DE10085347T1 - Entstörkondensator für dünne Gate-Oxide - Google Patents

Entstörkondensator für dünne Gate-Oxide

Info

Publication number
DE10085347T1
DE10085347T1 DE10085347T DE10085347T DE10085347T1 DE 10085347 T1 DE10085347 T1 DE 10085347T1 DE 10085347 T DE10085347 T DE 10085347T DE 10085347 T DE10085347 T DE 10085347T DE 10085347 T1 DE10085347 T1 DE 10085347T1
Authority
DE
Germany
Prior art keywords
interference suppression
thin gate
gate oxides
suppression capacitor
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE10085347T
Other languages
English (en)
Other versions
DE10085347B4 (de
Inventor
Ali Keshavarzi
Vivek K De
Tanay Karnik
Rajendran Nair
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of DE10085347T1 publication Critical patent/DE10085347T1/de
Application granted granted Critical
Publication of DE10085347B4 publication Critical patent/DE10085347B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/0805—Capacitors only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/92—Capacitors with potential-jump barrier or surface barrier
    • H01L29/94—Metal-insulator-semiconductors, e.g. MOS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE10085347T 1999-12-22 2000-11-13 Verwendung einer MOS-Struktur als Entstörkondensator bei dünnen Gate-Oxiden Expired - Fee Related DE10085347B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/469,406 US6828638B2 (en) 1999-12-22 1999-12-22 Decoupling capacitors for thin gate oxides
US09/469,406 1999-12-22
PCT/US2000/031352 WO2001046989A2 (en) 1999-12-22 2000-11-13 Decoupling capacitors for thin gate oxides

Publications (2)

Publication Number Publication Date
DE10085347T1 true DE10085347T1 (de) 2003-01-30
DE10085347B4 DE10085347B4 (de) 2009-04-09

Family

ID=23863664

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10085347T Expired - Fee Related DE10085347B4 (de) 1999-12-22 2000-11-13 Verwendung einer MOS-Struktur als Entstörkondensator bei dünnen Gate-Oxiden

Country Status (8)

Country Link
US (1) US6828638B2 (de)
JP (1) JP4954413B2 (de)
KR (1) KR100532208B1 (de)
AU (1) AU3072601A (de)
DE (1) DE10085347B4 (de)
GB (1) GB2374462B (de)
HK (1) HK1046776B (de)
WO (1) WO2001046989A2 (de)

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US6828654B2 (en) 2001-12-27 2004-12-07 Broadcom Corporation Thick oxide P-gate NMOS capacitor for use in a phase-locked loop circuit and method of making same
US6917544B2 (en) 2002-07-10 2005-07-12 Saifun Semiconductors Ltd. Multiple use memory chip
US6809386B2 (en) * 2002-08-29 2004-10-26 Micron Technology, Inc. Cascode I/O driver with improved ESD operation
US7136304B2 (en) 2002-10-29 2006-11-14 Saifun Semiconductor Ltd Method, system and circuit for programming a non-volatile memory array
US7178004B2 (en) 2003-01-31 2007-02-13 Yan Polansky Memory array programming circuit and a method for using the circuit
JP4046634B2 (ja) * 2003-04-08 2008-02-13 Ｎｅｃエレクトロニクス株式会社 電圧制御型容量素子及び半導体集積回路
CN100594663C (zh) * 2003-08-05 2010-03-17 爱普生拓优科梦株式会社 压电振荡器
JP2005175003A (ja) * 2003-12-08 2005-06-30 Matsushita Electric Ind Co Ltd デカップリングコンデンサ及び半導体集積回路
DE102004006484A1 (de) * 2004-02-10 2005-08-25 Infineon Technologies Ag Integrierte Schaltungsanordnungen mit ESD-festem Kondensator und Herstellungsverfahren
US7256438B2 (en) * 2004-06-08 2007-08-14 Saifun Semiconductors Ltd MOS capacitor with reduced parasitic capacitance
US7619273B2 (en) * 2004-10-06 2009-11-17 Freescale Semiconductor, Inc. Varactor
US7638850B2 (en) 2004-10-14 2009-12-29 Saifun Semiconductors Ltd. Non-volatile memory structure and method of fabrication
US8053812B2 (en) 2005-03-17 2011-11-08 Spansion Israel Ltd Contact in planar NROM technology
US7786512B2 (en) 2005-07-18 2010-08-31 Saifun Semiconductors Ltd. Dense non-volatile memory array and method of fabrication
US7668017B2 (en) 2005-08-17 2010-02-23 Saifun Semiconductors Ltd. Method of erasing non-volatile memory cells
US8116142B2 (en) * 2005-09-06 2012-02-14 Infineon Technologies Ag Method and circuit for erasing a non-volatile memory cell
US7808818B2 (en) 2006-01-12 2010-10-05 Saifun Semiconductors Ltd. Secondary injection for NROM
US7358823B2 (en) * 2006-02-14 2008-04-15 International Business Machines Corporation Programmable capacitors and methods of using the same
US7477541B2 (en) * 2006-02-14 2009-01-13 International Business Machines Corporation Memory elements and methods of using the same
US8253452B2 (en) 2006-02-21 2012-08-28 Spansion Israel Ltd Circuit and method for powering up an integrated circuit and an integrated circuit utilizing same
US7760554B2 (en) 2006-02-21 2010-07-20 Saifun Semiconductors Ltd. NROM non-volatile memory and mode of operation
US7692961B2 (en) 2006-02-21 2010-04-06 Saifun Semiconductors Ltd. Method, circuit and device for disturb-control of programming nonvolatile memory cells by hot-hole injection (HHI) and by channel hot-electron (CHE) injection
US7701779B2 (en) 2006-04-27 2010-04-20 Sajfun Semiconductors Ltd. Method for programming a reference cell
JP5226696B2 (ja) * 2007-01-01 2013-07-03 サンディスク テクノロジィース インコーポレイテッド ２つのタイプの減結合コンデンサを備えた集積回路および方法
KR100907020B1 (ko) * 2008-02-25 2009-07-08 주식회사 하이닉스반도체 반도체 집적회로의 전원 공급 장치 및 이를 이용한 입력임피던스 제어 방법
FR2982707A1 (fr) * 2011-11-10 2013-05-17 St Microelectronics Sa Condensateur a transistor mos sur soi
KR102143520B1 (ko) * 2014-09-17 2020-08-11 삼성전자 주식회사 펌핑 캐패시터
US9837555B2 (en) 2015-04-15 2017-12-05 Futurewei Technologies, Inc. Apparatus and method for a low loss coupling capacitor
US10510906B2 (en) * 2016-07-01 2019-12-17 Taiwan Semiconductor Manufacturing Company Ltd. MOS capacitor, semiconductor fabrication method and MOS capacitor circuit
JP7027176B2 (ja) * 2018-01-22 2022-03-01 ラピスセミコンダクタ株式会社 半導体装置

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JPS59154077A (ja) * 1983-02-23 1984-09-03 Clarion Co Ltd 可変容量素子
US5032892A (en) * 1988-05-31 1991-07-16 Micron Technology, Inc. Depletion mode chip decoupling capacitor
JPH0513680A (ja) * 1990-10-26 1993-01-22 Seiko Epson Corp 半導体装置
US5173835A (en) 1991-10-15 1992-12-22 Motorola, Inc. Voltage variable capacitor
US5341009A (en) * 1993-07-09 1994-08-23 Harris Corporation Fast charging MOS capacitor structure for high magnitude voltage of either positive or negative polarity
US5405790A (en) 1993-11-23 1995-04-11 Motorola, Inc. Method of forming a semiconductor structure having MOS, bipolar, and varactor devices
US5615096A (en) 1994-06-06 1997-03-25 Motorola, Inc. Direct current power supply conditioning circuit
JPH0883887A (ja) * 1994-09-14 1996-03-26 Nissan Motor Co Ltd 半導体保護装置
US5563779A (en) 1994-12-05 1996-10-08 Motorola, Inc. Method and apparatus for a regulated supply on an integrated circuit
US5883423A (en) * 1996-02-23 1999-03-16 National Semiconductor Corporation Decoupling capacitor for integrated circuit signal driver
JP2795259B2 (ja) * 1996-04-17 1998-09-10 日本電気株式会社 半導体装置およびその製造方法
US5962887A (en) 1996-06-18 1999-10-05 Micron Technology, Inc. Metal-oxide-semiconductor capacitor
JPH10107235A (ja) * 1996-09-27 1998-04-24 Hitachi Ltd ゲートアレーｌｓｉの構成方法とこれを用いた回路装置
JPH10163421A (ja) * 1996-11-29 1998-06-19 Sanyo Electric Co Ltd 半導体集積回路
JPH10256489A (ja) * 1997-03-14 1998-09-25 Mitsubishi Electric Corp 半導体装置
US5965912A (en) 1997-09-03 1999-10-12 Motorola, Inc. Variable capacitor and method for fabricating the same

Also Published As

Publication number Publication date
GB0215177D0 (en) 2002-08-07
AU3072601A (en) 2001-07-03
US6828638B2 (en) 2004-12-07
KR20020089311A (ko) 2002-11-29
US20020140109A1 (en) 2002-10-03
HK1046776A1 (en) 2003-01-24
GB2374462B (en) 2004-05-26
WO2001046989A3 (en) 2002-05-10
GB2374462A (en) 2002-10-16
DE10085347B4 (de) 2009-04-09
HK1046776B (zh) 2004-12-03
WO2001046989A2 (en) 2001-06-28
KR100532208B1 (ko) 2005-11-29
JP4954413B2 (ja) 2012-06-13
JP2004501501A (ja) 2004-01-15

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