常规的并且在文献中有记载。
现在参照图5，优选地，保持销25具有小于保持通孔的直径46的直径26，从而使得要表面安装在该电路板上的元件能够浮动。例如，销直径26大约为0.9mm，而相应的通孔直径46大约为1.1mm；但是这些具体直径和这两个直径之间的差值可以更大或更小。该结构促进了焊球21与焊盘41的自动对准，并且导致低应力的焊接头。
在将电连接器10安装在电路板40上之后(如在图2中可以看出的一样)，最好在不会影响前面形成的焊接的情况下在高于钎焊膏50的熔点的温度下对电路板/元件组件进行进一步处理。本发明提供了方法实施方案，用来在最初元件安装期间或之后通过改变在保持通孔45内的焊料组分来改善采用了其直径小于通孔直径的保持销的所安装的电气元件的保持力。为了改变焊料组分，给保持销25镀上包含贵金属例如金、钯、铂、银、铑、铱、锇、钌或铼的材料。在第一次回流期间(或之后不久)，至少一部分贵金属镀层材料从保持销25转移并留在保持通孔45内的钎焊膏50中，由此形成包括有镀层材料构成的添加剂的混合焊料组分。由于存在添加剂，所以该混合焊料组分的熔点高于原始焊料组分的熔点(即，纯焊料的熔点)。优选地，该混合焊料组分的熔点应该比原始(或第一)组分的熔点高至少10℃。因此，可以将该电路板组件进一步处理至等于或高于第一焊料组分的熔点并且低于混合焊料组分的熔点的温度，而不用担心所安装的电气元件与电路板分开。
在可选实施方案中，可以用在最初回流过程期间或之后转移到钎焊膏中的材料镀覆保持通孔45的壁47(参见图5)。或者，可以通过用于转移到钎焊膏中的类似或不类似材料镀覆通孔壁47和保持销25。转移的材料也可以源自保持销和通孔壁的基底组分，而不是源自覆盖类似基底组分的镀层材料。优选地，保持销25是唯一的转移材料源。在优选实施方案中，保持销25由铅铜合金基底材料制成，并且具有厚度大约为0.00127至0.00635mm的镍的第一镀层和具有类似厚度的金或钯的第二镀层。
在将电气元件安装在电路板40的两侧42和43上时会出现这样一种情况，其中可以出现两个或多个回流步骤(两个热循环)。用于将电气元件安装在电路板的相对侧面上的优选方法实施例从将钎焊膏50施加在焊盘41以及位于电路板40的侧面42上的保持通孔45中和周围上的步骤开始。优选地，这时的焊料组分基本上由铅和锡构成。再次参照图4，通过将包括金或钯镀层的保持销25插入到包含焊料的通孔45中，从而使第一电气元件10与侧面42可动地连接。然后使电路板40进行其峰值温度大约为183℃的第一热循环以使钎焊膏50回流。在第一热循环期间，至少一部分金或钯镀层从保持销25转移并留在通孔45中的钎焊膏50中。现在，通孔45内的焊料组分包含锡、铅和金或钯，并且其熔点高于183℃。在回流焊料中的金或钯的量通常是变化的，并且在靠近保持销25处具有较高的浓度。在优选实施方案中，金或钯(或其它镀层材料)在回流焊料中的量至少为重量的大约0.5％。
现在参照图6，将该电路板40翻转，并且将侧面43准备用于在其上安装第二电气元件。将用于在电路板侧面42上安装电气元件10的相同钎焊膏50组分(基本上由铅和锡构成)施加在焊盘141以及位于电路板侧面43上的保持孔145中及其周围。按照与元件10类似的方式将包括焊球121的阵列和保持销125的第二电气元件110(与元件10类似或不同)可动地连接在电路板40上。对电路板40进行其峰值温度大约为183℃的第二热循环以使钎焊膏50回流。在第二热循环中，在保持通孔45中的回流焊料不会熔融，并且因此将第一电气元件10牢固地保持在电路板40上。在第二电气元件110上的保持销可以包括或不包括转移到留在保持通孔145中钎焊膏的材料。由于在从电气元件110中延伸出的保持销上(或者在通孔145的壁上)没有包含镀层材料，所以可以实现材料和加工上的成本节约。显然，如果在电气元件110上的保持销由包含贵金属的材料制成，则在第二热循环期间将有可能出现转移。
示例
示例1：
表1包括两个优选实施方案的参数以及在第一热循环之后计算出的焊料组分变化。
表1
  金镀层   钯镀层
  未镀覆的销直径，mm   0.90   0.90
  镀覆厚度，mm   0.0051   0.0051
  通孔直径，mm   1.10   1.10
  焊料体积，mm3   0.57   0.57
  转移量，体积百分比   60   40
  在回流焊料中的转移材料，体积百分比   6.10   4.20
  原始焊料熔点，℃   183   183
  改变后的焊料熔点，℃   226   235
示例2：
将直径为0.90mm的未镀覆保持销镀覆厚度大约为0.0051mm的金或钯。将共晶锡-铅钎焊膏施加在延伸穿过电路板的保持孔中及其周围。保持通孔其直径为1.10mm。将镀覆的保持销插入到保持通孔中，并且对该电路板进行足够的热循环以使钎焊膏回流。如图5中所示一样，在三个位置中获取改变后的焊料的试样：1)保持销附近-P1；2)保持通孔的壁附近-P3；以及3)中间位置-P2。通过质谱分析法来分析这些焊料试样。表2显示出在完成热循环之后在焊料中存在的镀层材料量(重量百分比)。
表2
  销的镀层材料 焊料采样位置 在焊料中的镀层材料量，重量百分比
  金 P1 14.88
  金 P2 5.84
  金 P3 4.58
  钯 P1 19.62
  钯 P2 6.05
  钯 P3 1.78
在表2中可以看出，镀层材料始终穿过设置在保持通孔内的焊料而扩散。也就是说，在焊料中的镀层材料没有与离材料源(保持销)最近的焊料区域隔离。另外，表2显示出一旦该材料从保持销滤出，金比钯更有效地穿过锡-铅焊料而扩散。
要理解的是，即使在前面的说明中与已经给出了本发明的许多特征和优点以及本发明的结构、制造和功能的细节，但是该内容只是举例性的。因此，在由所附权利要求表达的广义含义所表示的本发明原理范围内可以作出各种变化，尤其在结构特征的形状、尺寸和布置以及制造步骤的顺序方面作出各种变化。

Claims (34)

1.一种用于将电气元件安装并保持在受到至少两个热循环的基板上的方法，该方法包括以下步骤：
a)提供包括具有壁的保持通孔的基板；
b)提供具有从中延伸的保持销的电气元件，所述保持销的直径小于所述保持通孔的直径；
c)将第一焊料组分的钎焊膏设置在所述保持通孔中；
d)将所述保持销插入到所述保持通孔中；
e)使所述基板受到第一热循环，从而与所述保持通孔壁和所述保持销中的至少一个相连的材料转移到所述钎焊膏中以形成具有比所述第一焊料组分的熔点高的混合焊料组分；
f)使所述基板受到峰值温度小于所述混合焊料组分的熔点的第二热循环，由此使所述保持销牢固地保持在所述保持通孔中。
2.如权利要求1所述的方法，其中所述转移材料为最初设置在所述保持销上的镀层材料。
3.如权利要求2所述的方法，其中所述镀层材料包括钯。
4.如权利要求2所述的方法，其中所述镀层材料包括金。
5.如权利要求1所述的方法，其中所述转移材料为最初设置在所述保持通孔壁上的镀层材料。
6.如权利要求1所述的方法，其中所述转移材料包括最初设置在所述保持通孔壁和所述保持销上的镀层材料。
7.如权利要求1所述的方法，其中所述转移材料在所述保持通孔壁附近的焊料位置处的重量至少为大约0.5％。
8.一种制作电子组件的方法，包括以下步骤：
a)提供包括具有壁的保持通孔的电路板；
b)提供具有从中延伸的保持销的电连接器，所述保持销的直径小于所述保持通孔的直径并且由包括贵金属的材料制成；
c)将第一焊料组分的所述钎焊膏设置到所述保持通孔中；
d)将所述保持销插入到所述保持通孔中；并且
e)使所述钎焊膏回流，从而最初与所述保持销相连的至少一些贵金属转移到所述钎焊膏中以形成混合焊料组分。
9.如权利要求8所述的方法，其中所述混合钎焊膏组分的熔点比所述第一焊料组分的熔点至少高大约10℃。
10.如权利要求8所述的方法，其中所述第一焊料组分基本上由铅和锡构成。
11.如权利要求8所述的方法，其中所述贵金属为金。
12.如权利要求8所述的方法，其中所述贵金属为钯。
13.如权利要求8所述的方法，其中所述转移材料在所述混合焊料组分中成梯度分布。
14.如权利要求8所述的方法，其中在靠近所述保持通孔壁的焊料位置处的所述混合焊料组分包括转移材料重量的至少约0.5％。
15.如权利要求8所述的方法，其中在靠近所述保持销的焊料位置处的所述混合焊料组分包括转移材料重量的至少约15％。
16.一种用于将电气元件安装在基板的相对侧面上的方法，该方法包括以下步骤：
a)提供包括第一和第二侧面以及第一和第二保持通孔的基板；
b)提供包括从中延伸的第一保持销的第一电气元件，所述第一保持销的直径小于所述第一保持通孔的直径，并且在其上具有镀层材料；
c)将第一焊料组分的钎焊膏设置到所述第一保持通孔中；
d)将所述第一电气元件并置在所述基板的所述第一侧面上，并且将所述第一保持销插入到所述第一保持通孔中；
e)加热所述基板，从而所述镀层材料的至少一部分从所述第一保持销转移到所述钎焊膏中，形成熔点高于所述第一焊料组分熔点的混合焊料组分；
f)将所述第一焊料组分的钎焊膏设置到所述第二保持通孔中；
g)提供包括从中延伸的第二保持销的第二电气元件，所述第二保持销的直径小于所述第二保持通孔的直径；
h)将所述第二电气元件并置在所述基板的所述第二侧面上，并且将所述第二保持销插入到所述第二保持通孔中；并且
i)将所述基板加热至足以使所述第一焊料组分回流并低于所述混合焊料组分的熔点的温度。
17.如权利要求16所述的方法，其中所述第一焊料组分的熔点大约为180℃。
18.如权利要求16所述的方法，其中所述混合焊料组分的熔点大约为225℃。
19.如权利要求16所述的方法，其中所述镀层材料体积的至少约40％从所述保持销转移到所述钎焊膏中。
20.如权利要求16所述的方法，其中所述镀层材料包括钯。
21.如权利要求16所述的方法，其中所述镀层材料包括金。
22.如权利要求16所述的方法，其中所述第二保持销没有镀层材料。
23.一种电子组件，它包括：
一电路板，该电路板包括具有壁的保持通孔；
安装在所述电路板上的一电子元件，该电子元件包括一外壳和从中延伸的保持销，其中所述保持销设置在所述保持通孔中并且其直径小于所述保持通孔的直径；以及
在所述保持通孔中的混合焊料组分，该混合焊料组分包围着所述保持销的至少一部分，所述混合焊料组分包括与所述保持销和所述保持通孔壁中的至少一个最初相连的材料，该材料在回流过程中转移到设置于所述保持通孔中的第一焊料组分中，其中所述混合焊料组分的熔点高于所述第一焊料组分的熔点。
24.如权利要求23所述的电子组件，其中所述混合焊料组分的熔点比所述第一焊料组分的熔点高大约10℃。
25.如权利要求23所述的电子组件，其中在靠近所述保持销的位置处，所述混合焊料组分包括最初与所述保持销和所述保持通孔壁中的至少一个相连的材料重量的至少约10％。
26.如权利要求23所述的电子组件，其中在靠近所述通孔壁的位置处的所述混合焊料组分包括最初与所述保持销和所述保持通孔壁中的至少一个相连的材料重量的至少约0.5％。
27.如权利要求23所述的电子组件，其中最初与所述保持销和所述保持通孔壁中的至少一个相连的材料只与所述保持销最初相连。
28.如权利要求23所述的电子组件，其中最初与所述保持销和所述保持通孔壁中的至少一个相连的材料与所述通孔壁最初相连。
29.一种电子组件，其包括：
包括保持通孔的电路板；
安装在所述电路板上的电子元件，其具有一外壳和从中延伸的保持销，其中所述保持销设置在所述保持通孔内并且其直径小于所述保持通孔的直径；以及
回流焊料，其设置在所述保持通孔中并包围所述保持销，其中所述回流焊料的重量的至少大约0.5％为包括贵金属的添加剂。
30.如权利要求29所述的电子组件，其中所述贵金属为金。
31.如权利要求29所述的电子组件，其中所述贵金属为钯。
32.一种电子组件，其包括：
包括保持通孔的电路板；
安装在所述电路板上的电子元件，该电子元件包括一外壳和从中延伸的保持销，其中所述保持销设置在所述保持通孔内，其直径小于所述保持通孔的直径并且在其上具有镀层材料；以及
混合焊料组分，其设置在所述保持通孔中并包围所述保持销，其中所述混合焊料组分包括重量至少为大约0.5％的所述镀层材料，所述镀层材料在回流过程中从所述保持销转移到设置在所述保持通孔中的第一焊料组分，该第一焊料组分包括重量小于大约0.5％的所述镀层材料。
33.一种电子组件，其包括：
包括保持孔的电路板；
安装在所述电路板上的电子元件，所述电子元件包括一外壳和从中延伸的保持结构，所述保持结构设置在所述保持孔内；以及
混合焊料组分，其设置在所述保持孔中并且包围着所述保持结构，其中所述混合焊料组分包括重量至少为大约0.5％的镀层材料，所述镀层材料在回流过程中从所述保持孔和所述保持结构中的至少一个转移到设置在所述保持通孔中的第一焊料组分，该第一焊料组分包括重量小于大约0.5％的所述镀层材料。
34.一种电连接器，其包括：
一外壳；
多个从所述外壳的表面中延伸的焊料块；以及
至少一个用于接合电路基板的保持结构，所述至少一个保持结构从所述外壳的所述表面中延伸并且与所述多个焊球中的每一个间隔开，并且镀覆有包含贵金属的材料。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102137549B (zh) * 2010-01-26 2013-01-16 英业达股份有限公司 双面表面黏着型态的电路板的电子零组件布局方法

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6791845B2 (en) * 2002-09-26 2004-09-14 Fci Americas Technology, Inc. Surface mounted electrical components
US20040198082A1 (en) * 2003-04-07 2004-10-07 Victor Zaderej Method of making an electrical connector
CN1802883A (zh) * 2003-07-03 2006-07-12 株式会社日立制作所 组件装置及其制造方法
US7167375B2 (en) * 2004-01-16 2007-01-23 Motorola, Inc. Populated printed wiring board and method of manufacture
US7005742B2 (en) * 2004-02-05 2006-02-28 Texas Instruments Incorporated Socket grid array
JP2006339316A (ja) * 2005-05-31 2006-12-14 Toshiba Corp 半導体装置、半導体装置実装基板、および半導体装置の実装方法
JP4995527B2 (ja) * 2006-09-28 2012-08-08 日本電波工業株式会社 表面実装用の圧電発振器
KR20090067249A (ko) * 2007-12-21 2009-06-25 삼성전기주식회사 인쇄회로기판 및 그 제조방법
CN101568224B (zh) * 2008-04-22 2012-01-25 鸿富锦精密工业（深圳）有限公司 电路板及具有该电路板的电子装置
DE102008041497A1 (de) * 2008-08-25 2010-03-04 Robert Bosch Gmbh Bauteil mit einem mechanischen Kontakt und Verfahren zur Herstellung des Bauteils
US8210424B2 (en) * 2010-09-16 2012-07-03 Hewlett-Packard Development Company, L.P. Soldering entities to a monolithic metallic sheet
JP6236915B2 (ja) * 2013-06-25 2017-11-29 富士電機株式会社 はんだ付け方法および半導体装置の製造方法
US9564697B2 (en) * 2014-11-13 2017-02-07 Lear Corporation Press fit electrical terminal having a solder tab shorter than PCB thickness and method of using same
US10164361B2 (en) 2015-01-15 2018-12-25 Fci Usa Llc Separator for electrical assembly
DE102015214807A1 (de) * 2015-08-04 2017-02-09 Continental Automotive Gmbh PCB mit Pin-in-Paste (PIP) Montage
US9627784B1 (en) * 2015-12-01 2017-04-18 International Business Machines Corporation Method and apparatus for strain relieving surface mount attached connectors
US11521785B2 (en) * 2016-11-18 2022-12-06 Hutchinson Technology Incorporated High density coil design and process
US11387033B2 (en) 2016-11-18 2022-07-12 Hutchinson Technology Incorporated High-aspect ratio electroplated structures and anisotropic electroplating processes
CN108346952B (zh) * 2018-01-25 2020-11-24 番禺得意精密电子工业有限公司 电连接器固持装置
CN110396708A (zh) * 2019-08-07 2019-11-01 东莞市合航精密科技有限公司 一种银组合镀层的耐腐蚀性镀层

Family Cites Families (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4217024A (en) 1977-11-07 1980-08-12 Burroughs Corporation Dip socket having preloading and antiwicking features
ZA826825B (en) 1981-10-02 1983-07-27 Int Computers Ltd Devices for mounting integrated circuit packages on a printed circuit board
CH650373A5 (fr) * 1982-07-16 1985-07-15 Jean Paul Strobel Circuit imprime et procede de fabrication du circuit.
US4518112A (en) * 1982-12-30 1985-05-21 International Business Machines Corporation Process for controlled braze joining of electronic packaging elements
US4535955A (en) * 1983-03-31 1985-08-20 Morgan Construction Company Means for sensing an undesirable approach angle in a level wind coiler
US4647476A (en) * 1984-03-05 1987-03-03 General Electric Company Insulating glass body with electrical feedthroughs and method of preparation
US4878611A (en) 1986-05-30 1989-11-07 American Telephone And Telegraph Company, At&T Bell Laboratories Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate
US4767344A (en) 1986-08-22 1988-08-30 Burndy Corporation Solder mounting of electrical contacts
US5029748A (en) * 1987-07-10 1991-07-09 Amp Incorporated Solder preforms in a cast array
JPH0228990A (ja) 1988-07-19 1990-01-31 Seiko Epson Corp 半導体装置の実装方式
AU645283B2 (en) 1990-01-23 1994-01-13 Sumitomo Electric Industries, Ltd. Substrate for packaging a semiconductor device
US5086966A (en) * 1990-11-05 1992-02-11 Motorola Inc. Palladium-coated solder ball
US5102829A (en) * 1991-07-22 1992-04-07 At&T Bell Laboratories Plastic pin grid array package
US5261593A (en) 1992-08-19 1993-11-16 Sheldahl, Inc. Direct application of unpackaged integrated circuit to flexible printed circuit
US5363280A (en) * 1993-04-22 1994-11-08 International Business Machines Corporation Printed circuit board or card thermal mass design
US5810607A (en) 1995-09-13 1998-09-22 International Business Machines Corporation Interconnector with contact pads having enhanced durability
US5831828A (en) 1993-06-03 1998-11-03 International Business Machines Corporation Flexible circuit board and common heat spreader assembly
US5772451A (en) 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
US5490040A (en) 1993-12-22 1996-02-06 International Business Machines Corporation Surface mount chip package having an array of solder ball contacts arranged in a circle and conductive pin contacts arranged outside the circular array
JP3228841B2 (ja) 1994-10-26 2001-11-12 松下電器産業株式会社 シールド装置
US5799393A (en) * 1994-11-09 1998-09-01 Blaupunkt-Werke Gmbh Method for producing a plated-through hole on a printed-circuit board
US5637008A (en) 1995-02-01 1997-06-10 Methode Electronics, Inc. Zero insertion force miniature grid array socket
US5743009A (en) 1995-04-07 1998-04-28 Hitachi, Ltd. Method of making multi-pin connector
FR2735648B1 (fr) 1995-06-13 1997-07-11 Bull Sa Procede de refroidissement d'un circuit integre monte dans un boitier
US5691041A (en) 1995-09-29 1997-11-25 International Business Machines Corporation Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer
US5638008A (en) * 1995-10-30 1997-06-10 Cypress Semiconductor Corp. Method and apparatus for generating an asynchronously clocked signal in a synchronously clocked programmable device
US5751556A (en) * 1996-03-29 1998-05-12 Intel Corporation Method and apparatus for reducing warpage of an assembly substrate
CH693478A5 (fr) 1996-05-10 2003-08-15 E Tec Ag Socle de connexion de deux composants électriques.
US6086386A (en) 1996-05-24 2000-07-11 Tessera, Inc. Flexible connectors for microelectronic elements
US5984726A (en) 1996-06-07 1999-11-16 Hon Hai Precision Ind. Co., Ltd. Shielded electrical connector
US5735452A (en) 1996-06-17 1998-04-07 International Business Machines Corporation Ball grid array by partitioned lamination process
US5757071A (en) * 1996-06-24 1998-05-26 Intel Corporation C4 substrate contact pad which has a layer of Ni-B plating
US5755595A (en) 1996-06-27 1998-05-26 Whitaker Corporation Shielded electrical connector
TW354200U (en) 1996-07-18 1999-03-01 Hon Hai Prec Ind Co Ltd Fastener for connector
TW406454B (en) 1996-10-10 2000-09-21 Berg Tech Inc High density connector and method of manufacture
US5729896A (en) 1996-10-31 1998-03-24 International Business Machines Corporation Method for attaching a flip chip on flexible circuit carrier using chip with metallic cap on solder
US5796590A (en) 1996-11-05 1998-08-18 Micron Electronics, Inc. Assembly aid for mounting packaged integrated circuit devices to printed circuit boards
KR100268460B1 (ko) 1996-12-07 2000-10-16 윤종용 표면실장용 반도체ic의 위치결정장치
US6183301B1 (en) 1997-01-16 2001-02-06 Berg Technology, Inc. Surface mount connector with integrated PCB assembly
US5742484A (en) 1997-02-18 1998-04-21 Motorola, Inc. Flexible connector for circuit boards
US5883782A (en) 1997-03-05 1999-03-16 Intel Corporation Apparatus for attaching a heat sink to a PCB mounted semiconductor package
US5919050A (en) 1997-04-14 1999-07-06 International Business Machines Corporation Method and apparatus for separable interconnecting electronic components
US5874776A (en) 1997-04-21 1999-02-23 International Business Machines Corporation Thermal stress relieving substrate
US5870272A (en) * 1997-05-06 1999-02-09 Medtronic Inc. Capacitive filter feedthrough for implantable medical device
US5938451A (en) 1997-05-06 1999-08-17 Gryphics, Inc. Electrical connector with multiple modes of compliance
TW321372U (en) 1997-05-16 1997-11-21 Molex Taiwan Co Ltd Electrical connector to block the EMI (Electromagnetic Interference)
US5876219A (en) 1997-08-29 1999-03-02 The Whitaker Corp. Board-to-board connector assembly
US5955888A (en) 1997-09-10 1999-09-21 Xilinx, Inc. Apparatus and method for testing ball grid array packaged integrated circuits
TW361737U (en) 1997-11-24 1999-06-11 Hon Hai Prec Ind Co Ltd Power connector assembly
US5888884A (en) 1998-01-02 1999-03-30 General Electric Company Electronic device pad relocation, precision placement, and packaging in arrays
US6037044A (en) 1998-01-08 2000-03-14 International Business Machines Corporation Direct deposit thin film single/multi chip module
JP2000049438A (ja) * 1998-07-28 2000-02-18 Nec Kofu Ltd 表面実装部品の落下防止構造とその落下防止方法
US6203690B1 (en) * 1998-09-29 2001-03-20 International Business Machines Corporation Process of reworking pin grid array chip carriers
TW465146B (en) 1999-02-02 2001-11-21 Hon Hai Prec Ind Co Ltd Thermal expansion adjustment method of plate-shaped electronic devices and the structure thereof
TW433624U (en) 1999-04-06 2001-05-01 Hon Hai Prec Ind Co Ltd Electrical connector
US6174198B1 (en) 1999-04-21 2001-01-16 Hon Hai Precision Ind. Co., Ltd. Electrical connector assembly
US6116926A (en) 1999-04-21 2000-09-12 Berg Technology, Inc. Connector for electrical isolation in a condensed area
US6527587B1 (en) * 1999-04-29 2003-03-04 Fci Americas Technology, Inc. Header assembly for mounting to a circuit substrate and having ground shields therewithin
US6243272B1 (en) * 1999-06-18 2001-06-05 Intel Corporation Method and apparatus for interconnecting multiple devices on a circuit board
US6529385B1 (en) * 1999-08-25 2003-03-04 Intel Corporation Component array adapter
TW531948B (en) * 1999-10-19 2003-05-11 Fci Sa Electrical connector with strain relief
CA2395651A1 (en) * 1999-12-20 2001-06-28 Lennart Pitzele Flanged terminal pins for dc/dc converters
JP3473566B2 (ja) * 2000-08-31 2003-12-08 イビデン株式会社 ピン立て型プリント回路基板
US6644985B2 (en) * 2001-02-16 2003-11-11 Fci Americas Technology, Inc. Ball attached zero insertion force socket
US6791845B2 (en) * 2002-09-26 2004-09-14 Fci Americas Technology, Inc. Surface mounted electrical components

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102137549B (zh) * 2010-01-26 2013-01-16 英业达股份有限公司 双面表面黏着型态的电路板的电子零组件布局方法

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