CN1829783B - 耐热遮蔽带 - Google Patents

耐热遮蔽带 Download PDF

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CN1829783B
CN1829783B CN2004800216509A CN200480021650A CN1829783B CN 1829783 B CN1829783 B CN 1829783B CN 2004800216509 A CN2004800216509 A CN 2004800216509A CN 200480021650 A CN200480021650 A CN 200480021650A CN 1829783 B CN1829783 B CN 1829783B
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methyl
sensitive adhesive
heat
pressure sensitive
weight
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CN1829783A (zh
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筱原大
金容�
高松赖信
牛户晴美
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3M Innovative Properties Co
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Abstract

一种耐热遮蔽带，包括(1)耐热衬垫膜层；和(2)置于耐热衬垫膜层上的压敏粘合剂层，其中压敏粘合剂层包括由聚合和交联单体混合物得到的聚合物，该单体混合物包括具有4～15个碳原子烷基的烷基(甲基)丙烯酸酯、(甲基)丙烯酸缩水甘油酯和(甲基)丙烯酸，(甲基)丙烯酸缩水甘油酯存在的量为单体总重量的2～13重量％，(甲基)丙烯酸存在的量为单体总重量的1～7重量％。

Description

耐热遮蔽带
发明背景
本发明涉及耐热遮蔽材料。
通常，具有含丙烯酸聚合物的压敏粘合剂层作为衬垫层上主要组分的压敏粘合剂带是已知的。因为丙烯酸压敏粘合剂通常具有优良的耐候性。尤其是，在丙烯酸压敏粘合剂被交联的情况下，它变得可以提供耐热性。美国专利3,284,423中公开了交联型丙烯酸粘合剂的例子。这种交联型丙烯酸粘合剂包含(a)35～75重量％的具有6～15个碳原子的丙烯酸酯；(b)10～60重量％的丙烯酸甲酯或丙烯酸乙酯；(c)0.1～10重量％的酸组分，如(甲基)丙烯酸、衣康酸或巴豆酸；和(d)0.1～10重量％的(甲基)丙烯酸缩水甘油酯，并且在室温下或加热时自交联。因此，交联型丙烯酸压敏粘合剂在高温下可同时具有内聚力和保持力以及足够高的粘合力。优选地，(甲基)丙烯酸缩水甘油酯存在的量为1～3重量％，由此赋予以上交联型压敏丙烯酸粘合剂期望的内聚力。这种类型的压敏粘合剂甚至在通过使用丙烯酸甲酯或丙烯酸乙酯作为单体组分进行交联之后，能保持高的粘合力。
另外，日本专利2955095公开了用于表面保护膜的压敏粘合剂，其包括由(甲基)丙烯酸酯单体与含羧基的可共聚单体共聚衍生的共聚物，该共聚物被具有两个或多个环氧基团的环氧化合物交联，如聚缩水甘油醚或聚缩水甘油胺，其中压敏粘合剂在固化后具有0.8～4.0kgf/cm2的10％模量。该专利描述了压敏粘合剂用于保护树脂板的表面。它还描述了，通过将粘合剂的模量调节至0.8kg/cm2或更高，能够从树脂板快速剥离保护膜和压敏粘合剂。但是，非常难以同时具有两种相对的性质，即高的初始粘合强度和使用过程中的粘合强度，以及使用后能够使粘合剂剥离的内聚力。
另一方面，建议这样一种压敏粘合剂，其在使用期间能够提供足够的粘合性，并且在使用后能够降低其粘合性，由此容易地被剥离或除去。日本未审查专利公开(Kokai)10-25456公开了一种压敏粘合剂薄片，其在加热时能容易地被剥离和除去。日本未审查专利公开(Kokai)10-25456中公开的压敏粘合剂通常包括压敏粘合剂层，其包含100重量份的粘性原料聚合物、10～900重量份的热固性化合物和0.1～10重量份的热聚合引发剂。压敏粘合剂薄片的基质聚合物在使用期间能够有强的粘合性。但是，一旦当压敏粘合剂薄片在使用后被热处理时，粘合力降低了，变得可能容易地剥离压敏粘合剂薄片。热固性化合物是这样三维交联的，在热聚合引发剂如有机过氧化物存在下，加热至30～150℃的温度，从而降低压敏粘合剂薄片的粘合性。虽然具有至少两个碳-碳双键的低分子化合物或低聚物通常被用作热固性化合物，但是这种低分子化合物或低聚物很可能保留在压敏粘合剂层中，而没有被交联，导致剥离时粘合剂的残留。而且，由于它在使用期间没有交联，内聚力低，因而它不能被复位。如果粘合剂遇到苛刻条件如等离子处理，更加可能降低粘合剂的内聚力，而导致粘合剂的残留。
在用于如制造芯片级封装中使用的引线框架(lead frame)的遮蔽带等领域中，需要能够抵抗渐增的苛刻条件的压敏粘合剂带。例如，需要作为遮蔽带的压敏粘合剂带，其具有足够的对粘合体的初始粘合性以及复位能力的内聚力，在长时间的高温热处理和等离子处理期间具有稳定的粘合强度，然后可被容易地剥离，而没有粘合剂的残留。
概述
在一个实施方案中，本发明提供耐热遮蔽带，其包括(1)耐热衬垫膜层；和(2)置于耐热衬垫膜层上的压敏粘合剂层，其中压敏粘合剂层包括由聚合和交联单体混合物得到的聚合物，该单体混合物包括具有4～15个碳原子烷基的烷基(甲基)丙烯酸酯、(甲基)丙烯酸缩水甘油酯和(甲基)丙烯酸，(甲基)丙烯酸缩水甘油酯存在的量为单体总重量的2～13重量％，(甲基)丙烯酸存在的量为单体总重量的1～7重量％。
附图简述
图1a～1f表示四方扁平无引脚(QFN)芯片级封装的制造方法流程图的一个实施方案。
符号
1    耐热遮蔽带
2    耐热衬垫膜层
3    压敏粘合剂层
11   引线框架
12   芯片结合(die-bonding)的粘合剂带
13   半导体芯片
14   密封树脂
详述
具有特定压敏粘合剂层的耐热遮蔽带是可复位的，施涂后具有足够的粘合强度，如通过热处理或等离子处理的作用，不会剥离或增加粘合强度，并在使用后可被剥离，而没有粘合剂的残留。
术语“(甲基)丙烯酸酯”指的是丙烯酸酯或甲基丙烯酸酯，术语“(甲基)丙烯酸”指的是丙烯酸或甲基丙烯酸。而且，术语“耐热遮蔽带”广义地解释为包括膜、薄片或带材。
将通过优选实施方案的方式来说明本发明的耐热遮蔽带。本领域的技术人员应该理解，本发明不限于这些实施方案。
本发明的耐热遮蔽带包括耐热衬垫膜层和置于耐热衬垫膜层上的压敏粘合剂层。耐热衬垫膜层支撑压敏粘合剂层。耐热衬垫膜层可仅在整体表面的一面或其部分表面上支撑丙烯酸压敏粘合剂层，或在整个表面的两侧或其部分表面上支撑压敏粘合剂层。通常，根据遮蔽带在使用期间遇到的温度，适当选择用于耐热衬垫膜层的材料。例如，当加工过程中遇到的温度低于170℃时，可选择聚对苯二甲酸乙二醇酯(PET)作为优选的耐热衬垫膜层。当加工温度为170～200℃时，优选的耐热衬垫膜层为聚醚酰亚胺、聚醚砜、聚萘二酸乙二醇酯或聚苯硫醚的膜。另外，当加工温度为200℃或更高时，优选的耐热衬垫膜层为聚醚醚酮、聚酰胺酰亚胺或聚酰亚胺的膜。考虑到可用性和化学稳定性，因为高的多用性，尤其优选PET、聚萘二酸乙二醇酯、聚苯硫醚和聚酰亚胺。考虑到操作和可用性，耐热衬垫膜层优选具有1～250μm的厚度。
压敏粘合剂层包括由聚合和交联单体混合物得到的聚合物，该单体混合物包括具有4～15个碳原子烷基的烷基(甲基)丙烯酸酯、(甲基)丙烯酸缩水甘油酯和(甲基)丙烯酸。聚合由丙烯酸单体中的碳-碳双键的自由基聚合引起。交联由(甲基)丙烯酸缩水甘油酯中的缩水甘油基团(环氧基团)与(甲基)丙烯酸中的羧基的反应产生。(甲基)丙烯酸缩水甘油酯存在的量为单体总重量的2～13重量％，(甲基)丙烯酸存在的量为单体总重量的1～7重量％。如果(甲基)丙烯酸缩水甘油酯的量小于2重量％，或者(甲基)丙烯酸的量小于1重量％，压敏粘合剂的耐热性变低，热处理之后可能在粘合体上留下残留的粘合剂。另一方面，如果(甲基)丙烯酸缩水甘油酯的量大于13重量％，或者(甲基)丙烯酸的量大于7重量％，粘合剂对粘合体的粘合力低，粘合剂在使用期间可能被剥落。考虑到压敏粘合剂层对粘合体的粘合力与内聚力之间的良好平衡，(甲基)丙烯酸缩水甘油酯更加优选包含的量为单体总重量的2～10重量％，(甲基)丙烯酸更加优选包含的量为单体总重量的1～5重量％。
单体混合物包含具有4～15个碳原子烷基的烷基(甲基)丙烯酸酯。更具体地，具有4～15个碳原子烷基的烷基(甲基)丙烯酸酯包括，例如，C4-8烷基丙烯酸酯如丙烯酸正丁酯、丙烯酸异丁酯、丙烯酸异辛酯、丙烯酸2-乙基己酯、丙烯酸2-甲基丁酯、丙烯酸异戊酯或丙烯酸正辛酯；C8-15烷基甲基丙烯酸酯如甲基丙烯酸异辛酯、甲基丙烯酸2-乙基己酯、甲基丙烯酸十二烷酯和/或甲基丙烯酸正辛酯。虽然单体混合物优选由具有4～15个碳原子烷基的烷基(甲基)丙烯酸酯、(甲基)丙烯酸缩水甘油酯和(甲基)丙烯酸组成，但是它还可包含其它单体，只要不损害本发明的效果。这类共聚单体的例子可为玻璃化转变温度为0℃或以上的(甲基)丙烯酸酯，更具体地包括烷基(甲基)丙烯酸酯，如(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸异冰片酯、(甲基)丙烯酸硬脂酰酯、(甲基)丙烯酸环己酯或丙烯酸月桂酯；羟基烷基(甲基)丙烯酸酯如(甲基)丙烯酸羟乙酯、(甲基)丙烯酸羟丙酯或(甲基)丙烯酸羟丁酯；和极性单体如丙烯酰胺、(甲基)丙烯酸二甲基氨基乙酯、N-乙烯基吡咯烷酮、丙烯酸2-羟基-3-苯氧基丙酯、二甲基氨基丙基酰胺、N，N-二甲基丙烯酰胺、异丙基丙烯酰胺或N-羟甲基丙烯酰胺。
压敏粘合剂层的厚度优选为0.5～100μm。当压敏粘合剂层的厚度小于0.5μm时，得到的膜与粘合体接触时几乎不能顺应粘合体，并且在使用过程中很可能剥落。另一方面，当压敏粘合剂层的厚度大于100μm时，在涂覆压敏粘合剂层之后，变得难以充分地除去溶剂，或者当粘合剂层被热处理时会产生发泡。
在耐热衬垫膜层和压敏粘合剂层之间的粘合性(结合性质)差的情况下，从粘合体剥落耐热遮蔽带时，耐热衬垫膜层和压敏粘合剂层之间有时发生分层。在那种情况下，耐热衬垫膜层的一个表面可经过使用通常已知的技术，为了容易粘合进行表面处理，以提高与压敏粘合剂层的结合性质。表面处理的优选例子是物理处理如电晕放电处理、火焰处理、等离子体处理或紫外线辐射处理；或湿化学处理。电晕放电处理是特别优选的。因为经过电晕放电处理的耐热衬垫膜层是可商业获得的和容易得到的。
在表面处理难以进行，或者甚至在表面处理后结合性质仍然差的情况下，可进行初始处理以进一步提高结合性质。初始处理指的是这样的处理，在耐热衬垫膜层上，对耐热衬垫膜层和压敏粘合剂层都提供具有优良粘合性的涂覆层(初始层)，并可在初始层上提供压敏粘合剂层。在那种情况下，初始层的厚度优选为0.1～2μm。当初始层的厚度为0.1μm或以下时，它的效果达不到预计。另一方面，当厚度为2μm或以上时，很可能发生溶剂或化学渗透和耐热遮蔽带的分层以及粘合体的污染。
与放置压敏粘合剂层的侧面相对的耐热衬垫膜层的表面，可进行脱模处理。当相对的侧面经过脱模处理时，本发明的耐热遮蔽带可以卷绕带的形式储存。作为用于脱模处理的脱模剂，例如，可使用硅氧烷脱模剂、氟脱模剂、具有长链烷基的(甲基)丙烯酸脱模剂和具有长链烷基的乙烯基醚脱模剂。
只要本发明的目的和效果不被有害地影响，压敏粘合剂层可包含添加剂如抗氧化剂、紫外线吸收剂、填料(例如，无机填料、导电颗粒或颜料)、润滑剂如蜡、增粘剂、增塑剂、固化加速剂和荧光染料。
下面，将说明用于制备上述耐热遮蔽带的方法的实施例。
首先，聚合以上单体混合物。单体混合物可在基于偶氮化合物或过氧化物的聚合引发剂存在下进行自由基聚合。作为聚合方法，可使用通常已知的聚合方法，如溶液聚合法、乳液聚合法、悬浮液聚合法和本体聚合法等。在这些方法中，溶液聚合法是特别优选的，因为可通过聚合之后涂覆和干燥包含所得聚合物的溶液，在耐热衬垫膜层上容易地形成压敏粘合剂层。溶液聚合通常在氮气气氛下进行，聚合温度为30～80℃，聚合时间为1～24小时。将如上所述制备的聚合物溶解于有机溶剂中，以制备涂层溶液。作为有机溶剂，通常可使用乙酸乙酯、甲基醚酮(MEK)、甲苯或其混合物。然后通过芯片涂层法、刮涂法、棒涂法或其它通常已知的涂覆方法，在耐热衬垫膜层上均匀地涂覆涂层溶液。由于大部分涂层溶液仅由以上聚合物和溶剂制得，它可简单地实现均匀涂覆。然后，通过干燥涂层溶液和耐热衬垫膜层，除去溶剂。然后，通过加热耐热衬垫膜层上的聚合物，产生聚合物的交联。通过在低于100℃或更低的温度下加热，干燥步骤也可起到交联步骤的作用。可选择地，在干燥步骤过程中初步产生交联，然后在另外的加热步骤过程中进行另外的交联。通过聚合物中的缩水甘油基与羰基之间的反应产生交联。但是，交联不必彻底完成。
例如，通过在60～100℃的温度下进行反应几小时至约3天，可获得足够的粘合强度和使用后的剥落能力。如上所述，可制备本发明的耐热遮蔽带。
本发明的耐热遮蔽带用作层压到铜基体或镍-钯合金基体上的遮蔽带，用于防止当引线框架上的半导体芯片通过模塑被覆盖时，环氧模塑化合物的泄漏。图1说明了制备四方扁平无引脚(QFN)芯片级封装的方法流程图。首先，制备本发明的耐热遮蔽带1，其具有耐热衬垫膜层2上的压敏粘合剂层3。层压耐热遮蔽带1和引线框架11，从而引线框架11的背面与遮蔽带1的压敏粘合剂层3接触(步骤(a))。由此，防止在后面的步骤中，模塑化合物通过引线框架11的开口从引线框架11流到其背面。
接下来，通过等离子处理如氩等离子、氩/氧等离子、氩/氢等离子、氩/氮等离子，清洗引线框架11，以除去粘着在引线框架11上的污染物(步骤(b))。这时，虽然等离子通过引线框架的开口轰击本发明遮蔽带1的压敏粘合剂层3，但是遮蔽带1的压敏粘合剂层3将不会剥落，或者将不会发生粘合强度的过度增加。
接下来，在引线框架11上涂覆芯片结合粘合剂带12，在其上固定半导体芯片13，加热固化芯片结合粘合剂带12(步骤(c))。芯片结合粘合剂带12通常为基于环氧化物的热固性粘合剂，并通过在180～240℃的温度下处理约几分钟至一小时来固化。
在如步骤(b)中进行的等离子清洗之后，进行线结合(步骤(d))。线结合通常是通过金属线如金线，将芯片上的电极焊接点电连接到导线上。线结合这样进行，通过熔融金属线如金线，例如通过发火花并将它热压到芯片的电极上。在此过程中，层压物可被加热至180℃～210℃，在一些情况下，可被加热至200～240℃。
在此之后，通过使用包覆成型化合物进行树脂密封步骤(步骤(e))。包覆成型化合物例如是基于环氧化物的热固性树脂。通过将流化树脂加热至约160～240℃，而使其固化为密封树脂14。
接下来，剥离附着到引线框架11的遮蔽带1(步骤(f))。通过高温热处理和等离子处理，本发明遮蔽带1的性质没有降低，并且遮蔽带保持稳定的粘合强度。因此，它没有分层，没有产生粘合强度的过度增加。由于粘合剂用于剥离的粘合强度足够低且内聚强度足够高，在引线框架11上剥离时，它没有留下粘合剂残留物。
剥离遮蔽带1之后，对得到的物体可进行通常的步骤。例如，将它焊接到板上、固定在切成片的带上和切成独立的包装。
实施例
本发明将以实施例的方式来说明。本领域的技术人员应该理解，本发明不限于这些实施例。
实施例1～3和对比例1～6
1.合成丙烯酸共聚物和制备压敏粘合剂前体溶液
在乙酸乙酯溶液中30％的固体含量下，制备具有如下表1所示的以下组成比率的丙烯酸共聚物。作为引发剂，V-65的用量为基于单体的0.25重量％。在氮气清洗之后，在水浴中50℃下进行聚合20小时。
表1
  组成   (重量％)
  溶液1   BA/AA/GMA   97.07/0.98/1.94
  溶液2   BA/AA/GMA   94.28/1.92/3.80
  溶液3   BA/AA/GMA   88.98/3.70/7.34
  溶液4   BA/AA/GMA   79.46/6.90/13.64
  溶液5   BA/AA/GMA   96.1/1.96/1.94
  溶液6   2EHA/MA/AA/GMA   60/34/5/1
  溶液7   2EHA/MA/AA/GMA   64/30/5/1
  溶液8   BA/AA   98/2
符号和生产商
  BA   丙烯酸丁酯，来自Mitsubishi Chemical Corporation(丙烯酸丁酯)
  2EHA   丙烯酸2-乙基己酯，来自Wako Pure Chemical Industries Ltd.
  MA   丙烯酸甲酯，来自Wako Pure Chemical Industries Ltd.
  EA   丙烯酸乙酯，来自Wako Pure Chemical Industries Ltd.
  GMA   甲基丙烯酸缩水甘油酯，来自NOF Corporation(Nissan blemer G)
  AA   丙烯酸，来自Wako Pure Chemical Industries Ltd.
  V-65   聚合引发剂，来自Wako Pure Chemical Industries Ltd.
接下来，如上所述得到的溶液用如下表2所示的交联剂调配，以制备压敏粘合剂前体溶液。在所有溶液中加入相对于100份压敏粘合剂固体的2.0份抗氧化剂，即来自Ciba Specialty Chemicals的Irganox1330，用甲基乙基酮(MEK)将溶液调节至固体含量为20％。
表2
  溶液   交联剂
  实施例1   溶液2   无
  实施例2   溶液3   无
  实施例3   溶液5   无
  对比例1   溶液1   无
  对比例2   溶液4   无
  对比例3   溶液6   无
  对比例4   溶液7   无
  对比例5   溶液8   与丙烯酸相当的R789
  对比例6   溶液8   与丙烯酸相当的E-AX
商标名称和生产商
  R789：双酰胺交联剂，5％溶液，来自3M公司
  E-AX：环氧交联剂，5％溶液，来自Soken Chemical K.K.
2.制备遮蔽带
用以上1中获得的压敏粘合剂前体溶液涂覆25μm的聚酰亚胺膜(Toray Dow，Kapton 100V)，100℃下在炉中干燥5分钟，层压到硅处理的聚对苯二甲酸乙二醇酯(PET)膜(Teijin Dupont Co.Ltd.，PurexA50，50μm)上。调节涂层厚度，以致干燥后的涂层厚度变为5μm。另外，65℃下在炉中进行后固化3天，以加速交联反应。由此，制备了在25μm聚酰亚胺耐热衬垫膜上具有5μm压敏粘合剂层的遮蔽带。
3.测量初始粘合强度和热处理后的粘合强度
将以上2中获得的样品切成宽度为25mm的部分，用2kg辊子来回滚动一次，将每个部分压粘到铜板上(C1100，1mm厚度，来自Nippon Tact K.K.)。将压粘的样品放在室温下20分钟，在滕西隆(tensilon)上测量它的90°剥离粘合强度。在25℃下以300mm/min的测量速度进行测量。这称为“初始粘合强度”。
在样品被压粘到板上后，放在200℃的炉中60分钟，并放在室温下1小时后，测量热处理后的粘合强度。所有情况下粘合强度的单位为N/25mm。
表3中概括了粘合强度测试的结果。
表3
  初始粘合强度   热处理后的粘合强度
  实施例1   1.2   1.4
  实施例2   1.2   1.6
  实施例3   1.7   2.4
  对比例1   1.6   1.6
  对比例2   0.7   1.2
  对比例3   3.7   6.3
  对比例4   3.3   5.3
  对比例5   0.1   1.2
  对比例6   0.2   2.0
从表3看出，实施例1、2和3以及对比例1和2对粘合体具有足够的初始粘着强度，并且它们容易从粘合体剥离，因为它们在热处理后没有显著增加粘着强度。
4.应用测试
模拟制造四方扁平无引脚芯片级封装中使用的引线框架遮蔽应用中遇到的条件。通过以下方法进行评价，以检查模塑树脂的泄漏和带剥离时的粘合剂残留。对于基体，使用镍-钯合金基体。
步骤1(将遮蔽带附着到引线框架上)：将遮蔽带层压到镍-钯合金引线框架上，以致在它们间没有结合气泡。
步骤2(等离子清洗)：用氩等离子清洗得到的层压物10分钟。具体地，处理的条件是氩气流速为20sccm，细丝电流为190A(安培)，弧电流为40A(安培)，使用来自Balzers的LFC150，等离子偏转为62.5％。
步骤3(在引线框架上芯片的芯片结合)：为了模拟连接模具的环氧化物的热固化，在200℃下将层压物热处理60分钟。
步骤4(等离子清洗)：在以上步骤2中相同的条件下进行氩等离子清洗。
步骤5(线结合)：为了模拟线结合，在200℃下将层压物热处理20分钟。
步骤5(树脂密封)：用环氧模塑化合物进行模塑。在175℃下进行模塑2分钟。
步骤6(剥离)：在90°的方向上以300mm/min的速度剥离该带材。
步骤7(观察)：用显微镜观察引线框架的带材剥离的表面。结果概括于表4中。
表4
  模塑树脂的泄漏   粘合剂残留
  实施例1   无   无
  实施例2   无   无
  实施例3   无   无
  对比例1   无   残留
  对比例2   泄漏   无
  对比例3   无   残留
  对比例4   无   残留
  对比例5   泄漏   残留
  对比例6   泄漏   无
从表4看出，实施例1、2和3具有足够的初始强度，以通过在热处理过程中抑制环氧模塑化合物的泄漏来保护粘合体。而且，它们有足够的内聚强度，从而甚至在200℃或以上热处理1小时或以上的热处理步骤和用等离子的清洗步骤之后，带材可从粘合体剥离，而不留下粘合剂残留物。

Claims (3)

1.一种耐热遮蔽带，包括(1)耐热衬垫膜层；和(2)置于耐热衬垫膜层上的压敏粘合剂层，其中压敏粘合剂层包括由在不加入交联剂的条件下聚合和交联单体混合物得到的聚合物，该单体混合物主要由如下物质组成：具有4～15个碳原子烷基的烷基(甲基)丙烯酸酯、(甲基)丙烯酸缩水甘油酯和(甲基)丙烯酸，(甲基)丙烯酸缩水甘油酯存在的量为单体总重量的2～13重量％，(甲基)丙烯酸存在的量为单体总重量的1～7重量％，其中所述的耐热衬垫膜层是聚对苯二甲酸乙二醇酯、聚萘二酸乙二醇酯、聚苯硫醚或聚酰亚胺的层。
2.根据权利要求1所述的耐热遮蔽带，其中所述的压敏性粘合剂层的厚度为0.5～100μm。
3.根据权利要求1～2中任一项所述的耐热遮蔽带，其中所述的耐热衬垫膜层的厚度为1～250μm。
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