CN1921130A - 固体摄像装置以及照相模块 - Google Patents

固体摄像装置以及照相模块 Download PDF

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CN1921130A
CN1921130A CNA2006101213335A CN200610121333A CN1921130A CN 1921130 A CN1921130 A CN 1921130A CN A2006101213335 A CNA2006101213335 A CN A2006101213335A CN 200610121333 A CN200610121333 A CN 200610121333A CN 1921130 A CN1921130 A CN 1921130A
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image unit
camera head
solid camera
jut
base plate
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西川卓男
丹生和男
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Konica Minolta Opto Inc
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Abstract

一种固体摄像装置，包括印刷基板和粘接固定在该印刷基板上的摄像单元，在所述印刷基板上，由摄像单元覆盖的区域内的所述摄像单元的中央部不形成模型，而由所述摄像单元覆盖的区域内的围着所述中央部形成导电性材料的模型，覆盖所述区域的表面地涂有绝缘涂料。

Description

固体摄像装置以及照相模块
技术领域
本发明涉及在印刷基板上固定了摄像单元芯片的固体摄像装置。
背景技术
近年来，对摄像光学系统成的被摄物体的像进行光电变换的固体摄像装置被广泛应用在摄像机或照相机等中。另外，作为小型照相模块，被装载于手机、PDA(Personal Digital Assistant)等小型薄型的电子器具便携终端。
在这些固体摄像装置中，作为摄像单元，采用CCD(Charge CoupledDevice)型影像传感或CMOS(Complementary Metal-Oxide Semiconductor)型影像传感等。这些固体摄像装置是摄像单元在裸芯片状态粘接固定在基板部，摄像单元和基板部是通过接线作电连接。
像这样摄像单元接着固定在基板的固体摄像装置，其中，在基板部形成多个突起部，在摄像单元支靠于突起部的状态进行粘接，为了使由于与平坦性不好的基板粘接而引起的摄像单元的弯斜得以减轻的固体摄像装置，已经有所公开(参照例如专利文献1)。
(专利文献1)特开2005-129721号公报
发明的内容
发明企图解决的课题
使用上述固体摄像装置的照相机或照相模块，以得到更优画质的图像为目的，所以，固体摄像装置中使用的摄像单元，其像素间距(pitch)减小、采用更高密度配列的高像素数的摄像单元。
伴随如此摄像单元的高像素化，摄像光学系统的成像面上配置的摄像单元的受光面，必须是平坦的同时，还必须配置为对摄像光学系统的光轴是没有倾斜地正确地垂直相交。例如，摄像单元的像素间距δ＝2.2μm、摄像光学系统的F数为F＝2.8的情况，例如，假定景深(focal depth)为2Fδ的话则为12.32μm，对于在摄像单元面与光轴交叉的点与光轴垂直相交的面来说，必须配置为摄像单元面的对角最周边部的偏移量在12.32μm以内。也就是说，在像面侧的景深(focal depth)非常浅，摄像单元面对摄像光学系统光轴的设定，精度要求很高。
但是，上述专利文献1中记载的固体摄像装置，虽然减轻了摄像单元面的歪斜，但是，粘接摄像单元的基板部是由金属模具成型的，因此，正确地使形成在基板部的突起部的各个高度一致是困难的，要使摄像单元面相对基板部的面安定并按照所希望的方向进行制作是困难的。并且，需要对金属模具加工以及严密的成型条件进行管理，尤其存在金属模具加工成本上升之问题。
另外，为了更进一步使固体摄像装置薄型化，将裸芯片状态的摄像单元COB(Chip On Board)实装于印刷基板上时，如上述专利文献1所述的结构不能适用。
本发明鉴于上述问题，以下述为目的：在将裸芯片摄像单元COB实装于印刷基板上时，能够用低成本，正确地使形成在基板部的突起部的各个高度一致，由此，能够使摄像单元面相对基板部安定，并能够按照所希望的方向进行制作，得到薄型的固体摄像装置。
解决课题的手段
上述课题，通过以下结构来解决。
结构1)的固体摄像装置，备有：二维配置了摄像元件的摄像单元；装载了所述摄像单元的印刷基板；所述基板上的围着由所述摄像单元覆盖的地面区域中央部地形成的导电性材料的模型状突起部，
所述摄像单元粘接固定于所述印刷基板的地面区域以及所述突起部上。
结构2)的固体摄像装置，备有：二维配置了摄像元件的摄像单元；装载了所述摄像单元的印刷基板；在由所述摄像元件覆盖的所述基板上的地面区域内，围着所述地面区域的略中心地以同心状地形成的导电性材料的模型状的多个环状突起部；覆盖所述地面区域上的多个环状突起部地涂置的绝缘涂料层，
所述摄像单元粘接固定于所述绝缘涂料层上。
结构3)的照相模块，其特征在于，具有上述结构1或2中记载的固体摄像装置和向所述固体摄像装置提供被摄物体像的摄像光学系统。
附图的简单说明
图1：备有本实施形态中的照相模块的便携终端的一个例子、手机的外观图。
图2：本实施形态中的照相模块的斜视图。
图3：图2所示照相模块的截面图。
图4：本实施形态中的印刷基板上的由摄像单元覆盖的区域内形成的导电性材料的模型状突起部的一例模式示意图。
图5：印刷基板上的由摄像单元覆盖的区域内形成的导电性材料的模型状突起部的其他变形例的示意图。
图6：本实施形态中的印刷基板上的由摄像单元覆盖的区域内形成的导电性材料的模型状突起部的其他一例的模式示意图。
图7：在图6所示印刷基板上实装了摄像单元状态下的截面模式示意图。
图8：在以往的固体摄像装置中，摄像单元弯曲状态下的模式示意图。
实施发明的最佳形态
以下，根据实施形态对本发明作详细说明，但本发明不局限于此。
图1是备有本实施形态中的照相模块100的便携终端的一个例子、手机T的外观图。
同图所示手机T，是备有显示画面D1及D2的、作为盒的上框体71和备有操作按钮P的下框体72经铰链73连结。照相模块100内藏于上框体71内显示画面D2的下方，照相模块100配置为能从上框体71的外表面侧取得光线。
而且，该照相模块100的位置也可以配置在上框体71内显示画面D2的上方或侧面。当然手机不限于折叠式。
图2是本实施形态中的照相模块100的斜视图。
同图所示照相模块100由实装了摄像单元的印刷基板11和，用来连接便携终端其他控制基板的连接器17、摄像光学系统的镜框14、保持镜框14的保持部件12构成。另外，印刷基板11上实装着没有图示的各种电阻、电容等电器部件。
而且，照相模块100也可以是在实装了摄像单元的印刷基板11上连接柔软的印刷基板15，在端部备有连接器部以连接便携终端的其他控制基板之结构。
图3是图2所示照相模块100的截面图。同图是用F-F线切断图2所示照相模块100而得到的截面图。而且，以下的附图中，为了避免重复说明，对同样部件付与同样的符号进行说明。
如同图所示，在照相模块100中，由第1透镜21、第2透镜22以及固定光圈23构成的摄像光学系统组装在镜框14中。该摄像光学系统是在镜框14内，由形成在第1透镜21上的脚部21k和形成在第2透镜22上的凸缘部22f中介固定光圈23碰接，由此定下第1透镜21和第2透镜22的间隔，通过外周部分与镜框嵌合，进行了轴合对，第2透镜22通过粘接剂B固定于透镜框14。24是红外线滤器。在第1透镜21或第2透镜22上实施红外线过滤涂层时，该红外线滤器24可以省略。
配置在摄像光学系统像侧面的裸芯片摄像单元25通过粘接剂固定在印刷基板11上，同时，通过多个接线WB作电连接。
挟持镜框14的挟持部件12上形成有雌螺旋部12n，与其螺合的雄螺旋部14n形成在镜框14上，通过旋转镜框14能够在光轴O方向上移动，能够对一定的被摄体距离进行聚焦调整。另外，挟持部件12通过粘接剂B固定在印刷基板11上。
图4是本实施形态中的印刷基板11上的由摄像单元25覆盖的区域内形成的导电性材料的模型状突起部的一例模式示意图。同图(a)是从上面看到的印刷基板11的图(俯视图)，同图(b)是在印刷基板11上实装了摄像单元25状态下的截面图。
同图所示印刷基板11，其基体是由玻璃环氧系材料、纸苯酚、陶瓷等材料形成的PWB(Print Wiring Board)，摄像单元25是在裸芯片状态COB实装的。
同图(a)所示印刷基板11上，用同一工序，事先形成了导电性材料的突起部32以及用虚线表示的由摄像单元覆盖的区域上、围着区域中央部的导电性材料的突起部31。另一方面，相当于摄像单元中央部的区域的中央部，特意不形成突起部。
而且，这里形成的突起部，也可以作为配线使用。
而且，分别与突起部32以及突起部31连着形成的配线模型等、形成在印刷基板11上的其他模型，省略说明。
并且，如同图(b)所示，在印刷基板11的模型31上载置摄像单元25，用粘接剂33粘接固定之后，通过接线WB对形成在摄像单元25上的没有图示的缓冲(pad)电极和模型32作电连接，构成COB实装的固体摄像装置。
这样，在印刷基板11上实装裸芯片的摄像单元25的情况时，采用在印刷基板11上形成导电性材料的配线模型时之形成工序，同时形成突起部31，由此，能够使得载置摄像单元25的突起部31的厚度正确的均匀化，能够批量生产性地安定的保持摄像单元25的摄像面对印刷基板的平行，能够得到实质上不需要为了形成突起部31之成本的薄型固体摄像装置。
并且，形成由摄像单元覆盖区域内的围着相当于摄像单元中央部区域的突起部，在相当于摄像单元中央部区域不形成突起部，这样，相当于摄像单元中央部的区域的粘接剂层变厚。这意味着在基板部固定摄像单元之际使用热固化性的粘接剂时，具有以下效果。
在图8中，印刷基板的由摄像单元覆盖的部分上，形成略同以往摄像单元形状的模型，用热固化性粘接剂粘接摄像单元与印刷基板时，因为摄像单元和印刷基板的热膨胀率不同，所以回到常温时，存在一个问题，即由于各自的收缩量的差而产生应力，使得摄像单元的中央部是在膨胀的状态下弯曲地固定。也就是说，收缩量小的摄像单元25由收缩量大的印刷基板11向中心部推压。
但是，本实施形态的印刷基板，其中，在相当于摄像单元中央部的区域上粘接剂层较厚，围着中央部的区域由于突起部的存在，粘接剂层涂得较薄。因此，回到常温时，各自的收缩量的差引起产生的应力，由粘接剂固化时的收缩量差抵消，能够解消摄像单元的弯曲。
图5是印刷基板11上，由摄像单元25覆盖的区域内形成的导电性材料的模型突起部的其他变形例的示意图。同图是印刷基板的正面图，虚线表示载置摄像单元25而被覆盖的区域，抽出该区域内形成的导电性材料的模型状突起部而进行表示的图。
同图(a)是环状地形成了导电性材料的突起部31。同图(b)是在由矩形和圆围着的区域上，形成了突起部31的图。同图(c)是同图(b)的变形例。
而且，在由该摄像单元覆盖的区域内形成的突起部31，不限于如上形状，只要是在由摄像单元覆盖的区域内的围着摄像单元中央部的区域，事先形成导电性材料的模型状的突起部，而在相当于摄像单元的中央部的区域不形成突起部的都可以。并且，也可以是在突起部31上涂置绝缘涂料。
图6是本实施形态中的印刷基板上的由摄像单元覆盖的区域内形成的导电性材料的模型状突起部的其他一例的模式示意图。同图是从上面看到的印刷基板11的平面图。
同图所示印刷基板11上，用同一工序，事先形成了导电性材料的突起部32以及用虚线表示的由摄像单元覆盖的区域的围着相当于摄像单元中心部分的突起部31。并且，突起部31的形状是形成为，用虚线所示的由摄像单元覆盖的区域内的突起部31的宽度，随远离摄像单元中心宽度加宽。也就是说，在同图中，形成为突起部31a宽度最宽，突起部31c宽度最狭。而且，分别与突起部32以及突起部31连着形成的配线模型等形成在印刷基板11上的其他模型，省略说明。
图7是在图6所示印刷基板上实装了摄像单元状态下的截面模式示意图。
如同图所示，印刷基板11上涂置了绝缘涂料34，该绝缘涂料34的层上载置着摄像单元25，用粘接剂33粘接固定之后，通过接线WB对形成在摄像单元25上的没有图示的缓冲(pad)电极和模型32作电连接，构成COB实装的固体摄像装置。
涂置的绝缘涂料34的层的厚度，是突起部的宽度越宽越是厚地停留在突起部上，如图所示的截面图，是相当于摄像单元25的最周边部的区域的突起部31a的绝缘涂料层最具有厚度。因此，摄像单元25和绝缘涂料34之间的粘接剂33是摄像单元25的中央部相当的区域上粘接剂层厚，相当于最外侧部分的区域上粘接剂层涂置得薄。
这样，形成突起部31以及绝缘涂料34的层，能够使得载置摄像单元25的突起部31及绝缘涂料34以及粘接剂33的合计厚度正确地均匀化，能够量产性的保持摄像单元25的摄像面相对印刷基板11的安定平行，能够得到上述同样的效果。
并且，由摄像单元覆盖的区域内的导电性材料形成的突起部的宽度，是随接近摄像单元的外郭，也就是说，随远离相当于摄像单元中心的位置，形成得宽度变宽，通过涂置绝缘涂料，如图所示突起部宽度宽的部位绝缘涂料层厚，突起部的宽度狭窄的部位绝缘涂料涂置得薄。由此，使粘接剂层的厚度是周边部薄，中央部厚地形成，即使是采用固化收缩的粘接剂的情况时，与上述同样，可以用粘接剂固化时的收缩量差，来抵消各个收缩量的差引起产生的应力，得到解消摄像单元弯曲之效果。
根据本发明，将裸芯片的摄像单元COB实装在印刷基板上时，能够用低成本，正确地使形成在基板部的突起部的各个高度一致，由此，能够得到一种摄像单元的面能够相对基板部保持安定平行的薄型固体摄像装置。

Claims (10)

1.一种固体摄像装置，备有：
二维配置了摄像元件的摄像单元；
装载了所述摄像单元的印刷基板；
所述基板上的围着由所述摄像单元覆盖的地面区域中央部地形成的导电性材料的模型状突起部，
所述摄像单元粘接固定于所述印刷基板的地面区域以及所述突起部上。
2.权利要求1中记载的固体摄像装置，其中，所述突起部是作为结合的单一的连续形状形成的。
3.权利要求1中记载的固体摄像装置，其中，所述摄像单元在所述印刷基板的所述地面区域以及所述突起部上，通过热固化性粘接剂粘接。
4.一种固体摄像装置，备有：
二维配置了摄像元件的摄像单元；
装载了所述摄像单元的印刷基板；
在由所述摄像元件覆盖的所述基板上的地面区域内，围着所述地面区域的略中心地以同心状地形成的导电性材料的模型状的多个环状突起部；
覆盖所述地面区域上的多个环状突起部地涂置的绝缘涂料层，
所述摄像单元粘接固定于所述绝缘涂料层上。
5.权利要求4中记载的固体摄像装置，其中，多个环状突起部的宽度，是从所述区域的略中心向外侧方向，随远离所述略中心而变宽。
6.权利要求4中记载的固体摄像装置，其中，多个环状突起部是略圆形的。
7.权利要求4中记载的固体摄像装置，其中，多个环状突起部是略矩形的。
8.权利要求4中记载的固体摄像装置，其特征在于，所述绝缘涂料层和所述摄像单元通过热固化性粘接剂粘接。
9.一种照相模块，其特征在于，备有权利要求1中记载的固体摄像装置和向所述固体摄像装置提供被摄物体像的摄像光学系统。
10.一种照相模块，其特征在于，备有权利要求4中记载的固体摄像装置和向所述固体摄像装置提供被摄物体像的摄像光学系统。
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