CN2572586Y - 电连接器的热传导器 - Google Patents

电连接器的热传导器 Download PDF

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CN2572586Y
CN2572586Y CN02255006U CN02255006U CN2572586Y CN 2572586 Y CN2572586 Y CN 2572586Y CN 02255006 U CN02255006 U CN 02255006U CN 02255006 U CN02255006 U CN 02255006U CN 2572586 Y CN2572586 Y CN 2572586Y
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heat
heat conductor
electric connector
substrate
stitch
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安祖·郑
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Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
    • H05K7/1084—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding pin grid array package carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/165—Stabilizing, e.g. temperature stabilization

Abstract

本实用新型公开一种热传导器，其用于安装在电连接器上，该电连接器具有设有若干容室的本体，于上述容室内固持收容有附着有焊料的导电端子，上述热传导器用以在焊接过程中将热量均匀地传递至上述导电端子上，该热传导器包括有基板及若干导热针脚，该基板由热传导材料制成，其具有可定位于上述本体上的底面及相对的顶面，所述导热针脚自上述基板的底面延伸而出，其中上述针脚对应于上述容室排列，并且可插置于容室中与导电端子物理连接以传递热量至导电端子及焊料上，从而实现电连接器的焊接尾部上热量的均匀传递，并且方便自动化取置电连接器。

Description

电连接器的热传导器
【技术领域】
本实用新型有关一种热传导器，尤其是指一种有选择地连接于电连接器的焊球上以均匀分配热量至焊球上的热传导器。
【背景技术】
电连接器通常包括一个固持有若干端子的绝缘本体，电连接器通过其端子尾部与印刷电路板上对应的导电回路相连接使其与印刷电路板电性连接。电子及计算机工业中通过焊接方式使电连接器连接于印刷电路板上的技术已为业界所经常使用。而所面临的问题是如何将热量分配至电连接器的端子尾部及印刷电路板的导电回路。在焊接过程中，如表面粘着技术(Surface MountTechnology；SMT)，首先将焊料涂覆于导电回路上。在SMT过程中焊料必须同时均匀熔化及凝固，以防止由于端子尾部与导电回路间受热不均而产生的残余应力。而这种热应力可能导致端子尾部与导电回路间出现裂缝，从而使焊接品质下降。
某一类型的电连接器，如双排嵌入式存储模块(Double In-Line MemoryModule；DIMM)插座连接器，其端子尾部沿电连接器绝缘本体的相对侧面平行排布成两排。由于端子尾部沿电连接器绝缘本体的侧面排布，热量可以相当均匀地分配至端子尾部，因此，热应力的问题并不严重。
然而，当电连接器具有大量端子时，如球脚栅格阵列(Ball GridArray；BGA)插座连接器用于连接中央处理单元(Central ProcessingUnit；CPU)模块，这种电连接器的端子排列成矩阵或阵列，上述问题就变得严重起来。
如图1至图4所示，一种BGA插座连接器(如参考标号100所示)，其包括大量排列成阵列的导电端子，如具有603个端子的一种BGA插座连接器。这种BGA插座连接器100包括基座110及可移动地组接于基座110上的盖体120。盖体120可承载且支撑CPU模块(未图示)于其上，其包括若干通孔121，如603个通孔，于基座110内设有若干容室111与其相对准。每个容室111固持收容有一具有延伸超出基座110的底面且附接有一焊球130的尾部112a。每个端子112具有一个用以与CPU模块的针脚相连接的对接部112b。
从图中很容易看出，当BGA插座连接器100放置在印刷电路板150上时，BGA插座连接器100的底面100a与印刷电路板150间具有一小间隙。焊球130经热风回流过程而被熔化，在该过程中红外线热源使焊球130熔化且同时下沉。
可以从图中清楚地看到，基座110呈一矩形体，焊球130排列成矩阵。容易理解，利用业界惯用的红外线加热，位于靠近基座110外缘位置的焊球130能够很快加热，而位于远离基座外缘位置的焊球130较难加热。
上述BGA插座连接器100提供一开口113使热量有效地传送至位于内部的焊球130上。然而，该方法并没有彻底解决上述问题。另外，一些BGA插座连接器，如用于笔记本电脑上的mPGA478插座连接器并没有提供这样的开口113。
此外，一些BGA插座连接器甚至可能具有一千多个端子及焊球。在这种情况下，如何均匀加热焊球并使其同时冷却以避免加热程度不均匀的情形，实为一有意义、富有挑战性的技术课题。
经过BGA插座连接器焊接于电路板上的SMT过程以后，由于很难将所有的焊球同时熔化而将连接器端子从电路板上分离，因此很难将该插座连接器从电路板上整体移除，这还是由于上述原因即热量分配不均匀所致。
目前实际操作，是在红外线加热的条件下通过SMT过程附着于电路板上。红外线借助传送装置使热风在BGA插座连接器的区域内流动，该区域内的温度将逐渐升高直到焊球熔化使端子尾部与电路板的接地回路相焊接。然后，BGA插座连接器将逐渐冷却。
由上述分析可知，对于内部焊球来说，热量的分配使其无论在加热还是冷却过程都存在问题，即内部焊球的加热或冷却均有难度。因此，确实需要一种均匀地且同时熔化焊球的方法来解决上述问题。
大多数电连接器都具有一平滑表面，该表面可能是电连接器自身的一部分或者是附着于电连接器上的附加部分，用以供如工业机器人之类的机械对电连接器进行提取及放置操作。上述BGA插座连接器的附加部分(例如塑料盖或塑料带)附着于BGA插座连接器的上表面以方便提取及放置操作。然而，这种附加部分增加了电连接器的成本。
【发明内容】
本实用新型的第一目的在于提供一种热传导器，其与电连接器配合使用，用以在焊接过程中实现电连接器的焊接尾部上热量的均匀传递。
本实用新型的另一目的在于提供一种热传导器，其能够均匀地传递热量于电连接器的所有焊接尾部，并且可以作为提取及放置的操作板以方便自动化取置电连接器。
为实现上述目的，本实用新型热传导器用于安装在电连接器上，该电连接器具有设有若干容室的本体，于上述容室内固持收容有附着有焊料的导电端子，上述热传导器用以在焊接过程中将热量均匀地传递至上述导电端子上，该热传导器包括有基板及若干导热针脚，该基板由热传导材料制成，其具有可定位于上述本体上的底面及相对的顶面，所述导热针脚自上述基板的底面延伸而出，其中上述针脚对应于上述容室排列，并且可插置于容室中与导电端子物理连接以传递热量至导电端子及焊料上。
与现有技术相比较，本实用新型热传导器通过导热基板及从基板上延伸出的针脚与电连接器相配合，从而可将热量均匀地传递至电连接器的导电端子及焊料上，并且方便自动化取置电连接器。
【附图说明】
图1是一种现有BGA插座连接器的立体图。
图2是图1的仰视图，以显示附着于其上的焊球。
图3是图1所示BGA插座连接器的横向剖视图。
图4是图3圈出部分4的放大图，其显示了与其配合的电路板的一部分。
图5是本实用新型第一实施例的热传导器安装于焊接至电路板上的电连接器上的立体分解图。
图6是图5所示热传导器的侧视图。
图7是热传导器安装于电连接器上的横向剖视图。
图8是图7圈出部分8的放大图。
图9是本实用新型第二实施例的热传导器结构的立体图。
图10是本实用新型热传导器的其它不同应用的立体图。
图11是本实用新型第三实施例的热传导器结构的立体图。
图12是本实用新型第四实施例的热传导器结构的横向剖视图。
【具体实施方式】
请参阅附图，尤其是图5及图6所示，本实用新型第一实施例的热传导器结构通常设计成如参考标号30所示，其安装于电连接器10上用以均匀分配热量至电连接器10的端子尾端。热传导器30包括一具有较大表面积的顶面33、底面35的基板32。若干针脚36从底面35延伸而出，并且每个针脚36具有一斜切缩小的自由端38。
电连接器10可以是任何类型的连接器。较佳的例子就是如图1及图2所示的BGA插座连接器。为方便描述，本实施例中电连接器10具有简化的结构，其包括一安装有已固定于其上而不可移动的盖体的绝缘本体或基座19。显然，熟悉该项技术者可将本实用新型的原理运用于BGA插座连接器上。
请参阅图7及图8所示，电连接器10的本体19具有一位于电路板20上的底面13及支撑电子装置(例如具有若干针脚的中央处理单元模块)的相对顶面11。若干容室14呈阵列排布设置于本体19上。每个容室14收容一导电端子12，该导电端子12具有一对接部122及附着一焊球15的焊接尾部124。电连接器10通过焊球15与形成于电路板上的导电回路22相连，从而结合于电路板20上。每一容室14向本体19的顶面11开口，用以收容对应电子装置的一个针脚，以使电子装置与电路板20电性连接。
为将电连接器10焊接于电路板20上，需要经过一加热过程使焊球15熔化，并且当焊球15冷却时，焊球15固定附着于电路板20的导电回路22上。
热传导器30的针脚36按电子装置针脚排列的相同方式排列，热传导器30能被安装于本体19的顶面11上，通过将针脚36插入对应的容室14中而与电连接器10对应的导电端子12相连。针脚36的自由端38有助于将针脚36插入电连接器10的本体19的对应容室14中。
热传导器30的基板32及针脚36由热传导材料制成(例如金属或合金)，基板32具有较大表面积以利于吸收由红外线产生的热量。基板32的热传导性能可使热量被基板32所吸收，并且有效地传递到与电连接器10的导电端子12相连接的针脚36上，以利于热量均匀地分配至电连接器10的每个端子12的焊球15上。
显然，制造热传导器30的材料的熔点必须比焊球15的熔点高才可避免加热过程中热传导器30的不必要熔化。由于热传导器30的针脚36可稳固连接电连接器10的导电端子12，因此，热传导器30与电连接器10可相互可靠连接。由于热传导器30的顶面33具有一平滑表面，一真空吸取装置(未图示)可被安装于热传导器30的顶面33上，以使电连接器10更可靠地与热传导器30相组接。因此，热传导器30也具有有助于提取及放置的结构，以使电连接器10可被如工业机器人(未图示)之类的机械所控制。
为利于热量的吸收及散发，热传导器30还可自顶面33上延伸出翼部34，如图9的本实用新型第二实施例所示。热传导器30的基板32可具有完全对应于电连接器10的本体19的顶面11的表面积(如图5所示)，或者小于电连接器10的顶面的表面积(如图10所示)，其中热传导器30位于本体19的顶面11的中央区域以传输热量至对应于本体19中央区域的端子的焊球15上。基板32的外围区域被移除。
请参阅图11所示，本实用新型第三实施例具有一开口37，该开口37可设于热传导器30的基板32上并且可对应于电连接器的中央开口(如图1及图2所示)。
请参阅图12所示，本实用新型热传导器的第四实施例具有设于基板32上针脚36间的若干通孔39。设置通孔39的目的在于节省热传导器30的材料并且可使热量保持在热传导器30上的时间减小，进而使传递到焊球15的热量最大。

Claims (6)

1.一种热传导器，用于安装在电连接器上，该电连接器具有设有若干容室的本体，于上述容室内固持收容有附着有焊料的导电端子，上述热传导器用以在焊接过程中将热量均匀地传递至上述导电端子上，其特征在于：该热传导器包括有基板及若干导热针脚，该基板由热传导材料制成，其具有可定位于上述本体上的底面及相对的顶面，所述导热针脚自上述基板的底面延伸而出，其中上述针脚对应于上述容室排列，并且可插置于容室中与导电端子物理连接以传递热量至导电端子及焊料上。
2.如权利要求1所述的热传导器，其特征在于：所述基板与针脚均为金属材质。
3.如权利要求1所述的热传导器，其特征在于：所述基板上设有控制其吸收热量的若干通孔。
4.如权利要求1所述的热传导器，其特征在于：该热传导器还包括有若干自基板顶面延伸而出的翼片。
5.如权利要求1所述的热传导器，其特征在于：所述基板具有完全对应于所述本体的顶面的表面积。
6.如权利要求1所述的热传导器，其特征在于：所述基板具有小于所述本体顶面的表面积。
CN02255006U 2001-12-11 2002-09-18 电连接器的热传导器 Expired - Fee Related CN2572586Y (zh)

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