CN1764932A - 射频识别标签和生产射频识别标签的工艺 - Google Patents

射频识别标签和生产射频识别标签的工艺 Download PDF

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CN1764932A
CN1764932A CNA2004800078250A CN200480007825A CN1764932A CN 1764932 A CN1764932 A CN 1764932A CN A2004800078250 A CNA2004800078250 A CN A2004800078250A CN 200480007825 A CN200480007825 A CN 200480007825A CN 1764932 A CN1764932 A CN 1764932A
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integrated circuit
rfid tag
flexible substrate
conducting element
substrate
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CN1764932B (zh
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格兰·W·甘格尔
马克·A·哈德雷
汤姆·庞德
肯尼斯·D·司嚓兹
保罗·S·德扎伊克
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Ruizhang Technology Ltd
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Alien Technology LLC
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Abstract

射频识别(RFID)标签(10，20)包括柔性衬底(28、75、83、90)和嵌入在所述柔性衬底内的集成电路(26、71、85、94)。所述集成电路的顶表面与所述柔性衬底共面。至少一个导电元件(22、24、79、81、92、93)形成在所述柔性衬底上。所述导电元件电连接到所述集成电路。所述导电元件用作RFID标签的天线。

Description

射频识别标签和生产射频识别标签的工艺
政府权利通告
在美国国防微电子机构资助合作协议No.90-03-2-0303(主合同)、北达科他州立大学分包合同SB-004-03下政府支持进行了本发明。政府具有对此发明的一定权利。
相关申请
本申请涉及2003年3月24日递交的美国临时专利申请序列号60/457,263并要求享受其优先权，其整个内容通过引用而被包含于此。
技术领域
本发明的实施例一般地涉及射频识别(RFID)器件或标签以及制造REID器件或标签的方法。
背景技术
射频识别(RFID)标签允许通过无线电波的使用远程识别物体。
此处描述的本发明的某些实施例针对的是通过降低组件成本、通过提供新的和有用的形状因子(form factor)、或通过能够进行RFID的新应用，来改善RFID技术的现状。虽然此处描述的设计和工艺可以用于形成许多类型的电子组件(例如用于天线或其他不是RFID标签器件的传感器或者阵列)，但是其对成本、尺寸和形状因子为所需因素的RFID标签特别有用。
对RFID标签的需求扩展到从小型商品到大型商品的许多应用。所期望的是使RFID标签制造得尽可能小并且尽可能柔性使得RFID标签能够应用在各种商品中。而且，所期望的是使RFID标签制造得尽可能便宜以允许RFID标签广泛集成到各种商品中。
发明内容
本发明的示例性实施例关于射频识别(RFID)标签。此RFID标签包括柔性衬底和嵌入在所述柔性衬底内的集成电路。所述集成电路的顶表面与所述柔性衬底共面。至少一个导电元件形成在所述柔性衬底上。所述导电元件电连接到所述集成电路。所述导电元件用作所述射频识别标签的天线。
根据本发明的一个方面，一种RFID标签包括柔性衬底和嵌入在所述柔性衬底内的集成电路。所述集成电路的顶表面与所述柔性衬底共面。所述集成电路使用流控自装配(FSA)工艺嵌入在所述柔性衬底内。平面层形成在所述柔性衬底和所述集成电路之上。至少一个导电元件形成在所述柔性衬底并通过所述平面层中产生的至少一个通路电连接到所述集成电路。所述导电元件用作所述射频识别标签的天线。
根据本发明的另一个方面，一种射频识别标签包括柔性衬底和嵌入在所述柔性衬底内的集成电路。所述集成电路具有与所述柔性衬底共面的顶表面。导电元件形成在所述柔性衬底上并电连接到所述集成电路。所述导电元件也用作所述射频识别标签的天线。所述导电元件形成在所述衬底的顶表面和底表面上。提供电连接以将所述底表面上的所述导电元件连接到所述集成电路。
根据本发明的另一个方面，一种射频识别标签包括沉积在柔性衬底中的射频识别集成电路。第一天线层耦合到所述射频识别集成电路。第二天线层耦合到所述射频识别集成电路。所述第一天线层在所述射频识别集成电路上方且所述第二天线层在所述射频识别集成电路下方。所述射频识别集成电路在所述射频识别集成电路的顶部处耦合到所述第一天线层。所述射频识别集成电路在所述射频识别集成电路的底部处耦合到所述第二天线层。
本发明的另一个方面还关于其对准不需严格的组装块体的方法。该方法包括将每个包含功能部件的块体与流体结合以形成浆液。接着将所述浆液分布在具有受体孔的衬底上，每个所述受体孔被设计为收纳所述块体中的一个。其中每个所述孔和所述块体的相对尺寸为：使得每个所述块体不是相对于所述受体孔的周界轴向地对准。每个所述块体构造为包括底触点垫和顶触点垫，所述底触点垫和顶触点垫即使在每个所述块体不是相对于所述受体孔的周界对准时，仍然允许所述块体的所述功能部件与形成在所述衬底上的导电元件互连。
在其他方面，还描述了制造本发明的RFID标签的示例性实施例的方法。
附图说明
本发明的实施例通过示例的方式来说明，并且并不限制在附图中，在附图中，相似参考符号表示相似的元件，其中：
图1-2将根据本发明实施例制造的示例性的RFID细丝或线的实际尺寸与美元一角硬币相比；
图3-4详细图示了具有线或细丝形式的RFID标签的示例性实施例；
图5A-5C图示了使用NanoBlockTM IC作为集成电路的具有细丝结构的RFID标签的更多示例(NanoBlockTM是Alien科技有限公司的商标)；
图6图示了形成在柔性或塑料片上的细丝RFID标签的密集封装阵列；
图7图示了RFID标签的一个示例性实施例；
图8图示了RFID标签的另一个示例性实施例；
图9A-9B图示了具有形成电感回路的顶导体和底导体的RFID标签的示例性实施例；
图10图示了根据本发明实施例制造的RFID标签的示例性尺度；
图11图示了在沉积到衬底中时不需要精确对准和定向的RFID标签的示例性实施例；
图12图示了组装根据本发明的某个实施例的RFID标签的示例性实施例；
图13A-13B图示了组装根据本发明的某个实施例的RFID标签的另一个示例性实施例；
图14A-14B图示了组装RFID标签的示例性实施例，其中使用FSA艺来将NanoBlockTM器件110组装到衬底组件中的孔中；
图15图示了形成在衬底上的RFID标签的示例性实施例和RFID标签可以用于切单的切割的示例性位置；
图16图示了切单RFID标签的剖视图；
图17图示了用于切单形成在衬底上的RFID标签的示例性切割图案；
图18图示了切单RFID标签的俯视图和剖视图；以及
图19图示了包括电感的RFID标签组件。
具体实施方式
在以下说明中，为了解释的目的，阐述了许多具体细节，以便提供更本发明详尽的理解。但是对本领域的技术人员显而易见的是，没有这些具体细节仍可以实现本发明。在其他情况下，只要不使本发明模糊不清，就没有描述具体的装置结构和方法。以下说明和附图是本发明的解释而非构造为本发明的限制。
在一个实施例中，我们描述了RFID标签的形状因子，其中RFID标签是薄的、柔性的条状，可令人联想到细丝10或线20。在整个此文档中，这样薄的柔性条、细丝、线或其他合适结构的形状的RFID器件称作“RFID标签”。这些RFID标签可以是相当小的(图1和图2)。图1和图2示出了用于RFID应用的电子组件的照片示例，其将RFID的细丝10或线20与美元一角硬币相比。图3和图4图示了在一个实施例中，RFID标签20包括柔性衬底28(在一个实施例中，塑料膜)、嵌入在柔性衬底28内的集成电路26、和形成在柔性或塑料衬底28的顶部上的两个导电膜22和24。导电膜22和24电连接到集成电路26以用作天线。
图4示出了图3所示RFID标签20的放大部分。在一个实施例中，RFID标签20包括位于集成电路(IC)26上的多个接合垫27(或电连接)。接合垫可以围绕集成电路26的中心或边缘放置，或放置在集成电路上的方便位置处。在一个实施例中，两个导电膜22和24连接到IC 26的相对角上或斜对角上集成电路26。
图5A-5C图示了使用NanoBlockTM IC作为集成电路的具有细丝结构RFID标签的更多示例。NanoBlockTM是Alien科技有限公司(AlienTechnology Inc.)的商标。为清楚的目的，印制的导体未示出。图5B-5C示出了RFID标签的俯视图和仰视图。
在一个实施例中，流控自装配(FSA)工艺用于在柔性或塑料片上形成细丝标签的密集封装阵列。FSA是在液浆中分配多个集成电路器件(例如NanoBlockTM IC)的工艺。具有集成电路的液浆被分配在衬底上，其衬底构造有用于将集成电路沉积在其中的受体。图6示出了此示例。对于FSA工艺的说明可以参见美国专利No.5,545,291。每个集成电路可以是NanoBlockTM IC，其可以以美国专利公开No.2002/0127864-A1所述的方式形成并接着使用FSA工艺放置在受体上或放置到受体中。
图6是在诸如塑料片60之类的衬底上的细丝标签的密集封装阵列的一个示例性实施例的图示。还可以使用(除塑料之外的)其他衬底类型。衬底可以具有网状衬底的形状且是柔性的。稍后，每个细丝标签可以被切单(singulation)以形成RFID标签。RFID集成电路62通过FSA沉积在塑料片60中。导电迹线64印制在该片的至少一个表面上以在塑料片60上形成天线。形成天线的导电迹线64连接到RFID集成电路62。多个细丝标签可以接着被切单以形成各个RFID标签。放大视图61示出了在塑料片60上未被切单的细丝标签的阵列，其阵列包括耦合到多个导电迹线64的多个RFID IC 62(通过FSA工艺沿着由在塑料片上收纳RFID IC的受体位置形成的直线而沉积)。
在一个实施例中，切单工艺用于将标签阵列分离为各个RFID标签；在一个示例性实施例中，可以由机械的切、锯、冲压，激光消融、热刃刀切(hot-blade knife cutting)或其他技术来实行切单工艺。在完成切单工艺后，单个的RFID标签可以看上去象图3所示的RFID标签20。从塑料片60生产的这些标签的示例性尺度如下所述并如图10所示。从图6可以看到的是由锯齿形间隙63彼此分离的RFID子阵列。还可以看到IC 62沉积为与塑料片60的边缘平行的直线，在一个示例性实施例中，其塑料片60可以在诸如用于造纸的工艺类型之类的卷至卷(roll to roll)的网状工艺中作为网状材料处理。在一个实施例中，用于为每个标签形成天线元件的印制的导电迹线64以相对于塑料片60边缘的倾斜角形成。在图6的情况中，每个导向迹线形成大约10。的角。此布置易于优化(例如最大化)在塑料片60的给定面积中可以制造的细丝RFID标签的数量。可以明白的是不同布局(例如迹线相对于网状材料边缘的角度，其在工艺的开始和结尾接合卷)可以为不同长度和宽度的RFID标签进行优化。如图6所示，一组子阵列，诸如子阵列组65的端部与相邻的子阵列组66的端部交错或交织；此附加的布局布置也易于最大化可以在塑料片中的给定面积制造的细丝RFID标签(或其他类型的器件)的数量。每个导电迹线的端部与间隙63相邻。
为维持柔性，在一个实施例中，包含集成电路的衬底由塑料制成。衬底也可以由其他柔性材料制成。在一个实施例中，衬底的厚度小于1毫米，优选地小于250微米，且更优选地小于125微米。在一个实施例中，细丝RFID标签的宽度小于5毫米，更优选地小于3毫米，且可以小于1毫米。RFID标签和形成在RFID标签衬底上的天线的长度可以变化，但应该至少5毫米长，更优选地10毫米长，且甚至可以长达100毫米。这样，具有此形状因子的RFID标签将在长度上较长，在厚度上较薄并在宽度上较窄。图10示出了RFID标签细丝相对于诸如RFID IC之类的IC的尺度的示例。
可以明白的是虽然流控自装配工艺是形成这些RFID标签组件的一种所需方式，但是其他方案可以用于将集成电路放置在这些线和细丝上。
显然，用于RFID的这样细、小和柔性的形状因子能够具有一些新的应用。在一个实施例中，RFID标签组件接合到绝缘的线，并接着编织为织物。RFID标签可以嵌入在纸张中，并且RFID标签的柔性衬底允许该纸张保持柔性。RFID标签可以粘接到粘接材料以允许其附装到另一个物品(例如，衣服或其他商品)。
由于RFID标签较小，所以如果期望，可以将其掩藏以免被看见。RFID标签可以掩藏在不透明表面之下。可选地，RFID标签可以着色为黑色以使其难以看见，或者以与其围绕物融合的方式着色。例如，RFID标签可以制为黑色或以使得RFID标签与RFID标签所结合到其中的材料相符的方式着色。此外，层叠片可以应用在顶表面(和/或底表面)上以保护RFID标签避免被从其嵌入的物体中切掉。
可选地，在一些应用中可能期望使得RFID细丝标签的存在非常明显或易发现。在这些应用中，RFID标签可以着色或金属处理以从其背景中突出。这样，RFID标签可以具有明显的外观，用作辨认RFID标签存在的功能。
RFID标签可以用于辨认或识别纸基产品，包括货币、法律文件(例如护照或签证)或其他有价值的物品。RFID标签的薄尺寸和柔性特性使得可以将RFID标签集成到签条或带子中，其可以接着附装到物品以提供RFID标签性能。RFID标签也可以用于辨认或识别非纸的物品。例如，RFID标签的薄外形和小尺寸使得其容易将RFID标签性能提供给小的有价值的物品，例如药物或电子部件。这样的标签可以嵌入在包装物内(例如嵌入在塑料包装物中)，或实际上与包装物的成分混合。
在一个实施例中，RFID标签被展开(或结合)或者以下述方式构造为展开到另一个物品中：RFID标签延伸成三维结构，例如，RFID线弯曲为弯曲的RFID细丝或线或者RFID线成形或弯曲成折皱的RFID线或者另外RFID标签成形为三维结构。存在各种方法将RFID标签构造为包括集成电路、柔性聚合物、柔性衬底和导电迹线。以下是一些说明性示例。虽然这些结构可以用于窄的细丝标签，但是应该认识到更多的传统RFID标签结构也可以使用这些结构来构造。
图7以剖视图示出了RFID标签的一个构造。图7所示的RFID标签可以是图6所示的RFID标签中的一个。在用于形成此结构的一个示例性方法中，使用FSA工艺将集成电路71沉积在基膜(柔性或塑料衬底75)中的受体孔73中。在一个实施例中，定位或沉积集成电路71使得其与柔性衬底75共面。在一个实施例中，共面是指集成电路71沉积在衬底75中使得集成电路71的表面与衬底75的表面平齐的构造。在一个实施例中，共面是指集成电路71沉积在衬底75中使得集成电路71的表面在衬底75的表面之下的构造。在一个实施例中，共面是指集成电路71沉积在衬底75中使得集成电路71的顶表面与衬底75的顶表面基本共有同一个平面的构造。
仍然参考图7，平面层77形成在衬底75和集成电路71的顶部上。通路孔72形成在平面层中以曝露集成电路71上的触点垫。接着制造金属互连79(或金属迹线)来既提供到集成电路上的垫的连接又形成用于RFID标签的天线。虽然光刻方法可以用于形成金属迹线，但是也可以简单地在衬底75上印制导电墨以形成天线。此印制操作同时形成到集成电路71的电连接和形成天线元件。图7所示的RFID标签可以与图3所示的标签20相似。应该注意的是，图7所示的RFID标签未按比例绘制。
此外，虽然可以印制具体的天线迹线，但是也可以在平面层的顶部上覆盖几乎连续的导体膜，仅集成电路的中心部分保留为曝露。当细丝标签从片上切下时，分离细丝的简单动作将形成天线。在一个实施例中，移除法(subtractive method)用于在平面层上形成天线迹线。移除法包括诸如化学刻蚀、激光消融和机械移除之类的技术，其中首先施加连续的层然后通过化学刻蚀、激光消融或机械移除来刻蚀部分以产生合适图案。
在一个实施例中，如图8所示，RFID标签不形成有平面层。在图8中，集成电路85(在一个实施例中使用FSA工艺)沉积在衬底83中的受体孔73中。金属互连81直接形成在衬底83的顶表面上。当然，可以相继将其他材料附装到图7或图8所示RFID标签的顶表面或底表面。图8所示的RFID标签中没有使用平面层。金属层81可以形成为在衬底83和集成电路85上基本连续的膜。在集成电路85上的一个区域(例如，近似中心部分中)保留为暴露。
图9A以剖视图示出了用于RFID细丝(线)标签的另一个结构，其中形成为通过衬底90(例如塑料衬底)的通路孔91提供在形成在衬底90顶表面上的导体92(例如天线元件)到形成在衬底90底表面上的导体93(例如天线元件)之间电连接的通道。这样的RFID标签构型将使天线可以形成电感回路结构，其可以是某些实施例中用于最大化某些RFID标签性能的很有价值的设计特征。在一个实施例中，衬底90包括可以是NanoBlockTM IC的集成电路94。
虽然图9A未示出顶平面层的存在，但是应该认识到可以形成具有图7所示平面层的等同结构，其在平面层和衬底中具有通路孔以允许在顶表面上的导体和底表面上的导体之间的电连接。
图9B示出了图9A的RFID标签的俯视图。IC 94示出为电连接到形成在衬底90顶表面上的导体92并连接到形成在衬底90底表面上的导体93。导体92和93可以印制在衬底90上或可以由其他方法形成。在图9B所示的例子中，导体92不覆盖衬底90的整个顶表面，且出于图示的目的，这些导体被示出为透明物体，即使它们可以不是透明的。导体93可以覆盖或不覆盖衬底90的整个底表面且可以是或可以不是透明的。通路孔91示出为相邻于两个顶导体92的端部。IC 94通过IC 94上的两个接合垫94A和94B电耦合到导体92。在制造图9A和图9B所示RFID标签的工艺的一个示例性实施例中，可以用钻通塑料衬底的激光消融来产生通路孔91。在可选实施例中，顶导体和底导体可以绕柔性衬底的边缘电连接，而不是使用通路孔91来将顶导体电连接到底导体。提供这种连接的一个方式是通过将线的端部(或者不会使IC短路的某些其他部分)涂覆或浸蘸于导电墨中。在图9A和9B所示的RFID标签的某些实施例中，在顶导体和底导体之间的电连接可以帮助防止静电放电对线中的IC 94的损害并还可以帮助消除来自IC 94的电抗。在一个实施例中，图9A中的RFID标签具有(通过通路孔)到底导体的触点，其构造为或者用于匹配天线元件和RFID IC 94的阻抗。
图10示出了用于细丝RFID的一些说明性的尺度，其中未示出保持RFID标签IC 101的衬底。在一个实施例中，衬底可以仅比天线元件104和105稍宽。天线元件104和105示出为通过接合垫106和107电耦合到IC 101。
从图10及其所附说明可以看到，RFID标签的宽度可以等于或略大于容纳在RFID标签内的IC 101(例如RFID IC或NanoBlockTM IC)。在图10的情况中，衬底可以比IC 101略宽(例如宽大约0.1毫米或0.20毫米)或其在宽度上可以基本等于IC 101的宽度。此外，RFID标签的长度可以至少是IC 101长度的10倍，并且更优选地可以至少是IC 101长度的30倍，并甚至可以超过IC 101长度的100倍。在一个实施例中，RFID标签的长度可以优化为消除RFID标签中RFID IC 101的电抗。此外，天线元件104和105的结构可以设计为基本或近似地将天线元件的阻抗匹配于RFID IC 101的输入阻抗。
本发明的示例性的RFID标签可以从包括两个互连垫或多于两个互连垫的集成电路形成。例如，可以使用在集成电路上具有三个互连垫的RFID标签和在集成电路上具有四个互连垫的RFID标签。在一些实施例中，一个互连垫用作本地接地连接(其仍然附装到天线)，一个或更多个互连垫用作附加天线连接，且一个或更多个互连垫起可以连接到外部电容或其他电元件以增强RFID标签的性能。应该认识到，具有三或四个集成电路连接垫的设计可以用于此处所述的设计和应用中。
在一些实施例中，可以将RFID IC生产为NanoBlockTM IC(例如使用美国专利公开No.2002/0127864-A1所述的工艺)或生产为传统IC(例如不具有NanoBlockTM IC实施例的楔形侧)。
图11图示了RFID IC可以组装到衬底中的示例性实施例，其中待沉积到在衬底中的受体中的RFID IC的正确对准或定向可以是更轻松的或更不严格的。如图11所示，RFID IC 110放置到包括用作天线元件的导电元件117的受体109中。导电元件117由此位于RFID IC 110的下方。导电元件117可以被称作底天线，且其(电阻性地或电容性地)电耦合到IC110。RFID IC 110也(电阻性地或电容性地)电耦合到在RFID IC上方的导电元件107，且导电元件107可以被称作顶天线。在一个实施例中，RFID IC 110通过设置在RFID IC 110顶表面上的触点116电耦合到顶天线并通过设置在RFID IC 110底表面上的触点115电耦合到底天线。
在IC 100的顶表面114上的IC接合垫137和136分别与底触点115和顶侧触点116进行电接触。在一个实施例中，如图11所示，底触点115与接合垫137电连接并包围IC 110(其象一个块体)的一侧并在IC 110的底侧上延续。在一个实施例中，IC 110示出为具有楔形侧但应该明白的是在某些实施例中也可以使用矩形侧。
在此RFID标签的一个实施例中，在RFID标签的顶表面上的顶触点116的尺寸比在RFID IC 110的顶部上的接合垫136大得多，且在RFID的底表面上的底触点115的尺寸比在RFID IC 110的顶部上的另一个接合垫137大得多。在此实施例中，顶触点116的尺寸与RFID IC 110的整个顶表面的尺寸大约相同，且底触点116的尺寸与RFID IC 110的整个底表面的尺寸大约相同。在一个实施例中，RFID IC 110包括从IC 110的顶部上的接合垫137绕IC 110的一侧延伸到IC 110的底部的互连115a，且此互连115a的底部可以是底触点115。在一个实施例中，类似于图7所示RFID标签，RFID标签可以包括形成在间隔层120和IC 110的顶部上的平面层或绝缘层(dialectic layer)(未示出)。
在一个实施例中，RFID IC 100支撑在间隔层120内，间隔层120耦合到顶天线107和底天线117。在间隔层120中的受体或开口109比RFID IC110的尺寸还相当地大。此开口109未设计为相对精确地匹配RFID IC 110的块体尺寸。而是，RFID IC 110不对准开口109周界地装配在开口109中。在一个示例性实施例中，开口在面积上比RFID IC 110块体的底表面的面积(或顶表面的面积)至少大50％。此外，开口109的几何形状无需匹配RFID IC 110的几何形状；例如，开口109可以具有圆形的几何形状而RFID IC 110可以具有矩形(例如正方形)的几何形状。即使FSA工艺可以用于将RFID IC 110放置到开口109中，RFID IC 110也无需与开口109的周界对准。这样，在FSA工艺之后，RFID IC 110可以在开口109内具有不同的旋转方位。因为在RFID IC 110的顶表面上只有一个电触点(触点116)且在RFID IC 110的底表面上只有一个电触点(触点115)，所以在此实施例中的RFID IC 110被设计为无论其被(相对于RFID IC 110中的电路层)向上或向下定位都能正确地运行。由于这些触点覆盖RFIDIC 110的两个表面(顶和底)的较大的部分且由于在这些表面上没有其他电触点，所以可以将RFID IC 110沉积到开口109中，而不将其对准在开口109中，且无需将RFID IC 110上的小接合垫与在顶天线和底天线上的互连对准。所讨论的实施例可以用于线标签或非线标签。这些实施例允许FSA工艺，其中每个包含功能元件(例如RFID IC)的块体混合在流体中以形成浆液并且该浆液接着被沉积到具有开口的衬底上，其开口基本大于块体和/或与块体具有不同形状，和/或在FSA处理完成后块体的周界不与开口的周界对准。
制造RFID线标签的示例性方法从预成型的具有两端的RFIDNanoBlockTM器件详细地开始，其中RFID NanoblockTM器件具有位于器件顶侧上的一个电触点116和位于器件底部上的另一个电触点115。该方法便于作为网基制造工艺的实现。
首先，提供如图11所示的具有顶电触点116和底电触点115的RFIDNanoBlockTM器件110。电触点115和116可以从导电粘接材料形成或包括导电粘接材料的全部或部分层，所述导电粘接材料为诸如填载银微粒的热塑料或b阶环氧树脂、低温焊接剂、诸如金之类的可冷焊接的材料等。可选地，(在一个实施例中，为形成电容性的接触)电触点115和116可以由薄层绝缘粘接材料覆盖，所述绝缘粘接材料为诸如PSA、热熔粘接剂等，或绝缘b阶环氧树脂。
接着，RFID NanoBlockTM器件110沉积在衬底中以形成RFID标签。在一个实施例中，RFID标签形成在网基材料或衬底上并接着被切单为单个的RFID标签。这样，多个RFID标签可以形成在一个衬底上。图12图示了根据本发明的某个实施例组装RFID标签的示例性实施例。在一个实施例中，FSA工艺用于将多个RFID IC组装到RFID标签的衬底中。间隔层120粘接到网基材料的衬底。在图12中，提供了具有一条或多条NanoBlockTM间隔层120的衬底129，在间隔层120中已形成了RFIDNanoBlockTM器件受体位置孔121。如图12所示，衬底129可以具有网状衬底的形式。网状衬底的切离端表示图中所示的是从(在诸如造纸工艺之类的卷至卷网工艺中处理的)较长的网中所取的一段。
如图12所示，孔121具有圆形形状。可以通过冲压、压纹、钻、激光切割或消融等制造这些圆形孔121。孔121可以具有诸如长方形或正方形孔的可选的几何形状，或者具有其他圆形形状或甚至于不规则形状。为方便组装，间隔层120可以在其前侧和/或后侧涂覆以诸如PSA、热熔粘接剂等或绝缘b阶环氧树脂或UV固化聚合材料之类的粘接材料(未示出)。此间隔层120的厚度和孔121的尺寸被制为使得在FSA工艺完成之后在每个孔121中留下不超过1个NanoBlockTM器件110。
作为示例，在其中NanoBlockTM器件110是标称正方形(俯视)且在间隔层120中的孔121是圆形的一个实施例中，间隔层120的厚度被选定为近似相等于NanoBlockTM器件110的厚度，且孔121的直径可以在NanoBlockTM器件110的标称宽度的1.41到1.8倍的范围内。
接着，在一个实施例中，如图13A-13B所示，底天线层130附装到间隔层120。在一个实施例中，底天线层130由导电材料制成或者是包括导电层131的层状结构。图13A-13B分别示出了底天线130的俯视图和端侧视图。为方便组装，在底天线层130的一侧或两侧上的区域可以涂覆以导电粘接材料(或在电容性接触的情况下的绝缘粘接材料)。在一个实施例中，可以通过层叠或丝网印刷(或其他合适的技术)将导电(或绝缘)的粘接材料施加到底天线层130。此外，一些区域，包括将接触NanoBlockTM器件110的顶触点或底触点的那些区域，可以涂覆以诸如图13A和图13B所示的导电粘接剂条132之类的导电粘接剂(或在电容性接触的情况下的薄层绝缘粘接剂)。
在一个实施例中，间隔层120(或多个间隔层条120)通过静压力、层叠等附装到底天线层130，其一个或多个上述的粘接剂层132将片接合在一起。在一个实施例中，间隔层120和底天线层130形成用于RFID标签的衬底129。
在一个实施例中，FSA工艺用于将NanoBlockTM器件110组装到衬底组件中的孔121中(见图14A和图14B)。IC(诸如NanoBlockTM器件110)与流体混合以形成浆液且该浆液分配在衬底上(诸如具有层120的底天线层130)，使得形状为块体的IC中的至少一些落到并留在间隔层120中的孔(例如孔121)中。图14A和图14B示出了FSA工艺(或可选工艺)的结果，所述工艺用于产生这些图14A和图14B中所示的结构。注意，IC 110没有相对于其各自的孔121轴向对准和旋转对准；这样，相对于边缘133，IC 110具有不同的旋转方位且它们在其各自的孔121内相对于其各自的孔121也具有不同的轴向位置(例如一些定位到中心的左边，一些定位到中心的右边等)。
取决于所采用的粘接剂材料的位置和类型，如果期望，那么NanoBlockTM器件110可以现在通过热卷层叠工艺附装到衬底组件。在一个实施例中，间隔层132是半透明的。衬底组件包括(如图14A所示)层叠在底天线层130上的三条间隔层120。可以期望的是，可以包括多于或少于三个间隔层132。在一个实施例中，每条间隔层120在粘接到底天线层130上的导电粘接剂条132中的一个之上对准。
图14B示出了在由一条间隔层(例如间隔层120)的组件和底天线层(例如层130)形成的受体位置(孔121)中的NanoBlockTM器件110的放大剖视图。在一个实施例中，各个间隔层条120层叠在粘接在底天线层130上的各个导电粘接剂条132之上。可选地，间隔层条120层叠在一个连续的粘接剂条132之上。如图12中标注的，采用在间隔层条120的顶部和底部上的粘接剂层132来将组件保持在一起，且NanoBlockTM器件110被导电粘接剂条132的一部分，主要地由底天线层130的一部分保持在适当的位置。
接着，如图15所示，在一个实施例中，顶天线层135层叠在其中沉积有RFID IC 110的间隔层120之上。在一个实施例中，顶天线层135由导电材料制成或者是包括导电层136且在一个实施例中具有其结构类似于或相同于底天线层130结构的层状结构。在一个示例性实施例中，顶天线层135包括导电层136，其可以支撑在塑料衬底(未示出)和导电粘接剂条132上，导电粘接剂条132粘接到导电层136。在顶天线层上的导电粘接剂条132可以布置为与底天线层相同的图案(例如见图14A)。由于如导电粘接剂条132的可导电的粘接剂层的存在，可以去除导电层136。
在另一个实施例中，在顶天线层135上一侧或两侧的区域可以涂覆以导电的或绝缘的粘接材料。此外，一些区域，包括将接触NanoBlockTM器件110的顶部或者底部触点垫的那些区域，可以涂覆以导电粘接剂(例如，导电粘接剂条132)或一薄层绝缘粘接剂。在另一个实施例中，顶天线层135层叠在间隔层120之上使得导电层136与出现或沉积在间隔层120中的NanoBlockTM器件110电阻性地或电容性地电接触。
在一个实施例中，RFID标签形成在网状衬底上。网状衬底包括一个或多个间隔层120，其中间隔层120的每个具有用于将RFID IC 110沉积在其中的受体121。在RFID IC 110沉积且如前述地层叠或形成各种层之后，可以从网状衬底切单每个单个的RFID标签。为了分离被连接的多片RFID标签而切割(例如以网的纵向方式)网状衬底。图15图示了在网状衬底上的所形成的RFID标签可以被切单的两个示例性位置。图16图示了具有从网状衬底切单的RFID标签的一片的端侧视图。可以通过机械的切割、锯、冲压、激光消融、热刃刀切割(hot-blade knife cutting)、喷气切割等实现切割操作。
当形成为网状衬底形式时，至少顶天线层135和底天线层130在从一个RFID标签组件到另一个RFID标签组件上是连续的或连接的形式。图17图示了连接的RFID标签的一片的半透视的俯视图。在该片的左部示出的是底天线层130而在该片的右部示出的是顶天线层135。具有沉积在其中的多个RFID IC 110(例如NanoBlockTM器件)的一条间隔层120示出为附装到底天线层130和顶天线层135。图17还示出了形成在网状衬底上的RFID标签如何被切单的两个示例。在此图中图示了两个示例性的切割图案，切割图案A和切割图案B。可以沿着虚线切割每个RFID标签以从网状衬底分离。在如前所述形成RFID标签之后，可以切单RFID标签。图18图示了使用切割图案A被切单的或分离的RFID标签的半透视的俯视图和侧视图。可以通过机械切割、锯、冲压、激光消融、热刃刀切割(hot-blade knife cutting)、喷气切割等实现切割操作。可以使得切口笔直地越过片或以更复杂的图案来影响所得到的天线的电特性或者标签的物理或设计特性。在一个实施例中，也可以在天线层中形成孔以影响形式、功能和应用。
图19中示出了包括平行于NanoBlockTM器件的电感的可选标签组件。在一个实施例中，RFID标签包括每个间隔层条一个附加条的导电粘接剂(其施加到顶天线层或底天线层)，以及宽间隔层条。所形成的电感可以改善标签的电性能。图19图示了片形式的RFID标签的端侧视图。
RFID标签包括宽间隔层180、施加到顶天线层或底天线层的附加条的导电粘接剂183。图19所示的RFID标签组件类似于图15所示的标签组件，且包括底天线层181(其具有用作底天线的导电层和将底天线电连接到RFID IC 110上的底触点的导电粘接剂条)和底天线层182(其具有用作顶天线的导电层和将顶天线电连接到RFID IC 110上的顶触点的导电粘接剂条)以及包括开口以收纳RFID IC 110的宽间隔层180。
在顶天线层182层叠期间，顶天线层181和底天线层182沿着增加的导电粘接剂183条被电接合。在成品的标签中，绕宽间隔层180的导电路径形成平行于RFID IC 110(例如NanoBlockTM器件)的电感回路，因而增强了某些实施例中的电性能。
虽然已经描述并在附图中示出了某些示例性实施例，但是应该理解的是这样的实施例对本发明仅是说明性的而非限制性的，且由于本领域的普通技术人员可以进行修改，所以此发明不限于所示和所描述的具体构造和布置。

Claims (68)

1.一种射频识别标签，包括：
柔性衬底；
嵌入在所述柔性衬底内的集成电路，所述集成电路的顶表面与所述柔性衬底共面；
形成在所述柔性衬底上的至少一个导电元件，所述至少一个导电元件电连接到所述集成电路，所述导电元件用作所述射频识别标签的天线。
2.如权利要求1所述的射频识别标签，其中所述至少一个导电元件电连接到所述集成电路是通过实质上为电容性的电连接完成的。
3.如权利要求1所述的射频识别标签，其中所述至少一个导电元件电连接到所述集成电路是通过实质上为电阻性的电连接完成的。
4.如权利要求1所述的射频识别标签，其中所述集成电路包括至少两个互连垫。
5.如权利要求1所述的射频识别标签，其中所述导电元件包括金属微粒、有机微粒、半导电微粒中的至少一种。
6.如权利要求1所述的射频识别标签，其中所述导电元件是印刷导电元件、蒸镀金属、喷镀金属、电镀金属、以及层叠导电箔中的至少一种。
7.如权利要求1所述的射频识别标签，其中所述柔性衬底具有略大于所述集成电路宽度或基本等于所述集成电路宽度中之一的宽度。
8.如权利要求1所述的射频识别标签，其中所述射频识别标签包括形成在所述衬底上的两个导电元件，且其中所述两个导电元件在所述集成电路的相对角上或斜对角上电连接到所述集成电路。
9.一种射频识别标签，包括：
柔性衬底；
嵌入在所述柔性衬底内的集成电路，所述集成电路的顶表面与所述柔性衬底共面，其中所述集成电路使用流控自装配工艺嵌入在所述柔性衬底内；
形成在所述柔性衬底和所述集成电路之上的平面层；
形成在所述柔性衬底上的至少一个导电元件，所述至少一个导电元件通过所述平面层中产生的至少一个通路电连接到所述集成电路，所述导电元件用作所述射频识别标签的天线。
10.如权利要求8所述的射频识别标签，其中所述至少一个导电元件电连接到所述集成电路是通过实质上为电容性的电连接完成的。
11.如权利要求8所述的射频识别标签，其中所述至少一个导电元件电连接到所述集成电路是通过实质上为电阻性的电连接完成的。
12.如权利要求8所述的射频识别标签，其中所述集成电路包括至少两个互连垫。
13.如权利要求8所述的射频识别标签，其中所述导电元件包括金属微粒、有机微粒、半导电微粒中的至少一种。
14.如权利要求8所述的射频识别标签，其中所述导电元件是印刷导电元件、蒸镀金属、喷镀金属、电镀金属、以及层叠导电箔中的至少一种。
15.如权利要求8所述的射频识别标签，其中所述柔性衬底具有略大于所述集成电路宽度或基本等于所述集成电路宽度中之一的宽度。
16.如权利要求8所述的射频识别标签，其中所述射频识别标签包括形成在所述衬底上的两个导电元件，且其中所述两个导电元件在所述集成电路的相对角上或斜对角上电连接到所述集成电路。
17.如权利要求8所述的射频识别标签，其中所述射频识别标签具有线标签的几何形状或形式因子。
18.如权利要求8所述的射频识别标签，其中所述射频识别标签具有小于或等于约1毫米的厚度、小于或等于约3毫米的厚度、和约10毫米或更长的长度。
19.如权利要求8所述的射频识别标签，其中所述射频识别标签组件接合到绝缘线。
20.如权利要求19所述的射频识别标签，其中所述绝缘线编织为织物。
21.如权利要求19所述的射频识别标签，其中所述绝缘线嵌入或编织在纸张内。
22.如权利要求19所述的射频识别标签，其中所述绝缘线具有用作识别所述射频识别标签存在的目的的明显外观。
23.如权利要求19所述的射频识别标签，其中粘接材料用于将所述射频识别标签组件附装到其他物品。
24.如权利要求19所述的射频识别标签，其中所述射频识别标签以在三维上扩展的方式展开。
25.如权利要求19所述的射频识别标签，其中所述射频识别标签包括使得难以看见所述射频识别标签的视觉外观。
26.如权利要求19所述的射频识别标签，其中所述射频识别标签包括使得容易看见所述射频识别标签的视觉外观。
27.一种形成射频识别标签的方法，包括：
使用流控自装配将集成电路沉积在柔性衬底中的受体内；
在所述柔性衬底上形成至少一个导电迹线以同时形成到所述集成电路的电连接和形成天线元件。
28.如权利要求27所述的方法，其中所述集成电路与所述柔性衬底共面。
29.如权利要求27所述的方法，还包括在所述柔性衬底和所述集成电路之上形成平面层，其中连接到所述集成电路的电连接是通过所述平面层中产生的至少一个通路。
30.如权利要求27所述的方法，其中所述至少一个导电迹线电连接到所述集成电路是通过实质上为电容性的电连接完成的。
31.如权利要求27所述的方法，其中所述至少一个导电迹线电连接到所述集成电路是通过实质上为电阻性的电连接完成的。
32.如权利要求27所述的方法，其中所述集成电路包括至少两个互连垫。
33.如权利要求27所述的方法，其中所述导电迹线包括金属微粒、有机微粒、半导电微粒中的至少一种。
34.如权利要求27所述的方法，其中所述导电迹线是印刷导电元件、蒸镀金属、喷镀金属、电镀金属、以及层叠导电箔中的至少一种。
35.如权利要求27所述的方法，其中所述柔性衬底具有略大于所述集成电路宽度或基本等于所述集成电路宽度中之一的宽度。
36.如权利要求27所述的方法，其中所述射频识别标签包括形成在所述衬底上的两个导电迹线，且其中所述两个导电迹线在所述集成电路的相对角上或斜对角上电连接到所述集成电路。
37.如权利要求27所述的方法，其中所述集成电路是NanoBlock集成电路。
38.如权利要求29所述的方法，其中所述集成电路是NanoBlock集成电路。
39.如权利要求29所述的方法，其中所述至少一个导电迹线电连接到所述集成电路是通过实质上为电容性的电连接完成的。
40.如权利要求29所述的方法，其中所述至少一个导电迹线电连接到所述集成电路是通过实质上为电阻性的电连接完成的。
41.如权利要求29所述的方法，其中所述集成电路包括至少两个互连垫。
42.如权利要求29所述的方法，其中所述导电迹线包括金属微粒、有机微粒、半导电微粒中的至少一种。
43.如权利要求29所述的方法，其中所述导电迹线是印刷导电元件、蒸镀金属、喷镀金属、电镀金属、层叠导电箔中的至少一种。
44.如权利要求29所述的方法，其中所述柔性衬底具有略大于所述集成电路宽度或基本等于所述集成电路宽度中之一的宽度。
45.如权利要求29所述的方法，其中所述射频识别标签包括形成在所述衬底上的两个导电迹线，且其中所述两个导电迹线在所述集成电路的相对角上或斜对角上电连接到所述集成电路。
46.如权利要求29所述的方法，其中所述平面层包括聚合物。
47.如权利要求29所述的方法，其中使用丝网印刷、喷墨印刷、和挤压印刷中的至少一种形成所述导电迹线。
48.如权利要求29所述的方法，其中由移除图案方法形成所述导电迹线。
49.如权利要求48所述的方法，其中所述移除图案方法包括化学刻蚀、激光消融、和机械移除中的至少一种。
50.一种射频识别标签，包括：
柔性衬底；
嵌入在所述柔性衬底内的集成电路，所述集成电路具有与所述柔性衬底共面的顶表面；
形成在所述柔性衬底上并电连接到所述集成电路的导电元件，所述导电元件也用作所述射频识别标签的天线；且
其中所述导电元件形成在所述衬底的顶表面和底表面上，且其中提供电连接以将所述底表面上的所述导电元件连接到所述集成电路。
51.如权利要求50所述的射频识别标签，还包括形成在所述柔性衬底和所述集成电路之上的平面层，且其中通过所述平面层中的至少一个通路孔形成所述电连接。
52.如权利要求50所述的射频识别标签，其中由绕所述柔性衬底的至少一侧的电连接形成所述电连接。
53.如权利要求50所述的射频识别标签，其中通过所述电连接来连接形成在所述顶表面上和在所述底表面上的所述导电元件。
54.如权利要求53所述的射频识别标签，其中形成在所述顶表面上和所述底表面上的所述导电元件形成用于所述射频识别标签的电回路结构或电感元件。
55.一种射频识别标签，包括：
沉积在柔性衬底中的射频识别集成电路；
耦合到所述射频识别集成电路的第一天线层；和
耦合到所述射频识别集成电路的第二天线层，其中所述第一天线层在所述射频识别集成电路上方且所述第二天线层在所述射频识别集成电路下方，其中所述射频识别集成电路在所述射频识别集成电路的顶部处耦合到所述第一天线层，且所述射频识别集成电路在所述射频识别集成电路的底部处耦合到所述第二天线层。
56.一种形成射频识别标签的方法，包括：
将每个包含功能部件的块体与流体结合以形成浆液；
将所述浆液分布在具有受体孔的衬底上，每个所述受体孔被设计为收纳所述块体中的一个，其中每个所述孔和所述块体的相对尺寸为：使得每个所述块体不是相对于所述受体孔的周界轴向地对准；且
其中每个所述块体构造为包括底触点垫和顶触点垫，所述底触点垫和顶触点垫即使在每个所述块体不是相对于所述受体孔的周界对准时，仍然允许所述块体的所述功能部件与形成在所述衬底上的导电元件互连。
57.如权利要求56所述的方法，其中所述块体沉积在所述衬底中使得其与所述衬底共面。
58.如权利要求56所述的方法，还包括形成其中产生有通路的平面层，所述平面层形成在所述衬底和所述块体之上，所述通路允许到所述块体的所述功能部件的电连接。
59.如权利要求58所述的方法，其中所述导电元件实质上是电容性。
60.如权利要求58所述的方法，其中所述导电元件实质上是电阻性。
61.如权利要求58所述的方法，其中所述导电元件包括金属微粒、有机微粒、半导电微粒中的至少一种。
62.如权利要求58所述的方法，其中所述导电迹线是印刷导电元件、蒸镀金属、喷镀金属、电镀金属、以及层叠导电箔中的至少一种。
63.如权利要求58所述的方法，其中所述块体中的每个是NanoBlock集成电路。
64.如权利要求58所述的方法，其中所述导电元件是印刷导电元件、蒸镀金属、喷镀金属、员镀金属、以及层叠导电箔中的至少一种。
65.如权利要求58所述的方法，其中所述柔性衬底具有略大于所述集成电路宽度或基本等于所述集成电路宽度中之一的宽度。
66.如权利要求58所述的方法，其中使用丝网印刷、喷墨印刷、和挤压印刷中的至少一种形成所述导电元件。
67.如权利要求58所述的方法，其中由移除图案方法形成所述导电元件。
68.如权利要求58所述的方法，其中所述移除图案方法包括化学刻蚀、激光消融、和机械移除中的至少一种。
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8333004B2 (en) 2007-04-24 2012-12-18 Smartrac Ip B.V. Electronic interface apparatus and method and system for manufacturing same
CN108603311A (zh) * 2015-12-30 2018-09-28 诺丁汉特伦特大学 电子条带纱线
CN111542835A (zh) * 2017-12-01 2020-08-14 艾利丹尼森零售信息服务公司 利用基板中的孔的柔性织物标签
CN112384956A (zh) * 2018-05-22 2021-02-19 先讯美资电子有限责任公司 细长柔性标签

Families Citing this family (196)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6479395B1 (en) * 1999-11-02 2002-11-12 Alien Technology Corporation Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings
US6623579B1 (en) * 1999-11-02 2003-09-23 Alien Technology Corporation Methods and apparatus for fluidic self assembly
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
US20030130912A1 (en) 2002-01-04 2003-07-10 Davis Tommy Lee Equipment management system
US7224280B2 (en) * 2002-12-31 2007-05-29 Avery Dennison Corporation RFID device and method of forming
US7253735B2 (en) 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
JP2005111973A (ja) * 2003-09-18 2005-04-28 Konica Minolta Medical & Graphic Inc 印刷版材料、印刷版原反、印刷版の作製方法、印刷方法及び印刷版材料の製造方法
US7691009B2 (en) * 2003-09-26 2010-04-06 Radar Golf, Inc. Apparatuses and methods relating to findable balls
KR101107555B1 (ko) * 2004-01-22 2012-01-31 미코 코포레이션 모듈러 무선 주파수 식별 태깅 방법
US7384496B2 (en) * 2004-02-23 2008-06-10 Checkpoint Systems, Inc. Security tag system for fabricating a tag including an integrated surface processing system
US7019391B2 (en) * 2004-04-06 2006-03-28 Bao Tran NANO IC packaging
KR100603761B1 (ko) * 2004-04-22 2006-07-24 삼성전자주식회사 마이크로웨이브 트랜스폰더
CN102004393B (zh) 2004-04-27 2013-05-01 伊利诺伊大学评议会 用于软光刻法的复合构图设备
US7268063B1 (en) * 2004-06-01 2007-09-11 University Of Central Florida Process for fabricating semiconductor component
US7943491B2 (en) 2004-06-04 2011-05-17 The Board Of Trustees Of The University Of Illinois Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp
US8217381B2 (en) 2004-06-04 2012-07-10 The Board Of Trustees Of The University Of Illinois Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
EP2650906A3 (en) 2004-06-04 2015-02-18 The Board of Trustees of the University of Illinois Methods and devices for fabricating and assembling printable semiconductor elements
US7521292B2 (en) 2004-06-04 2009-04-21 The Board Of Trustees Of The University Of Illinois Stretchable form of single crystal silicon for high performance electronics on rubber substrates
US7799699B2 (en) 2004-06-04 2010-09-21 The Board Of Trustees Of The University Of Illinois Printable semiconductor structures and related methods of making and assembling
US20060020803A1 (en) * 2004-07-06 2006-01-26 Zih Corp. Systems and methods for authentication of items or documents
US6957777B1 (en) * 2004-09-21 2005-10-25 Sheng-Chang Huang Label to be attached on a plastic product formed in a mold and identifiable by a detecting device
US7500307B2 (en) 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
BRPI0519478A2 (pt) 2004-12-27 2009-02-03 Quantum Paper Inc display emissivo endereÇÁvel e imprimÍvel
US7712674B1 (en) * 2005-02-22 2010-05-11 Eigent Technologies Llc RFID devices for verification of correctness, reliability, functionality and security
EP1851692A1 (de) * 2005-02-23 2007-11-07 Textilma Ag Transponder-faden sowie seine verwendung
US7691280B2 (en) * 2005-03-25 2010-04-06 E. I. Du Pont De Nemours And Company Ink jet printing of etchants and modifiers
US7623034B2 (en) 2005-04-25 2009-11-24 Avery Dennison Corporation High-speed RFID circuit placement method and device
WO2006120309A2 (fr) * 2005-05-11 2006-11-16 Stmicroelectronics Sa Microplaquette de silicium ayant des plages de contact inclinees et module electronique comprenant une telle microplaquette
JP4815891B2 (ja) 2005-06-22 2011-11-16 株式会社日立製作所 無線ｉｃタグ及びアンテナの製造方法
US20060290498A1 (en) * 2005-06-23 2006-12-28 Ncr Corporation Incorporation of RFID devices into labels
US7436305B2 (en) * 2005-07-19 2008-10-14 Checkpoint Systems, Inc. RFID tags for pallets and cartons and system for attaching same
US7528727B2 (en) * 2005-08-04 2009-05-05 Sonoco Development, Inc. Tracking device for polymeric packaging
US20070031992A1 (en) * 2005-08-05 2007-02-08 Schatz Kenneth D Apparatuses and methods facilitating functional block deposition
US7986236B2 (en) * 2005-08-25 2011-07-26 Bae Systems Information And Electronic Systems Integration Inc. RFID tag and method and apparatus for manufacturing same
US7408463B2 (en) 2005-09-30 2008-08-05 Intel Corporation Radio frequency identification tag
BRPI0616904B1 (pt) * 2005-10-06 2017-01-24 Textilma Ag processo e tear de agulhas para fitas, para tecer uma fita
US20070130754A1 (en) * 2005-12-14 2007-06-14 Michael Fein Laser ablation prototyping of RFID antennas
US7555826B2 (en) 2005-12-22 2009-07-07 Avery Dennison Corporation Method of manufacturing RFID devices
US8317107B2 (en) * 2005-12-30 2012-11-27 Intel Corporation Chip-spacer integrated radio frequency ID tags, methods of making same, and systems containing same
US20070158804A1 (en) * 2006-01-10 2007-07-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, manufacturing method of semiconductor device, and RFID tag
US20070159337A1 (en) * 2006-01-12 2007-07-12 Sdgi Holdings, Inc. Modular RFID tag
EP1821241A3 (en) * 2006-02-15 2008-07-23 Assa Abloy AB Hybrid frequency contactless transponder unit, module for and method of manufacturing
CA2655219A1 (en) * 2006-07-24 2008-01-31 Textilma Ag Rfid tag
US7561107B2 (en) * 2006-09-07 2009-07-14 Intelleflex Corporation RFID device with microstrip antennas
US20080062046A1 (en) * 2006-09-08 2008-03-13 Intelleflex Corporation Mounting structure for matching an rf integrated circuit with an antenna and rfid device implementing same
US10032102B2 (en) 2006-10-31 2018-07-24 Fiber Mountain, Inc. Excess radio-frequency (RF) power storage in RF identification (RFID) tags, and related systems and methods
US9652708B2 (en) 2006-10-31 2017-05-16 Fiber Mountain, Inc. Protocol for communications between a radio frequency identification (RFID) tag and a connected device, and related systems and methods
US9652707B2 (en) 2006-10-31 2017-05-16 Fiber Mountain, Inc. Radio frequency identification (RFID) connected tag communications protocol and related systems and methods
US8264366B2 (en) 2009-03-31 2012-09-11 Corning Incorporated Components, systems, and methods for associating sensor data with component location
US7782202B2 (en) 2006-10-31 2010-08-24 Corning Cable Systems, Llc Radio frequency identification of component connections
US7772975B2 (en) * 2006-10-31 2010-08-10 Corning Cable Systems, Llc System for mapping connections using RFID function
US9652709B2 (en) 2006-10-31 2017-05-16 Fiber Mountain, Inc. Communications between multiple radio frequency identification (RFID) connected tags and one or more devices, and related systems and methods
US8421626B2 (en) * 2006-10-31 2013-04-16 Corning Cable Systems, Llc Radio frequency identification transponder for communicating condition of a component
US8283683B2 (en) * 2006-11-07 2012-10-09 Opto Tech Corporation Chip-bonding light emitting diode chip
US20080106415A1 (en) * 2006-11-08 2008-05-08 Macsema, Inc. Information tag
US7701352B2 (en) * 2006-11-22 2010-04-20 Avery Dennison Corporation RFID label with release liner window, and method of making
US7760094B1 (en) 2006-12-14 2010-07-20 Corning Cable Systems Llc RFID systems and methods for optical fiber network deployment and maintenance
US8264355B2 (en) 2006-12-14 2012-09-11 Corning Cable Systems Llc RFID systems and methods for optical fiber network deployment and maintenance
US7667574B2 (en) * 2006-12-14 2010-02-23 Corning Cable Systems, Llc Signal-processing systems and methods for RFID-tag signals
KR101610885B1 (ko) 2007-01-17 2016-04-08 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 프린팅­기반 어셈블리에 의해 제조되는 광학 시스템
US7893385B2 (en) * 2007-03-01 2011-02-22 James Neil Rodgers Method for enhancing gain and range of an RFID antenna
US7965186B2 (en) 2007-03-09 2011-06-21 Corning Cable Systems, Llc Passive RFID elements having visual indicators
EP2000957A1 (fr) * 2007-05-21 2008-12-10 Gemplus Procédé de réalisation d'un dispositif comportant une antenne de transpondeur radiofréquence avec deux portions terminales réalisées sur un support et dispositif obtenu
US8877101B2 (en) 2007-05-31 2014-11-04 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, power generating or other electronic apparatus
US8133768B2 (en) 2007-05-31 2012-03-13 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system
US9343593B2 (en) 2007-05-31 2016-05-17 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US8456392B2 (en) 2007-05-31 2013-06-04 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system
US9425357B2 (en) 2007-05-31 2016-08-23 Nthdegree Technologies Worldwide Inc. Diode for a printable composition
US8674593B2 (en) 2007-05-31 2014-03-18 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US8415879B2 (en) 2007-05-31 2013-04-09 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US9018833B2 (en) 2007-05-31 2015-04-28 Nthdegree Technologies Worldwide Inc Apparatus with light emitting or absorbing diodes
US8889216B2 (en) 2007-05-31 2014-11-18 Nthdegree Technologies Worldwide Inc Method of manufacturing addressable and static electronic displays
US9419179B2 (en) 2007-05-31 2016-08-16 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US8852467B2 (en) 2007-05-31 2014-10-07 Nthdegree Technologies Worldwide Inc Method of manufacturing a printable composition of a liquid or gel suspension of diodes
US8809126B2 (en) 2007-05-31 2014-08-19 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US8846457B2 (en) 2007-05-31 2014-09-30 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US9534772B2 (en) 2007-05-31 2017-01-03 Nthdegree Technologies Worldwide Inc Apparatus with light emitting diodes
EP2174360A4 (en) 2007-06-29 2013-12-11 Artificial Muscle Inc CONVERTER WITH ELECTROACTIVE POLYMER FOR SENSOR REVIEW APPLICATIONS
DE102007043920A1 (de) 2007-07-17 2009-01-22 Merck Patent Gmbh Funktionelles Material für gedruckte elektronische Bauteile
US20090033495A1 (en) * 2007-08-03 2009-02-05 Akash Abraham Moldable radio frequency identification device
US7855697B2 (en) * 2007-08-13 2010-12-21 Corning Cable Systems, Llc Antenna systems for passive RFID tags
TW200919327A (en) * 2007-10-29 2009-05-01 China Steel Corp Three-dimensional wireless identification label adhered onto metal
US10262167B2 (en) 2008-01-31 2019-04-16 Smartrac Technology Fletcher, Inc. Detachable radio frequency identification switch tag
JP5743553B2 (ja) 2008-03-05 2015-07-01 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ 伸張可能及び折畳み可能な電子デバイス
US9436902B1 (en) 2008-03-11 2016-09-06 Impinj, International Ltd. RFID integrated circuits with large contact pads
US11288564B1 (en) 2008-03-11 2022-03-29 Impinj, Inc. High-speed RFID tag assembly using impulse heating
US8188927B1 (en) 2008-03-11 2012-05-29 Impinj, Inc. RFID tag assembly methods
US8881373B1 (en) 2008-03-11 2014-11-11 Impinj, Inc. Assembling a radio frequency identification (RFID) tag precursor
US9059074B2 (en) * 2008-03-26 2015-06-16 Stats Chippac Ltd. Integrated circuit package system with planar interconnect
DE102008016274A1 (de) * 2008-03-28 2009-10-01 Smartrac Ip B.V. Chipträger für ein Transpondermodul sowie Transpondermodul
US20090266736A1 (en) * 2008-04-25 2009-10-29 Drug Plastics & Glass Company, Inc. Container having an identification device molded therein and method of making same
US7992332B2 (en) 2008-05-13 2011-08-09 Nthdegree Technologies Worldwide Inc. Apparatuses for providing power for illumination of a display object
US8127477B2 (en) 2008-05-13 2012-03-06 Nthdegree Technologies Worldwide Inc Illuminating display systems
EP2286445A1 (en) * 2008-06-02 2011-02-23 Nxp B.V. Method for manufacturing an electronic device
JP2009294953A (ja) * 2008-06-05 2009-12-17 Hitachi Ltd Ｒｆｉｄスレッド、ｒｆｉｄスレッド付シートおよびｒｆｉｄスレッド付シート用印刷機
US8946683B2 (en) 2008-06-16 2015-02-03 The Board Of Trustees Of The University Of Illinois Medium scale carbon nanotube thin film integrated circuits on flexible plastic substrates
US8044861B2 (en) * 2008-06-30 2011-10-25 Harris Corporation Electronic device with edge surface antenna elements and related methods
US8248208B2 (en) 2008-07-15 2012-08-21 Corning Cable Systems, Llc. RFID-based active labeling system for telecommunication systems
US7884721B2 (en) * 2008-08-25 2011-02-08 James Edward Gibson Devices for identifying and tracking wireless microphones
US8731405B2 (en) 2008-08-28 2014-05-20 Corning Cable Systems Llc RFID-based systems and methods for collecting telecommunications network information
US20150227829A1 (en) * 2008-08-29 2015-08-13 David Finn Laminates for security documents
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
EP2349440B1 (en) 2008-10-07 2019-08-21 Mc10, Inc. Catheter balloon having stretchable integrated circuitry and sensor array
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US8222799B2 (en) * 2008-11-05 2012-07-17 Bayer Materialscience Ag Surface deformation electroactive polymer transducers
US20100139756A1 (en) * 2008-12-10 2010-06-10 Palo Alto Research Center Incorporated Simultaneously Writing Bus Bars And Gridlines For Solar Cell
DE102009004491A1 (de) 2009-01-09 2010-07-15 Merck Patent Gmbh Funktionelles Material für gedruckte elektronische Bauteile
KR20100087932A (ko) * 2009-01-29 2010-08-06 삼성전기주식회사 자기 조립 단분자막을 이용한 다이 어태치 방법 및 자기 조립 단분자막을 이용하여 다이가 어태치된 패키지 기판
EP2239793A1 (de) 2009-04-11 2010-10-13 Bayer MaterialScience AG Elektrisch schaltbarer Polymerfilmaufbau und dessen Verwendung
WO2010123925A2 (en) * 2009-04-20 2010-10-28 Flextronics Ap, Llc Miniature rfid tag
TWI592996B (zh) 2009-05-12 2017-07-21 美國伊利諾大學理事會 用於可變形及半透明顯示器之超薄微刻度無機發光二極體之印刷總成
US20100301005A1 (en) * 2009-05-29 2010-12-02 Nilsson Peter L J Method of Manufacturing an Electrical Circuit on a Substrate
US20100301006A1 (en) * 2009-05-29 2010-12-02 Nilsson Peter L J Method of Manufacturing an Electrical Component on a Substrate
GB2472025A (en) * 2009-07-21 2011-01-26 Univ Manchester Identification device
GB2472026A (en) * 2009-07-21 2011-01-26 Univ Manchester Signalling device
FR2948796A1 (fr) * 2009-07-28 2011-02-04 Ask Sa Support de dispositif d'identification radiofrequence pour carte hybride et son procede de fabrication
WO2011041727A1 (en) 2009-10-01 2011-04-07 Mc10, Inc. Protective cases with integrated electronics
US8469280B2 (en) 2009-10-22 2013-06-25 Intellipaper, Llc Programming devices and programming methods
US8561910B2 (en) 2009-10-22 2013-10-22 Intellipaper, Llc Memory programming methods and memory programming devices
US8469271B2 (en) 2009-10-22 2013-06-25 Intellipaper, Llc Electronic storage devices, programming methods, and device manufacturing methods
JP5403353B2 (ja) * 2009-11-11 2014-01-29 日立化成株式会社 Ｒｆｉｄタグの製造方法
CN102741865B (zh) 2009-11-30 2016-04-06 康宁股份有限公司 Rfid状况锁存
WO2011084450A1 (en) 2009-12-16 2011-07-14 The Board Of Trustees Of The University Of Illinois Electrophysiology in-vivo using conformal electronics
US10441185B2 (en) 2009-12-16 2019-10-15 The Board Of Trustees Of The University Of Illinois Flexible and stretchable electronic systems for epidermal electronics
US9936574B2 (en) 2009-12-16 2018-04-03 The Board Of Trustees Of The University Of Illinois Waterproof stretchable optoelectronics
KR101724273B1 (ko) 2010-03-17 2017-04-07 더 보드 오브 트러스티즈 오브 더 유니버시티 오브 일리노이 생체흡수성 기판 상 이식가능한 바이오의료 장치
DE102010012603B4 (de) * 2010-03-24 2019-09-12 Snaptrack, Inc. Frontendmodul und Verfahren zum Betrieb in unterschiedlichen Schaltungsumgebungen
WO2011127328A2 (en) * 2010-04-07 2011-10-13 Intellipaper, Llc Electronic assemblies and methods of forming electronic assemblies
US8172468B2 (en) 2010-05-06 2012-05-08 Corning Incorporated Radio frequency identification (RFID) in communication connections, including fiber optic components
US9442285B2 (en) 2011-01-14 2016-09-13 The Board Of Trustees Of The University Of Illinois Optical component array having adjustable curvature
AU2012211055B2 (en) 2011-01-28 2017-07-13 Curonix Llc Neural stimulator system
WO2012115717A2 (en) * 2011-02-24 2012-08-30 Mcclung Guy L Iii Nanotag indentification systems and methods
CA2828809A1 (en) 2011-03-01 2012-09-07 Francois EGRON Automated manufacturing processes for producing deformable polymer devices and films
CN103703404A (zh) 2011-03-22 2014-04-02 拜耳知识产权有限责任公司 电活化聚合物致动器双凸透镜系统
JP6671843B2 (ja) 2011-04-04 2020-03-25 マイクロン デヴァイシーズ リミテッド ライアビリティ カンパニー 移植式導線
US9220897B2 (en) 2011-04-04 2015-12-29 Micron Devices Llc Implantable lead
EP3879458A1 (en) 2011-05-06 2021-09-15 Neology, Inc. Rfid switch tag
US10885418B2 (en) 2011-05-06 2021-01-05 Neology, Inc. Detachable radio frequency identification switch tag
US10102685B2 (en) 2011-05-06 2018-10-16 Neology, Inc. Self declaring device for a vehicle using restrict traffic lanes
US11948035B2 (en) 2011-05-06 2024-04-02 Neology, Inc. RFID switch tag
WO2012158709A1 (en) 2011-05-16 2012-11-22 The Board Of Trustees Of The University Of Illinois Thermally managed led arrays assembled by printing
JP2014523633A (ja) 2011-05-27 2014-09-11 エムシー１０ インコーポレイテッド 電子的、光学的、且つ／又は機械的装置及びシステム並びにこれらの装置及びシステムを製造する方法
US8934965B2 (en) 2011-06-03 2015-01-13 The Board Of Trustees Of The University Of Illinois Conformable actively multiplexed high-density surface electrode array for brain interfacing
JP5397423B2 (ja) * 2011-07-01 2014-01-22 コニカミノルタ株式会社 非接触情報記録媒体の製造方法
JP2014524279A (ja) 2011-07-29 2014-09-22 スティムウェイブ テクノロジーズ インコーポレイテッド 神経刺激器のための電力又は極性選択の遠隔制御
EP3912675A1 (en) 2011-08-12 2021-11-24 Stimwave Technologies Incorporated Microwave field stimulator
EP2562692B1 (en) * 2011-08-25 2013-10-09 Textilma Ag RFID chip module
EP2755718B8 (en) 2011-09-15 2018-06-06 Micron Devices LLC Relay module for implant
JP5912398B2 (ja) * 2011-10-18 2016-04-27 アピックヤマダ株式会社 Ｒｆｉｄタグ、ｒｆｉｄタグの製造方法、および、金型
EP2786644B1 (en) 2011-12-01 2019-04-10 The Board of Trustees of the University of Illionis Transient devices designed to undergo programmable transformations
WO2013142552A1 (en) 2012-03-21 2013-09-26 Bayer Materialscience Ag Roll-to-roll manufacturing processes for producing self-healing electroactive polymer devices
JP2015521303A (ja) 2012-03-30 2015-07-27 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシ 表面への形状適合可能な付属物装着可能電子デバイス
DE102012205768B4 (de) * 2012-04-10 2019-02-21 Smartrac Ip B.V. Transponderlage und Verfahren zu deren Herstellung
US9165232B2 (en) 2012-05-14 2015-10-20 Corning Incorporated Radio-frequency identification (RFID) tag-to-tag autoconnect discovery, and related methods, circuits, and systems
WO2013177006A2 (en) 2012-05-21 2013-11-28 Stimwave Technologies, Incorporated Methods and devices for modulating excitable tissue of the exiting spinal nerves
US9761790B2 (en) 2012-06-18 2017-09-12 Parker-Hannifin Corporation Stretch frame for stretching process
US9563832B2 (en) 2012-10-08 2017-02-07 Corning Incorporated Excess radio-frequency (RF) power storage and power sharing RF identification (RFID) tags, and related connection systems and methods
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
WO2014066576A1 (en) 2012-10-24 2014-05-01 Bayer Intellectual Property Gmbh Polymer diode
EP2938393A1 (en) 2012-12-26 2015-11-04 Micron Devices, LLC Wearable antenna assembly
WO2014129069A1 (ja) * 2013-02-22 2014-08-28 株式会社村田製作所 センサタグ、センサタグの製造方法
US8998101B2 (en) 2013-02-27 2015-04-07 Tata Consultancy Services Limited RFID tag enabled article and a method therefor
US10169698B1 (en) 2013-10-30 2019-01-01 Automated Assembly Corporation RF transponder on adhesive transfer tape
US9897292B1 (en) 2013-10-30 2018-02-20 Automated Assembly Corporation Solid-state lighting elements on adhesive transfer tape
US10402713B1 (en) 2013-10-30 2019-09-03 Automated Assembly Corporation RF transponder on adhesive transfer tape
US9379289B1 (en) 2013-10-30 2016-06-28 Automated Assembly Corporation LEDs on adhesive transfer tape
USD770991S1 (en) * 2013-11-05 2016-11-08 Nok Corporation Integrated circuit tag
US9409029B2 (en) 2014-05-12 2016-08-09 Micron Devices Llc Remote RF power system with low profile transmitting antenna
USD763833S1 (en) 2014-10-01 2016-08-16 Ohio State Innovation Foundation RFID tag
US10204297B2 (en) * 2014-10-06 2019-02-12 Itire, Llc Smart tag assembly for mounting on an object to be tracked
CN107111973B (zh) 2015-01-12 2020-01-17 杜比实验室特许公司 像素区块结构和布局
MX2017012925A (es) 2015-05-21 2018-08-15 Neology Inc Etiqueta de identificacion de radio frecuencia de frecuencias multiples.
US11403506B2 (en) 2015-05-21 2022-08-02 Neology, Inc. Detachable radio frequency identification switch tag
CN107851208B (zh) 2015-06-01 2021-09-10 伊利诺伊大学评议会 具有无线供电和近场通信能力的小型化电子系统
EP3304130B1 (en) 2015-06-01 2021-10-06 The Board of Trustees of the University of Illinois Alternative approach to uv sensing
US9984962B2 (en) 2015-08-31 2018-05-29 Arizona Board Of Regents On Behalf Of Arizona State University Systems and methods for hybrid flexible electronics with rigid integrated circuits
US10925543B2 (en) 2015-11-11 2021-02-23 The Board Of Trustees Of The University Of Illinois Bioresorbable silicon electronics for transient implants
US11296398B2 (en) 2016-10-06 2022-04-05 Avery Dennison Retail Information Services Llc Methods for creating RFID tags based on flexible antenna materials
US10685273B2 (en) 2016-10-07 2020-06-16 Avery Dennison Retail Information Services, Llc Vibratory feeder systems for RFID elements
WO2018094065A1 (en) * 2016-11-16 2018-05-24 Avery Dennison Retail Information Services, Llc Programming and testing of wire rfid tags
BR112019017426A2 (pt) * 2017-03-08 2020-04-07 Agco Corp material de ligação com etiqueta de identificação para um fardo de material de colheita agrícola
US10578495B2 (en) * 2017-05-23 2020-03-03 Barry Nicholson, JR. Temperature measuring and logging slide
US10398873B1 (en) 2018-07-20 2019-09-03 Automated Assembly Corporation Rolled substrate cable
EP3996288A1 (en) 2019-04-11 2022-05-11 Nexite Ltd. Wireless dual-mode identification tag
US11551537B2 (en) 2019-04-11 2023-01-10 Nexite Ltd. Wireless dual-mode identification tag
US20220083957A1 (en) * 2019-05-08 2022-03-17 Hewlett-Packard Development Company, L.P. Kiosk device having storage bins
GB2587033A (en) * 2019-09-16 2021-03-17 Payper Tech Limited Printing substrate, method of manufacture, method of use, and computer system
US11443160B2 (en) 2019-09-18 2022-09-13 Sensormatic Electronics, LLC Systems and methods for laser tuning and attaching RFID tags to products
US10970613B1 (en) 2019-09-18 2021-04-06 Sensormatic Electronics, LLC Systems and methods for providing tags adapted to be incorporated with or in items
US11055588B2 (en) 2019-11-27 2021-07-06 Sensormatic Electronics, LLC Flexible water-resistant sensor tag
US11694057B2 (en) 2020-01-03 2023-07-04 Sensormatic Electronics, LLC RFID tag and method of making same
EP4275160A1 (en) 2021-01-11 2023-11-15 Nexite Ltd. Contactless and automatic operations of a retail store
DE102021102349A1 (de) 2021-02-02 2022-08-04 Manfred Rietzler RFID-Funketikett zum Befestigen an einer Textilie
US11755874B2 (en) 2021-03-03 2023-09-12 Sensormatic Electronics, LLC Methods and systems for heat applied sensor tag
US20230186239A1 (en) 2021-12-13 2023-06-15 Nexite Ltd. Systems and methods for presence estimation for missing products
US11869324B2 (en) 2021-12-23 2024-01-09 Sensormatic Electronics, LLC Securing a security tag into an article

Family Cites Families (264)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2551591A (en) 1944-11-17 1951-05-08 Int Standard Electric Corp Polyethylene bonded to copper by means of a layer of cuprous oxide integral with copper base
US3024151A (en) 1957-09-30 1962-03-06 Automated Circuits Inc Printed electrical circuits and method of making the same
US3458382A (en) 1965-10-24 1969-07-29 Schjeldahl Co G T Laminator assembly
US3390308A (en) 1966-03-31 1968-06-25 Itt Multiple chip integrated circuit assembly
US3440027A (en) 1966-06-22 1969-04-22 Frances Hugle Automated packaging of semiconductors
US3689991A (en) 1968-03-01 1972-09-12 Gen Electric A method of manufacturing a semiconductor device utilizing a flexible carrier
US3708860A (en) 1971-03-04 1973-01-09 Eastman Kodak Co Method and apparatus for chopping a plurality of articles and depositing the articles in complementary article receptors
US3724737A (en) 1971-10-06 1973-04-03 E Bodnar Spreader for slit web material
JPS49131863U (zh) * 1973-03-10 1974-11-13
US3891157A (en) 1973-06-04 1975-06-24 Beloit Corp Slitting mechanism for winder
US3989575A (en) 1975-04-16 1976-11-02 Oliver Machinery Company Split labeling apparatus
US4246595A (en) 1977-03-08 1981-01-20 Matsushita Electric Industrial Co., Ltd. Electronics circuit device and method of making the same
DE2810005A1 (de) 1978-03-08 1979-09-20 Egon P Schubert Hoehenverstellbare waescheleinen-vorrichtung
AT374596B (de) 1979-04-20 1984-05-10 Enander Bengt Zum auffinden von lawinenopfern dienender, am koerper zu tragender antwortsender
CH642594A5 (de) 1979-06-25 1984-04-30 Hunkeler Jos Ag Fabrik Fuer Gr Verfahren und vorrichtung zum automatischen aufbringen von aufklebern auf eine endlosbahn.
DE3203943A1 (de) 1982-02-05 1983-08-25 Karl 7631 Meißenheim Gallus Verfahren zum schneiden von fotosatz-filmen o.dgl. sowie vorrichtung zur durchfuehrung des verfahrens
US4670770A (en) * 1984-02-21 1987-06-02 American Telephone And Telegraph Company Integrated circuit chip-and-substrate assembly
US4818855A (en) * 1985-01-11 1989-04-04 Indala Corporation Identification system
US4783646A (en) 1986-03-07 1988-11-08 Kabushiki Kaisha Toshiba Stolen article detection tag sheet, and method for manufacturing the same
US4795898A (en) 1986-04-28 1989-01-03 American Telephone And Telegraph Company Personal memory card having a contactless interface using differential data transfer
FR2599893B1 (fr) * 1986-05-23 1996-08-02 Ricoh Kk Procede de montage d'un module electronique sur un substrat et carte a circuit integre
US4857893A (en) 1986-07-18 1989-08-15 Bi Inc. Single chip transponder device
DE3777164D1 (de) 1986-09-26 1992-04-09 Gen Electric Verfahren und anordnung zum pruefen elektronischer schaltungen und integrierter schaltungschips mit einer loesbaren bedeckungsschicht.
US4918811A (en) * 1986-09-26 1990-04-24 General Electric Company Multichip integrated circuit packaging method
US4783695A (en) 1986-09-26 1988-11-08 General Electric Company Multichip integrated circuit packaging configuration and method
US4766670A (en) 1987-02-02 1988-08-30 International Business Machines Corporation Full panel electronic packaging structure and method of making same
JPH0834264B2 (ja) * 1987-04-21 1996-03-29 住友電気工業株式会社 半導体装置およびその製造方法
DE8709503U1 (zh) 1987-07-10 1987-12-10 Mayer, Helmut, 7342 Bad Ditzenbach, De
JP2517341B2 (ja) * 1988-01-14 1996-07-24 三洋電機株式会社 光学式情報記録ディスクの製造方法
US4937653A (en) 1988-07-21 1990-06-26 American Telephone And Telegraph Company Semiconductor integrated circuit chip-to-chip interconnection scheme
US5212625A (en) * 1988-12-01 1993-05-18 Akzo Nv Semiconductor module having projecting cooling fin groups
US5008213A (en) * 1988-12-09 1991-04-16 The United States Of America As Represented By The Secretary Of The Air Force Hybrid wafer scale microcircuit integration
US4990462A (en) * 1989-04-12 1991-02-05 Advanced Micro Devices, Inc. Method for coplanar integration of semiconductor ic devices
US5099227A (en) * 1989-07-18 1992-03-24 Indala Corporation Proximity detecting apparatus
US5032896A (en) * 1989-08-31 1991-07-16 Hughes Aircraft Company 3-D integrated circuit assembly employing discrete chips
US5083697A (en) * 1990-02-14 1992-01-28 Difrancesco Louis Particle-enhanced joining of metal surfaces
JPH0777258B2 (ja) * 1990-03-16 1995-08-16 株式会社東芝 半導体装置
JP3280394B2 (ja) 1990-04-05 2002-05-13 ロックヒード マーティン コーポレーション 電子装置
US5241456A (en) * 1990-07-02 1993-08-31 General Electric Company Compact high density interconnect structure
US5049978A (en) 1990-09-10 1991-09-17 General Electric Company Conductively enclosed hybrid integrated circuit assembly using a silicon substrate
US5205032A (en) * 1990-09-28 1993-04-27 Kabushiki Kaisha Toshiba Electronic parts mounting apparatus
US5298685A (en) * 1990-10-30 1994-03-29 International Business Machines Corporation Interconnection method and structure for organic circuit boards
US5138436A (en) * 1990-11-16 1992-08-11 Ball Corporation Interconnect package having means for waveguide transmission of rf signals
FR2672428B1 (fr) 1991-02-04 1993-05-28 Schiltz Andre Procede et dispositif d'insertion de puces dans des logements d'un substrat par tete d'encollage.
USD343261S (en) * 1991-07-11 1994-01-11 Indala Corporation Transponder tag housing for attachment to the ear of an animal
US5231751A (en) * 1991-10-29 1993-08-03 International Business Machines Corporation Process for thin film interconnect
US5221831A (en) * 1991-11-29 1993-06-22 Indala Corporation Flap-type portal reader
JPH05169885A (ja) * 1991-12-26 1993-07-09 Mitsubishi Electric Corp 薄型ｉｃカード
US5382952A (en) * 1992-01-22 1995-01-17 Indala Corporation Transponder for proximity identification system
USD353343S (en) 1992-03-17 1994-12-13 Indala Corporation Identification transponder tag for fabric-type articles
US5517752A (en) * 1992-05-13 1996-05-21 Fujitsu Limited Method of connecting a pressure-connector terminal of a device with a terminal electrode of a substrate
US5779839A (en) 1992-06-17 1998-07-14 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
DE4319878A1 (de) * 1992-06-17 1993-12-23 Micron Technology Inc Hochfrequenz-Identifikationseinrichtung (HFID) und Verfahren zu ihrer Herstellung
US5612254A (en) * 1992-06-29 1997-03-18 Intel Corporation Methods of forming an interconnect on a semiconductor substrate
US5422513A (en) * 1992-10-16 1995-06-06 Martin Marietta Corporation Integrated circuit chip placement in a high density interconnect structure
US6274391B1 (en) 1992-10-26 2001-08-14 Texas Instruments Incorporated HDI land grid array packaged device having electrical and optical interconnects
US5382784A (en) * 1993-02-08 1995-01-17 Indala Corporation Hand-held dual technology identification tag reading head
US5353498A (en) * 1993-02-08 1994-10-11 General Electric Company Method for fabricating an integrated circuit module
US5420757A (en) * 1993-02-11 1995-05-30 Indala Corporation Method of producing a radio frequency transponder with a molded environmentally sealed package
ZA941671B (en) * 1993-03-11 1994-10-12 Csir Attaching an electronic circuit to a substrate.
JPH06337354A (ja) 1993-05-27 1994-12-06 Nikon Corp ズームレンズ
US5378880A (en) * 1993-08-20 1995-01-03 Indala Corporation Housing structure for an access control RFID reader
US5430441A (en) * 1993-10-12 1995-07-04 Motorola, Inc. Transponding tag and method
US5373627A (en) 1993-11-23 1994-12-20 Grebe; Kurt R. Method of forming multi-chip module with high density interconnections
US5824186A (en) * 1993-12-17 1998-10-20 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
US5904545A (en) 1993-12-17 1999-05-18 The Regents Of The University Of California Apparatus for fabricating self-assembling microstructures
US6864570B2 (en) * 1993-12-17 2005-03-08 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
US5545291A (en) * 1993-12-17 1996-08-13 The Regents Of The University Of California Method for fabricating self-assembling microstructures
EP0665705B1 (en) 1993-12-30 2009-08-19 Kabushiki Kaisha Miyake Circuit-like metallic foil sheet and the like and process for producing them
US5444223A (en) 1994-01-11 1995-08-22 Blama; Michael J. Radio frequency identification tag and method
US5514613A (en) * 1994-01-27 1996-05-07 Integrated Device Technology Parallel manufacturing of semiconductor devices and the resulting structure
US6222212B1 (en) 1994-01-27 2001-04-24 Integrated Device Technology, Inc. Semiconductor device having programmable interconnect layers
USD378578S (en) * 1994-02-25 1997-03-25 Indala Corporation Identification transponder tag
US5434751A (en) * 1994-04-11 1995-07-18 Martin Marietta Corporation Reworkable high density interconnect structure incorporating a release layer
US5565846A (en) * 1994-04-25 1996-10-15 Indala Corporation Reader system for waste bin pickup vehicles
CA2152860A1 (en) * 1994-07-15 1996-01-16 Argyrios A. Chatzipetros Antenna for communication device
US5554821A (en) * 1994-07-15 1996-09-10 National Semiconductor Corporation Removable computer peripheral cards having a solid one-piece housing
DE4427309C2 (de) 1994-08-02 1999-12-02 Ibm Herstellung eines Trägerelementmoduls zum Einbau in Chipkarten oder andere Datenträgerkarten
US5528222A (en) * 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
US5682143A (en) * 1994-09-09 1997-10-28 International Business Machines Corporation Radio frequency identification tag
US5574470A (en) * 1994-09-30 1996-11-12 Palomar Technologies Corporation Radio frequency identification transponder apparatus and method
US5541613A (en) 1994-11-03 1996-07-30 Hughes Aircraft Company, Hughes Electronics Efficient broadband antenna system using photonic bandgap crystals
US5707902A (en) * 1995-02-13 1998-01-13 Industrial Technology Research Institute Composite bump structure and methods of fabrication
WO1996028941A1 (en) * 1995-03-13 1996-09-19 Motorola Inc. Radio frequency identification system for reliable communication
CA2176625C (en) 1995-05-19 2008-07-15 Donald Harold Fergusen Radio frequency identification tag
US5745984A (en) * 1995-07-10 1998-05-05 Martin Marietta Corporation Method for making an electronic module
GB2305075A (en) 1995-09-05 1997-03-26 Ibm Radio Frequency Tag for Electronic Apparatus
DE19534480C2 (de) 1995-09-18 1999-11-11 David Finn IC-Kartenmodul zur Herstellung einer IC-Karte sowie IC-Karte mit einem IC-Kartenmodul
US6040773A (en) * 1995-10-11 2000-03-21 Motorola, Inc. Radio frequency identification tag arranged for magnetically storing tag state information
US6252508B1 (en) * 1995-10-11 2001-06-26 Motorola, Inc. Radio frequency identification tag arranged for magnetically storing tag state information
US6211572B1 (en) * 1995-10-31 2001-04-03 Tessera, Inc. Semiconductor chip package with fan-in leads
US5785181A (en) * 1995-11-02 1998-07-28 Clothestrak, Inc. Permanent RFID garment tracking system
US5754110A (en) 1996-03-07 1998-05-19 Checkpoint Systems, Inc. Security tag and manufacturing method
DE19616819A1 (de) 1996-04-26 1997-10-30 Giesecke & Devrient Gmbh CD mit eingebautem Chip
US5627931A (en) * 1996-05-28 1997-05-06 Motorola Optoelectronic transducer
US5708419A (en) * 1996-07-22 1998-01-13 Checkpoint Systems, Inc. Method of wire bonding an integrated circuit to an ultraflexible substrate
FR2751767B1 (fr) * 1996-07-26 1998-12-18 Thomson Csf Systeme de stockage securise de donnees sur cd-rom
US6466131B1 (en) * 1996-07-30 2002-10-15 Micron Technology, Inc. Radio frequency data communications device with adjustable receiver sensitivity and method
KR19990072029A (ko) 1996-10-10 1999-09-27 윤종용 마이크로웨이브 하이브리드 집적회로
JPH10166770A (ja) 1996-12-17 1998-06-23 Rohm Co Ltd 非接触型ｉｃカード及びその製造方法
DE19703057A1 (de) * 1996-12-20 1998-07-02 Siemens Ag Trägerelement zum Einbau in Kombi-Chipkarten und Kombi-Chipkarte
US5798050A (en) * 1997-01-10 1998-08-25 International Business Machines Corporation Process for fabrication of a selectively filled flexible adhesive device for solderless connection of electronic modules to a substrate
CA2278367C (en) * 1997-01-25 2007-05-08 Philip Noel Leonard Identification or control arrangements
US6082600A (en) 1997-03-08 2000-07-04 Angus; June Clipable article container
JP2001514777A (ja) 1997-03-10 2001-09-11 プレシジョン ダイナミクス コーポレイション 可撓性基体に設けられた回路の反応可能に接続された要素
US6229203B1 (en) 1997-03-12 2001-05-08 General Electric Company Semiconductor interconnect structure for high temperature applications
US5862117A (en) 1997-03-12 1999-01-19 Em Microelectronic-Marin Sa Device, in particular a compact disc, comprising a data storage medium and an integrated circuit
US6094173A (en) * 1997-04-18 2000-07-25 Motorola, Inc. Method and apparatus for detecting an RFID tag signal
US6329213B1 (en) 1997-05-01 2001-12-11 Micron Technology, Inc. Methods for forming integrated circuits within substrates
DE19722327A1 (de) 1997-05-28 1998-12-03 Arsoma Druckmaschinen Gmbh Verfahren zur Herstellung eines mehrlagigen Etiketts und Vorrichtung zur Durchführung des Verfahrens
US6459084B1 (en) 1997-05-30 2002-10-01 University Of Central Florida Area receiver with antenna-coupled infrared sensors
US6064116A (en) 1997-06-06 2000-05-16 Micron Technology, Inc. Device for electrically or thermally coupling to the backsides of integrated circuit dice in chip-on-board applications
US6816830B1 (en) 1997-07-04 2004-11-09 Xerox Corporation Finite state data structures with paths representing paired strings of tags and tag combinations
JP3438565B2 (ja) * 1997-08-22 2003-08-18 ユニ電子工業株式会社 盗難防止用タグ
FR2769389B1 (fr) 1997-10-07 2000-01-28 Rue Cartes Et Systemes De Carte a microcircuit combinant des plages de contact exterieur et une antenne, et procede de fabrication d'une telle carte
DE19745648A1 (de) 1997-10-15 1998-11-26 Siemens Ag Trägerelement für einen Halbleiterchip zum Einbau in Chipkarten
US6164551A (en) 1997-10-29 2000-12-26 Meto International Gmbh Radio frequency identification transponder having non-encapsulated IC chip
US6002344A (en) * 1997-11-21 1999-12-14 Bandy; William R. System and method for electronic inventory
JP2001510670A (ja) * 1997-12-05 2001-07-31 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 識別トランスポンダ
US6268796B1 (en) 1997-12-12 2001-07-31 Alfred Gnadinger Radio frequency identification transponder having integrated antenna
US6281794B1 (en) * 1998-01-02 2001-08-28 Intermec Ip Corp. Radio frequency transponder with improved read distance
US6019284A (en) 1998-01-27 2000-02-01 Viztec Inc. Flexible chip card with display
DE19805282A1 (de) 1998-02-10 1999-08-19 Siemens Ag Flächiger Träger mit einer Anzeigeeinrichtung
US6395373B2 (en) 1998-02-11 2002-05-28 Avery Dennison Corporation Label/tag with embedded signaling device and method and apparatus for making and using
US6094138A (en) * 1998-02-27 2000-07-25 Motorola, Inc. Integrated circuit assembly and method of assembly
US6206282B1 (en) 1998-03-03 2001-03-27 Pyper Products Corporation RF embedded identification device
FR2775810B1 (fr) 1998-03-09 2000-04-28 Gemplus Card Int Procede de fabrication de cartes sans contact
JP3625646B2 (ja) 1998-03-23 2005-03-02 東レエンジニアリング株式会社 フリップチップ実装方法
US20010024127A1 (en) * 1998-03-30 2001-09-27 William E. Bernier Semiconductor testing using electrically conductive adhesives
US6040630A (en) 1998-04-13 2000-03-21 Harris Corporation Integrated circuit package for flip chip with alignment preform feature and method of forming same
US6107921A (en) * 1998-04-16 2000-08-22 Motorola, Inc. Conveyor bed with openings for capacitive coupled readers
US6275681B1 (en) * 1998-04-16 2001-08-14 Motorola, Inc. Wireless electrostatic charging and communicating system
US6282407B1 (en) * 1998-04-16 2001-08-28 Motorola, Inc. Active electrostatic transceiver and communicating system
EP0951068A1 (en) 1998-04-17 1999-10-20 Interuniversitair Micro-Elektronica Centrum Vzw Method of fabrication of a microstructure having an inside cavity
JP4043601B2 (ja) 1998-06-04 2008-02-06 大日本印刷株式会社 非接触型ｉｃカードとその製造方法、非接触型ｉｃカード用基体
US6246327B1 (en) * 1998-06-09 2001-06-12 Motorola, Inc. Radio frequency identification tag circuit chip having printed interconnection pads
US6018299A (en) 1998-06-09 2000-01-25 Motorola, Inc. Radio frequency identification tag having a printed antenna and method
US6091332A (en) 1998-06-09 2000-07-18 Motorola, Inc. Radio frequency identification tag having printed circuit interconnections
US6107920A (en) 1998-06-09 2000-08-22 Motorola, Inc. Radio frequency identification tag having an article integrated antenna
EP1014302B1 (en) 1998-07-08 2005-09-21 Dai Nippon Printing Co., Ltd. Noncontact ic card and manufacture thereof
EP1770591B1 (en) 1998-08-14 2010-04-28 3M Innovative Properties Company RFID reader
DE19840210A1 (de) * 1998-09-03 2000-03-09 Fraunhofer Ges Forschung Verfahren zur Handhabung einer Mehrzahl von Schaltungschips
DE19840226B4 (de) 1998-09-03 2006-02-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Aufbringen eines Schaltungschips auf einen Träger
GB2341166B (en) 1998-09-04 2001-04-18 Denny Bros Printing Adhesive labels and maunfacture thereof
ATE398814T1 (de) * 1998-09-11 2008-07-15 Motorola Inc Rfid-etikettenvorrichtung und verfahren
US6147605A (en) 1998-09-11 2000-11-14 Motorola, Inc. Method and apparatus for an optimized circuit for an electrostatic radio frequency identification tag
US6189208B1 (en) 1998-09-11 2001-02-20 Polymer Flip Chip Corp. Flip chip mounting technique
WO2000016493A1 (en) 1998-09-17 2000-03-23 Trakus, Inc. Moldable transceiver for use with apparel
DE19846237A1 (de) 1998-10-07 2000-04-13 Fraunhofer Ges Forschung Verfahren zur Herstellung eines Mikrotransponders
WO2000023994A1 (en) 1998-10-16 2000-04-27 Intermec Ip Corp. Smart optical storage media
JP2000132871A (ja) * 1998-10-22 2000-05-12 Hitachi Ltd ディスク及びこれを用いた記録再生装置
US6100804A (en) 1998-10-29 2000-08-08 Intecmec Ip Corp. Radio frequency identification system
US6902111B2 (en) * 1998-11-12 2005-06-07 Wenyu Han Method and apparatus for impeding the counterfeiting of discs
US6262692B1 (en) 1999-01-13 2001-07-17 Brady Worldwide, Inc. Laminate RFID label and method of manufacture
US6114088A (en) 1999-01-15 2000-09-05 3M Innovative Properties Company Thermal transfer element for forming multilayer devices
DE59900131D1 (de) 1999-01-23 2001-07-26 Ident Gmbh X RFID-Transponder mit bedruckbarer Oberfläche
US6031450A (en) 1999-02-03 2000-02-29 Huang; Tien-Tsai Tire pressure alarm system with centrifugal force-controlled power switch
US6274508B1 (en) * 1999-02-05 2001-08-14 Alien Technology Corporation Apparatuses and methods used in forming assemblies
JP2002536695A (ja) 1999-02-05 2002-10-29 エイリアン・テクノロジイ・コーポレーション アセンブリを形成するための装置および方法
US6850312B2 (en) * 1999-03-16 2005-02-01 Alien Technology Corporation Apparatuses and methods for flexible displays
US6281038B1 (en) * 1999-02-05 2001-08-28 Alien Technology Corporation Methods for forming assemblies
US6122492A (en) * 1999-02-08 2000-09-19 Motorola, Inc. Adjustable radio frequency power amplifier and transmitter
ES2246759T3 (es) 1999-02-09 2006-03-01 Magnus Granhed Antena encapsulada para transpondor pasivo.
JP2000231614A (ja) 1999-02-12 2000-08-22 Omron Corp 電磁波読み取り可能なデータキャリア
US6291896B1 (en) 1999-02-16 2001-09-18 Alien Technology Corporation Functionally symmetric integrated circuit die
US6133833A (en) * 1999-02-25 2000-10-17 Motorola, Inc. Wireless add-on keyboard system and method
WO2000052109A1 (en) 1999-03-02 2000-09-08 Motorola Inc. Electronic tag assembly and method therefor
FR2790849B1 (fr) * 1999-03-12 2001-04-27 Gemplus Card Int Procede de fabrication pour dispositif electronique du type carte sans contact
US6468638B2 (en) * 1999-03-16 2002-10-22 Alien Technology Corporation Web process interconnect in electronic assemblies
US6410415B1 (en) * 1999-03-23 2002-06-25 Polymer Flip Chip Corporation Flip chip mounting technique
ES2453486T3 (es) 1999-03-24 2014-04-07 Motorola Solutions, Inc. Conector de chip de circuito y método de conexión de un chip de circuito
JP2000278009A (ja) 1999-03-24 2000-10-06 Nec Corp マイクロ波・ミリ波回路装置
EP1043684A1 (de) * 1999-03-29 2000-10-11 OMD Productions AG Informationsträger
US6280544B1 (en) * 1999-04-21 2001-08-28 Intermec Ip Corp. RF tag application system
JP3928682B2 (ja) * 1999-06-22 2007-06-13 オムロン株式会社 配線基板同士の接合体、配線基板同士の接合方法、データキャリアの製造方法、及び電子部品モジュールの実装装置
DE19929610C1 (de) 1999-06-28 2000-10-12 Giesecke & Devrient Gmbh Chipmodul, Chipkarte und Verfahren zu deren Herstellung
GB9915331D0 (en) 1999-06-30 1999-09-01 World Golf Systems Limited Golf balls
US6134130A (en) 1999-07-19 2000-10-17 Motorola, Inc. Power reception circuits for a device receiving an AC power signal
US6140146A (en) 1999-08-03 2000-10-31 Intermec Ip Corp. Automated RFID transponder manufacturing on flexible tape substrates
US6147662A (en) 1999-09-10 2000-11-14 Moore North America, Inc. Radio frequency identification tags and labels
US6271060B1 (en) * 1999-09-13 2001-08-07 Vishay Intertechnology, Inc. Process of fabricating a chip scale surface mount package for semiconductor device
US6421013B1 (en) * 1999-10-04 2002-07-16 Amerasia International Technology, Inc. Tamper-resistant wireless article including an antenna
AU1330201A (en) * 1999-10-06 2001-05-10 Bradley G. Trimble Object locating system employing rf signaling
US6686650B1 (en) 1999-10-08 2004-02-03 Dai Nippon Printing Co., Ltd. Non-contact data carrier and IC chip
US6479395B1 (en) 1999-11-02 2002-11-12 Alien Technology Corporation Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings
US6420266B1 (en) * 1999-11-02 2002-07-16 Alien Technology Corporation Methods for creating elements of predetermined shape and apparatuses using these elements
US6271793B1 (en) 1999-11-05 2001-08-07 International Business Machines Corporation Radio frequency (RF) transponder (Tag) with composite antenna
EP1232477A1 (de) 1999-11-18 2002-08-21 Siemens Aktiengesellschaft Mobiler datenträger mit einem transponder aus einem oberflächenwellenbauelement mit schlitzantenne
US6259408B1 (en) * 1999-11-19 2001-07-10 Intermec Ip Corp. RFID transponders with paste antennas and flip-chip attachment
FR2801708B1 (fr) * 1999-11-29 2003-12-26 A S K Procede de fabrication d'une carte a puce sans contact avec un support d'antenne en materiau fibreux
DE19957647A1 (de) 1999-11-30 2001-06-28 Siemens Ag Ringförmiger Datenmobilspeicher mit Koppelspule insbesondere für ein Identifikationssystem bevorzugt zur Identifikation von Gasflaschen
JP3390389B2 (ja) 1999-12-08 2003-03-24 チェックポイント・マニュファクチュアリング・ジャパン株式会社 共振タグ
JP2001175837A (ja) 1999-12-22 2001-06-29 Toppan Printing Co Ltd Ｉｃカード
FI112288B (fi) 2000-01-17 2003-11-14 Rafsec Oy Menetelmä älytarrasyöttörainan valmistamiseksi
US6275156B1 (en) 2000-02-07 2001-08-14 Westvaco Corporation EAS ready paperboard
US6451154B1 (en) 2000-02-18 2002-09-17 Moore North America, Inc. RFID manufacturing concepts
CN1200822C (zh) * 2000-02-22 2005-05-11 东丽工程株式会社 非接触式识别信息卡类及其制造方法
FR2806029A1 (fr) 2000-03-09 2001-09-14 Christian Antoine Fournier Procede de fabrication d'objets portables
EP1278612B1 (en) 2000-03-10 2010-02-24 Chippac, Inc. Flip chip Interconnection structure and method of obtaining the same
US6229442B1 (en) * 2000-03-14 2001-05-08 Motorola, Inc, Radio frequency identification device having displacement current control and method thereof
DE60110906T2 (de) 2000-04-04 2006-04-27 Toray Engineering Co., Ltd. Verfahren zur herstellung eines cof-gehäuses
DE10017431C2 (de) 2000-04-07 2002-05-23 Melzer Maschinenbau Gmbh Verfahren und Vorrichtung zum Herstellen von Datenträgern mit integriertem Transponder
US6366468B1 (en) * 2000-04-28 2002-04-02 Hewlett-Packard Company Self-aligned common carrier
AU2001274896A1 (en) * 2000-05-22 2001-12-03 Avery Dennison Corporation Trackable files and systems for using the same
FI20001344A (fi) * 2000-06-06 2001-12-07 Rafsec Oy Menetelmä ja laitteisto älytarrasyöttörainan valmistamiseksi
FI111881B (fi) 2000-06-06 2003-09-30 Rafsec Oy Älykorttiraina ja menetelmä sen valmistamiseksi
US6908295B2 (en) * 2000-06-16 2005-06-21 Avery Dennison Corporation Process and apparatus for embossing precise microstructures and embossing tool for making same
US6309912B1 (en) 2000-06-20 2001-10-30 Motorola, Inc. Method of interconnecting an embedded integrated circuit
JP4239439B2 (ja) 2000-07-06 2009-03-18 セイコーエプソン株式会社 光学装置およびその製造方法ならびに光伝送装置
JP3840926B2 (ja) 2000-07-07 2006-11-01 セイコーエプソン株式会社 有機ｅｌ表示体及びその製造方法、並びに電子機器
JP3815269B2 (ja) * 2000-07-07 2006-08-30 セイコーエプソン株式会社 有機ｅｌ表示体及びその製造方法、孔開き基板、電気光学装置及びその製造方法、並びに電子機器
JP3915868B2 (ja) * 2000-07-07 2007-05-16 セイコーエプソン株式会社 強誘電体メモリ装置およびその製造方法
US6483473B1 (en) * 2000-07-18 2002-11-19 Marconi Communications Inc. Wireless communication device and method
US6780696B1 (en) 2000-09-12 2004-08-24 Alien Technology Corporation Method and apparatus for self-assembly of functional blocks on a substrate facilitated by electrode pairs
KR20030060894A (ko) * 2000-09-19 2003-07-16 나노피어스 테크놀러지스, 인코포레이티드 무선 주파수 인식 장치의 소자와 안테나 어셈블리 방법
US6392213B1 (en) * 2000-10-12 2002-05-21 The Charles Stark Draper Laboratory, Inc. Flyer assembly
US6448109B1 (en) 2000-11-15 2002-09-10 Analog Devices, Inc. Wafer level method of capping multiple MEMS elements
US20020149107A1 (en) 2001-02-02 2002-10-17 Avery Dennison Corporation Method of making a flexible substrate containing self-assembling microstructures
US6794221B2 (en) 2000-11-29 2004-09-21 Hrl Laboratories, Llc Method of placing elements into receptors in a substrate
US6611237B2 (en) * 2000-11-30 2003-08-26 The Regents Of The University Of California Fluidic self-assembly of active antenna
FI112121B (fi) 2000-12-11 2003-10-31 Rafsec Oy Älytarraraina, menetelmä sen valmistamiseksi, menetelmä kantorainan valmistamiseksi ja älytarrarainan älytarran rakenneosa
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
US6734797B2 (en) * 2001-02-12 2004-05-11 Matrics, Inc. Identification tag utilizing charge pumps for voltage supply generation and data recovery
US7101091B2 (en) * 2001-02-21 2006-09-05 Zarlink Semiconductor, Inc. Apparatus for coupling a fiber optic cable to an optoelectronic device, a system including the apparatus, and a method of forming the same
US7000834B2 (en) * 2001-02-21 2006-02-21 International Business Machines Corporation Method to address security and privacy issue of the use of RFID systems to track consumer products
US6417025B1 (en) 2001-04-02 2002-07-09 Alien Technology Corporation Integrated circuit packages assembled utilizing fluidic self-assembly
DE10120269C1 (de) * 2001-04-25 2002-07-25 Muehlbauer Ag Verfahren zum Verbinden von Mikrochips mit auf einem Trägerband angeordneten Antennen zum Herstellen eines Transponders
US6606247B2 (en) 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
US6727970B2 (en) * 2001-06-25 2004-04-27 Avery Dennison Corporation Method of making a hybrid display device having a rigid substrate and a flexible substrate
US6856086B2 (en) * 2001-06-25 2005-02-15 Avery Dennison Corporation Hybrid display device
US6590346B1 (en) 2001-07-16 2003-07-08 Alien Technology Corporation Double-metal background driven displays
US7112138B2 (en) * 2001-08-03 2006-09-26 Igt Player tracking communication mechanisms in a gaming machine
US20030036249A1 (en) * 2001-08-06 2003-02-20 Bauer Donald G. Chip alignment and placement apparatus for integrated circuit, MEMS, photonic or other devices
US6530649B1 (en) * 2001-08-16 2003-03-11 Hewlett-Packard Company Hermetic seal in microelectronic devices
US6863219B1 (en) * 2001-08-17 2005-03-08 Alien Technology Corporation Apparatuses and methods for forming electronic assemblies
US6528351B1 (en) * 2001-09-24 2003-03-04 Jigsaw Tek, Inc. Integrated package and methods for making same
DE10150458A1 (de) 2001-10-16 2003-04-17 Ident Gmbh X Opto-elektronischer Datenträger mit appliziertem Transponder
US6844673B1 (en) * 2001-12-06 2005-01-18 Alien Technology Corporation Split-fabrication for light emitting display structures
JP2006504251A (ja) 2002-01-23 2006-02-02 エイリアン・テクノロジイ・コーポレーション 小さなサイズの構成要素と大きなサイズの構成要素を組み込んでいる装置およびその作成方法
KR20030076274A (ko) * 2002-03-18 2003-09-26 도레 엔지니아린구 가부시키가이샤 비접촉 아이디 카드류 및 그 제조방법
ES2198216B1 (es) 2002-07-02 2005-04-16 Juan Carlos Instituto Cientifico Y Tecnologico De Navarra, S.A.(67%). Medio de cultivo de celulas madre-progenitoras autologas humanas y sus aplicaciones.
US20040005494A1 (en) * 2002-07-05 2004-01-08 Drake Javit A. Chemical sensing in fuel cell systems
CN1666284A (zh) 2002-07-08 2005-09-07 皇家飞利浦电子股份有限公司 配备有双天线的信息载体驱动设备
US6867983B2 (en) * 2002-08-07 2005-03-15 Avery Dennison Corporation Radio frequency identification device and method
US7275040B2 (en) 2002-09-12 2007-09-25 Mineral Lassen Llc RFID security device for optical disc
US20040052203A1 (en) * 2002-09-13 2004-03-18 Brollier Brian W. Light enabled RFID in information disks
US20040052202A1 (en) * 2002-09-13 2004-03-18 Brollier Brian W. RFID enabled information disks
US20040143505A1 (en) * 2002-10-16 2004-07-22 Aram Kovach Method for tracking and disposition of articles
US6900731B2 (en) * 2002-10-30 2005-05-31 Bellsouth Intellectual Property Corporation Method for monitoring and tracking objects
JP2004206412A (ja) 2002-12-25 2004-07-22 Casio Comput Co Ltd カード型デバイスおよび認証システム
US6940408B2 (en) * 2002-12-31 2005-09-06 Avery Dennison Corporation RFID device and method of forming
US20040142766A1 (en) * 2003-01-17 2004-07-22 Chris Savarese Apparatuses, methods and systems relating to findable golf balls
US7253735B2 (en) * 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
GB0309498D0 (en) 2003-04-25 2003-06-04 Avery Dennison Corp Extended range RFID system
US7120987B2 (en) 2003-08-05 2006-10-17 Avery Dennison Corporation Method of making RFID device
US7017807B2 (en) * 2003-09-08 2006-03-28 Francis M. Claessens Apparatus and method for detecting tampering with containers and preventing counterfeiting thereof
US7691009B2 (en) * 2003-09-26 2010-04-06 Radar Golf, Inc. Apparatuses and methods relating to findable balls
WO2005045755A2 (en) * 2003-11-04 2005-05-19 Avery Dennison Corporation Rfid tag with enhanced readability
US7158037B2 (en) * 2004-03-22 2007-01-02 Avery Dennison Corporation Low cost method of producing radio frequency identification tags with straps without antenna patterning
DE602004017840D1 (de) 2004-05-17 2009-01-02 Sony Dadc Austria Ag Optischer Datenträger, Verfahren und Vorrichtung zur Herstellung eines optischen Datenträgers
JP4328682B2 (ja) * 2004-07-13 2009-09-09 富士通株式会社 光記録媒体用の無線タグアンテナ構造および無線タグアンテナ付き光記録媒体の収納ケース
SG119329A1 (en) * 2004-07-29 2006-02-28 Fujikura Ltd Semiconductor device and method for manufacturing the same
US7353598B2 (en) * 2004-11-08 2008-04-08 Alien Technology Corporation Assembly comprising functional devices and method of making same
US20070031992A1 (en) * 2005-08-05 2007-02-08 Schatz Kenneth D Apparatuses and methods facilitating functional block deposition

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8333004B2 (en) 2007-04-24 2012-12-18 Smartrac Ip B.V. Electronic interface apparatus and method and system for manufacturing same
CN101689249B (zh) * 2007-04-24 2013-07-31 斯迈达Ip有限公司 电子接口装置及其制造方法和系统
US9038913B2 (en) 2007-04-24 2015-05-26 Smartrac Ip B.V. Electronic interface apparatus and method and system for manufacturing same
US9773201B2 (en) 2007-04-24 2017-09-26 Smartrac Ip B.V. Electronic interface apparatus and method and system for manufacturing same
CN108603311A (zh) * 2015-12-30 2018-09-28 诺丁汉特伦特大学 电子条带纱线
CN108603311B (zh) * 2015-12-30 2021-12-07 诺丁汉特伦特大学 电子条带纱线
CN111542835A (zh) * 2017-12-01 2020-08-14 艾利丹尼森零售信息服务公司 利用基板中的孔的柔性织物标签
CN112384956A (zh) * 2018-05-22 2021-02-19 先讯美资电子有限责任公司 细长柔性标签
US11282357B2 (en) 2018-05-22 2022-03-22 Tyco Fire & Security Gmbh Elongate flexible tag
CN112384956B (zh) * 2018-05-22 2024-03-15 先讯美资电子有限责任公司 细长柔性标签

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EP1606778A2 (en) 2005-12-21
US7489248B2 (en) 2009-02-10
US20150242739A1 (en) 2015-08-27
US7868766B2 (en) 2011-01-11
WO2004086289A2 (en) 2004-10-07
US20090167534A1 (en) 2009-07-02
US8350703B2 (en) 2013-01-08
US20130265134A1 (en) 2013-10-10
US8912907B2 (en) 2014-12-16
CN1764932B (zh) 2012-05-23
US20110186640A1 (en) 2011-08-04
US20060267778A1 (en) 2006-11-30
US7253735B2 (en) 2007-08-07
US9418328B2 (en) 2016-08-16
WO2004086289A3 (en) 2005-04-14
EP1606778A4 (en) 2011-07-27

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