CN1786781B - 混合电路板及具有该混合电路板的显示装置 - Google Patents
混合电路板及具有该混合电路板的显示装置 Download PDFInfo
- Publication number
- CN1786781B CN1786781B CN2005101094859A CN200510109485A CN1786781B CN 1786781 B CN1786781 B CN 1786781B CN 2005101094859 A CN2005101094859 A CN 2005101094859A CN 200510109485 A CN200510109485 A CN 200510109485A CN 1786781 B CN1786781 B CN 1786781B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- peristome
- auxiliary body
- auxiliary
- protuberance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09127—PCB or component having an integral separable or breakable part
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09645—Patterning on via walls; Plural lands around one hole
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
Abstract
Description
Claims (6)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040103611A KR20060064924A (ko) | 2004-12-09 | 2004-12-09 | 하이브리드 회로기판 및 이를 갖는 표시장치 |
KR10-2004-0103611 | 2004-12-09 | ||
KR1020040103611 | 2004-12-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1786781A CN1786781A (zh) | 2006-06-14 |
CN1786781B true CN1786781B (zh) | 2011-04-13 |
Family
ID=36584575
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2005101094859A Expired - Fee Related CN1786781B (zh) | 2004-12-09 | 2005-10-20 | 混合电路板及具有该混合电路板的显示装置 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7273379B2 (zh) |
JP (1) | JP2006165490A (zh) |
KR (1) | KR20060064924A (zh) |
CN (1) | CN1786781B (zh) |
TW (1) | TWI343768B (zh) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050190824A1 (en) * | 2004-02-26 | 2005-09-01 | Grande Brad L. | Method and apparatus for mounting a modem to a carrier assembly |
KR101301954B1 (ko) * | 2006-06-30 | 2013-08-30 | 엘지디스플레이 주식회사 | 백라이트 유닛 및 이를 포함하는 액정표시장치모듈 |
KR20080027599A (ko) * | 2006-09-25 | 2008-03-28 | 삼성전자주식회사 | 백라이트 어셈블리 및 이를 포함하는 표시 장치 |
TWI350931B (en) * | 2007-09-12 | 2011-10-21 | Au Optronics Corp | Backlight structure |
US11266014B2 (en) | 2008-02-14 | 2022-03-01 | Metrospec Technology, L.L.C. | LED lighting systems and method |
US8007286B1 (en) * | 2008-03-18 | 2011-08-30 | Metrospec Technology, Llc | Circuit boards interconnected by overlapping plated through holes portions |
US10334735B2 (en) | 2008-02-14 | 2019-06-25 | Metrospec Technology, L.L.C. | LED lighting systems and methods |
US8851356B1 (en) | 2008-02-14 | 2014-10-07 | Metrospec Technology, L.L.C. | Flexible circuit board interconnection and methods |
FR2928066A1 (fr) * | 2008-02-27 | 2009-08-28 | Thomson Licensing Sas | Systeme d'interconnexion de deux substrats comportant chacun au moins une ligne de transmission |
DE102008012443B4 (de) * | 2008-03-04 | 2015-05-21 | Ifm Electronic Gmbh | Verbindungsanordnung zweier Leiterplatten für einen optischen Näherungsschalter |
DE102008001557A1 (de) * | 2008-05-05 | 2009-11-12 | Robert Bosch Gmbh | Messerleisten-Kontaktierung über Zwischenleiterplatten |
US7972143B2 (en) | 2009-02-02 | 2011-07-05 | Tyco Electronics Corporation | Printed circuit assembly |
JP2011129708A (ja) * | 2009-12-17 | 2011-06-30 | Panasonic Electric Works Co Ltd | プリント配線板の接続構造 |
US8289729B2 (en) * | 2010-02-26 | 2012-10-16 | Corsair Memory, Inc. | PCB interconnect scheme for PSU |
CN102340087A (zh) * | 2010-07-28 | 2012-02-01 | 鸿富锦精密工业(深圳)有限公司 | 电源转接卡 |
GB2494919B (en) * | 2011-09-23 | 2015-06-17 | Control Tech Ltd | Method for connecting printed circuit boards. |
WO2013157098A1 (ja) * | 2012-04-18 | 2013-10-24 | 三菱電機株式会社 | ノイズフィルタ装置 |
EP3146811B1 (en) * | 2014-05-22 | 2023-08-02 | Signify Holding B.V. | Printed circuit board arrangement |
US10163687B2 (en) * | 2015-05-22 | 2018-12-25 | Qualcomm Incorporated | System, apparatus, and method for embedding a 3D component with an interconnect structure |
US10608359B2 (en) * | 2016-12-16 | 2020-03-31 | Samsung Electronics Co., Ltd. | Connection structure between flat cable and electronic circuit board |
CN106704993A (zh) * | 2017-01-09 | 2017-05-24 | 宁波亚茂光电股份有限公司 | 一种插卡式电源与光源板的连接结构 |
US10461467B2 (en) * | 2017-01-20 | 2019-10-29 | Fci Usa Llc | Compact card edge connector |
CN109754748B (zh) * | 2017-11-03 | 2021-05-14 | 上海和辉光电股份有限公司 | 一种显示面板的驱动电路、显示面板及显示装置 |
JP6925447B2 (ja) * | 2017-12-08 | 2021-08-25 | 三菱電機株式会社 | プリント配線板およびその製造方法 |
US10849200B2 (en) | 2018-09-28 | 2020-11-24 | Metrospec Technology, L.L.C. | Solid state lighting circuit with current bias and method of controlling thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5455742A (en) * | 1994-03-21 | 1995-10-03 | Eaton Corporation | Direct circuit board connection |
US5629839A (en) * | 1995-09-12 | 1997-05-13 | Allen-Bradley Company, Inc. | Module interconnect adapter for reduced parasitic inductance |
CN1188389A (zh) * | 1996-12-25 | 1998-07-22 | 佳能株式会社 | 电路板连接结构 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2894241A (en) * | 1956-03-28 | 1959-07-07 | United Carr Fastener Corp | Right-angle printed wire connector |
US4513064A (en) * | 1982-12-17 | 1985-04-23 | The United States Of America As Represented By The Secretary Of The Army | Package for rugged electronics |
US5110298A (en) * | 1990-07-26 | 1992-05-05 | Motorola, Inc. | Solderless interconnect |
US6496384B1 (en) * | 2001-09-21 | 2002-12-17 | Visteon Global Technologies, Inc. | Circuit board assembly and method of fabricating same |
JP3901501B2 (ja) * | 2001-12-12 | 2007-04-04 | アルプス電気株式会社 | 電子回路ユニットの取付構造 |
JP3090836U (ja) * | 2002-06-19 | 2002-12-26 | 船井電機株式会社 | 立ち基板の固定構造 |
-
2004
- 2004-12-09 KR KR1020040103611A patent/KR20060064924A/ko not_active Application Discontinuation
-
2005
- 2005-03-16 JP JP2005074744A patent/JP2006165490A/ja active Pending
- 2005-09-20 TW TW094132544A patent/TWI343768B/zh not_active IP Right Cessation
- 2005-10-13 US US11/248,345 patent/US7273379B2/en not_active Expired - Fee Related
- 2005-10-20 CN CN2005101094859A patent/CN1786781B/zh not_active Expired - Fee Related
-
2007
- 2007-08-27 US US11/845,193 patent/US7419381B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5455742A (en) * | 1994-03-21 | 1995-10-03 | Eaton Corporation | Direct circuit board connection |
US5629839A (en) * | 1995-09-12 | 1997-05-13 | Allen-Bradley Company, Inc. | Module interconnect adapter for reduced parasitic inductance |
CN1188389A (zh) * | 1996-12-25 | 1998-07-22 | 佳能株式会社 | 电路板连接结构 |
Also Published As
Publication number | Publication date |
---|---|
JP2006165490A (ja) | 2006-06-22 |
CN1786781A (zh) | 2006-06-14 |
US7273379B2 (en) | 2007-09-25 |
KR20060064924A (ko) | 2006-06-14 |
US20060128174A1 (en) | 2006-06-15 |
TWI343768B (en) | 2011-06-11 |
TW200635453A (en) | 2006-10-01 |
US7419381B2 (en) | 2008-09-02 |
US20070291454A1 (en) | 2007-12-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SAMSUNG DISPLAY CO., LTD. Free format text: FORMER OWNER: SAMSUNG ELECTRONICS CO., LTD. Effective date: 20121228 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20121228 Address after: Gyeonggi Do, South Korea Patentee after: Samsung Display Co., Ltd. Address before: Gyeonggi Do, South Korea Patentee before: Samsung Electronics Co., Ltd. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110413 Termination date: 20121020 |