CN1870842A - Electro-optical panel, sealing member, self-emission panel, and manufacturing method therreof - Google Patents
Electro-optical panel, sealing member, self-emission panel, and manufacturing method therreof Download PDFInfo
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- CN1870842A CN1870842A CN 200610075870 CN200610075870A CN1870842A CN 1870842 A CN1870842 A CN 1870842A CN 200610075870 CN200610075870 CN 200610075870 CN 200610075870 A CN200610075870 A CN 200610075870A CN 1870842 A CN1870842 A CN 1870842A
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Abstract
It is an object of the present invention to provide an improved structure having an adequate strength to satisfy a requirement of making a thin electro-optical panel. The electro-optical panel forms a sealing area having an electro-optical functional section between the support substrate and the sealing member. The support substrate has a lead-out area containing an area for forming lead-out wiring extending from the sealing area and for connecting or mounting the driving means (IC chip, flexible substrate and the like) to the lead-out wiring. The sealing member has protruding reinforcement sections protruding from the sealing area S on to the lead-out area. The support substrate and the sealing member are bonded together through an adhesive layer, thereby forming an adhesive area surrounding the sealing member. It is another object of the present invention to provide an improved process of producing a plurality of self-emission panels formed by cutting a mother panel into a plurality of unit panels, to prevent lead-out wiring portions from being wounded during the cutting process, thereby improving the yield of production. A further object of the invention is to improve the efficiency of inspection step, thereby improving the productivity of manufacturing process.
Description
Self-emission panel and their manufacture method
Technical field
The present invention relates to the manufacture method of electrooptic panel, containment member and electrooptic panel.
Background technology
With EL (electroluminescence) display floater, PDP (plasma display), FED (Field Emission Display) panel or display panels be the electrooptic panel of representative as flat-panel monitor or illuminating member etc., be used in the various electronic equipments.Particularly, organic EL panel can be implemented in the RGB colour that obtains desirable luminance efficiency down of all kinds certainly and show, it is characterized in that: driving voltage is low to be reached about several volts～tens volt, even from the angle that tilts, also can obtain high visuality, to showing the response speed height of conversion, expect that its replaces display panels as the display floater of slimming more.
Such electrooptic panel possesses form sealing area between opposed members, forms the basic structure of electric light function portion in the sealing zone.Under the situation of organic EL panel, in making the formed seal cavity of planar substrates and containment member (comprising glass capsulation substrate and metallic seal jar) applying, form the self-luminescent part that constitutes by organic EL.In addition, under the situation of PDP, between a pair of counter substrate, form and promote luminous discharge space, under the situation of display panels, between a pair of counter substrate, form the sealing liquid crystal zone.
In these electrooptic panels, at least one substrate of a pair of opposed members forms to drive uses substrate.And the lead-out wiring of drawing from above-mentioned sealing area is formed on the end regions that drives with substrate, carries out the installation of being connected of lead-out wiring and drive unit or drive unit at this end regions.Fig. 1 (a) is the vertical view of a configuration example of the such prior art of expression, have substrate J1 and be sealed in the sealing plate J2 that this substrate J1 goes up the organic EL structure that forms, part on substrate J1 beyond the zone of configuration sealing plate J2, part with the circuit that is used to drive or control organic EL driving body, the circuit constituting element J3 that constitutes this circuit takes COG (chip bonding is on glass) that (with reference to following patent documentation 1) is installed.
[patent documentation 1] spy opens the 2000-58255 communique
In so existing electrooptic panel, shown in Fig. 1 (a) and (b) (Fig. 1 (b) is the J-J profile of Fig. 1 (a)), supporting substrate (substrate J1) has draws regional A, this is drawn regional A and comprises: forming in the lead-out wiring that sealing area is drawn, also drive unit (circuit constituting element J3 and flexible printed circuit board J4) is being connected or be installed to zone on this lead-out wiring.This is drawn regional A and forms the structure of extending laterally from the end of containment member (sealing plate J2).Particularly, under the situation that adopts the such COG of diagram, in order to connect or drive unit such as circuit constituting element to be installed, the space that needs are bigger, thus must increase the above-mentioned regional A that draws.
And, under the situation of such structure, in case such loading of power F or impact force action are then being drawn the inner end positions A of regional A in the outer end of drawing regional A
0(the boundary line part of containment member) locates to cause easily that stress is concentrated, in addition, and at this inner end positions A
0Draw regional A and be in the state that is supported by single armed at the place, for power F, has maximum bending moment to be applied to it.In contrast, save the space when being installed on the electronic equipment in order to be implemented on thickness direction, electrooptic panel is sought thin structure, the thickness of attenuate supporting substrate as much as possible.Therefore, supporting substrate is at above-mentioned inner end positions A
0The place causes fracture easily, under the situation of seeking more slimming, this supporting substrate be broken into big problem.
In contrast, shown in Fig. 1 (b), though draw regional A with strengthening resin J5 covering, if there is the above power of cohesive force of this binding resin J5 and containment member J2 to be applied to it, at inner end positions A
0Place's supporting substrate still can rupture, and present situation is still not have effective solution.
The invention still further relates to the manufacture method of self-emission panel, self-emission panel usefulness containment member and self-emission panel.
With EL (electroluminescence) display floater, PDP (plasma display), FED (Field Emission Display) panel be the self-emission panel of representative as flat-panel monitor or illuminating member etc., be used in the various electronic equipments.Particularly, organic EL panel can be implemented in the RGB colour that obtains desirable luminance efficiency down of all kinds certainly and show, it is characterized in that: driving voltage is low to be reached about several volts～tens volt, even from the angle that tilts, also can obtain high visuality, to showing the response speed height of conversion, expect the more display floater of slimming of its conduct.
Such self-emission panel possesses between supporting substrate and containment member and forms sealing area, forms the basic structure of self-luminescent part in the sealing zone.Under the situation of organic EL panel, in case being organic EL, known inscape with self-luminescent part is exposed in the ambient atmosphere, its characteristics of luminescence will worsen, after forming self-luminescent part on the supporting substrate, supporting substrate and containment member (comprising glass capsulation substrate and metallic seal jar) are fitted, surround self-luminescent part with sealing area.
As the manufacturing process of such self-emission panel, in order to enhance productivity, on female supporting substrate, form a plurality of self-luminescent parts, after it being sealed, cut off/be divided into each panel again with containment member.
Fig. 2 is the key diagram (with reference to patent documentation 1) of the manufacturing process of this existing self-emission panel of expression.Shown in Fig. 2 (a), a plurality of positions on female supporting substrate J101 form self-luminescent part J10, all form the J11 of lead-out wiring portion on each self-luminescent part J10.In addition, form the J2a of the material storage portion that catchments of spill on female containment member J201, make it corresponding with self-luminescent part J10, the material J20 that catchments is configured in wherein.Form tack coat J21 to surround self-luminescent part J10 at (or on female supporting substrate J101) on female containment member J201, form tack coat J22 separating each panel, and form tack coat J23 in periphery.
Then, shown in Fig. 2 (b), through tack coat J21, J22, J23, female supporting member J101 and female containment member J201 are fitted, the inboard that is formed on tack coat J21 disposes the sealing area of self-luminescent part J10.
Thereafter, after tack coat J21, J22, J23 are cured processing, according to such line of cut C shown in Fig. 2 (b)
10, C
11, C
2Cut off female supporting substrate J101 and female containment member J2, form each self-emission panel J301 shown in Fig. 2 (c).
[patent documentation 1] spy opens the 2005-78932 communique
According to above-mentioned existing self-emission panel or its manufacture method, in the cut-out operation shown in Fig. 2 (c), the end J30e of cutting plate J30 contacts with the J11 of lead-out wiring portion of self-emission panel J301, tend to injure the J11 of this lead-out wiring portion, thus, exist in the problem of the bad situations such as lead-out wiring portion place generation broken string of self-emission panel J301.The bad situation of this lead-out wiring is the bad situation that end produced in manufacturing process, because whole front panel partly becomes defective item, the material of supplying with the whole front panel part in manufacturing process has so far all slatterned.The damage of lead-out wiring is being an important problem aspect raising finished product rate and the reduction manufacturing cost when therefore, cutting off operation.
In addition, in the completed stage of the sealing of self-luminescent part J10, check the inspection operation of the operating state of self-luminescent part J10.This is connected with the J11 of lead-out wiring portion that draws from sealing area by checking terminal, lights affirmation, brightness measuring, determination of colority etc.In the past, owing to cover the lead-out wiring J11 of portion (with reference to Fig. 2 (b)) with female containment member J201 before panel is cut apart, therefore this inspection operation was carried out after each panel is cut off/cuts apart.Yet, each self-emission panel J301 that will become in disorder after will cutting apart picks up one by one, with checking that the operation that terminal is connected with the J11 of this lead-out wiring portion is a kind of extremely bothersome operation, there are the time lengthening of causing whole manufacturing process, the problem that can not get good productivity ratio.
Summary of the invention
The present invention will handle the problems referred to above as one of problem example.Promptly, the objective of the invention is to: the slimming at electrooptic panel requires to have the enough supporting constructions of intensity, formation prevents that the stress that produces from concentrating in supporting substrate and the structure that is difficult to rupture particularly provides the supporting substrate to adopting COG effectively to strengthen structure.
The present invention will handle above-mentioned other problem as one of problem example.Promptly, one object of the present invention is: will open panel greatly and cut off/cut apart when obtaining each self-emission panel, the damage of the lead-out wiring when having prevented to cut off operation, fabrication yield is improved, another purpose is: will open panel greatly and cut off/cut apart when obtaining each self-emission panel equally, realize checking the efficient activity of operation, also realized the raising of productivity ratio, or the like.
In order to reach such purpose, the present invention has possessed the structure of following each independent aspects at least.
[first aspect] a kind of electrooptic panel that between a pair of opposed members, forms sealing area with electric light function portion, it is characterized in that: a member of above-mentioned opposed members is made of supporting substrate, on above-mentioned supporting substrate, form the lead-out wiring of drawing from above-mentioned sealing area, have simultaneously and comprise the zone of drawing that drive unit is connected or be installed to zone on this lead-out wiring, another member of above-mentioned opposed members has from above-mentioned sealing area and reaches the above-mentioned enhancing portion of stretching out of drawing on the zone.
[the 9th aspect] a kind of and supporting substrate between form the containment member of sealing area with electric light function portion, it is characterized in that: have the enhancing portion of stretching out of stretching out from above-mentioned sealing area, this stretches out enhancing portion and is formed, on above-mentioned supporting substrate, form the lead-out wiring of drawing, be configured in simultaneously to comprise and drive unit connected or be installed to the drawing on the zone of zone on this lead-out wiring from above-mentioned sealing area.
[the 12 aspect] a kind of manufacture method that between a pair of opposed members, forms the electrooptic panel of sealing area with electric light function portion, it is characterized in that: a member of above-mentioned opposed members is made of supporting substrate, on above-mentioned supporting substrate, comprise the lead-out wiring that formation is drawn from above-mentioned sealing area, have simultaneously and comprise the zone of drawing that drive unit is connected or be installed to zone on this lead-out wiring, another member of above-mentioned opposed members has from above-mentioned sealing area and reaches the above-mentioned enhancing portion of stretching out of drawing on the zone, form the tack coat that surrounds above-mentioned sealing area in the opposed faces of above-mentioned opposed members one or two, above-mentioned a pair of opposed members is fitted through this tack coat.
[the 14 aspect] a kind of self-emission panel, on supporting substrate, form self-luminescent part, the above-mentioned self-luminescent part of configuration in the sealing area that forms in that above-mentioned supporting substrate and containment member are fitted, the lead-out wiring portion that is drawn out to beyond the above-mentioned sealing area from this self-luminescent part is formed on drawing on the zone of above-mentioned supporting substrate end, it is characterized in that: the ora terminalis that faces the above-mentioned lead-out wiring portion of above-mentioned containment member is processed edge by the hole of being processed into and is formed before above-mentioned supporting substrate and above-mentioned containment member are fitted.
[the 16 aspect] a kind of self-emission panel, possess female supporting substrate that has formed a plurality of self-luminescent parts and the female containment member that has disposed a plurality of sealings corresponding with above-mentioned a plurality of self-luminescent parts, applying by above-mentioned female supporting substrate and above-mentioned female containment member, formed the sealing area that above-mentioned a plurality of self-luminescent part and above-mentioned a plurality of sealing are sealed accordingly, it is characterized in that: above-mentioned female supporting substrate has the zone of drawing that has formed the lead-out wiring portion beyond the above-mentioned sealing area of being drawn out to from above-mentioned a plurality of self-luminescent parts, and above-mentioned female containment member has the hole that above-mentioned lead-out wiring portion is exposed and adds the Ministry of worker.
The manufacture method of [the 17 aspect] a kind of self-emission panel is characterized in that, has following operation: the operation that forms a plurality of self-luminescent parts on female supporting substrate; On female containment member, form the operation that the hole corresponding with the lead-out wiring portion in above-mentioned a plurality of self-luminescent parts adds the Ministry of worker; Above-mentioned female supporting substrate and above-mentioned female containment member are fitted, make above-mentioned lead-out wiring portion add the Ministry of worker and expose, simultaneously above-mentioned a plurality of self-luminescent parts are sealed in the operation in the sealing area corresponding with the sealing of above-mentioned female containment member from above-mentioned hole; Add in the lead-out wiring portion that the Ministry of worker exposes the inspection operation of carrying out the inspection of above-mentioned a plurality of self-luminescent parts by checking that terminal is connected from above-mentioned hole; And the cut-out/segmentation process that above-mentioned female supporting substrate and above-mentioned female containment member is cut off and be divided into the panel unit that has above-mentioned sealing area and above-mentioned lead-in wire wiring portion respectively.
[the 19 aspect] a kind of self-emission panel containment member, by fitting with female supporting substrate, be sealed in a plurality of self-luminescent parts that formed on this mother's supporting substrate, it is characterized in that: have a plurality of sealings corresponding, have a plurality of holes corresponding simultaneously and add the Ministry of worker with the lead-out wiring portion of above-mentioned a plurality of self-luminescent parts with above-mentioned a plurality of self-luminescent parts.
Description of drawings
Fig. 1 is the key diagram of prior art.
Fig. 2 is the key diagram of prior art.
Fig. 3 is the key diagram (Fig. 3 (a) is a vertical view, and Fig. 3 (b) is an end view) of the electrooptic panel of expression embodiments of the present invention.
Fig. 4 is the key diagram of change example of the electrooptic panel of expression embodiments of the present invention.
Fig. 5 is the key diagram of change example of the electrooptic panel of expression embodiments of the present invention.
Fig. 6 is the key diagram of change example of the electrooptic panel of expression embodiments of the present invention.
Fig. 7 is the key diagram (Fig. 7 (a) is a vertical view, and Fig. 7 (b) is the X-X profile) of the containment member of expression embodiments of the present invention.
Fig. 8 is that the object lesson of the electrooptic panel of expression embodiments of the present invention is the key diagram of organic EL panel.
Fig. 9 is the key diagram (Fig. 9 (a) is stereoscopic figure, and Fig. 9 (b) is the X-X profile) of the self-emission panel of expression embodiments of the present invention.
Figure 10 is a key diagram (vertical view) of representing to make in embodiments of the present invention the state (female supporting substrate, female containment member) before supporting substrate or containment member are fitted.
Figure 11 is the key diagram (profile) of the self-emission panel (female self-emission panel) in the expression embodiments of the present invention.
Figure 12 illustrates the key diagram of the cut-out/dividing processing of female self-emission panel in embodiments of the present invention.
Figure 13 is the figure (Figure 13 (a) is the profile of female self-emission panel, and Figure 13 (b) is expression has carried out cutting off the state of handling to female self-emission panel a profile) of another execution mode of the female self-emission panel of expression.
Figure 14 is the key diagram of manufacture method of the self-emission panel of explanation embodiments of the present invention.
Figure 15 is the key diagram (Figure 15 (a) is stereoscopic figure, and Figure 15 (b) is the X-X profile) of the self-emission panel of expression another embodiment of the present invention.
Figure 16 is the key diagram (Figure 16 (a) is stereoscopic figure, and Figure 16 (b) is the X-X profile) of the self-emission panel of expression another embodiment of the present invention.
Figure 17 is the key diagram of structure of expression organic EL panel, as the object lesson of the self-emission panel of embodiments of the present invention.
Embodiment
Below, with reference to the description of drawings embodiments of the present invention.Fig. 3 is the key diagram (Fig. 3 (a) is a vertical view, and Fig. 3 (b) is an end view) of the electrooptic panel of one embodiment of the present invention.Electrooptic panel 1 has the basic structure that has formed the sealing area S that electric light function portion is arranged between a pair of opposed members.So-called herein opposed members both can be the such structure of the following supporting substrate that will illustrate 10 and containment member 11, can be again 2 opposed structures of smooth supporting substrate.
Herein, a member in the opposed members is made of supporting substrate 10, when this supporting substrate 10 has the lead-out wiring that the formation of being included in draws from sealing area S (diagram is omitted), also drive unit (IC chip 20, flexible base, board 21 etc.) is connected or is installed to the regional 10A that draws in zone on this lead-out wiring.
In addition, another member in the opposed members (containment member 11) has from sealing area S and reaches the 11A of the enhancing portion of stretching out that draws on the regional 10A.
At this moment, sealing area S refers under the situation on plane uniformly-spaced keep member and the zone that forms across liner, refers to the zone that forms by this recess in addition supporting substrate 10 or containment member 11 have the situation of recess in opposed faces under.In addition, a pair of opposed members is fitted through tack coat 12 and is formed, and forms bonded areas 12A around containment member 11.
In the electrooptic panel 1 of such embodiments of the present invention, because for having the supporting substrate 10 of drawing regional 10A, containment member 11 has from sealing area S and reaches the 11A of the enhancing portion of stretching out that draws on the regional 10A, can not accept loading or impulsive force separately so draw regional 10A, in addition, because being concentrated, the stress of the risk of breakage position 10d (with the corresponding position of root of stretching out the 11A of enhancing portion) in the supporting substrate 10 is dispersed, so can improve the intensity of electrooptic panel 1.
In addition, the containment member 11 that is equivalent to another member in the opposed members forms sealing area S and stretches out the 11A of enhancing portion and constitutes conplane supporting surface 11P.Owing to have this supporting surface 11P, even be containment member 11 sides with another member in the opposed members and supporting under the situation of object butt, because the regional 10A that draws in the supporting substrate 10 is also had the reacting force of supporting effect, thus supporting substrate 10 draw the power effect that regional 10A is not subjected to the single armed state.Thus, can prevent the fracture at 10d place, above-mentioned risk of breakage position.
In addition, stretch out the 11A of enhancing portion and be formed on drawing on the regional 10A except the zone of connection or installation drive unit (IC chip 20, flexible base, board 21 etc.).Thus, even after a pair of opposed members is fitted, also can carry out the connection or the installation of drive unit.In addition, also can not influence the connection of drive unit or installation site and form and stretch out the 11A of enhancing portion.
In addition, stretching out bonded being fixed in of the 11A of enhancing portion draws on the regional 10A.That is, also form tack coat 12 stretching out the 11A of enhancing portion and draw between the opposed faces of regional 10A.This stretches out the sealing property not influence of the bonding of the 11A of enhancing portion to sealing area S, in addition, also can get reinforced effects to a certain degree under situation about not boning, but can obtain more strong reinforced effects by bonding.
In addition, in execution mode shown in Figure 3,, and make the extension elongation 11a that respectively stretches out the 11A of enhancing portion form equal length Yi Bian it is a plurality of along being set up to stretch out the 11A of enhancing portion.According to this execution mode, owing to can avoid connecting or installing the zone of drawing the drive unit on the regional 10A, (2 positions) forms and stretches out the 11A of enhancing portion at a plurality of positions, so can carry out the enhancing of drawing regional 10A on the supporting substrate 10 more reliably.In addition, owing to can guarantee to stretch out the extension elongation 11a of the 11A of enhancing portion to greatest extent, can carry out the enhancing of drawing regional 10A on the supporting substrate 10 thus more reliably according to the width of drawing regional 10A.
Fig. 4～Fig. 6 is the change example (in each figure for being marked with common symbol with the common position of Fig. 2 local omit repeat specification) of electrooptic panel 1 of the execution mode of expression the invention described above.
Execution mode shown in Figure 4 shows the example of setting the extension elongation of stretching out the 11A of enhancing portion with respect to the width of drawing regional 10A shortly.Example shown in Fig. 4 (a) is such, at the formed extension elongation 11a that stretches out the 11A of enhancing portion in both sides that makes drive unit (IC chip 20, flexible base, board 21 etc.)
1Equate, and set this draws length 11a shortly with respect to the width of drawing regional 10A
1Situation under, in drawing regional 10A, can guarantee the installation region of IC chip 20 and the crimp region of flexible base, board 21 on whole one side, can easily carry out the connection or the installation exercise of drive unit.
In addition; even in such example; also can protect and become the risk of breakage of the root of drawing regional 10A position by stretching out the 11A of enhancing portion; because the width of drawing regional 10A that exposes from the end of stretching out the 11A of enhancing portion is compared and will be shortened with the situation of not stretching out the 11A of enhancing portion, act on the maximum bending moment of drawing regional 10A that is exposed to a certain degree minimizing is arranged so can make.In addition, the concentrated position that is produced of stress is disperseed.
Example shown in Fig. 4 (b) is to make the extension elongation 11a that stretch out enhancing portion 11A set at a plurality of positions
2, 11a
3Different examples.Like this, even make extension elongation 11a
2, 11a
3Under the different situations, also can obtain and the same effect of example shown in Fig. 4 (a).
Execution mode shown in Figure 5 shows at an one-sided position on the one side of drawing regional 10A and is provided with the example that stretches out the 11A of enhancing portion.Example shown in Fig. 5 (a) is such, under the connection or installation site left and right deviation situation to a certain degree that make drive unit (IC chip 20, flexible base, board 21 etc.), can utilize this vacant space to be provided with at a position and stretch out the 11A of enhancing portion.
At this moment, both can shown in Fig. 5 (a), make the extension elongation 11a that stretches out the 11A of enhancing portion
4For drawing whole width of regional 10A, perhaps, again can be shown in Fig. 5 (b), with extension elongation 11a
5Set shortlyer, so that form vacant space in the end of drawing regional 10A.If form the structure shown in Fig. 5 (b), then utilize idle space that a plurality of IC chips 20 are set
1, 20
2Become possibility, can make the connection of drive unit or the configuration variation of installation.Have again, much less,, also can obtain the reinforced effects same with above-mentioned execution mode even in the present embodiment.
In execution mode shown in Figure 6, opposed 2 limits in supporting substrate 10 and containment member 11 are provided with shown in Figure 2 drawing regional 10A and stretch out the 11A of enhancing portion respectively, and drive unit (IC chip 20 is set respectively
1, 20
2, flexible base, board 21
1, 21
2).Like this, for have the structure of drawing regional 10A on many limits of supporting substrate 10, effect also can be enhanced with same structure.
In the respective embodiments described above, a side or both sides in a pair of opposed members (for example supporting substrate 10 and containment member 11) are transparent material, can be from by the formed side-draw bright dipping of this transparent material.Therefore, under the situation that forms display unit, can make a side is the single face demonstration of transparent material, perhaps makes both sides be the double-sided display of transparent material.Formed organic EL constitutes under the situation of the electric light function portion in the sealing area S on supporting substrate 10 adopting, both can take to make the end radiation pattern of supporting substrate 10, can take to make the top radiation pattern of containment member 11 again for transparent material and side-draw bright dipping from then on for transparent material and side-draw bright dipping from then on.
In addition, under the situation of the independent member that is conceived to containment member 11, it is characterized in that: this be and supporting substrate 10 between form the containment member 11 of the sealing area S with electric light function portion, have from the 11A of the enhancing portion of stretching out that sealing area S stretches out, this stretches out the 11A of enhancing portion and is formed, be configured in and draw on the regional 10A, this is drawn regional 10A and is included on the supporting substrate 10 when forming the lead-out wiring of drawing from above-mentioned sealing area S, drive unit (IC chip 20, flexible base, board 21 etc.) is connected or is installed in zone on this lead-out wiring.In addition, with regard to shape, it is characterized in that:, form and make the notch part that connects or the regional opening of drive unit is installed in abutting connection with stretching out the 11A of enhancing portion.
For the containment member 11 that forms this mode efficiently, can adopt the mode shown in Fig. 7 (Fig. 7 (a) is a vertical view, and Fig. 7 (b) is the X-X profile).That is, containment member 11 is to form by cutting off a plate 11L who forms a plurality of sealing area S according to each sealing area S, and above-mentioned notch part is formed by formed peristome 11B on a plate 11L.
In the illustrated embodiment, a plate 11L who is used to form containment member 11 by in advance with peristome 11B opening, use line of cut C
11～C
14, C
21～
26Cut it, form containment member 11 one by one.At this moment, available blast etc. are sheltered and are processed to form peristome 11B, can form a plurality of peristome 11B simultaneously.In addition, shelter processing with a plurality of sealing area S corresponding concave part also available blast etc. and form.
In the present embodiment, line of cut C
11～C
14Be the straight line along the base of the 11B of oblong openings portion, by cutting off processing along this straight line, available simple operation forms the notch part of opening into " コ " font, forms in the left and right sides of this notch part and stretches out the 11A of enhancing portion.
Utilize such containment member 11, form the enhanced seal member 11 that can have the supporting substrate 10 of drawing regional 10A with high productivity ratio and become possibility.
Below, the manufacture method of electrooptic panel of the execution mode of the invention described above is described.This manufacture method forms the tack coat 12 that surrounds sealing area S by a side or the both sides in the opposed faces of opposed members (supporting substrate 10, containment member 11), and through tack coat 12 a pair of opposed members is fitted to carry out.Utilize the coating or a certain side or the both sides of various printing process in supporting substrate 10 sides, containment member 11 sides of dispenser etc. to form tack coat 12.Then, two opposed members are fitted, be cured processing.
Utilize such manufacture method, owing to adopt to be pre-formed and processed the containment member 11 that stretches out the 11A of enhancing portion, it is attached on the supporting substrate 10, if, then on main manufacturing line, do not append operation and create possibility so in advance the processing of containment member 11 is handled with other operation.In addition,, also be pre-formed tack coat stretching out on the 11A of enhancing portion, then simultaneously, can be bonded and fixed at and draw on the regional 10A stretching out the 11A of enhancing portion in the applying that forms sealing area S if when the tack coat when fitting 12 forms.
Below, utilize Fig. 8 to enumerate organic EL panel and describe for the object lesson of example as above-mentioned electrooptic panel 1.
The basic structure of organic EL panel 100 is organic material layers 33 that clamping contains organic light emitting functional layer between the 1st electrode 31 and the 2nd electrode 32, forms a plurality of organic ELs 30 on supporting substrate 110.In illustrated embodiment, on supporting substrate 110, be pre-formed silicon covering layer 120a, the 1st electrode 31 that forms thereon is set at the anode that is made of transparency electrodes such as ITO, the 2nd electrode 32 is set at the negative electrode that is made of metal materials such as Al, constitutes end radiation pattern from supporting substrate 110 side-draw bright dippings.In addition, as organic material layer 33, show the example of the 3-tier architecture of hole transport layer 33A, luminescent layer 33B, electron transport layer 33C.Then, form sealing area S, in the sealing region S, form the display part (electric light function portion) that constitutes by organic EL 30 by supporting substrate 110 is fitted with containment member 111.
The display part that is made of organic EL 30 separates the 1st electrode 31 with insulating barrier 34 in advance in illustrated embodiment, the below of the 1st electrode 31 that is separated forms the unit viewing area (30R, 30G, 30B) that is made of each organic EL 30.In addition, drying device 40 is installed on the inner face of the containment member 111 that forms sealing area S, is prevented the deterioration of the organic EL 30 that causes by moisture.
In addition, drawing of forming in the end of supporting substrate 110 uses the 1st electrode layer 121A that forms with the 1st electrode 31 same materials, same processes to form figure under the state with insulating barrier 34 and 31 insulation of the 1st electrode on the regional 110A.Lead-out wiring at the 1st electrode layer 121A partly is pre-formed the 2nd electrode layer 121B; the 2nd electrode layer 121B is formed with the low-resistance wiring portion that contains silver alloy etc.; also on the 2nd electrode layer 121B, form protection overlay film 121C such as IZO as required, form the lead-out wiring 121 that constitutes by the 1st electrode layer 121A, the 2nd electrode layer 121B, protection overlay film 121C.And the end 32a with the 2nd electrode 32 is connected with lead-out wiring 121 at sealing area S inner end.
Though the lead-out wiring of the 1st electrode 31 diagram has been given omission, can form by the 1st electrode 31 is extended and is drawn out to outside the sealing area S.In this lead-out wiring, also can similarly form electrode layer with the situation of above-mentioned the 2nd electrode 32, this electrode layer is formed with the low-resistance wiring portion that contains Ag alloy etc.
Then, on the regional 110A of drawing of supporting substrate 110, shown in Fig. 3～6, form the 111A of the enhancing portion of stretching out of containment member 111.In addition, stretching out the barbed portion that the 111A of enhancing portion is removed, firstly appearing out from lead-out wiring 121 etc. on the regional 110A in advance drawing,, shown in Fig. 3～6, connecting or drive units such as IC chip, flexible base, board (diagram is omitted) are installed for this lead-out wiring 121 etc.
Below, more specifically describe the detail portion of organic EL panel 100.
A. electrode:
Side in the 1st electrode the 31, the 2nd electrode 32 is set at cathode side, and the opposing party is set at anode-side.Anode-side adopts the material higher than cathode side work function to constitute, and can use chromium (Cr), molybdenum (Mo), nickel (Ni), platinum metal films such as (Pt) or nesa coatings such as oxidized metal film such as ITO, IZO.Otherwise, cathode side adopts the material lower than anode-side work function to constitute, low metal and the compounds thereof of work function such as alkali metal (Li, Na, K, Rb, Cs), alkaline-earth metal (Be, Mg, Ca, Sr, Ba), rare earth metal be can use, their alloy, the polyaniline of doping or amorphous semiconductors such as polyphenylene vinylene, the Cr of doping perhaps comprised
2O
3, NiO, Mn
2O
5Deng oxide.In addition, under the situation that the 1st electrode the 31, the 2nd electrode 32 constitutes by transparent material, the electrode side opposite with the emitting side of light can form the structure that reflectance coating is set.
On lead-out wiring (lead-out wiring of illustrated lead-out wiring 121 and the 1st electrode 31), can be connected drive circuit parts or the flexible printed circuit board that drives organic EL panel 100, but preferable case is, form low-resistance as far as possible, as mentioned above, can stacked Ag alloy or low resistance metal electrode layers such as APC, Cr, Al, perhaps form separately with these low resistance metal electrodes.
B. organic material layer:
In addition, for the luminescent material that forms luminescent layer 33B, also can adopt luminous (fluorescence) and luminous (phosphorescence) when 3 heavy excitation state turn back to ground state any when 1 heavy excitation state turns back to ground state.
C. containment member:
For organic EL panel 100, as the containment member 111 that is used for gas-tight seal organic EL 30, tabular component or container-like member that available metal system, glass, plastics system etc. form.Both can adopt on the hermetic sealing substrate of glass by press molding, etching, blast processing etc. and be processed to form sealing with recess (no matter being that one-level digging, secondary are dug), perhaps can use plate glass again, by glass (with plastics also can) liner of system and supporting substrate 110 between form sealing area S.
D. binding agent:
The binding agent that forms tack coat 112 can use thermohardening type, chemosetting type (2 kinds of liquid mix), light (ultraviolet ray) curing type etc., as material, and available acrylic resin, epoxy resin, polyester, polyolefin etc.Particularly, preferable case is to need not the epoxy resin system binding agent that heat treated can be used the high ultraviolet hardening of curable.
E. drying device:
Drying device 40 can be dissolved in drier in the oil series solvents such as toluene, dimethylbenzene, aliphat organic solvent with chemical drier such as physical property drier, alkali metal oxide, metal halide, chlorine peroxides such as zeolite, silica gel, carbon, carbon nano-tube, with metal-organic complex, desiccant particles is scattered in has the drier in the binding agents such as polyethylene, polyisoprene, polyethylene diluent of the transparency and forms.
F. variety of way of organic EL panel etc.:
As embodiments of the invention is organic EL panel 100, can carry out various design alterations in the scope of aim of the present invention.For example, no matter the illumination mode of organic EL 30 is as mentioned above from the end radiation pattern of supporting substrate 110 side-draw bright dippings, still the top radiation pattern from containment member 111 side-draw bright dippings all can (at this moment, form transparent material with containment member 111, must consider the configuration of drying device 40).In addition, organic EL panel 100 both can be monochromatic the demonstration, it can be again multicolor displaying, in order to realize multicolor displaying, certainly comprise branch and be coated with mode, mode (the CF mode that can adopt the light emitting functional layer of the color conversion layer that will form by colour filter agent or fluorescent material and monochromes such as white or blueness to combine, the CCM mode), to the luminous zone irradiation electromagnetic wave of the light emitting functional layer of monochrome etc. to realize multiple luminous mode (photobleaching mode), longitudinally the unit viewing area more than 2 looks is carried out stacked mode (SOLED (transparent stacked OLED) mode) to form a unit viewing area, in advance with low molecule organic material film forming on different films of different colors, utilize the heat of laser to duplicate then and copy to a laser copy mode on the substrate etc.In addition, in illustrated embodiment, show the passive drive mode, but also can adopt active type of drive, adopt the TFT substrate, form planarization layer thereon, form the 1st electrode 31 then as supporting substrate 110.
As seen from the above description, electrooptic panel and manufacture method thereof according to embodiments of the present invention, can have the supporting construction that the requirement of the slimming of electrooptic panel is had full intensity, in addition, can be prevented that the stress that produces on the supporting substrate is concentrated and the structure that is difficult to rupture.
Below, with reference to another execution mode among description of drawings the present invention.Fig. 9 is the key diagram (Fig. 9 (a) is stereoscopic figure, and Fig. 9 (b) is the X-X profile) of the self-emission panel of expression one embodiment of the present invention.Self-emission panel 1 has following basic structure: form self-luminescent part 12 on supporting substrate 10, configuration self-luminescent part 12 in the sealing area S that forms through tack coat 13 supporting substrate 10 and containment member 11 being fit together, the 12A of lead-out wiring portion outside self-luminescent part 12 is drawn out to sealing area S is formed on drawing on the regional 10A of supporting substrate 10 ends.
And on the self-emission panel 1 in embodiments of the present invention, the ora terminalis that forms the outer peripheral edges of the self-emission panel 1 in supporting substrate 10 and the containment member 11 (for supporting substrate 10, is ora terminalis 10E
1, 10E
2, 10E
3, 10E
4,, be ora terminalis 11E for containment member 11
1, 11E
2, 11E
3) constitute by the formed cut-out edge in back that supporting substrate 10 and containment member 11 are fitted, face the ora terminalis 11E of the 12A of lead-out wiring portion of containment member 11
0Form by the hole processing edge that is processed into before supporting substrate 10 and containment member 11 are fitted.Herein, so-called " cut-out edge " is meant by cutting off and handles formed ora terminalis, is also contained in to cut off and handles the laggard various surface-treated parts of having gone.In addition, so-called " processing edge " is meant by the formed ora terminalis of processed (cutting, blast handle, die-cut etc.), is also contained in and carried out various surface-treated parts thereafter.
According to the self-emission panel 1 of such execution mode, owing to face the ora terminalis 11E of the containment member 11 of the 12A of lead-out wiring portion
0Form by the hole processing edge that is processed into before supporting substrate 10 and containment member 11 are fitted, so the influence that the cut-out after the 12A of lead-out wiring portion is not fitted is handled.Therefore, cut-out/cutting plate both contacted with the 12A of lead-out wiring portion, smear metal again can surface attached to the 12A of lead-out wiring portion on, form the end of operation at panel, can avoid producing bad situation at the 12A of lead-out wiring portion.
Figure 10 is the key diagram of representing the state (female supporting substrate 10L, female containment member 11L) before supporting substrate 10 or containment member 11 applyings (vertical view).On female supporting substrate 10L, form a plurality of self-luminescent parts 12, alignment arrangements under desirable state.In addition, on each self-luminescent part 12, formed the wiring portion that is formed with the 12A of lead-out wiring portion.Above-mentioned supporting substrate 10 is the supporting substrates that this mother's supporting substrate 10L cut into each self-luminescent part 12.
On the other hand, at the corresponding a plurality of sealing 11A of configuration on female containment member 11L and a plurality of self-luminescent parts of on female supporting substrate 10L, forming 12.The 11A of sealing portion both can be formed by the recess that forms sealing area S shown in Fig. 9 (b), it can be again the plane (at this moment, the gasket material (distance maintaining material) of guaranteeing sealing area S being set between supporting substrate 10 and containment member 11) that separates sealing area S.That is, above-mentioned containment member 11 is the containment members that this mother's containment member 11L cut into each sealing 11A.
And, on this mother's containment member 11L, form a plurality of holes and add the 11H of the Ministry of worker, make it when fitting with female supporting substrate 10L and the position of the 12A of lead-out wiring portion on female supporting substrate 10L corresponding.That is the ora terminalis 11E in the containment member 11,
0(hole processing edge) can form the part that the hole adds the inner peripheral of the 11H of the Ministry of worker.
Female self-emission panel 1L shown in Figure 11 now is described, it comprises female supporting substrate 10L of being formed with a plurality of self-luminescent parts 12 and disposes female containment member 11L of a plurality of sealing 11As corresponding with a plurality of self-luminescent part 12, by the applying of female supporting substrate 10L and female containment member 11L, form the sealing area S that a plurality of self-luminescent parts 12 and a plurality of sealing 11A are sealed accordingly.Recess at sealing 11A is equipped with the material that catchments (drying device) 14 as required.
Between this mother's supporting substrate 10L and female containment member 11L, formed as mentioned above by means of the coating of binding agent or printed formed tack coat 13A, 13B, surrounded sealing area S with tack coat 13A, the applying around carrying out with tack coat 13B.
For so female self-emission panel 1L, female supporting substrate 10L has and has formed the regional 10A that draws that is drawn out to the 12A of lead-out wiring portion outside the sealing area S from a plurality of self-luminescent parts 12.In addition, female containment member 11L has the hole that the 12A of lead-out wiring portion is exposed and adds the 11H of the Ministry of worker.
That is to say, for this mother's self-emission panel 1L, in that female supporting substrate 10L and female containment member 11L are fitted after having formed sealing area S, and the stage it being cut off/cut apart before, formation adds the state that the 11H of the Ministry of worker exposes the 12A of lead-out wiring portion through the hole.Therefore, can add the 11H of the Ministry of worker through this hole and shown in arrow p, insert the inspection terminal, and will check that terminal is connected on the 12A of lead-out wiring portion that is exposed.Thus, carry out the inspection operation of each self-luminescent part 12 is become possibility before cutting apart/cutting off female self-emission panel 1L.In view of the above, can before cutting apart each self-emission panel 1, check operation scatteredly, a plurality of self-luminescent part 12 can be controlled as one, so carry out the inspection of each self-luminescent part 12 is become possibility with high operating efficiency.
Figure 12 is the key diagram (common part is marked with prosign and the local explanation that dispenses repetition with above-mentioned explanation) of cut-out/dividing processing of the female self-emission panel 1L of explanation.Shown in Figure 12 (a), for female supporting substrate 10L and female containment member 11L, set line of cut C respectively
B1～C
B4, C
A1～C
A3Line of cut C
B1～C
S1, C
B2～C
S3, C
B3～C
S5, C
B4～C
S7It is the line of cut that forms the outer peripheral edges of self-emission panel 1.In contrast, line of cut C
S2, C
S4, C
S6Be the ora terminalis 11E that forms the containment member 11 that faces the 12A of lead-out wiring portion
0Line of cut.Herein, the line that adds the part of the inner peripheral among the 11H of the Ministry of worker along the hole that comprises female containment member 11L is set line of cut C
S2, C
S3, C
S4, C
S5, C
S6, C
S7
Figure 12 (b) is the state after the cutting process is carried out in expression along above-mentioned line of cut a key diagram.Cut apart self-emission panel 1 by this cutting process.At this moment, though formed cutting plate CP1, CP2, CP3, CP4, the CP5 of cut end, but because cutting plate CP2, CP3, position that CP4 is corresponding with the 12A of lead-out wiring portion add the 11H of the Ministry of worker by the hole and open, so these cutting plates can not damage the 12A of lead-out wiring portion, the end that can do one's utmost to force down in panel formation operation makes self-emission panel 1 become the probability of defective item.
Figure 13 is that (Figure 13 (a) is the profile of female self-emission panel 1L to the figure that represents another execution mode of female self-emission panel, and Figure 13 (b) is expression has carried out cutting off the state of handling to female self-emission panel 1L a profile; Be marked with prosign with the common part of above-mentioned explanation and dispense the explanation that a part repeats).For this mother's self-emission panel 1L, the tack coat 13C that utilizes the tack coat 13A that surrounds sealing area S, the tack coat 13B that gets up boning and bonding panel isolating part to divide on every side fits together female supporting substrate 10L and female containment member 11L.
And, for this mother's self-emission panel 1L, set line of cut C respectively
B11～C
B14, C
S11～C
S14Line of cut C
B11～C
S11, C
B12, C
B13～C
S13, C
B14Be the line of cut of setting the outer peripheral edges of self-emission panel 1, line of cut C
S12, C
S14Be the ora terminalis 11E that forms the containment member 11 that faces the 12A of lead-out wiring portion
0Line of cut, the line that adds the part of the inner peripheral among the 11H of the Ministry of worker along the hole that comprises female containment member 11L is set.
In the present embodiment, with above-mentioned execution mode similarly, under the state of female self-emission panel 1L before cutting off/cutting apart, add the 11H of the Ministry of worker through this hole and shown in arrow p, insert the inspection terminal, realize and being connected of the 12A of lead-out wiring portion, can check operation under by incorporate female self-emission panel 1L state at self-luminescent part 12.
In addition, female self-emission panel 1L is being cut off under the situation of processing, shown in Figure 13 (b), though formed the cutting plate CP11～CP13 of cut end, but because the position corresponding with the 12A of lead-out wiring portion adds the 11H of the Ministry of worker by the hole and opens, so the end of cutting plate CP12, CP13 can not contact with the 12A of lead-out wiring portion, can avoid when cutting off processing, lead-out wiring being affected.In addition, owing to utilize tack coat 13C that the cutting plate of female supporting substrate 10L side and female containment member 11L side is combined, the operation of removing of therefore carrying out the cutting plate of cut end simply becomes possibility.
Figure 14 is the key diagram of manufacture method of the self-emission panel of explanation embodiments of the present invention.
Form among the operation S01 at self-luminescent part, on female supporting substrate 10L, form a plurality of self-luminescent parts 12.The formation of self-luminescent part 12 is adopted various formation methods according to the kind of the light-emitting component that constitutes self-luminescent part etc.
When an example of the situation that the self-luminescent part that formation is made of organic EL is shown, female supporting substrate 10L of glass etc. is cleaned and necessary surface treatment, overlay film are handled (planarization film that comprises under the TFT substrate situation forms), evaporation forms the material (ITO etc.) of lower electrode and lead-out wiring on this mother's supporting substrate 10L, form film with film build methods such as sputters, and be patterned into desirable shape with photoetching process etc.Then, separate light-emitting zone on the lower electrode with dielectric film, with coating processs such as tumbling barrel process, infusion processes, the wet processing of print processes such as silk screen print method, ink-jet method etc., perhaps the dry process with vapour deposition method, laser replica method etc. forms organic light emitting functional layer on light-emitting zone.In detail, stack gradually various materials such as hole transport layer, luminescent layer, electron transport layer with vapour deposition method.Then, utilize the metallic film that becomes negative electrode thereon, become embrane method to form upper electrode, form organic EL with the structure of upper electrode and lower electrode clamping organic luminescence function layer with evaporation or sputter etc.
In containment member processing, preparatory process S02, female containment member 11L of glass etc. is formed above-mentioned sealing 11A.When sealing 11A forms recess, will the mask of formation portion opening be covered from the teeth outwards, carry out processed such as blast, form desirable recess.When forming sealing 11A in the plane, especially need not such processing.In addition, on the position corresponding, form above-mentioned hole and add the 11H of the Ministry of worker with the 12A of lead-out wiring portion.The mask that this hole is added the formation position opening of the 11H of the Ministry of worker can be covered from the teeth outwards, form by processed such as blasts.And, under the situation of organic EL panel, in sealing 11A, be equipped with the agent (drying device) 14 of catchmenting.
Sealing process S1 is made of bonding process S11 and cured operation S12 thereafter.In bonding process S11, female supporting substrate 10L and female containment member 11L are fit together through above-mentioned tack coat (13A, 13B, 13C).The formation of the tack coat that is undertaken by the coating or the printing of binding agent both can be carried out in any one party of female supporting substrate 10L side, female containment member 11L side, can carry out its both sides again.Fit by this, with the self-luminescent part 12 on female supporting substrate 10L when being enclosed in the sealing area S, the 12A of lead-out wiring portion on female supporting substrate 10L adds the 11H of the Ministry of worker from the hole of female containment member 11L and exposes.In cured operation S12, carry out ultraviolet irradiation or heat treated to tack coat (13A, 13B, 13C), tack coat is solidified.
In checking operation S2, check that terminal is connected to from the hole and add on the lead-out wiring 12A that the Ministry of worker exposes by making, carry out the inspection of a plurality of self-luminescent parts 12.As the content of checking, can light inspection, chromaticity inapection, brightness inspection etc.At this moment, both can check one by one by connecting the inspection terminal, can connect them simultaneously by preparing a plurality of inspection terminals corresponding again, check a plurality of self-luminescent parts 12 simultaneously with the 12A of lead-out wiring portion of a plurality of self-luminescent parts 12 to each self-luminescent part 12.No matter be which kind of situation, and cut off/cut apart reprocessing and become the situation of each self-emission panel 1 to compare, all obtain good control, can check operation efficiently.
In cut-out/segmentation process S3, cut off processing along line of cut as described above, female supporting substrate 10L and female containment member 11L are cut off/are divided into the panel unit that has sealing area S and the 12A of lead-out wiring portion respectively.
At this moment, as mentioned above, this one procedure of cut-out/segmentation process adds the part of the inner peripheral among the 11H of the Ministry of worker along the hole that comprises female containment member 11L line carries out.Thus, when forming the cutting plate of cut end, because of the hole adds the existence of the 11H of the Ministry of worker, the end of cutting plate can not contact with the 12A of lead-out wiring portion.Thus, in the cut-out/segmentation process of manufacturing process's end, can prevent from advance to cause bad situations such as broken string at lead-out wiring portion 12A place.
For each self-emission panel 1 that utilizes this cut-out/segmentation process S4 to cut out, carry out the installation (drive division installation procedure S4) of drive division (IC chip and flexible base, board), finish the manufacturing (S5) of finished product panel with this.
Figure 15, the 16th, the key diagram (Figure 15 (a), 16 (a) they are stereoscopic figure, and Figure 15 (b), 16 (b) they are the X-X profiles) of the self-emission panel of expression another embodiment of the present invention (part identical be marked with prosign and dispense the explanation that a part repeats) with execution mode shown in Figure 9.In this embodiment, self-emission panel 1 also has following basic structure: form self-luminescent part 12 on supporting substrate 10, configuration self-luminescent part 12 in the sealing area S that forms supporting substrate 10 and containment member 11 being fit together through tack coat 13, be drawn out to the sealing area S 12A of lead-out wiring portion in addition from self-luminescent part 12 and be formed on drawing on the regional 10A of supporting substrate 10 ends, but in these execution modes, for containment member 11, form from ora terminalis 11E
0Protrude in the 11B of enhancing portion that draws on the regional 10A
1～11B
4The 11B of this enhancing portion
1～11B
4Make at ora terminalis 11E
0Under the stress that on supporting substrate 10, generates concentrate and reduce, be used to strengthen the maximum bending moment of drawing regional 10A to the supporting substrate 10 that becomes the single armed holding state, thus, prevented that supporting substrate 10 from drawing the root fracture of regional 10A.
The 11B of this enhancing portion
1～11B
4Execution mode that both can be as shown in figure 15 is such, in the both sides of the 12A of lead-out wiring portion the enhancing portion 11B corresponding with the length of drawing regional 10A is set
1, 11B
2, execution mode that again can be as shown in figure 16 is such, and the enhancing portion 11B shorter than the length of drawing regional 10A is set in the both sides of the 12A of lead-out wiring portion
3, 11B
4In addition, as mentioned above, the 11B of enhancing portion is set in the both sides of the 12A of lead-out wiring portion
1, 11B
2, 11B
3, 11B
4Situation under, need not left and right symmetrically and form, width or length difference about also can being.In addition, the side about also can dispensing and only in the one-sided enhancing portion that is provided with of the 12A of lead-out wiring portion.
Add width little form of the width of the 11H of the Ministry of worker by the hole that makes above-mentioned female containment member 11L, such 11B of enhancing portion than the containment member 11 that is cut off/cuts apart
1～11B
4Can add the left and right sides or the one-sided formation of the 11H of the Ministry of worker in the hole.
Below, according to Figure 17, as the concrete example of above-mentioned self-emission panel 1, enumerating organic EL panel is example, and its concrete structure is described.
The basic structure of organic EL panel 100 is organic material layers 33 that clamping contains organic light emitting functional layer between the 1st electrode (lower electrode) 31 and the 2nd electrode 32 (upper electrode), forms a plurality of organic ELs 30 on supporting substrate 110.In illustrated embodiment, on supporting substrate 110, be pre-formed silicon covering layer 120a, the 1st electrode 31 that forms thereon is set at the anode that is made of transparency electrodes such as ITO, the 2nd electrode 32 is set at the negative electrode that is made of metal materials such as Al, constitutes end radiation pattern from supporting substrate 110 side-draw bright dippings.In addition, as organic material layer 33, show the example of the 3-tier architecture of hole transport layer 33A, luminescent layer 33B, electron transport layer 33C.Then, form sealing area S, in the sealing region S, form the self-luminescent part that constitutes by organic EL 30 by supporting substrate 110 is fitted with containment member 111.
The self-luminescent part that is made of organic EL 30 separates the 1st electrode 31 with insulating barrier 34 in advance in illustrated embodiment, the below of the 1st electrode 31 that is separated forms the unit viewing area (30R, 30G, 30B) that is made of each organic EL 30.In addition, drying device 40 is installed on the inner face of the containment member 111 that forms sealing area S, is prevented the deterioration of the organic EL 30 that causes by moisture.
In addition, drawing of forming in the end of supporting substrate 110 uses the 1st electrode layer 121A that forms with the 1st electrode 31 same materials, same processes to form figure under the state with insulating barrier 34 and 31 insulation of the 1st electrode on the regional 110A.Lead-out wiring at the 1st electrode layer 121A partly is pre-formed the 2nd electrode layer 121B; the 2nd electrode layer 121B forms the low-resistance wiring portion contain silver alloy etc.; also on the 2nd electrode layer 121B, form protection overlay film 121C such as IZO as required, form the lead-out wiring portion 121 that constitutes by the 1st electrode layer 121A, the 2nd electrode layer 121B, protection overlay film 121C.And the end 32a with the 2nd electrode 32 is connected with lead-out wiring 121 at sealing area S inner end.
Though the lead-out wiring of the 1st electrode 31 diagram has been given omission, can form by the 1st electrode 31 is extended and is drawn out to outside the sealing area S.In this lead-out wiring, also can similarly form electrode layer with the situation of above-mentioned the 2nd electrode 32, this electrode layer forms the low-resistance wiring portion that contains Ag alloy etc.
Then, face the ora terminalis 111E of the lead-out wiring portion 121 of containment member 111
0Form by the hole processing edge of being processed before supporting substrate 110 and containment member 111 applyings.
Below, more specifically describe the detail portion of organic EL panel 100.
A. electrode:
Side in the 1st electrode the 31, the 2nd electrode 32 is set at cathode side, and the opposing party is set at anode-side.Anode-side adopts the material higher than cathode side work function to constitute, and can use chromium (Cr), molybdenum (Mo), nickel (Ni), platinum metal films such as (Pt) or nesa coatings such as oxidized metal film such as ITO, IZO.Otherwise, cathode side adopts the material lower than anode-side work function to constitute, low metal and the compounds thereof of work function such as alkali metal (Li, Na, K, Rb, Cs), alkaline-earth metal (Be, Mg, Ca, Sr, Ba), rare earth metal be can use, their alloy, the polyaniline of doping or amorphous semiconductors such as polyphenylene vinylene, the Cr of doping perhaps comprised
2O
3, NiO, Mn
2O
5Deng oxide.In addition, under the situation that the 1st electrode the 31, the 2nd electrode 32 constitutes by transparent material, the electrode side opposite with the emitting side of light can form the structure that reflectance coating is set.
In lead-out wiring portion (lead-out wiring of illustrated lead-out wiring portion 121 and the 1st electrode 31), be connected drive circuit parts or the flexible printed circuit board that drives organic EL panel 100, but preferable case is, form low-resistance as far as possible, as mentioned above, can stacked Ag alloy or low resistance metal electrode layers such as APC, Cr, Al, perhaps form separately with these low resistance metal electrodes.
B. organic material layer:
In addition, for the luminescent material that forms luminescent layer 33B, also can adopt luminous (fluorescence) and luminous (phosphorescence) when 3 heavy excitation state turn back to ground state any when 1 heavy excitation state turns back to ground state.
C. containment member:
For organic EL panel 100, as the containment member 111 that is used for gas-tight seal organic EL 30, the tabular component that useable glass system, plastics system etc. form.Both can adopt on the hermetic sealing substrate of glass by press molding, etching, blast processing etc. and be processed to form sealing with recess (no matter being that one-level digging, secondary are dug), perhaps can use plate glass again, by glass (with plastics also can) liner of system and supporting substrate 110 between form sealing area S.
D. binding agent:
The binding agent that forms tack coat 112 can use thermohardening type, chemosetting type (2 kinds of liquid mix), light (ultraviolet ray) curing type etc., as material, and available acrylic resin, epoxy resin, polyester, polyolefin etc.Particularly, preferable case is to need not the epoxy resin system binding agent that heat treated can be used the high ultraviolet hardening of curable.
E. drying device:
Drying device 40 can be dissolved in drier in the oil series solvents such as toluene, dimethylbenzene, aliphat organic solvent with chemical drier such as physical property drier, alkali metal oxide, metal halide, chlorine peroxides such as zeolite, silica gel, carbon, carbon nano-tube, with metal-organic complex, desiccant particles is scattered in has the drier in the binding agents such as polyethylene, polyisoprene, polyethylene diluent of the transparency and forms.
F. variety of way of organic EL panel etc.:
As embodiments of the invention is organic EL panel 100, can carry out various design alterations in the scope of aim of the present invention.For example, no matter the illumination mode of organic EL 30 is as mentioned above from the end radiation pattern of supporting substrate 110 side-draw bright dippings, still the top radiation pattern from containment member 111 side-draw bright dippings all can (at this moment, form transparent material with containment member 111, must consider the configuration of drying device 40).In addition, organic EL panel 100 both can be monochromatic the demonstration, it can be again multicolor displaying, in order to realize multicolor displaying, certainly comprise branch and be coated with mode, mode (the CF mode that can adopt the light emitting functional layer of the color conversion layer that will form by colour filter agent or fluorescent material and monochromes such as white or blueness to combine, the CCM mode), to the luminous zone irradiation electromagnetic wave of the light emitting functional layer of monochrome etc. to realize multiple luminous mode (photobleaching mode), longitudinally the unit viewing area more than 2 looks is carried out stacked mode (SOLED (transparent stacked OLED) mode) to form a unit viewing area, with low molecule organic material film forming on different films of different colors, duplicate with LASER HEAT then and copy to a laser copy mode on the substrate etc. in advance.In addition, in illustrated embodiment, show the passive drive mode, but also can adopt active type of drive, adopt the TFT substrate, form planarization layer thereon, form the 1st electrode 31 then as supporting substrate 110.
As seen from the above description, self-emission panel and manufacture method or self-emission panel containment member according to embodiments of the present invention, cut off/cut apart will opening panel greatly, when obtaining each self-emission panel 1, can prevent to cut off/damage of lead-out wiring during segmentation process, the finished product rate is improved.In addition, similarly, cut off/cut apart will opening panel greatly, when obtaining each self-emission panel 1, can realize checking the efficient activity of operation, realize the raising of productivity ratio.
Claims (19)
1, a kind of electrooptic panel forms the sealing area with electric light function portion between a pair of opposed members, it is characterized in that:
One side's member of described opposed members is made of supporting substrate, forms the lead-out wiring of drawing from described sealing area on above-mentioned supporting substrate, have simultaneously to comprise the zone of drawing that drive unit is connected or be installed to zone on this lead-out wiring,
The opposing party's member of described opposed members has from described sealing area and reaches the described enhancing portion of stretching out of drawing on the zone.
2, according to the described electrooptic panel of claim 1, it is characterized in that:
Described the opposing party's member forms and makes described sealing area and the described enhancing portion of stretching out is conplane supporting surface.
3, according to the described electrooptic panel of claim 1, it is characterized in that:
The described enhancing portion of stretching out is formed on except connecting or described drawing on the zone the zone of described drive unit being installed.
4, according to the described electrooptic panel of claim 1, it is characterized in that:
The described enhancing portion of stretching out is along being provided with a plurality of positions on one side, and the extension elongation of respectively stretching out enhancing portion equates.
5, according to the described electrooptic panel of claim 1, it is characterized in that:
The described enhancing portion of stretching out is along being provided with on one side a plurality of positions, and the extension elongation that at least one position described stretches out enhancing portion is different with the extension elongation at other positions.
6, according to the described electrooptic panel of claim 1, it is characterized in that:
The described enhancing portion of stretching out is bonded and fixed at described drawing on the zone.
7, according to the described electrooptic panel of claim 1, it is characterized in that:
A side or both sides in the described opposed members are transparent materials.
8, according to the described electrooptic panel of claim 1, it is characterized in that:
Described electric light function portion utilizes the organic EL that is made of the organic luminescence function layer more than one deck to form.
9, a kind of containment member forms the sealing area with electric light function portion between itself and supporting substrate, it is characterized in that:
Have the enhancing portion of stretching out of stretching out from described sealing area,
This stretches out enhancing portion and is formed, and forms from described sealing area on described supporting substrate
The lead-out wiring of drawing is configured in simultaneously to comprise and drive unit connected or is installed to the drawing on the zone of zone on this lead-out wiring.
10, according to the described containment member of claim 9, it is characterized in that:
Form and the described enhancing portion adjacency of stretching out, make the notch part that connects or the regional opening of described drive unit is installed.
11, according to the described containment member of claim 10, it is characterized in that:
Described containment member cuts into each sealing area with a plate that forms a plurality of described sealing areas and forms, and described notch part forms by formed peristome on a described plate.
12, a kind of manufacture method of electrooptic panel in this electrooptic panel, forms the sealing area with electric light function portion between a pair of opposed members, it is characterized in that:
One side's member of described opposed members is made of supporting substrate, forms the lead-out wiring of drawing from described sealing area on described supporting substrate, have simultaneously to comprise the zone of drawing that drive unit is connected or be installed to zone on this lead-out wiring,
The opposing party's member of described opposed members has from described sealing area and reaches the described enhancing portion of stretching out of drawing on the zone,
Side in the opposed faces of described opposed members or both sides go up and form the tack coat that surrounds described sealing area, through this tack coat described a pair of opposed members are fitted.
13, according to the manufacture method of the described electrooptic panel of claim 12, it is characterized in that:
Described tack coat also is formed on described stretching out in the enhancing portion.
14, a kind of self-emission panel, on supporting substrate, form self-luminescent part, the described self-luminescent part of configuration in the sealing area that forms in that described supporting substrate and containment member are fitted, be drawn out to described sealing area lead-out wiring portion in addition from this self-luminescent part and be formed on drawing on the zone of described supporting substrate end, it is characterized in that:
The ora terminalis that faces the described lead-out wiring portion of described containment member is formed by the hole processing edge that is processed into before described supporting substrate and described containment member are fitted.
15, according to the described self-emission panel of claim 14, it is characterized in that:
Described supporting substrate be will form female supporting substrate of a plurality of self-luminescent parts supporting substrate after cutting off,
Described containment member be will dispose female containment member of a plurality of sealings corresponding containment member after cutting off with described a plurality of self-luminescent parts,
Described hole processing edge is the part that the hole that forms on described female containment member adds the inner peripheral in the Ministry of worker.
16, a kind of self-emission panel, possess female supporting substrate that has formed a plurality of self-luminescent parts and the female containment member that has disposed a plurality of sealings corresponding with described a plurality of self-luminescent parts, applying by described female supporting substrate and described female containment member, formed the sealing area that described a plurality of self-luminescent part and described a plurality of sealing are sealed accordingly, it is characterized in that:
Described female supporting substrate has the zone of drawing that has formed the lead-out wiring portion beyond the described sealing area of being drawn out to from described a plurality of self-luminescent parts,
Described female containment member has the hole that described lead-out wiring portion is exposed and adds the Ministry of worker.
17, a kind of manufacture method of self-emission panel is characterized in that, has following operation:
On female supporting substrate, form the operation of a plurality of self-luminescent parts;
On female containment member, form the operation that the hole corresponding with the lead-out wiring portion in described a plurality of self-luminescent parts adds the Ministry of worker;
Described female supporting substrate and described female containment member are fitted, make described lead-out wiring portion add the Ministry of worker and expose, simultaneously described a plurality of self-luminescent parts are sealed in the operation in the sealing area corresponding with the sealing of described female containment member from described hole;
Add in the lead-out wiring portion that the Ministry of worker exposes the inspection operation of carrying out the inspection of described a plurality of self-luminescent parts by checking that terminal is connected from described hole; And
Described female supporting substrate and described female containment member are cut off and are divided into the cut-out/segmentation process of the panel unit that has described sealing area and described lead-in wire wiring portion respectively.
18, according to the manufacture method of the described self-emission panel of claim 17, it is characterized in that:
This operation of described cut-out/segmentation process is carried out along comprising the line of cut that described hole adds the part of the inner peripheral in the Ministry of worker.
19, a kind of self-emission panel containment member fits by itself and female supporting substrate, is sealed in a plurality of self-luminescent parts that formed on this mother's supporting substrate, it is characterized in that:
Have a plurality of sealings corresponding, have a plurality of holes corresponding simultaneously and add the Ministry of worker with the lead-out wiring portion of described a plurality of self-luminescent parts with described a plurality of self-luminescent parts.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005151298A JP2006330185A (en) | 2005-05-24 | 2005-05-24 | Electro-optical panel, sealing member, and manufacturing method of electro-optical panel |
| JP2005151298 | 2005-05-24 | ||
| JP2005176631 | 2005-06-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1870842A true CN1870842A (en) | 2006-11-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610075870 Pending CN1870842A (en) | 2005-05-24 | 2006-04-24 | Electro-optical panel, sealing member, self-emission panel, and manufacturing method therreof |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2006330185A (en) |
| CN (1) | CN1870842A (en) |
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| JP2000058255A (en) * | 1998-08-12 | 2000-02-25 | Tdk Corp | Organic el module |
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